CAT25320VI-1.8-GT3 [CATALYST]

EEPROM, 4KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8;
CAT25320VI-1.8-GT3
型号: CAT25320VI-1.8-GT3
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

EEPROM, 4KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路
文件: 总17页 (文件大小:262K)
中文:  中文翻译
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CAT25320  
32K-Bit SPI Serial CMOS EEPROM  
FEATURES  
DESCRIPTION  
I 10 MHz SPI compatible  
I 1.8 to 5.5 volt operation  
I Hardware and software protection  
I Low power CMOS technology  
I SPI modes (0,0 &1,1)  
The CAT25320 is a 32K-Bit SPI Serial CMOS EEPROM  
internally organized as 4Kx8 bits. Catalyst’s advanced  
CMOS Technology substantially reduces device power  
requirements. The CAT25320 features a 64-byte page  
write buffer. The device operates via the SPI bus serial  
interface and is enabled though a Chip Select (CS). In  
addition to the Chip Select, the clock input (SCK), data  
in (SI) and data out (SO) are required to access the  
device. The HOLD pin may be used to suspend any  
serial communication without resetting the serial se-  
quence. The CAT25320 is designed with software and  
hardware write protection features including Block write  
protection. The device is available in 8-pin DIP, SOIC  
and TSSOP packages.  
I Industrial temperature range  
I 1,000,000 program/erase cycles  
I 100 year data tetention  
I Self-timed write cycle  
I RoHS compliant “  
& “  
8-pin PDIP and 8-pin SOIC packages  
I 64-Byte page write buffer  
I Block write protection  
– Protect 1/4, 1/2 or all of EEPROM array  
PIN CONFIGURATION  
FUNCTIONAL SYMBOL  
PDIP (L)  
SOIC (V)  
TSSOP (Y)  
V
CC  
CS  
1
8
V
CC  
SI  
CS  
SO  
2
3
4
7
6
5
HOLD  
SCK  
SI  
WP  
CAT25320  
V
SS  
WP  
SO  
HOLD  
SCK  
PIN FUNCTIONS  
Pin Name  
Function  
V
SS  
SO  
Serial Data Output  
Serial Clock  
SCK  
WP  
VCC  
VSS  
CS  
Write Protect  
+1.8V to +6.0V Power Supply  
Ground  
Chip Select  
SI  
Serial Data Input  
Suspends Serial Input  
HOLD  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1109, Rev. B  
1
CAT25320  
ABSOLUTE MAXIMUM RATINGS*  
Storage Temperature  
-65°C to +150°C  
Voltage on Any Pin with Respect to Ground(1)  
-0.5 V to +6.5 V  
* Stresses above those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification  
is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.  
RELIABILITY CHARACTERISTICS(2)  
Symbol  
NEND(*)  
TDR  
Parameter  
Min  
1,000,000  
100  
Units  
Program/ Erase Cycles  
Years  
Endurance  
Data Retention  
(*) Page Mode, VCC = 5 V, 25°C  
D.C. OPERATING CHARACTERISTICS  
V
CC = 1.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Symbol Parameter  
Test Conditions  
Min  
Max  
Units  
ICC  
ISB1  
ISB2  
Supply Current  
Read, Write, VCC = 5.0V, fSCK = 10MHz,  
SO open  
2
mA  
Standby Current  
Standby Current  
Input Leakage Current  
VIN = GND or VCC , CS = VCC , WP = VCC  
VCC = 5V  
,
2
4
µA  
µA  
VIN = GND or VCC , CS = VCC , WP = GND,  
VCC = 5V  
IL  
VIN = GND or VCC  
-2  
-1  
2
1
µA  
µA  
V
ILO  
Output Leakage Current CS = VCC , VOUT = GND or VCC  
Input Low Voltage  
(3)  
VIL  
VIH  
-0.5  
0.3VCC  
(3)  
Input High Voltage  
0.7VCC VCC + 0.5  
V
VOL1  
VOH1  
VOL2  
VOH2  
Output Low Voltage  
Output High Voltage  
Output Low Voltage  
Output High Voltage  
VCC > 2.5V, IOL = 3.0mA  
VCC > 2.5V, IOH = -1.6mA  
VCC > 1.8V, IOL = 150µA  
VCC > 1.8V, IOH = -100µA  
0.4  
VCC - 0.8V  
0.2  
V
V
V
VCC - 0.2V  
V
PIN CAPACITANCE(2)  
TA = 25°C, f = 1 MHz, VCC = 5V  
Symbol  
Test Conditions  
Max  
Units  
Conditions  
VOUT = 0 V  
VIN = 0 V  
COUT  
Output Capacitance (SO)  
8
pF  
CIN  
Input Capacitance (CS, SCK, SI, WP, HOLD)  
6
pF  
Note:  
(1) The DC input voltage on any pin should not be lower than -0.5V or higher than VCC + 0.5V. During transitions, the voltage on any pin may  
undershoot to no less than -1.5V or overshoot to no more than VCC + 1.5V, for periods of less than 20ns.  
(2) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100  
and JEDEC test methods.  
(3) VIL and VIH are reference values and are not tested.  
© 2006 by Catalyst Semiconductor, Inc.  
Doc. No. 1111, Rev. B  
2
Characteristics subject to change without notice  
CAT25320  
A.C. CHARACTERISTICS  
SYMBOL PARAMETER  
CAT250XX-1.8  
1.8V-5.5V  
CAT250XX  
2.5V-5.5V  
Test  
Min.  
Max.  
Min.  
Max.  
Conditions UNITS  
tSU  
tH  
Data Setup Time  
Data Hold Time  
30  
30  
75  
75  
DC  
20  
20  
40  
40  
DC  
ns  
ns  
tWH  
tWL  
fSCK  
tLZ  
SCK High Time  
ns  
SCK Low Time  
ns  
Clock Frequency  
HOLD to Output Low Z  
Input Rise Time  
5
50  
2
10  
50  
2
MHz  
ns  
(1)  
tRI  
µs  
(1)  
tFI  
Input Fall Time  
2
2
µs  
tHD  
tCD  
HOLD Setup Time  
HOLD Hold Time  
Write Cycle Time  
Output Valid from Clock Low  
Output Hold Time  
Output Disable Time  
HOLD to Output High Z  
CS High Time  
0
0
ns  
10  
10  
ns  
(4)  
CL = 50pf  
tWC  
tV  
5
5
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
75  
40  
tHO  
0
0
tDIS  
tHZ  
50  
20  
25  
100  
tCS  
50  
50  
50  
10  
10  
15  
15  
15  
10  
10  
tCSS  
tCSH  
tWPS  
tWPH  
CS Setup Time  
CS Hold Time  
WP Setup Time  
WP Hold Time  
(1)(3)  
Power-Up Timing  
Symbol  
tPUR  
Parameter  
Max.  
Units  
Power-up to Read Operation  
Power-up to Write Operation  
1
1
ms  
ms  
tPUW  
NOTE:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) AC Test Conditions:  
Input Pulse Voltages: 0.3V to 0.7V  
CC  
CC  
Input rise and fall times: 10ns  
Input and output reference voltages: 0.5V  
CC  
Output load: current source IOL max/IOH max; C =50pF  
L
(3)  
(4)  
t
t
and t  
are the delays required from the time V is stable until the specified operation can be initiated.  
PUR  
WC  
PUW CC  
is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
3
CAT25320  
FUNCTIONAL DESCRIPTION  
PIN DESCRIPTION  
The CAT25320 supports the SPI bus data transmission  
protocol. The synchronous Serial Peripheral Interface  
(SPI) helps the CAT25320 to interface directly with  
manyoftodayspopularmicrocontrollers.TheCAT25320  
contains an 8-bit instruction register. (The instruction  
set andtheoperationcodesaredetailedintheinstruction  
set table)  
SI: Serial Input  
SI is the serial data input pin. This pin is used to input all  
opcodes, byte addresses, and data to be written to the  
CAT25320.Inputdataislatchedontherisingedgeofthe  
serial clock.  
SO: Serial Output  
SO is the serial data output pin. This pin is used to  
transfer data out of the CAT25320. During a read cycle,  
data is shifted out on the falling edge of the serial clock.  
After the device is selected with CS going low, the first  
byte will be received. The part is accessed via the SI pin,  
with data being clocked in on the rising edge of SCK.  
Thefirstbytecontainsoneofthesixop-codesthatdefine  
the operation to be performed.  
SCK: Serial Clock  
SCKistheserialclockpin.Thispinisusedtosynchronize  
Figure 1. Sychronous Data Timing  
t
CS  
VIH  
CS  
VIL  
t
CSH  
t
CSS  
VIH  
VIL  
t
t
WL  
SCK  
SI  
WH  
t
H
t
SU  
VIH  
VALID IN  
V
IL  
t
RI  
FI  
t
t
V
t
t
HO  
DIS  
VOH  
VOL  
HI-Z  
HI-Z  
SO  
Note: Dashed Line= mode (1, 1) — — — —  
INSTRUCTION SET  
Instruction  
WREN  
WRDI  
Opcode  
Operation  
Enable Write Operations  
0000 0110  
0000 0100  
0000 0101  
0000 0001  
0000 0011  
0000 0010  
Disable Write Operations  
Read Status Register  
Write Status Register  
Read Data from Memory  
Write Data to Memory  
RDSR  
WRSR  
READ  
WRITE  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
4
CAT25320  
the communication between the microcontroller and the  
CAT25320. Opcodes, byte addresses, or data present  
on the SI pin are latched on the rising edge of the SCK.  
Data on the SO pin is updated on the falling edge of the  
SCK.  
will interrupt a write to the status register. If the internal  
write cycle has already been initiated, WP going low will  
have no effect on any write operation to the status  
register.TheWPpinfunctionisblockedwhentheWPEN  
bit is set to 0. Figure 10 illustrates the WP timing  
sequence during a write operation.  
CS: Chip Select  
CS istheChipselectpin. CSlowenablestheCAT25320  
and CS high disables the CAT25320. CS high takes the  
SO output pin to high impedance and forces the devices  
into a Standby Mode (unless an internal write operation  
is underway). A high to low transition on CS is required  
prior to any sequence being initiated. A low to high  
transition on CS after a valid write sequence is what  
initiates an internal write cycle.  
HOLD: Hold  
The HOLD pin is used to pause transmission to the  
CAT25320 while in the middle of a serial sequence  
without having to re-transmit entire sequence at a later  
time. To pause, HOLD must be brought low while SCK  
islow.TheSOpinisinahighimpedancestateduringthe  
timethepartispaused, andtransitionsontheSIpinswill  
beignored.Toresumecommunication,HOLDisbrought  
high, while SCK is low. (HOLD should be held high any  
time this function is not being used.) HOLD may be tied  
high directly to Vcc or tied to Vcc through a resistor.  
Figure 9 illustrates hold timing sequence.  
WP: Write Protect  
WP is the Write Protect pin. The Write Protect pin will  
allow normal read/write operations when held high.  
When WP is tied low and the WPEN bit in the status  
register is set to 1, all write operations to the status  
register are inhibited. WP going low while CS is still low  
STATUS REGISTER  
7
6
5
4
3
2
1
0
WPEN  
X
X
X
BP1  
BP0  
WEL  
RDY  
BLOCK PROTECTION BITS  
Status Register Bits  
Array Address  
Protected  
Protection  
BP1  
BP0  
0
0
1
1
0
1
0
1
None  
No Protection  
0C00-0FFF  
800-0FFF  
0000-0FFF  
Quarter Array Protection  
Half Array Protection  
Full Array Protection  
Protected  
Blocks  
Unprotected  
Blocks  
Status  
WPEN  
WP  
X
WEL  
Register  
0
0
1
1
X
X
0
1
0
1
0
1
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
X
Low  
Low  
High  
High  
Protected  
Protected  
Protected  
Writable  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
5
CAT25320  
The WPEN (Write Protect Enable) is an enable bit for the  
WP pin. The WP pin and WPEN bit in the status register  
controltheprogrammablehardwarewriteprotectfeature.  
HardwarewriteprotectionisenabledwhenWPis lowand  
WPENbitissettohigh.Theusercannotwritetothestatus  
register (including the block protect bits and the WPEN  
bit) and the block protected sections in the memory array  
when the chip is hardware write protected. Only the  
sections of the memory array that are not block protected  
can be written. Hardware write protection is disabled  
when either WP pin is high or the WPEN bit is zero.  
STATUS REGISTER  
The Status Register indicates the status of the device.  
The RDY (Ready) bit indicates whether the CAT25320  
is busy with a write operation. When set to 1 a write  
cycle is in progress and when set to 0 the device  
indicates it is ready. This bit is read only.  
The WEL (Write Enable) bit indicates the status of the  
write enable latch . When set to 1, the device is in a  
Write Enable state and when set to 0 the device is in a  
Write Disable state. The WEL bit can only be set by the  
WREN instruction and can be reset by the WRDI  
instruction.  
DEVICE OPERATION  
Write Enable and Disable  
The BP0 and BP1 (Block Protect) bits indicate which  
blocksarecurrentlyprotected. Thesebitsaresetbythe  
user issuing the WRSR instruction. The user is allowed  
to protect quarter of the memory, half of the memory or  
theentirememorybysettingthesebits. Onceprotected  
the user may only read from the protected portion of the  
array. These bits are non-volatile.  
The CAT25320 contains a write enable latch. This latch  
must be set before any write operation. The device  
powers up in a write disable state when Vcc is applied.  
WREN instruction will enable writes (set the latch) to  
thedevice. WRDI instruction will disable writes (reset the  
latch) to the device. Disabling writes will protect the  
device against inadvertent writes.  
Figure 2. WREN Instruction Timing  
CS  
SCK  
1
1
0
SI  
0
0
0
0
0
HIGH IMPEDANCE  
SO  
Note: Dashed Line = mode (1, 1) — — — —  
Figure 3. WRDI Instruction Timing  
CS  
SCK  
SI  
1
0
0
0
0
0
0
0
HIGH IMPEDANCE  
SO  
Note: Dashed Line = mode (1, 1) — — — —  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
6
CAT25320  
READ Sequence  
To read the status register, RDSR instruction should be  
sent. The contents of the status register are shifted out  
on the SO line. The status register may be read at any  
time even during a write cycle. Reading status register  
is illustrated in Figure 5.  
The part is selected by pulling CS low. The 8-bit read  
instruction is transmitted to the CAT25320, followed by  
the16-bitaddress(thefourmostsignificantbitsaredon't  
care).  
WRITE Sequence  
After the correct read instruction and address are sent,  
the data stored in the memory at the selected address is  
shifted out on the SO pin. The data stored in the memory  
at the next address can be read sequentially by continu-  
ing to provide clock pulses. The internal address pointer  
is automatically incremented to the next higher address  
after each byte of data is shifted out. When the highest  
address, FFFh is reached, the address counter rolls  
over to 0000h allowing the read cycle to be continued  
indefinitely. The read operation is terminated by pulling  
the CS high. Read sequece is illustrated in Figure 4.  
The CAT25320 powers up in a Write Disable state. Prior  
to any write instructions, the WREN instruction must be  
sent to CAT25320. The device goes into Write enable  
state by pulling the CS low and then clocking the WREN  
instruction into CAT25320. The CS must be brought  
high after the WREN instruction to enable writes to the  
device. If the write operation is initiated immediately  
after the WREN instruction without CS being brought  
high, the data will not be written to the array because the  
write enable latch will not have been properly set. Also,  
for a successful write operation the address of the  
memory location(s) to be programmed must be outside  
the protected address field location selected by the  
block protection level.  
Figure 4. Read Instruction Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10  
20 21 22 23 24 25 26 27 28 29 30  
SCK  
OPCODE  
ADDRESS  
SI  
0
0
0
0
0
0
1
1
DATA OUT  
HIGH IMPEDANCE  
SO  
7
6
5
4
3
2
1
0
MSB  
Note: Dashed Line= mode (1, 1) — — — —  
Figure 5. RDSR Instruction Timing  
CS  
0
1
2
3
4
5
1
6
0
7
1
8
9
10  
11  
12  
13  
14  
SCK  
OPCODE  
0
0
0
0
0
SI  
DATA OUT  
HIGH IMPEDANCE  
SO  
5
7
6
4
3
2
1
0
MSB  
Note: Dashed Line= mode (1, 1) — — — —  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
7
CAT25320  
Byte Write  
address will remain constant. The only restriction is that the  
64 bytes must reside on the same page. If the address  
counter reaches the end of the page and clock continues,  
the counter will roll overto the first address of the page  
and overwrite any data that may have been written. The  
CAT25320 is automatically returned to the write disable  
state at the completion of the write cycle. Figure 8 illustrates  
the page write sequence.  
Once the device is in a Write Enable state, the user  
may proceed with a write sequence by setting the CS  
low, issuing a write instruction via the SI line, followed  
by the 16-bit address (four most significant bits are  
don't care), and then the data to be written. Program-  
ming will start after the CS is brought high. Figure 6  
illustrates byte write sequence.  
During an internal write cycle, all commands will be  
ignored except the RDSR (Read Status Register)  
instruction.  
Status Register Write  
To write to the status register, the WRSR instruction should  
be sent. Only Bit 2, Bit 3 and Bit 7 of the status register can  
be written using the WRSR instruction. Figure 7 illustrates  
the sequence of writing to status register.  
The Status Register can be read to determine if the  
write cycle is still in progress. If Bit 0 of the Status  
Register is set at 1, write cycle is in progress. If Bit 0  
is set at 0, the device is ready for the next instruction.  
DESIGN CONSIDERATIONS  
The CAT25320 powers up in a write disable state and in a  
low power standby mode. A WREN instruction must be  
issued to perform any writes to the device after power up.  
After power up CS must be brought low to enter a ready  
state and receive an instruction. After a successful byte/  
page write or status register write the CAT25320 goes into  
Page Write  
The CAT25320 features page write capability. After  
the first initial byte the host may continue to write up  
to 64 bytes of data to the CAT25320. After each byte  
of data is received, six lower order address bits are  
internally incremented by one; the high order bits of  
Figure 6. Write Instruction Timing  
CS  
0
1
2
3
4
5
6
7
8
21 22 23 24 25 26 27 28 29 30 31  
SCK  
SI  
OPCODE  
DATA IN  
D7 D6 D5 D4 D3 D2 D1 D0  
0
0
0
0
0
0
1
0
ADDRESS  
HIGH IMPEDANCE  
SO  
Note: Dashed Line = mode (1, 1) — — — —  
Figure 7. WRSR Instruction Timing  
CS  
0
1
2
3
4
5
6
7
1
8
7
9
6
10  
5
11  
4
12  
13  
2
14  
1
15  
0
SCK  
OPCODE  
DATA IN  
SI  
0
0
0
0
0
0
0
3
MSB  
HIGH IMPEDANCE  
SO  
Note: Dashed Line = mode (1, 1) — — — —  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
8
CAT25320  
a write disable mode. CS must be set high after the proper If an invalid code is received, no data will be shifted into  
number of clock cycles to start an internal write cycle. the CAT25320 and the serial output pin (SO) will remain  
Access to the array during an internal write cycle is in a high impedance state until the falling edge of CS is  
ignored and programming iscontinued. Onpowerup, SO detected again.  
is in a high impedance.  
Figure 8. Page Write Instruction Timing  
CS  
24+(N-1)x8-1..24+(N-1)x8 24+Nx8-1  
0
1
2
3
4
5
6
7
8
21 22 23  
32-39  
24-31  
SCK  
SI  
DATA IN  
Data Data  
Byte 2 Byte 3  
OPCODE  
Data  
Byte 1  
Data Byte N  
0
0
0
0
0
0
1
0
ADDRESS  
0
7..1  
HIGH IMPEDANCE  
SO  
Note: Dashed Line = mode (1, 1) — — — —  
Figure 9. HOLD Timing  
CS  
t
t
CD  
CD  
SCK  
t
HD  
t
HD  
HOLD  
SO  
t
HZ  
HIGH IMPEDANCE  
t
LZ  
Note: Dashed Line = mode (1, 1) — — — —  
Figure 10. WP Timing  
t
t
WPH  
WPS  
CS  
SCK  
WP  
t
CSH  
WP  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
9
CAT25320  
8-LEAD 300 MIL WIDE PLASTIC DIP (L)  
E1  
E
D
A2  
A
L
A1  
e
eB  
b2  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
0.120  
0.015  
0.115  
0.014  
0.045  
0.355  
0.300  
0.300  
0.240  
0.210  
0.130  
0.018  
0.060  
0.365  
0.195  
0.022  
0.070  
0.400  
0.325  
0.325  
0.280  
b2  
D
D2  
E
0.310  
0.250  
E1  
e
0.100 BSC  
eB  
L
0.430  
0.150  
0.115  
0.130  
Notes:  
1. Complies with JEDEC Standard MS001.  
2. All dimensions are in inches.  
3. Dimensioning and tolerancing per ANSI Y14.5M-1982  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
10  
CAT25320  
8-LEAD 150 MIL WIDE SOIC (V)  
E1  
E
D
C
A
θ1  
e
A1  
L
b
SYMBOL  
MIN  
NOM  
MAX  
A1  
A2  
b
0.0040  
0.0532  
0.013  
0.0098  
0.0688  
0.020  
C
0.0075  
0.1890  
02284  
0.149  
0.0098  
0.1968  
0.2440  
0.1574  
D
E
E1  
e
0.050 BSC  
f
0.0099  
0.0196  
θ1  
0°  
8°  
Notes:  
1. Complies with JEDEC specification MS-012 dimensions.  
2. All linear dimensions in millimeters.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
11  
CAT25320  
8-LEAD TSSOP (Y)  
D
5
8
SEE DETAIL A  
c
E
E1  
E/2  
GAGE PLANE  
0.25  
1
4
PIN #1 IDENT.  
θ1  
L
A2  
SEATING PLANE  
SEE DETAIL A  
A
e
A1  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
1.20  
0.15  
1.05  
0.30  
0.20  
3.10  
6.50  
4.50  
0.05  
0.80  
0.19  
0.09  
2.90  
6.30  
4.30  
0.90  
c
D
3.00  
6.4  
E
E1  
e
4.40  
0.65 BSC  
0.60  
L
0.50  
0.00  
0.75  
8.00  
θ1  
Notes:  
1. All dimensions in millimeters.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
12  
CAT25320  
TAPE AND REEL  
Direction of Feed  
Device Orientation  
SPROKET HOLE  
TOP COVER  
TAPE THICKNESS (t1)  
0.10mm (0.004) MAX THICK  
DEVICE ORIENTATION  
EMBOSSED  
CARRIER  
PIN 1  
PIN 1  
PIN 1  
EMBOSSMENT  
TDFN  
SOIC  
TSSOP  
Reel Dimensions(1)  
T
40mm (1.575) MIN.  
ACCESS HOLE  
AT SLOT LOCATION  
B*  
A
D*  
C
N
FULL RADIUS*  
TAPE SLOT IN CORE  
FOR TAPE START.  
2.5mm (0.098) MIN WIDTH  
10mm (0.394) MIN DEPTH  
* DRIVE SPOKES OPTIONAL, IF USED  
ASTERISKED DIMENSIONS APPLY.  
G (MEASURED AT HUB)  
Embossed Carrier Dimensions  
A
TAPE  
SIZE  
MAX  
QTY/REEL  
B MIN  
C
D* MIN N MIN  
20.2 50  
G
T MAX  
330  
(13.00)  
1.5  
(0.059)  
12.80 (0.504)  
12.4 (0.488) _18.4_  
12MM  
3000  
13.20 (0.5200) (0.795) (1.969) 14.4 (0.558) (0.724)  
Component/Tape Size Cross-Reference  
Component  
Package Type  
V, Y  
Tape Size (W)  
Part Pitch (P)  
8L SOIC, TSSOP  
12mm  
8mm  
Notes:  
(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1111, Rev. B  
13  
CAT25320  
Embossed Carrier Dimensions (12 Pape Only)  
10 PITCHES  
CUMULATIVE TOLERANCE  
ON TAPE 0.2mm( 0.008)  
K
D
P
0
T
P
2
TOP  
COVER  
TAPE  
E
(2)  
A
0
F
W
(2)  
B
B
0
K
1
0
P
CENTER LINES  
OF CAVITY  
D
1
FOR COMPONENTS  
2.0mm X 1.2mm  
AND LARGER  
EMBOSSMENT  
FOR MACHINE REFERENCE ONLY  
INCLUDING DRAFT AND RADII  
USER DIRECTION OF FEED  
CONCENTRIC ABOUT B  
0
Embossed Tape—Constant Dimensions(1)  
Tape Sizes  
D
E
P0  
T Max.  
D1 Min.  
A0 B0 K0(2)  
1.5 (0.059)  
1.6 (0.063)  
1.65 (0.065)  
1.85 (0.073)  
3.9 (0.153)  
4.1 (0.161)  
400  
(0.016)  
1.5  
(0.059)  
12mm  
Embossed Tape—Variable Dimensions(1)  
Tape Sizes  
B1 Max.  
F
K Max.  
P2  
R Min.  
W
P
8.2  
5.45 (0.0215)  
4.5  
(0.177)  
1.95 (0.077)  
2.05 (0.081)  
30  
(1.181)  
11.7 (0.460) 7.9 (0.275)  
12.3 (0.484) 8.1 (0.355)  
12mm  
(0.0323) 5.55 (0.0219)  
Note:  
(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.  
(2) A B K are determined by component size. The clearance between the component and the cavity must be within 0.05 (0.002) min. to  
0
0
0
0.65 (0.026) max. for 12mm tape, 0.05 (0.002) min. to 0.90 (0.035) max. for 16mm tape, and 0.05 (0.002) min. to 1.00 (0.039) max. for  
24mm tape and larger. The component cannot rotate more than 20° within the determined cavity, see Component Rotation.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
14  
CAT25320  
Prefix  
Device #  
25320  
Suffix  
-1.8  
V
CAT  
GT3  
I
Temperature Range  
I = Industrial (-40°C to +85°C)  
Optional  
Company ID  
Product  
Number  
Operating Voltage  
Blank = 2.5V to 5.5V  
1.8 = 1.8V to 5.5V  
Package  
L: PDIP (Lead free, Halogen free)  
V: SOIC, JEDEC (Lead free, Halogen free)  
Y: TSSOP (Lead free, Halogen free)  
Lead Finish/Tape & Reel  
G: NiPdAu Lead Plating  
T: Tape & Reel  
3: 3000/Reel  
Notes:  
(1) The device used in the above example is a CAT25320VI-1.8GT3 (SOIC, Industrial Temperature, 1.8 Volt to 5.5 Volt Operating Voltage,  
Tape & Reel)  
© 2006 by Catalyst Semiconductor, Inc.  
Doc No. 1111, Rev. B  
15  
Characteristics subject to change without notice  
CAT25320  
PACKAGE MARKING  
8-Lead PDIP  
8-Lead SOIC  
VV  
25320LI  
YYWWB  
VV  
25320VI  
YYWWB  
CSI = Catalyst Semiconductor, Inc.  
VV = Voltage Range  
CSI = Catalyst Semiconductor, Inc.  
VV = Voltage Range  
1.8V - 5.5V = 18  
1.8V - 5.5V = 18  
2.5V - 5.5V = Blank  
2.5V - 5.5V = Blank  
25320L = Device Code  
I = Temperature Range  
YY = Production Year  
WW = Production Week  
B = Product Revision  
25320V = Device Code  
I = Temperature Range  
YY = Production Year  
WW = Production Week  
B = Product Revision  
8-Lead TSSOP  
YMBV  
25320I  
Y = Production Year  
M = Production Month  
B = Die Revision  
25320 = Device Code  
I = Industrial Temperature Range  
V = Voltage Range  
1.8V - 5.5V = 8  
2.5V - 5.5V = Blank  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1111, Rev. B  
16  
REVISION HISTORY  
Date  
Rev.  
A
Reason  
12/20/05  
03/21/06  
Initial Issue  
B
Update D.C. Operating Characteristics  
Update A.C. Characteristics  
Update Pin Description  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
DPP ™  
AE2 ™  
MiniPot™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
1250 Borregas Avenue  
Sunnyvale, CA 94089  
Phone: 408.542.1000  
Fax: 408.542.1200  
www.catsemi.com  
Publication #: 1111  
Revison:  
B
Issue date:  
03/21/06  

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