CP388X-BCY59-IX [CENTRAL]

Small Signal Bipolar Transistor,;
CP388X-BCY59-IX
型号: CP388X-BCY59-IX
厂家: CENTRAL SEMICONDUCTOR CORP    CENTRAL SEMICONDUCTOR CORP
描述:

Small Signal Bipolar Transistor,

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中文:  中文翻译
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CP388X-BCY59-IX  
NPN - Low Noise Transistor Die  
www.centralsemi.com  
The CP388X-BCY59-IX is a silicon NPN transistor designed for low noise amplifier applications.  
MECHANICAL SPECIFICATIONS:  
Die Size  
13 x 13 MILS  
5.9 MILS  
Die Thickness  
Base Bonding Pad Size  
Emitter Bonding Pad Size  
Top Side Metalization  
Back Side Metalization  
Scribe Alley Width  
Wafer Diameter  
3.9 x 3.9 MILS  
5.4 x 5.4 MILS  
Al-Si – 17,000Å  
Au – 9,000Å  
1.8 MILS  
5 INCHES  
Gross Die Per Wafer  
102,852  
BACKSIDE COLLECTOR  
R0  
MAXIMUM RATINGS: (T =25°C)  
Collector-Base Voltage  
SYMBOL  
UNITS  
V
A
V
V
V
45  
45  
CBO  
CEO  
EBO  
Collector-Emitter Voltage  
Emitter-Base Voltage  
V
7.0  
V
Continuous Collector Current  
Peak Collector Current  
I
100  
mA  
mA  
mA  
°C  
C
I
200  
CM  
Peak Base Current  
I
200  
BM  
T , T  
Operating and Storage Junction Temperature  
-65 to +150  
J
stg  
ELECTRICAL CHARACTERISTICS: (T =25°C)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
MAX  
UNITS  
I
V
=45V  
10  
nA  
CBO  
EBO  
CB  
EB  
I
V
=5.0V  
10  
nA  
V
BV  
BV  
BV  
I =10μA  
45  
45  
CBO  
CEO  
C
I =2.0mA  
V
C
I =1.0μA  
7.0  
V
EBO  
E
V
V
V
V
I =10mA, I =250μA  
0.35  
0.70  
0.85  
1.20  
V
CE(SAT)  
CE(SAT)  
BE(SAT)  
BE(SAT)  
FE  
C
B
I =100mA, I =2.5mA  
V
C
B
I =10mA, I =250μA  
0.60  
0.75  
40  
V
C
B
I =100mA, I =2.5mA  
V
C
B
h
h
h
h
V
=5.0V, I =10μA  
CE  
CE  
CE  
CE  
CE  
CB  
EB  
CE  
C
V
V
V
V
V
V
V
=5.0V, I =2.0mA  
250  
160  
60  
FE  
C
=1.0V, I =10mA  
630  
FE  
C
=1.0V, I =100mA  
FE  
C
f
=5.0V, I =10mA, f=100MHz  
150  
MHz  
pF  
T
C
C
=10V, I =0, f=1.0MHz  
5.0  
15  
ob  
E
C
=0.5V, I =0, f=1.0MHz  
pF  
ib  
C
NF  
=5.0V, I =0.2mA, R =2.0kΩ,  
C S  
f=1.0kHz, BW=200Hz  
10  
dB  
R0 (20-June 2016)  
CP388X-BCY59-IX  
Typical Electrical Characteristics  
www.centralsemi.com  
ELECTRICAL CHARACTERISTICS - Continued: (T =25°C)  
A
SYMBOL  
TEST CONDITIONS  
TYP  
MAX  
UNITS  
t
t
t
t
t
t
t
t
t
t
t
t
V
V
V
V
V
V
V
V
V
V
V
V
=10V, I =10mA, I =I =1.0mA  
85  
150  
ns  
on  
d
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
C
B1 B2  
=10V, I =10mA, I =I =1.0mA  
35  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
C
B1 B2  
=10V, I =10mA, I =I =1.0mA  
r
C
B1 B2  
=10V, I =10mA, I =I =1.0mA  
450  
400  
80  
800  
150  
800  
off  
s
C
B1 B2  
=10V, I =10mA, I =I =1.0mA  
C
B1 B2  
=10V, I =10mA, I =I =1.0mA  
f
C
B1 B2  
=10V, I =100mA, I =I =10mA  
55  
on  
d
C
B1 B2  
=10V, I =100mA, I =I =10mA  
5.0  
50  
C
B1 B2  
=10V, I =100mA, I =I =10mA  
r
C
B1 B2  
=10V, I =100mA, I =I =10mA  
450  
250  
20  
off  
s
C
B1 B2  
=10V, I =100mA, I =I =10mA  
C
B1 B2  
=10V, I =100mA, I =I =10mA  
f
C
B1 B2  
R0 (20-June 2016)  
CP388X-BCY59-IX  
Typical Electrical Characteristics  
www.centralsemi.com  
R0 (20-June 2016)  
BARE DIE PACKING OPTIONS  
BARE DIE IN TRAY (WAFFLE) PACK  
CT: Singulated die in tray (waffle) pack.  
(example: CP211-PART NUMBER-CT)  
CM: Singulated die in tray (waffle) pack 100% visually inspected as  
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).  
(example: CP211-PART NUMBER-CM)  
UNSAWN WAFER  
WN: Full wafer, unsawn, 100% tested with reject die inked.  
(example: CP211-PART NUMBER-WN)  
SAWN WAFER ON PLASTIC RING  
WR: Full wafer, sawn and mounted on plastic ring,  
100% tested with reject die inked.  
(example: CP211-PART NUMBER-WR)  
SAWN WAFER ON METAL FRAME  
WS: Full wafer, sawn and mounted on metal frame,  
100% tested with reject die inked.  
(example: CP211-PART NUMBER-WS)  
R0 (7-December 2015)  
www.centralsemi.com  
OUTSTANDING SUPPORT AND SUPERIOR SERVICES  
PRODUCT SUPPORT  
Central’s operations team provides the highest level of support to insure product is delivered on-time.  
• Supply management (Customer portals)  
• Inventory bonding  
• Custom bar coding for shipments  
• Custom product packing  
• Consolidated shipping options  
DESIGNER SUPPORT/SERVICES  
Central’s applications engineering team is ready to discuss your design challenges. Just ask.  
• Free quick ship samples (2nd day air)  
• Online technical data and parametric search  
• SPICE models  
• Special wafer diffusions  
• PbSn plating options  
• Package details  
• Custom electrical curves  
• Application notes  
• Environmental regulation compliance  
• Customer specific screening  
• Up-screening capabilities  
• Application and design sample kits  
• Custom product and package development  
CONTACT US  
Corporate Headquarters & Customer Support Team  
Central Semiconductor Corp.  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Main Tel: (631) 435-1110  
Main Fax: (631) 435-1824  
Support Team Fax: (631) 435-3388  
www.centralsemi.com  
Worldwide Field Representatives:  
www.centralsemi.com/wwreps  
Worldwide Distributors:  
www.centralsemi.com/wwdistributors  
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,  
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms  
(000)  
www.centralsemi.com  

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