JANTXV1N746D-1 [CDI-DIODE]
Zener Diode, 3.3V V(Z), 1%, 0.48W, Silicon, Unidirectional, DO-204AH, DO-35;
| 型号： | JANTXV1N746D-1 |
| 厂家： | 
COMPENSATED DEUICES INCORPORATED |
| 描述： | Zener Diode, 3.3V V(Z), 1%, 0.48W, Silicon, Unidirectional, DO-204AH, DO-35 测试 二极管 |
| 文件： | 总21页 (文件大小：75K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 3 August 2004.
INCH-POUND
MIL-PRF-19500/127P
3 May 2004
SUPERSEDING
MIL-PRF-19500/127N
09 July 1999
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR,
TYPES 1N4370A-1 THROUGH 1N4372A-1, AND 1N746A-1 THROUGH 1N759A-1, 1N4370AUR-1 THROUGH
1N4372AUR-1 AND 1N746AUR-1 THROUGH 1N759AUR-1, 1N4370C-1 THROUGH 1N4372C-1, AND 1N746C-1
THROUGH 1N759C-1, 1N4370CUR-1 THROUGH 1N4372CUR-1 AND 1N746CUR-1 THROUGH 1N759CUR-1,
1N4370D-1, THROUGH 1N4372D-1, AND 1N746D-1 THROUGH 1N759D-1, 1N4370DUR-1 THROUGH
1N4372DUR-1 AND 1N746DUR-1 THROUGH 1N759DUR-1,
JAN, JANTX, JANTXV, JANHC, AND JANKC
JANS level (see 6.4).
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
*
The requirements for acquiring the product described herein shall
consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for 500 milliwatt, silicon, voltage regulator
diodes with voltage tolerances of 5, 2, and 1 percent. Three levels of product assurance are provided for each
encapsulated device type as specified in MIL-PRF-19500. Two level of product assurance is provided for each
unencapsulated device .
1.2 Physical dimensions. See 3.4 and figure 1 (similar to DO-35) and figure 2 (similar to DO-213AA), and figures
3 and 4 for die.
* 1.3 Maximum ratings. Maximum ratings are as shown in maximum and primary test ratings (see 3.9) herein and
as follows:
PT = 500 mW, (DO-35) at TL = +50 C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink at
°
L = .375 inch (9.53 mm). Derate IZ to 0.0 mA dc at +175 C.
°
PT = 500 mW, (DO-213AA) at TEC = +125 C, derate to 0 at +175 C. -65 C TJ ≤ +175 C; -65 C TSTG ≤
°
°
°
≤
°
°
≤
+175 C.
°
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus,
ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43216-5000, or emailed to Semiconductor@dscc.dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the ASSIST
Online database at http://www.dodssp.daps.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/127P
* 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary
test ratings (see 3.9) herein and as follows:
2.4 V dc VZ ≤ 12 v dc.
≤
1N4370A-1 through 1N4372A-1 and 1N746A-1 through 1N759A-1 are 5 percent voltage tolerance.
±
1N4370C-1 through 1N4372C-1 and 1N746C-1 through 1N759C-1 are 2 percent voltage tolerance.
±
1N4370D-1 through 1N4372D-1 and 1N746D-1 through 1N759D-1 are 1 percent voltage tolerance.
±
Thermal resistance:
RθJL = 250 C/W maximum at L = .375 inch (9.53 mm) (D0-35).
°
RθJEC = 100 C/W maximum. Junction to end-caps (D0-213AA).
°
2. APPLICABLE DOCUMENTS
*
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
*
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
*
*
*
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500 Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750 Test Methods for Semiconductor Devices.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
-
-
http://www.dodssp.daps.mil from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
* 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
2
MIL-PRF-19500/127P
Symbol
Dimensions
Notes
3
Inches
Millimeters
Min
.055
.120
.018
1.000
Max
.090
.200
.023
1.500
.050
Min
1.40
3.05
0.46
25.40
Max
2.29
5.08
0.56
BD
BL
LD
LL
38.10
1.27
LU
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Symbol BD shall be measured at the largest diameter.
4. Within LU, lead diameter may vary to allow for flash, lead finish build-up, and minor irregularities
other than heat slugs.
5. In accordance with ASME Y14.5M, diameters are equivalent to X symbology.
φ
FIGURE 1. Physical dimensions for types 1N4370A-1 through 1N4372A-1, 1N4370C-1 through 1N4372C-1,
1N4370D-1 through 1N4372D-1, 1N746A-1 through 1N759A-1, 1N746C-1 through 1N759C-1, and
1N746D-1 through 1N759D-1 (DO-35).
3
MIL-PRF-19500/127P
Symbol
Dimensions
Inches
Millimeters
0.03 min
Min
.130
.063
.016
Max
.146
.067
.022
Min
3.30
1.60
0.41
Max
3.70
1.70
0.55
BL
BD
ECT
S
.001 min
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to X symbology.
φ
FIGURE 2. Physical dimensions for types 1N4370AUR-1 through 1N4372AUR-1, 1N4370CUR-1 through
1N4372CUR-1, 1N4370DUR-1 through 1N4372DUR-1, 1N746AUR-1 through 1N759AUR-1,
1N746CUR-1 through 1N759CUR-1, and 1N746DUR-1 through 1N759DUR-1 (DO-213AA).
4
MIL-PRF-19500/127P
(A – version)
Ltr
Dimensions
Inches
Millimeters
Min Max
Min
.021
.013
Max
.025
.017
A
B
0.53
0.33
0.63
0.43
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. The physical characteristics of the die thickness are .010 .002 (0.25
±
mm 0.051 mm). Metallization is top = (anode)-AL, back: (cathode)-AU.
±
AL thickness = 25,000 Å minimum, AU thickness = 4,000 Å minimum.
4. Circuit layout data: For zener operation, cathode must be operated
positive with respect to anode.
FIGURE 3. Physical dimensions (JANHCA and JANKCA die dimensions).
5
MIL-PRF-19500/127P
(B – version)
Ltr
Dimensions
Inches
Millimeters
Min Max
Min
.024
.017
Max
.028
.021
A
B
0.61
0.43
0.71
0.53
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. The physical characteristics of the die thickness are .010 .002 (0.25
±
mm 0.051 mm). Metallization is top = (anode)-AL, back: (cathode)-AU.
±
AL thickness = 40,000 Å minimum, AU thickness = 5,000 Å minimum.
4. Circuit layout data: For zener operation, cathode must be operated
positive with respect to anode.
FIGURE 4. Physical dimensions (JANHCB and JANKCB die dimensions).
6
MIL-PRF-19500/127P
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-19500, and as follows.
EC - - - - end-caps
3.4 Interface and physical dimensions. The interface and physical dimensions shall be specified in
MIL-PRF-19500 and figures 1 and 2 (similar to DO-35 and DO-213AA), and figures 3 and 4 (die) herein.
3.4.1 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
* 3.4.2 Diode construction. All devices shall be metallurgically bonded double plug construction in accordance with
the requirements of category I, II, or III (see MIL-PRF-19500).
3.5 Marking. Devices shall be marked in accordance with MIL-PRF-19500. At the option of the manufacturer, the
DO-35 version may leave off “-“ portion of the type designator (example: JANTX1N4370A1).
3.5.1 Marking of UR-1 version devices. For UR-1 version devices only, all marking (except polarity) may be
omitted from the body, but shall be retained on the initial container.
3.6 Selection of tight tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, or
JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5
percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tightened
tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish
correlation. For C and D tolerance levels, T = +25 C 2 C at .375 inch (9.53 mm) from body or equivalent.
± °
°
L
* 3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, table I and table II.
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table III
herein.
* 3.9 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are
specified in table III herein.
3.10 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
7
MIL-PRF-19500/127P
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 JANHC and JANKC devices. JANHC and JANKC devices shall be qualified in accordance with appendix G
of MIL-PRF-19500.
4.2.2 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification
report.
4.3 Screening (JAN, JANTX, and JANTXV levels only). Screening shall be in accordance with table IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table IV
of
Measurement
MIL-PRF-19500)
JANTX and JANTXV levels
JAN level
3a
Temperature cycling
Temperature cycling (in accordance
with JANTX level of MIL-PRF-19500).
(1) 3c
9
Thermal impedance (see 4.3.2)
Not applicable
Thermal impedance (see 4.3.2).
Not applicable
11
IR1 and VZ2
Not applicable
12
See 4.3.3, t = 48 hours
Not applicable
(2) 13
I
100 percent of initial reading or 50 nA
≤
Not applicable
∆
R1
dc, whichever is greater.
2 percent initial reading.
V
∆
≤ ±
Z
Subgroup 2 of table I herein.
(1) Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in
accordance with MIL-PRF-19500, screen 3 prior to this thermal test.
(2) PDA = 5 percent for screen 13 applies to
I
and
V
∆
Z2
, and I and V . Thermal impedance (Z
) is
JX
∆
R1
R1 Z2
θ
not required in screen 13.
4.3.1 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
appendix G of MIL-PRF-19500.
8
MIL-PRF-19500/127P
4.3.2 Thermal impedance (Z
. The Z
JX)
measurements shall be performed in accordance with method 3101
JX
θ
θ
of MIL-STD-750 to remove atypical devices. The maximum limit shall not exceed the group A subgroup 2 limit. If a
lot exhibits an out of control condition, the entire lot shall be removed from the line and held for engineering
evaluation and disposition.
a.
b.
c.
d.
I
I
t
t
measurement current .............................1 mA - 10 mA.
forward heating current ........................... .5 A - 1.0 A.
heating time ............................................10 ms.
M
H
H
measurement delay time .....................70 s maximum.
µ
MD
* 4.3.3 Power burn-in conditions. Power burn-in conditions are as follows: IZ = column 8 of table IV minimum; TA
shall be room ambient in accordance with MIL-STD-750, section 4.5. Mounting and test conditions in accordance
with method 1038 of MIL-STD-750, condition B. Adjust IZ or TA to achieve the required TJ. Use method 3100 of
MIL-STD 750 to measure T . T = 125 C minimum.
°
J
J
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. Group A inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 herein. Electrical
measurements (end-points) shall be in accordance with the applicable inspections of table I, subgroup 2 herein.
(Z JX applies to B3 only.)
θ
* 4.4.2.1 Group B inspection, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
Method
1056
1051
4066
1027
Condition
0 C to +100 C, 10cycles.
B2
B2
B2
B3
°
°
-55 C to +175 C, 25 cycles.
°
°
See 4.5.1.
*
I
ZM = Column 8 of table III minimum. Adjust IZM or T to ensure a TJ = 150 C
°
A
(minimum).
B4
B6
2075
1032
See 4.5.6.
TA = 175 C
°
9
MIL-PRF-19500/127P
*4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein. (Z JX applies to C6 only.)
θ
Subgroup
Method
1056
Condition
0 C to +100 C, 10 cycles.
C2
C2
C2
°
°
1051
-55 C to +175 C, 20 cycles.
° °
2036
Tension: Test condition A; weight = 4 pounds, t = 15 seconds.
Lead fatigue: Test condition E. (Tension and lead fatigue are not required for
UR-1 suffix devices)
C2
C3
C5
1071
Test condition E.
Not applicable.
See 4.5.5 herein.
*
*
3101
or
4081
C6
1026
IZM = Column 8 of table III minimum. Adjust IZM or T to ensure a TJ = 150 C
°
A
(minimum).
C7
C8
Not applicable.
4071
IZ = 7.5 mA dc, T1 = +25 C 5 C, T2 = +125 C 5 C. (Max limit in accordance
± ° ± °
°
°
with columns 13 and 14 of table III). Sample size = 22, 0 rejects allowed.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table IX of MIL-PRF-19500 and table II herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Surge current (IZSM). The peak currents shown in column 10 of table III shall be applied in the reverse
direction and these shall be imposed on the current (I = 20 mA dc) a total of 5 surges at 1-minute intervals. Each
Z
individual surge shall be one-half square-wave-pulse of one one-hundred twenty second duration or an equivalent
one-half sine wave with the same effective rms current. T = +25 C 5 C.
± °
°
A
4.5.2 Regulator voltage measurements. The test current shall be applied until thermal equilibrium is attained (20
2 seconds) prior to reading the breakdown voltage. For this test, the diode shall be suspended by its leads with
±
mounting clips whose inside edge is located at .375 inch (9.53 mm) from the body (UR version = 0 lead length) and
the mounting clips shall be maintained at a temperature of +25 C +8 C, and -2 C. This measurement may be
°
°
°
performed after a shorter time following application of the test current than that which provides thermal equilibrium if
correlation to stabilized readings can be established to the satisfaction of the Government. JANHC and JANKC shall
be pulse tested at 10 ms maximum.
4.5.3 Voltage regulation V (reg). Voltage regulation shall be determined by the difference of the regulator
Z
voltage measured at different currents as specified in table I, subgroup 7. Both test shall be performed at thermal
equilibrium. This
V shall not exceed column 7 of table III.
Z
∆
10
MIL-PRF-19500/127P
4.5.4 Temperature coefficient of regulator voltage ( V ). The device shall be temperature stabilized with current
α
Z
applied prior to reading regulator voltage at the specified ambient temperature as specified in paragraph 4.4.3, group
C, subgroup 8.
4.5.5 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 3101
or 4081 of MIL-STD-750. Forced moving air or draft shall not be permitted across the device during test. The
maximum limit for R
under these test conditions shall be R
= 250 C/W or R
= 100 C/W. The
°
JEC(max)
°
JL
JL(max)
θ
θ
θ
following conditions shall apply when using method 3101:
a. I
.............................................................1 mA to 10 mA.
M
H
H
b. I
.............................................................200 mA to 400 mA.
.............................................................25 seconds minimum.
c. t
d. t
.............................................................70 s maximum.
µ
MD
LS = Lead spacing = .375 inch as defined on figure 5 below:
LS = 0 inch for "UR" suffix devices.
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
FIGURE 5. Mounting conditions.
4.5.5.1 For initial qualification and requalification. Read and record data in accordance with table II herein and
shall be included in the qualification report.
4.5.6 Decap internal visual scribe and break. Scratch glass at cavity area with diamond scribe. Carefully snap
open. Using 30X magnification examine the area where die (or bonding material) are in contact with the plugs, verify
metallurgical bonding area. If the verification of the metallurgical bonding area is in question, test method 3101 of
MIL-STD-750; and limits herein (Z
) shall be used to determine suitability for use.
JX
θ
11
MIL-PRF-19500/127P
TABLE I. Group A inspection.
Inspection 1/
Subgroup 1
MIL-STD-750
Conditions
Symbol
Limits 2/
Unit
Method
2071
Min
Max
Visual and mechanical
examination
Subgroup 2
Forward voltage
Reverse current
4011
4016
IF = 200 mA dc.
VF
1.1
V dc
DC method, VR = column 11 of
table III.
IR1
VZ1
VZ2
Z
Col. 12
A dc
µ
Regulator voltage (see
4.5.2)
4022
4022
3101
IZ1 = 250 A dc.
Col. 9
Col. 3
Col. 4
Col. 4
35
V dc
V dc
µ
Regulator voltage (see
4.5.2)
IZ2 = 20 mA dc.
Thermal impedance
-1 suffix
See 4.3.2, not applicable for
JANHC and JANKC.
C/W
°
JX
θ
Subgroup 3
High temperature
operation
T = 150 C
°
A
Reverse current
Subgroup 4
4016
4051
DC method, VR = column 11 of
table III.
IR2
Col. 5
Col. 6
A dc
µ
Small-signal reverse
IZ = 20 mA dc,
ZZ
ohm
breakdown impedance
ISIG = 10 percent of IZ ac.
Subgroups 5
Not applicable
See footnotes at end of table.
12
MIL-PRF-19500/127P
TABLE I. Group A inspection - Continued.
Inspection 1/
Subgroup 6
MIL-STD-750
Symbol
Limits 2/
Unit
Method
4066
Conditions
Min
Max
Surge
See 4.5.1
Electrical
measurements
See table I, subgroup 2.
See 4.5.1
Surge
4066
Subgroup 7
Voltage regulation (see
4.5.3)
IZ3 = 2 mA dc; IZ4 = 20 mA dc
VZ (reg)
Col. 7
V dc
1/ For sampling plan, see MIL-PRF-19500.
2/ Column references are to table III.
13
MIL-PRF-19500/127P
* TABLE II. Group E inspection qualification and requalification (all product assurance levels).
Qualification
Inspection 1/
MIL-STD-750
Conditions
conformance inspection
(sampling plan)
Method
1051
Subgroup 1
45 devices, c = 0
Temperature cycling
500 cycles, -55 C to +175 C.
° °
Electrical measurements
Subgroup 2
See table I, subgroup 2 herein.
22 devices, c = 0
Intermittent operation life
1037
2101
6,000 cycles. IZ = column 8 of table III.
See table I, subgroup 2 herein.
Electrical measurements
Subgroup 3
3 devices, c = 0
Decap analysis
Cross section and scribe and break.
Separate samples shall be used for each test.
Subgroup 4
N/A
Thermal impedance
curves
Each supplier shall submit their (typical)
maximum design thermal impedance curves.
In addition, the optimal test conditions and Z
JX
θ
limit shall be provided to the qualifying activity
in the qualification report.
Subgroups 5 and 6
Not applicable
Subgroup 8
45 devices, c = 0
Resistance to glass
cracking
1057
Condition B. Cool down after solder immersion
is permitted. Test until failure occurs on all
devices with the chosen sample or to a
maximum of 25 cycles, whichever comes first.
14
MIL-PRF-19500/127P
15
MIL-PRF-19500/127P
16
MIL-PRF-19500/127P
17
MIL-PRF-19500/127P
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or
*
order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or
Defense Agency, or within the Military Service’s system commands. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by
contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.
*
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Packaging requirements (see 5.1).
c. Lead finish (see 3.4.1).
d. Product assurance level and type designator.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML No. 19500) whether
or not such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the
products covered by this specification. Information pertaining to qualification of products may be obtained from
Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43216-5000 or e-mail
vqe.chief@dla.mil.
18
MIL-PRF-19500/127P
6.4 Cross reference substitution list. Devices required for space flight applications are found in
MIL-PRF-19500/533. Existing supplies of parts can be used until existing supplies are exhausted. A PIN for PIN
replacement table follows, and these devices are directly interchangeable:
JANS
JANS
superseded PIN
superseding PIN
1N6309, C, D
1N6310, C, D
1N6311, C, D
1N6312, C, D
1N6313, C, D
1N6314, C, D
1N6315, C, D
1N6316, C, D
1N6317, C, D
1N6318, C, D
1N6319, C, D
1N6320, C, D
1N6321, C, D
1N6322, C, D
1N6323, C, D
1N6324, C, D
1N6326, C, D
1N4370A-1, C-1 or D-1
1N4371A-1, C-1 or D-1
1N4372A-1, C-1 or D-1
1N746A-1, C-1 or D-1
1N747A-1, C-1 or D-1
1N748A-1, C-1 or D-1
1N749A-1, C-1 or D-1
1N750A-1, C-1 or D-1
1N751A-1, C-1 or D-1
1N752A-1, C-1 or D-1
1N753A-1, C-1 or D-1
1N754A-1, C-1 or D-1
1N755A-1, C-1 or D-1
1N756A-1, C-1 or D-1
1N757A-1, C-1 or D-1
1N758A-1, C-1 or D-1
1N759A-1, C-1 or D-1
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MIL-PRF-19500/127P
* 6.5 Suppliers of JANHC and JANKC die. The qualified JANHC and JANKC die suppliers with the applicable letter
version (example JANHCA1N4370A) will be identified on the QML.
JANHC ordering information (1) (2)
PIN
Manufacture CAGE
43611
12954
1N4370
1N4371
1N4372
1N746
1N747
1N748
1N749
1N750
1N751
1N752
1N753
1N754
1N755
1N756
1N757
1N758
1N759
JANHCA1N4370
JANHCA1N4371
JANHCA1N4372
JANHCA1N746
JANHCA1N747
JANHCA1N748
JANHCA1N749
JANHCA1N750
JANHCA1N751
JANHCA1N752
JANHCA1N753
JANHCA1N754
JANHCA1N755
JANHCA1N756
JANHCA1N757
JANHCA1N758
JANHCA1N759
JANHCB1N4370
JANHCB1N4371
JANHCB1N4372
JANHCB1N746
JANHCB1N747
JANHCB1N748
JANHCB1N749
JANHCB1N750
JANHCB1N751
JANHCB1N752
JANHCB1N753
JANHCB1N754
JANHCB1N755
JANHCB1N756
JANHCB1N757
JANHCB1N758
JANHCB1N759
(1) Suffixes can be “A”, ”C”, or “D”.
(2) Replace “HC” with “KC” when ordering JANKC die.
6.6 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes
no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
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MIL-PRF-19500/127P
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
Review activities:
Army – AR, AV, MI, SM
Air Force – 19
(Project 5961-2725)
Navy – AS, MC
* NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://www.dodssp.daps.mil.
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