CAT3200_07

更新时间:2024-09-18 06:41:47
品牌:CATALYST
描述:Low Noise Regulated Charge Pump DC-DC Converter

CAT3200_07 概述

Low Noise Regulated Charge Pump DC-DC Converter 低噪声稳压电荷泵DC- DC转换器

CAT3200_07 数据手册

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CAT3200, CAT3200-5  
Low Noise Regulated Charge Pump DC-DC Converter  
FEATURES  
Thermal overload shutdown protection  
Constant high frequency (2MHz) operation  
100mA output current  
Low value external capacitors (1µF)  
Foldback current overload protection  
Shutdown current less than 1µA  
Regulated output voltage (5V fixed CAT3200-5,  
Adjustable CAT3200)  
Low quiescent current (1.7mA typ.)  
Input voltage operation down to 2.7V  
Soft start, slew rate control  
CAT3200-5 in low profile (1mm thin) 6-lead  
SOT23 package  
CAT3200 in MSOP-8 package  
APPLICATIONS  
3V to 5V boost conversion  
White LED driver  
Local 5V supply from lower rail  
Battery backup systems  
USB On-The-Go 5V supply  
Handheld portable devices  
DESCRIPTION  
A shutdown control input allows the device to be  
placed in power-down mode, reducing the supply  
current to less than 1µA.  
The CAT3200 and CAT3200-5 are switched capacitor  
boost converters that deliver a low noise, regulated  
outputvoltage. TheCAT3200-5givesafixedregulated  
5V output. The CAT3200 has an adjustable output  
usingexternalresistors. Theconstantfrequency2MHz  
charge pump allows small 1µF ceramic capacitors to  
be used.  
In the event of short circuit or overload conditions, the  
device is fully protected by both foldback current  
limiting and thermal overload detection. In addition, a  
soft start, slew rate control circuit limits inrush current  
during power-up.  
Maximum output loads of up to 100mA can be  
supported over a wide range of input supply voltages  
(2.7V to 4.5V) making the device ideal for battery-  
powered applications.  
The CAT3200-5 is available in a 6-lead, 1mm max  
thin SOT23 package. The CAT3200 is available in an  
8-lead MSOP package.  
TYPICAL APPLICATION  
5V Output  
Adjustable Output  
CNEG  
CPOS  
CNEG  
CPOS  
5V  
V
V
V
IN  
OUT  
FB  
IN  
OUT  
V
IN  
IN  
OUT  
100mA  
OUT  
100mA  
CAT3200-5  
CAT3200  
R
1
ON OFF  
ON OFF  
+
-
+
-
SHDN  
SHDN  
3.3V  
3.3V  
GND  
GND  
R
2
(
R
R
1
2
V
= 1.27 V 1+  
(
OUT  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
1
CAT3200/3200-5  
ORDERING INFORMATION  
Quantity  
per Reel  
Part Number  
Output Voltage  
Package  
Package Marking  
CAT3200TDI-T3  
CAT3200ZI-T3  
CAT3200ZI-GT3  
5V  
6-lead thin SOT23, Lead Free  
8-lead MSOP, Lead Free  
8-lead MSOP, NiPdAu  
LN  
3,000  
3,000  
3.000  
Adjustable  
Adjustable  
ABME  
ABRU  
PIN DESCRIPTIONS  
Designation  
Description  
OUT  
GND  
SHDN  
CNEG  
IN  
Regulated output voltage.  
Ground reference for all voltages.  
Shutdown control logic input (Active LOW)  
Negative connection for the flying capacitor.  
Input power supply.  
CPOS  
FB  
Positive connection for the flying capacitor.  
Feedback to set the output voltage.  
Power ground.  
PGND  
SGND  
Signal ground.  
PIN CONFIGURATION  
6-lead Thin SOT23  
8-pin MSOP  
OUT  
FB  
CPOS  
IN  
1
2
3
4
8
7
6
5
OUT  
GND  
1
2
3
6
5
4
CPOS  
IN  
CAT3200-5  
CAT3200  
CNEG  
PGND  
SHDN  
SGND  
SHDN  
CNEG  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
2
CAT3200/3200-5  
ABSOLUTE MAXIMUM RATINGS  
Power Dissipation (8-MSOP).............................0.5W  
VIN, VOUT, SHDN, CNEG, CPOS Voltage.. -0.6V to 6.0V  
VOUT Short Circuit Duration......................... Indefinite  
Output Current ................................................200mA  
ESD Protection (HBM) .....................................2000V  
Junction Temperature ...................................... 150°C  
Storage Temperature Range .............-65°C to 160°C  
Lead Soldering Temperature (10 sec)............. 300°C  
Power Dissipation (SOT23-6) ............................ 0.3W  
RECOMMENDED OPERATING CONDITIONS  
VIN ................................................................................... 2.7V to 4.5V  
CIN, COUT, CFLY .......................................................................... 1µF  
ILOAD ................................................................................. 0 to 100mA  
Ambient Temperature Range................... -40°C to 85°C  
ELECTRICAL SPECIFICATIONS  
Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1µF ceramic capacitors and VIN  
is set to 3.6V.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VOUT  
Regulated Output  
I
I
LOAD 40mA, VIN 2.7 V  
LOAD 100mA, VIN 3.1 V  
4.8  
5.0  
5.2  
V
VLINE  
VLOAD  
FOSC  
VR  
Line Regulation  
3.1V VIN 4.5V, ILOAD = 50mA  
6
mV  
mV  
Load Regulation  
Switching Frequency  
ILOAD = 10mA to 100mA, VIN = 3.6V  
20  
2.0  
30  
1.3  
2.6  
MHz  
mVp-p  
Output Ripple  
Voltage  
ILOAD = 100mA  
CAT3200-5 Only  
η
Efficiency  
ILOAD = 50mA, VIN = 3V, CAT3200-5  
ILOAD = 0mA, SHDN = VIN  
80  
%
IGND  
ISHDN  
Ground Current  
1.6  
4
1
mA  
µA  
Shutdown Input  
Current  
ILOAD = 0mA, SHDN = 0V to VIN  
VFB  
IFB  
FB Voltage  
CAT3200 Only  
1.22  
-50  
1.27  
10  
1.32  
50  
V
nA  
FB Input Current  
Open-Loop  
CAT3200 Only  
ROL  
ILOAD = 100mA, VIN = 3V (Note 1)  
Resistance  
TON  
VOUT Turn-on time  
(10% to 90%)  
ILOAD = 0mA, VIN = 3V  
0.5  
0.8  
ms  
VIHSHDN  
VILSHDN  
IROUT  
High Detect  
Shutdown Threshold  
1.3  
30  
V
V
Low Detect  
Shutdown Threshold  
0.4  
Reverse Leakage  
into OUT pin  
VOUT = 5V, Shutdown mode (Note 2)  
VOUT = 0V  
15  
µA  
ISC  
TSD  
Short-circuit Output  
Thermal Shutdown  
Thermal Hysteresis  
80  
160  
20  
mA  
°C  
THYST  
°C  
Note 1: ROL = (2VIN - VOUT)/IOUT  
Note 2: In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor  
feedback network. This will cause a small level of reverse current to flow back into the device to ground.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-5002, Rev. L  
3
CAT3200/3200-5  
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)  
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.  
Shutdown Input Threshold vs. Supply Voltage  
Ground Current vs. Supply Voltage (No Load)  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
2.7  
3.0  
3.3  
3.6  
3.9  
INPUT VOLTAGE [V]  
4.2  
4.5  
2.7  
3.0  
3.3  
3.6  
3.9  
INPUT VOLTAGE [V]  
4.2  
4.5  
Line Regulation  
Load Regulation  
5.2  
5.1  
5.0  
4.9  
4.8  
5.2  
5.1  
5.0  
4.9  
4.8  
20mA Load  
VIN = 3.2V  
100mA Load  
VIN = 3V  
VIN = 2.7V  
0
50 100  
LOAD CURRENT [mA]  
150  
2.7  
3.0  
3.3  
3.6  
3.9  
INPUT VOLTAGE [V]  
4.2  
4.5  
Oscillator Frequency vs. Supply Voltage  
Efficiency vs. Load Current  
2.6  
100  
90  
VIN=  
2.7V  
2.4  
2.2  
2.0  
1.8  
1.6  
VIN=3.2V  
80  
3.7V  
VIN=  
70  
60  
50  
4.5V  
VIN=  
40  
30  
1
100  
10  
LOAD CURRENT [mA]  
2.7  
3.0  
3.3  
3.6  
3.9  
INPUT VOLTAGE [V]  
4.2  
4.5  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
4
CAT3200/3200-5  
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)  
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.  
Soft Start Power Up (90mA Load, 3.3V Input)  
Load Step Response (3.3V Input)  
Output Ripple (100mA Load, 3.3V Input)  
Short Circuit Current vs Supply Voltage  
250  
200  
150  
100  
50  
0
2.7  
3.0  
3.3  
3.6  
3.9  
INPUT VOLTAGE [V]  
4.2  
4.5  
Output Voltage Change vs. Temperature  
Oscillator Frequency Change vs. Temperature  
2
4
1
2
0
10mA Load  
0
-1  
-2  
-2  
-4  
-40 -20  
0
20  
40  
TEMPERATURE [ C]  
60  
80 100  
-40 -20  
0
20  
40  
TEMPERATURE [ C]  
60  
80 100  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-5002, Rev. L  
5
CAT3200/3200-5  
BLOCK DIAGRAM  
CNEG CPOS  
CNEG CPOS  
2V  
IN  
2V  
2MHz  
Voltage  
Doubler  
IN  
2MHz  
Voltage  
Doubler  
IN  
IN  
SHDN  
SHDN  
EN  
EN  
+
+
5V/100mA  
OUT  
FB  
1.25V  
1.25V  
5V  
OUT  
100mA  
300k  
100k  
SGND  
GND  
PGND  
CAT3200 Adjustable Output  
CAT3200-5 5V Fixed Output  
PIN FUNCTIONS  
IN is the power supply. During normal operation the  
device draws a supply current which is almost constant.  
A very brief interval of non-conduction will occur at the  
switchingfrequency.Thedurationofthenon-conduction  
interval is set by the internal non-overlapping  
“break-before-make” timing. IN should be bypassed  
with a 1µF to 4.7µF low ESR (Equivalent Series  
Resistance) ceramic capacitor.  
resistor network (400k). The feedback network will  
result in a reverse current of 10µA to 20µA to flow back  
through the device to ground.  
Wheneverthedeviceistakenoutofshutdownmode,the  
output voltage will experience a slew rate controlled  
power-up. Full operating voltage is typically achieved in  
less than 0.5 msec.  
For filtering, a low ESR ceramic bypass capacitor (1µF)  
incloseproximitytotheINpinpreventsnoisefrombeing  
injected back into the power supply.  
GNDisthegroundreferenceforallvoltagesonCAT3200-  
5 devices.  
SHDN is the logic control input (Active LOW) that places  
the device into shutdown mode. The internal logic is  
CMOS and the pin does not use an internal pull-down  
resistor. The SHDN pin should not be allowed to float.  
FB (CAT3200 Only) is the feedback input pin. An output  
divider should be connected from OUT to FB to program  
the output voltage.  
CPOS,CNEGarethepositiveandnegativeconnections  
respectively for the charge pump flying capacitor. A low  
ESR ceramic capacitor (1µF) should be connected  
between these pins. During initial power-up it may be  
possibleforthecapacitortoexperienceavoltagereversal  
and for this reason, avoid using a polarized (tantalum or  
aluminum) flying capacitor.  
PGND (CAT3200 Only). Is the same as GND for the  
CAT3200-5 except for the internal reference connection  
to SGND.  
SGND (CAT3200 Only) Ground pin for the internal  
reference. The CNEG connection is switched to this pin  
during the normal charge pump operation.  
OUT is the regulated output voltage to power the load.  
During normal operation, the device will deliver a train of  
current pulses to the pin at a frequency of 2MHz.  
Adequate filtering on the pin can typically be achieved  
through the use a low ESR ceramic bypass capacitor  
(1µF to 4.7µF) in close proximity to the OUT pin. The  
ESR of the output capacitor will directly influence the  
output ripple voltage.  
When the shutdown mode is entered, the output is  
immediatelyisolatedfromtheinputsupply,however,the  
output will remain connected to the internal feedback  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
6
CAT3200/3200-5  
Typical values for total voltage divider resistance can  
range from several ks up to 1M.  
DEVICE OPERATION  
The CAT3200/CAT3200-5 use a switched capacitor  
charge pump to boost the voltage at IN to a regulated  
output voltage. Regulation is achieved by sensing the  
output voltage through an internal resistor divider  
(CAT3200-5) and modulating the charge pump output  
current based on the error signal. A 2-phase non-  
overlapping clock activates the charge pump switches.  
TheflyingcapacitorischargedfromtheINvoltageonthe  
firstphaseoftheclock. Onthesecondphaseoftheclock  
itisstackedinserieswiththeinputvoltageandconnected  
toOUT.Thecharginganddischargingtheflyingcapacitor  
continues at a free running frequency of typically 2MHz.  
1
3
CNEG  
CPOS  
V
2
OUT  
8
IN  
OUT  
R1  
1 +  
1.27V  
( )  
R2  
R1  
R2  
FB 7  
C
OUT  
PGND 4  
SGND 5  
6
SHDN  
In shutdown mode all circuitry is turned off and the  
CAT3200/CAT3200-5 draw only leakage current from  
the VIN supply. OUT is disconnected from IN. The SHDN  
pin is a CMOS input with a threshold voltage of  
approximately 0.8V. The CAT3200/CAT3200-5 is in  
shutdown when a logic LOW is applied to the SHDN pin.  
The SHDN pin is a high impedance CMOS input. SHDN  
does not have an internal pull-down resistor and should  
not be allowed to float and. It must always be driven with  
a valid logic level.  
Figure 1: Programming the Adjustable CAT3200  
Short-Circuit and Thermal Protection  
TheCAT3200andCAT3200-5havebuilt-inshort-circuit  
current limiting and over temperature protection. During  
overload conditions, output current is limited to  
approximately 225mA. At higher temperatures, or if the  
inputvoltageishighenoughtocauseexcessivechipself  
heating, the thermal shutdown circuit shuts down the  
charge pump as the junction temperature exceeds  
approximately 160°C. Once the junction temperature  
drops back to approximately 140°C, the charge pump is  
enabled. The CAT3200and CAT3200-5 will cycle in and  
out of thermal shutdown indefinitely without latch-up or  
damage until a short-circuit on OUT is removed.  
Programming the CAT3200 Output Voltage (FB Pin)  
The CAT3200-5 version has an internal resistive divider  
to program the output voltage. The programmable  
CAT3200 may be set to an arbitrary voltage via an  
external resistive divider. Since it employs a voltage  
doubling charge pump, it is not possible to achieve  
output voltages greater than twice the available input  
voltage. Figure 1 shows the required voltage divider  
connection. The voltage divider ratio is given by the  
formula:  
R1  
V
OUT  
=
1  
R2 1.27V  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-5002, Rev. L  
7
CAT3200/3200-5  
APPLICATION INFORMATION  
Ceramic Capacitors  
Ceramic capacitors of different dielectric materials lose  
theircapacitancewithhighertemperatureandvoltageat  
different rates. For example, a capacitor made of X5R or  
X7R material will retain most of its capacitance from –  
40°C to 85°C whereas a Z5U or Y5V style capacitor will  
lose considerable capacitance over that range.  
The overall junction to ambient thermal resistance (θJA)  
for device power dissipation (PD) consists primarily of  
two paths in series. The first path is the junction to the  
case (θJC) which is defined by the package style, and the  
second path is case to ambient (θCA) thermal resistance  
which is dependent on board layout. The final operating  
junction temperature for any set of conditions can be  
estimated by the following thermal equation:  
TJUNC = TAMB + P (ΘJC ) + P (ΘCA )  
D
D
Z5UandY5Vcapacitorsmayalsohavevoltagecoefficient  
causing them to lose 60% or more of their capacitance  
when the rated voltage is applied. When comparing  
differentcapacitorsitisoftenusefulconsidertheamount  
of achievable capacitance for a given case size rather  
than discussing the specified capacitance value. For  
example,overratedvoltageandtemperatureconditions,  
a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may  
not provide any more capacitance than a 0.22µF, 10V,  
X7R available in the same 0603 case. For many  
CAT3200/CAT3200-5applicationsthesecapacitorscan  
be considered roughly equivalent.  
= TAMB + P (ΘJA )  
D
The CAT3200 in SOT23 package, when mounted on  
printed circuit board with two square inches of copper  
allocated for heat spreading, will result with an overall  
θJA of less than 150°C/W.  
For a typical application operating from a 3.8V input  
supply, the maximum power dissipation is 260mW  
(100mA x 3V). This would result if a maximum junction  
temperature of :  
The capacitor manufacturers data sheet should be  
consultedtodeterminewhatvalueofcapacitorisneeded  
to ensure the desired capacitance at all temperatures  
and voltages. Below is a list of ceramic capacitor  
manufacturers and how to contact them:  
T
JUNC = TAMB + P (θJA)  
D
= 85°C + 0.26W (150°C/W)  
= 85°C + 39°C = 124°C  
The use of multi-layer board construction with power  
planes will further enhance the overall thermal  
performance. In the event of no dedicated copper area  
being used for heat spreading, a multi-layer board will  
typically provide the CAT3200 with an overall θJA of  
200°C/W. This level of thermal conduction would allow  
up to 200mW be safely dissipated within the device.  
Capacitor  
Manufacturer Web  
Phone  
Murata  
www.murata.com  
814.237.1431  
843.448.9411  
AVX/Kemet  
Vishay  
www.avxcorp.com  
www.vishay.com  
www.kemet.com  
Kemet  
408.986.0424  
408.573.4150  
Taiyo Yuden www.t-yuden.com  
Thermal Management  
For higher input voltages and maximum output current  
there can be substantial power dissipation in the  
CAT3200/CAT3200-5. If the junction temperature  
increases to 160°C, the thermal shutdown circuitry will  
automatically turn off the output.  
A good thermal connection to the PC board is  
recommended to reduce the chip temperature.  
ConnectingtheGNDpin(Pins4/5forCAT3200,Pin2for  
CAT3200-5) to a ground plane, and maintaining a solid  
ground plane under the device reduces the overall  
thermal resistance.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
8
CAT3200/3200-5  
TYPICAL APPLICATIONS  
3.3 V Supply to 5 V  
USB Port to Regulated 5V Power Supply  
4
6
4
6
5
3
1
5
3
1
IN  
OUT  
IN  
OUT  
3.3 V + 10%  
SHDN  
CAT3200-5  
SHDN  
V
OUT  
V
OUT  
5V + 4%  
100mA  
CAT3200-5  
5V + 4%  
GND  
2
GND  
2
Lithium-Ion Battery to 5V White or Blue LED Driver  
4
-
6
+
C
C
Drive up to 5 LEDs  
5
1
2
OUT  
CAT3200-5  
IN  
3V to 4.4V  
+
Li-ion  
100  
100Ω  
100Ω  
100Ω  
100Ω  
Battery  
3
SGND  
SHDN  
SHDN  
ON OFF  
Apply PWM Waveform for  
Adjustable Brightness Control  
V
t
White or Blue LED Driver with LED Current Control  
1
+
3
-
C
C
Up to 6 LEDs  
2
8
7
IN  
OUT  
3V to 4.4V  
+
Li-ion  
Battery  
CAT3200  
FB  
5
4
PGND  
SGND  
82Ω  
82Ω  
82Ω  
82Ω  
82Ω  
6
ON OFF  
SHDN  
SHDN  
Apply PWM Waveform for  
Adjustable Brightness Control  
V
t
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-5002, Rev. L  
9
CAT3200/3200-5  
PACKAGE OUTLINE DRAWING  
TSOT-23 6-Lead (TD)(1)(2)  
SYMBOL  
MIN  
NOM  
MAX  
1.00  
0.10  
0.90  
0.45  
0.20  
D
A
A1  
A2  
b
e
0.01  
0.80  
0.30  
0.12  
0.05  
0.87  
c
0.15  
D
2.90 BSC  
2.80 BSC  
1.60 BSC  
0.95 TYP  
0.40  
E1  
E
E
E1  
e
L
0.30  
0º  
0.50  
8º  
L1  
L2  
θ
0.60 REF  
0.25 BSC  
TOP VIEW  
A2 A  
θ
L
b
c
A1  
L2  
L1  
SIDE VIEW  
END VIEW  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Note:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC standard MO-193.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-5002, Rev. L  
10  
CAT3200/3200-5  
MSOP 8-Lead 3.0 x 3.0mm (Z)(1)(2)  
SYMBOL  
MIN  
NOM  
MAX  
1.10  
0.15  
0.95  
0.38  
0.23  
3.10  
5.00  
3.10  
A
A1  
A2  
b
0.05  
0.75  
0.22  
0.13  
2.90  
4.80  
2.90  
0.10  
0.85  
c
D
3.00  
4.90  
E
E
E1  
E1  
e
3.00  
0.65 BSC  
0.60  
L
0.40  
0º  
0.80  
6º  
L1  
L2  
θ
0.95 REF  
0.25 BSC  
TOP VIEW  
D
A2  
A
DETAIL A  
A1  
e
b
c
SIDE VIEW  
END VIEW  
θ
L2  
L
L1  
DETAIL A  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Note:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC standard MO-187.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-5002, Rev. L  
11  
REVISION HISTORY  
Date  
Rev.  
Reason  
06/17/2004  
09/3/2004  
A
B
C
D
E
F
G
H
I
Initial Release  
Update Ordering Information  
Minor change  
09/23/2004  
10/26/2004  
10/29/2004  
02/1/2005  
Removed TDFN package, minor changes  
Added Green Packages  
Update 6-lead SOT-23 mechanical package drawing  
Update Ordering Information  
Update Ordering Information  
Update Ordering Information  
Update Ordering Information  
Change MSOP Tape&Reel  
02/28/2005  
03/18/2005  
09/22/2005  
01/11/2006  
08/01/2006  
10/29/2007  
J
K
L
Update Ordering Information  
Update Package Outline Drawings  
Add MD- to Document Number  
Copyrights, Trademarks and Patents  
© Catalyst Semiconductor, Inc.  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
Adaptive Analog™, Beyond Memory™, DPP™, EZDim™, LDD™, MiniPot™, Quad-Mode™ and Quantum Charge Programmable™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
2975 Stender Way  
Santa Clara, CA 95054  
Phone: 408.542.1000  
Fax: 408.542.1200  
www.catsemi.com  
Publication #: MD-5002  
Revison:  
L
Issue date:  
10/29/07  

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