3SMC17CATR13LEADFREE [CENTRAL]
Trans Voltage Suppressor Diode, 3000W, 17V V(RWM), Bidirectional, 1 Element, Silicon, LEAD FREE, SMC, 2 PIN;![3SMC17CATR13LEADFREE](http://pdffile.icpdf.com/pdf2/p00220/img/icpdf/3SMC8-0CATR1_1282794_icpdf.jpg)
型号: | 3SMC17CATR13LEADFREE |
厂家: | ![]() |
描述: | Trans Voltage Suppressor Diode, 3000W, 17V V(RWM), Bidirectional, 1 Element, Silicon, LEAD FREE, SMC, 2 PIN 局域网 光电二极管 |
文件: | 总5页 (文件大小:250K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TM
3SMC5.0CA THRU 3SMC170CA
Central
Semiconductor Corp.
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
DESCRIPTION:
The CENTRAL SEMICONDUCTOR 3SMC5.0CA
Series types are Surface Mount Bi-Directional Glass
Passivated Junction Transient Voltage Suppressors
designed to protect voltage sensitive components
from high voltage transients.
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
THIS DEVICE IS MANUFACTURED WITH A
GLASS PASSIVATED CHIP FOR OPTIMUM RELI-
ABILITY.
STAND-OFF VOLTAGE
Note: For Uni-directional devices, please refer to the
3SMC5.0A Series data sheet.
SMC CASE
MARKING CODE: SEE MARKING CODE ON
ELECTRICAL CHARACTERISTIC TABLE
• This series is UL listed, UL file number E130224
MAXIMUM RATINGS: (T =25°C unless otherwise noted)
Peak Power Dissipation (Note 1)
Peak Forward Surge Current (JEDEC Method)
Operating and Storage Junction Temperature
SYMBOL
UNITS
W
A
A
P
3000
200
-65 to +150
DM
I
FSM
T , Tstg
°C
J
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
A
PEAK
BREAKDOWN
REVERSE
STAND-OFF
VOLTAGE
MAXIMUM
REVERSE
LEAKAGE
MAXIMUM
CLAMPING
VOLTAGE
TEST
CURRENT
PULSE
VOLTAGE
CURRENT
(Note 1)
MARKING
CODE
(V
BR
@ I )
T
TYPE
V
I
I
@ V
V
@ I
I
MIN
V
MAX
V
RWM
V
T
R
RWM
C
PP
PP
A
mA
μA
V
3SMC5.0CA
3SMC6.0CA
3SMC6.5CA
3SMC7.0CA
3SMC7.5CA
3SMC8.0CA
3SMC8.5CA
3SMC9.0CA
3SMC10CA
3SMC11CA
3SMC12CA
3SMC13CA
3SMC14CA
3SMC15CA
3SMC16CA
3SMC17CA
3SMC18CA
3SMC20CA
3SMC22CA
3SMC24CA
3SMC26CA
3SMC28CA
3SMC30CA
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
6.40
6.67
7.22
7.78
8.33
8.89
9.44
10.0
11.1
12.2
13.3
14.4
15.6
16.7
17.8
18.9
20.0
22.2
24.4
26.7
28.9
31.1
33.3
7.25
7.67
8.30
8.95
9.58
10.23
10.82
11.5
12.8
14.0
15.3
16.5
17.9
19.2
20.5
21.7
23.3
25.5
28.0
30.7
33.2
35.8
38.3
10
2000
2000
1000
400
200
100
50
9.2
326.0
291.3
267.9
250.0
232.6
220.6
208.4
194.8
176.4
184.8
150.6
139.4
129.4
123.0
115.4
106.6
102.8
92.6
CIDE
CIDG
CIDK
CIDM
CIDP
CIDR
CIDT
CIDV
CIDX
CIDZ
CIEE
CIEG
CIEK
CIEM
CIEP
CIER
CIET
CIEV
CIEX
CIEZ
CIFE
CIFG
CIFK
10
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
10
10
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
20
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
12
13
14
15
16
17
18
20
22
24
26
28
30
84.4
77.2
71.2
66.0
62.0
Notes: (1) Non-repetitive 10x1,000μs pulse
R4 (3-March 2008)
TM
3SMC5.0CA THRU 3SMC170CA
Central
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
Semiconductor Corp.
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
ELECTRICAL CHARACTERISTICS - Continued:
PEAK
MAXIMUM
MAXIMUM
REVERSE
LEAKAGE
BREAKDOWN
VOLTAGE
REVERSE
STAND-OFF
VOLTAGE
TEST
CURRENT
PULSE
CLAMPING
CURRENT
MARKING
CODE
VOLTAGE
TYPE
(Note 1)
(V
BR
@ I )
T
V
I
I
@ V
V
@ I
V
I
MIN
V
MAX
V
RWM
V
T
R
RWM
C
PP
PP
A
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
μA
3SMC33CA
3SMC36CA
3SMC40CA
3SMC43CA
3SMC45CA
3SMC48CA
3SMC51CA
3SMC54CA
3SMC58CA
3SMC60CA
3SMC64CA
3SMC70CA
3SMC75CA
3SMC78CA
3SMC85CA
3SMC90CA
3SMC100CA
3SMC110CA
3SMC120CA
3SMC130CA
3SMC150CA
3SMC160CA
3SMC170CA
33
36.7
40.0
44.4
47.8
50.0
53.3
56.7
60.0
64.4
66.7
71.1
77.8
83.3
86.7
94.4
100.0
111.0
122.0
133.0
144.0
167.0
178.0
189.0
42.2
46.0
51.1
54.9
57.5
61.3
65.2
69.0
74.1
76.7
81.8
89.5
95.8
99.7
108.2
115.5
128.0
140.5
153.0
165.5
192.5
205.0
217.5
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103
113
56.2
51.6
46.4
43.2
41.2
38.8
36.4
34.4
32.0
31.0
29.2
26.6
24.8
22.8
20.8
20.6
18.6
16.8
15.6
14.4
12.4
11.6
11.0
CIFM
CIFP
CIFR
CIFT
CIFV
CIFX
CIFZ
CIGE
CIGG
CIGK
CIGM
CIGP
CIGR
CIGT
CIGV
CIGX
CIGZ
CIHE
CIHG
CIHK
CIHM
CIHP
CIHR
36
40
43
45
48
51
54
58
60
64
70
75
121
126
137
146
162
177
193
209
243
259
275
78
85
90
100
110
120
130
150
160
170
SMC - CASE - MECHANICAL OUTLINE
R4 (3-March 2008)
Package Details -
SMC
Mechanical Drawing
Lead Code:
Reference individual
device datasheet.
Part Marking: 3-6 Character Alpha/Numeric Code
Mounting Pad Geometry (Dimensions in mm)
TM
Central
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
R1 (10-December 2002)
Package Details -
SMC
Tape Dimensions and Orientation (Dimensions in mm.)
Tape Width: 16mm
* Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-2-A
Direction of Unreeling
Packaging Base
13” Reel =
Bulk =
3,000 pcs. (add TR13 suffix to part number)
100 pcs. (add BK suffix to part number)
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Quantity
Per Box
Number of
Reels per Box
Box Dimensions
Shipping Weight
INCH
CM
LB
KG
13”
39,000
13
14x14x8
36x36x20
22
10
Ordering Information
• For devices taped and reeled on 13” reels, add TR13 suffix to part number.
• For devices bulk packed, add BK suffix to part number.
• All SMDs are available bulk packed, for prototype and manual placement applications.
TM
Central
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
R1 (10-December 2002)
Material Composition Specification
SMC Case
Pb (lead)-free plating**
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Material
Substance
(mg)
Component
Material
Substance
CAS No.
(%wt)
1.63%
(mg)
(%wt)
(ppm)
16,000
391,070
17,350
940
active device
leadframe
doped Si
copper
3.8
Si
Cu
7440-21-3
1.6%
3.8
39.107% 90.92
7440-50-8 39.107% 90.92
Pb
7439-92-1 1.735%
7440-31-5 0.094%
7440-22-4 0.047%
4.033
0.218
0.109
high temperature
solder paste
die attach
encapsulation*
plating**
1.875%
4.36
Sn
Ag
470
silica
7631-86-9 38.606% 89.76
386,060
170,320
5,680
epoxy resin Proprietary 17.032%
Sb O
39.6
1.32
1.32
EMC
56.77%
56.77 %
132
132
1309-64-4 0.568%
79-94-7 0.568 %
2
3
TBBA
silica
5,680
7631-86-9 39.39% 91.592 393,942
EMC GREEN
epoxy resin Proprietary 17.38% 40.408 173,798
Sn
Pb
Sn
7440-31-5 0.529%
7439-92-1 0.132%
1.135
0.335
0.708
5,290
1,320
7,700
tin lead process 0.661% 1.419
100% tin process 0.661% 1.419
7440-31-5
0.77%
*EMC GREEN molding compound is Halogen-Free.
**Specify Lead-Free when ordering 100% tin (Pb-free) plating.
Disclaimer
The information provided in this Material Composition data sheet is, to our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
TM
Central
R2 (10-March 2008)
Semiconductor Corp.
www. cent ralsemi. com
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