CAT24C256YI-GT2 [CATALYST]

EEPROM, 32KX8, Serial, CMOS, PDSO8, 4.4 MM, GREEN, MO-153, TSSOP-8;
CAT24C256YI-GT2
型号: CAT24C256YI-GT2
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

EEPROM, 32KX8, Serial, CMOS, PDSO8, 4.4 MM, GREEN, MO-153, TSSOP-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路
文件: 总17页 (文件大小:741K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CAT24C256  
256-Kb I2C CMOS Serial EEPROM  
fEATuRES  
DEVICE DESCRIPTIOn  
n Sꢂpports Staꢃdard aꢃd fast I2C Protocol  
n 1.8V to 5.5V Sꢂpplꢄ Voltaꢅe Raꢃꢅe  
n 64-ꢁꢄte Paꢅe Write ꢁꢂꢆꢆer  
The CAT24C256 is a 256-Kb Serial CMOS EEPROM,  
internally organized as 32,768 words of 8 bits each.  
It features a 64-byte page write buffer and supports  
both the Standard (ꢀ00kHz) as well as Fast (400kHz)  
I2C protocol.  
n Hardware Write Protectioꢃ ꢆor eꢃtire memorꢄ  
n Schmitt Triꢅꢅers aꢃd noise Sꢂppressioꢃ filters  
oꢃ I2C ꢁꢂs Iꢃpꢂts (SCꢀ aꢃd SDA).  
Write operations can be inhibited by taking the WP pin  
High (this protects the entire memory).  
n ꢀow power CMOS techꢃoloꢅꢄ  
n 1,000,000 proꢅram/erase cꢄcles  
n 100 ꢄear data reteꢃtioꢃ  
External address pins make it possible to address up to  
eight CAT24C256 devices on the same bus.  
n Iꢃdꢂstrial temperatꢂre raꢃꢅe  
n RoHS-compliaꢃt 8-piꢃ PDIP, SOIC, TSSOP aꢃd  
8-pad TDfn packaꢅes  
for Orderiꢃꢅ Iꢃꢆormatioꢃ details, see paꢅe 15.  
PIn COnfIguRATIOn  
funCTIOnAꢀ SyMꢁOꢀ  
PDIP (ꢀ)  
SOIC (W, X)  
TSSOP (y)  
TDfn (ZD2)  
V
CC  
A
1
8
V
CC  
0
SCL  
A
2
3
4
7
6
5
WP  
1
2
A
SCL  
SDA  
A , A , A  
CAT24C256  
SDA  
2
1
0
V
SS  
For the location of Pin ꢀ, please consult the  
corresponding package drawing.  
WP  
V
SS  
PIn funCTIOnS  
A0, A, A2  
SDA  
SCL  
Device Address  
Serial Data  
Serial Clock  
Write Protect  
Power Supply  
Ground  
WP  
VCC  
VSS  
* Catalyst carries the I2C protocol under a license from the Philips Corporation.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
CAT24C256  
AꢁSOꢀuTE MAXIMuM RATIngS(1)  
Storage Temperature  
Voltage on Any Pin with Respect to Ground(2)  
-65°C to +ꢀ50°C  
-0.5 V to +6.5 V  
REꢀIAꢁIꢀITy CHARACTERISTICS(3)  
Sꢄmbol Parameter  
Miꢃ  
ꢀ,000,000  
ꢀ00  
uꢃits  
(4)  
NEND  
TDR  
Endurance  
Program/ Erase Cycles  
Years  
Data Retention  
D.C. OPERATIng CHARACTERISTICS  
VCC = ꢀ.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Sꢄmbol Parameter  
ICC Supply Current  
ISB  
Test Coꢃditioꢃs  
Miꢃ  
Max  
uꢃits  
Read or Write at 400kHz  
All I/O Pins at GND or VCC  
Pin at GND or VCC  
mA  
µA  
µA  
V
Standby Current  
I/O Pin Leakage  
IL  
VIL  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output Low Voltage  
-0.5  
VCC x 0.3  
VIH  
VOLꢀ  
VOL2  
VCC x 0.7 VCC + 0.5  
V
VCC ≥ 2.5 V, IOL = 3.0mA  
0.4  
0.2  
V
VCC < 2.5 V, IOL = ꢀ.0mA  
V
PIn IMPEDAnCE CHARACTERISTICS  
VCC = ꢀ.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Sꢄmbol Parameter  
Coꢃditioꢃs  
Miꢃ  
Max  
8
uꢃits  
pF  
(3)  
CIN  
SDA I/O Pin Capacitance  
VIN = 0V  
(3)  
CIN  
IWP  
Input Capacitance (other pins)  
VIN = 0V  
6
pF  
(5)  
WP Input Current  
(CAT24C256 Rev. C - New Product)  
VIN < VIH, VCC = 5.5V  
VIN < VIH, VCC = 3.3V  
VIN < VIH, VCC = ꢀ.8V  
VIN > VIH  
200  
ꢀ50  
ꢀ00  
µA  
notes:  
(ꢀ) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this  
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.  
(2) The DC input voltage on any pin should not be lower than -0.5V or higher than VCC + 0.5V. During transitions, the voltage on any pin may  
undershoot to no less than -ꢀ.5V or overshoot to no more than VCC + ꢀ.5V, for periods of less than 20 ns.  
(3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Qꢀ00  
and JEDEC test methods.  
(4) Page Mode, VCC = 5V, 25°C  
(5) When not driven, the WP pin is pulled down to GND internally. For improved noise immunity, the internal pull-down is relatively strong;  
therefore the external driver must be able to supply the pull-down current when attempting to drive the input HIGH. To conserve power,  
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull-down reverts to a weak current source.  
The variable WP input impedance is available only for Die Rev. C, New Product.  
© Catalyst Semiconductor, Inc.  
Doc. No. MD-ꢀꢀ04, Rev. F  
2
Characteristics subject to change without notice  
CAT24C256  
A.C. CHARACTERISTICS(1)  
VCC = ꢀ.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Staꢃdard  
fast  
Sꢄmbol  
Parameter  
Miꢃ  
Max  
Miꢃ  
Max  
uꢃits  
FSCL  
Clock Frequency  
ꢀ00  
400  
kHz  
tHD:STA  
START Condition Hold Time  
4
0.6  
µs  
tLOW  
tHIGH  
Low Period of SCL Clock  
High Period of SCL Clock  
4.7  
4
ꢀ.3  
0.6  
µs  
µs  
tSU:STA  
tHD:DAT  
tSU:DAT  
START Condition Setup Time  
Data In Hold Time  
4.7  
0
0.6  
0
µs  
µs  
ns  
ns  
ns  
µs  
µs  
µs  
ns  
ns  
µs  
µs  
ms  
ms  
Data In Setup Time  
250  
ꢀ00  
(2)  
tR  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
STOP Condition Setup Time  
Bus Free Time Between STOP and START  
SCL Low to Data Out Valid  
Data Out Hold Time  
ꢀ000  
300  
300  
300  
(2)  
tF  
tSU:STO  
tBUF  
4
0.6  
ꢀ.3  
4.7  
tAA  
3.5  
0.9  
tDH  
ꢀ00  
ꢀ00  
Ti(2)  
Noise Pulse Filtered at SCL and SDA Inputs  
WP Setup Time  
ꢀ00  
ꢀ00  
tSU:WP  
tHD:WP  
tWR  
0
0
WP Hold Time  
2.5  
2.5  
Write Cycle Time  
5
5
(2, 3)  
tPU  
Power-up to Ready Mode  
notes:  
(ꢀ) Test conditions according to “A.C. Test Conditions” table.  
(2) Tested initially and after a design or process change that affects this parameter.  
(3) tPU is the delay between the time VCC is stable and the device is ready to accept commands.  
A.C. TEST COnDITIOnS  
Input Levels  
0.2 x VCC to 0.8 x VCC  
50ns  
Input Rise and Fall Times  
Input Reference Levels  
0.3 x VCC, 0.7 x VCC  
Output Reference Levels 0.5 x VCC  
Output Load  
Current Source: IOL = 3mA (VCC 2.5V); IOL = ꢀ mA (VCC < 2.5V); CL = ꢀ00pF  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
3
CAT24C256  
I2C ꢁuS PROTOCOꢀ  
POWER-On RESET (POR)  
The I2C bus consists of two ‘wires’, SCL and SDA. The  
two wires are connected to the VCC supply via pull-up  
resistors. Master and Slave devices connect to the 2-  
wire bus via their respective SCL and SDA pins. The  
transmitting device pulls down the SDAline to ‘transmit’  
a ‘0’ and releases it to ‘transmit’ a ‘ꢀ’.  
The CAT24C256 Die Rev. C incorporates Power-On  
Reset (POR) circuitry which protects the internal logic  
against powering up in the wrong state.  
The device will power up into Standby mode after VCC  
exceeds the POR trigger level and will power down  
into Reset mode when VCC drops below the POR  
trigger level. This bi-directional POR feature protects  
the device against ‘brown-out’ failure following a tem-  
porary loss of power.  
Data transfer may be initiated only when the bus is not  
busy (see A.C. Characteristics).  
During data transfer, the SDA line must remain stable  
while the SCL line is HIGH. An SDA transition while  
SCL is HIGH will be interpreted as a START or STOP  
condition (Figure ꢀ).  
PIn DESCRIPTIOn  
SCꢀ:The Serial Clock input pin accepts the Serial Clock  
generated by the Master.  
START  
TheSTARTconditionprecedesallcommands.Itconsists  
of a HIGH to LOW transition on SDAwhile SCLis HIGH.  
TheSTARTactsasawake-upcalltoallreceivers.Absent  
a START, a Slave will not respond to commands.  
SDA: The Serial Data I/O pin receives input data and  
transmitsdatastoredinEEPROM.Intransmitmode,this  
pin is open drain. Data is acquired on the positive edge,  
and is delivered on the negative edge of SCL.  
STOP  
A0, A1 aꢃd A2: The Address pins accept the device ad-  
dress. These pins have on-chip pull-down resistors.  
TheSTOPconditioncompletesallcommands.Itconsists  
of a LOW to HIGH transition on SDAwhile SCLis HIGH.  
The STOP starts the internal Write cycle (when follow-  
ing a Write command) or sends the Slave into standby  
mode (when following a Read command).  
WP: The Write Protect input pin inhibits all write op-  
erations, when pulled HIGH. This pin has an on-chip  
pull-down resistor.  
Device Addressiꢃꢅ  
funCTIOnAꢀ DESCRIPTIOn  
The Master initiates data transfer by creating a START  
condition on the bus. The Master then broadcasts an  
8-bit serial Slave address. The first 4 bits of the Slave  
address are set to ꢀ0ꢀ0, for normal Read/Write opera-  
tions (Figure 2). The next 3 bits, A2, Aand A0, select  
one of 8 possible Slave devices. The last bit, R/W,  
specifies whether a Read (1) or Write (0) operation is  
to be performed.  
The CAT24C256 supports the Inter-Integrated Circuit  
(I2C) Bus data transmission protocol, which defines a  
device that sends data to the bus as a transmitter and a  
devicereceivingdataasareceiver.Dataowiscontrolled  
by a Master device, which generates the serial clock  
and all START and STOP conditions. The CAT24C256  
acts as a Slave device. Master and Slave alternate as  
either transmitter or receiver. Up to 8 devices may be  
connected to the bus as determined by the device ad-  
dress inputs A0, A, and A2.  
Ackꢃowledꢅe  
After processing the Slave address, the Slave responds  
with an acknowledge (ACK) by pulling down the SDA  
line during the 9th clock cycle (Figure 3). The Slave will  
also acknowledge the byte address and every data  
byte presented in Write mode. In Read mode the Slave  
shifts out a data byte, and then releases the SDA line  
during the 9th clock cycle. If the Master acknowledges  
the data, then the Slave continues transmitting. The  
Master terminates the session by not acknowledging  
the last data byte (NoACK) and by sending a STOP to  
the Slave. Bus timing is illustrated in Figure 4.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
4
CAT24C256  
fiꢅꢂre 1. Start/Stop Timiꢃꢅ  
SCL  
SDA  
START  
STOP  
CONDITION  
CONDITION  
fiꢅꢂre 2. Slave Address ꢁits  
1
0
1
0
A
A
A
0
R/W  
2
1
DEVICE ADDRESS  
fiꢅꢂre 3. Ackꢃowledꢅe Timiꢃꢅ  
BUS RELEASE DELAY (TRANSMITTER)  
BUS RELEASE DELAY (RECEIVER)  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM TRANSMITTER  
DATA OUTPUT  
FROM RECEIVER  
ACK SETUP (t  
)
SU:DAT  
START  
ACK DELAY (t  
)
AA  
fiꢅꢂre 4. ꢁꢂs Timiꢃꢅ  
t
t
t
F
HIGH  
R
t
t
LOW  
LOW  
SCL  
t
t
SU:STA  
HD:DAT  
t
t
t
HD:STA  
SU:DAT  
SU:STO  
BUF  
SDA IN  
t
t
t
AA  
DH  
SDA OUT  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
5
CAT24C256  
WRITE OPERATIOnS  
ꢁꢄte Write  
In Byte Write mode the Master sends a START, followed  
by Slave address, two byte address and data to be  
written (Figure 5). The Slave acknowledges all 4 bytes,  
and the Master then follows up with a STOP, which in  
turn starts the internal Write operation (Figure 6). During  
internal Write, the Slave will not acknowledge any Read  
or Write request from the Master.  
Paꢅe Write  
TheCAT24C256contains32,768bytesofdata,arranged  
in 5ꢀ2 pages of 64 bytes each.Atwo byte address word,  
following the Slave address, points to the first byte to be  
written. The most significant bit of the address word is  
‘don’t care’, the next 9 bits identify the page and the last  
6 bits identify the byte within the page. Up to 64 bytes  
can be written in one Write cycle (Figure 7).  
The internal byte address counter is automatically in-  
cremented after each data byte is loaded. If the Master  
transmitsmorethan64databytes, thenearlierbyteswill  
be overwritten by later bytes in a ‘wrap-around’ fashion  
(withintheselectedpage).TheinternalWritecyclestarts  
immediately following the STOP.  
Ackꢃowledꢅe Polliꢃꢅ  
Acknowledge polling can be used to determine if the  
CAT24C256 is busy writing or is ready to accept com-  
mands. Polling is implemented by interrogating the  
device with a ‘Selective Read’ command (see READ  
OPERATIONS).  
TheCAT24C256willnotacknowledgetheSlaveaddress,  
as long as internal Write is in progress.  
Hardware Write Protectioꢃ  
With the WP pin held HIGH, the entire memory is pro-  
tectedagainstWriteoperations.IftheWPpinisleftoating  
or is grounded, it has no impact on the operation of the  
CAT24C256. The state of the WP pin is strobed on the  
last falling edge of SCL immediately preceding the first  
data byte (Figure 8). If the WP pin is HIGH during the  
strobeinterval,theCAT24C256willnotacknowledgethe  
data byte and the Write request will be rejected.  
Deliverꢄ State  
The CAT24C256 is shipped erased, i.e., all bytes are  
FFh.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
6
CAT24C256  
fiꢅꢂre 5. ꢁꢄte Write Timiꢃꢅ  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE ADDRESS  
A
–A  
A –A  
DATA  
15  
8
7
0
SDA LINE  
S
P
*
A
C
K
A
C
K
A
C
K
A
C
K
= Don't Care Bit  
*
fiꢅꢂre 6. Write Cꢄcle Timiꢃꢅ  
SCL  
th  
SDA  
8
Bit  
ACK  
Byte n  
t
WR  
STOP  
CONDITION  
START  
CONDITION  
ADDRESS  
fiꢅꢂre 7. Paꢅe Write Timiꢃꢅ  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE ADDRESS  
–A A –A  
0
A
DATA  
DATA n  
DATA n+63  
15  
8
7
SDA LINE  
S
P
*
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
= Don't Care Bit  
*
fiꢅꢂre 8. WP Timiꢃꢅ  
ADDRESS  
BYTE  
DATA  
BYTE  
1
8
9
1
8
SCL  
a
a
d
7
d
0
SDA  
WP  
7
0
t
SU:WP  
t
HD:WP  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
7
CAT24C256  
READ OPERATIOnS  
Immediate Address Read  
In standby mode, the CAT24C256 internal address  
counterpointstothedatabyteimmediatelyfollowingthe  
last byte accessed by a previous operation. If that ‘previ-  
ous’ byte was the last byte in memory, then the address  
counter will point to the ꢀst memory byte, etc.  
When, following a START, the CAT24C256 is presented  
with a Slave address containing a ‘ꢀ’ in the R/W bit  
position (Figure 9), it will acknowledge (ACK) in the 9th  
clock cycle, and will then transmit data being pointed  
at by the internal address counter. The Master can stop  
further transmission by issuing a NoACK, followed by a  
STOP condition.  
Selective Read  
The Read operation can also be started at an address  
different from the one stored in the internal address  
counter. The address counter can be initialized by per-  
forming a ‘dummyWrite operation (Figure ꢀ0). Here the  
START is followed by the Slave address (with the R/W  
bit set to ‘0’) and the desired two byte address. Instead  
of following up with data, the Master then issues a 2nd  
START, followed by the ‘Immediate Address Read’ se-  
quence, as described earlier.  
Seqꢂeꢃtial Read  
If the Master acknowledges the ꢀst data byte transmitted  
by the CAT24C256, then the device will continue trans-  
mitting as long as each data byte is acknowledged by  
the Master (Figure ꢀꢀ). If the end of memory is reached  
during sequential Read, then the address counter will  
‘wrap-aroundtothebeginningofmemory,etc.Sequential  
Read works with either ‘Immediate Address Read’ or  
‘Selective Read’, the only difference being the starting  
byte address.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
8
CAT24C256  
fiꢅꢂre 9. Immediate Address Read Timiꢃꢅ  
S
T
A
R
T
S
T
BUS ACTIVITY:  
MASTER  
SLAVE  
O
P
ADDRESS  
SDA LINE  
S
P
A
C
K
N
O
DATA  
A
C
K
SCL  
SDA  
8
9
th  
8
Bit  
DATA OUT  
NO ACK  
STOP  
fiꢅꢂre 10. Selective Read Timiꢃꢅ  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE ADDRESS  
SLAVE  
ADDRESS  
A
– A  
A – A  
DATA  
ꢀ5  
8
7
0
SDA LINE  
S
S
P
*
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
= Don't Care Bit  
*
fiꢅꢂre 11. Seqꢂeꢃtial Read Timiꢃꢅ  
S
T
BUS ACTIVITY:  
MASTER  
SLAVE  
O
P
ADDRESS  
DATA n  
DATA n+1  
DATA n+2  
DATA n+x  
SDA LINE  
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
9
CAT24C256  
PACKAgE OuTꢀInE DRAWIngS  
PDIP 8-ꢀead 300 mils (ꢀ)  
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
5.33  
0.38  
2.92  
0.36  
1.14  
0.20  
9.02  
7.62  
3.30  
0.46  
4.95  
0.56  
1.78  
0.36  
10.16  
8.25  
b2  
c
1.52  
E1  
0.25  
D
9.27  
E
7.87  
e
2.54 BSC  
6.35  
E1  
eB  
L
6.10  
7.87  
2.92  
7.11  
10.92  
3.80  
PIN # 1  
IDENTIFICATION  
3.30  
D
TOP VIEW  
E
A2  
A1  
A
L
c
b2  
eB  
e
b
SIDE VIEW  
END VIEW  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/docꢂmeꢃts/tapeaꢃdreel.pdꢆ  
notes:  
(ꢀ) All dimensions are in millimeters.  
(2) Complies with JEDEC MS-00ꢀ.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
ꢀ0  
CAT24C256  
SOIC 8-ꢀead 150 mils (W)  
SYMBOL  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
5.80  
3.80  
NOM  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
6.20  
4.00  
A
A1  
b
c
E1  
E
D
E
E1  
e
1.27 BSC  
h
0.25  
0.40  
0º  
0.50  
1.27  
8º  
L
PIN # 1  
IDENTIFICATION  
θ
TOP VIEW  
D
h
A1  
θ
A
c
e
b
L
SIDE VIEW  
END VIEW  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/docꢂmeꢃts/tapeaꢃdreel.pdꢆ  
notes:  
(1) Complies with JEDEC specification MS-012 dimensions.  
(2) All linear dimensions are in millimeters.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
ꢀꢀ  
CAT24C256  
SOIC 8-ꢀead 208 mils (X)  
E
b
D
c
A
θ1  
e
A1  
L
SYMBOL  
MIN  
NOM  
MAX  
A1  
A
b
c
D
E
0.05  
0.25  
2.03  
0.48  
0.25  
5.33  
8.26  
5.38  
0.36  
0.19  
5.13  
7.75  
5.13  
E1  
e
1.27 BSC  
L
θ1  
0.51  
0°  
0.76  
8°  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/docꢂmeꢃts/tapeaꢃdreel.pdꢆ  
notes:  
(1) Complies with EIAJ specification.  
(2) All linear dimensions are in millimeters.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
ꢀ2  
CAT24C256  
TSSOP 8-ꢀead 4.4mm (y)  
b
SYMBOL  
MIN  
NOM  
MAX  
1.20  
0.15  
1.05  
0.30  
0.20  
3.10  
6.50  
4.50  
A
A1  
A2  
b
0.05  
0.80  
0.19  
0.09  
2.90  
6.30  
4.30  
0.90  
c
D
3.00  
6.40  
E
E1  
E
E1  
e
4.40  
0.65 BSC  
1.00 REF  
0.60  
L
L1  
θ1  
0.50  
0.75  
0°  
8°  
e
TOP VIEW  
D
c
A2  
A1  
A
θ1  
L1  
L
SIDE VIEW  
END VIEW  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/docꢂmeꢃts/tapeaꢃdreel.pdꢆ  
notes:  
(ꢀ) All dimensions are in milimiters. Angles in degrees  
(2) Complies with JEDEC MO-ꢀ53.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
ꢀ3  
CAT24C256  
TDfn 8-Pad 3 x 4.9mm (ZD2)  
D
A
DETAIL A  
DAP SIZE  
2.6 x 3.3mm  
E
E2  
PIN #1  
IDENTIFICATION  
A1  
PIN #1 IDENTIFICATION  
D2  
TOP VIEW  
SIDE VIEW  
BOTTOM VIEW  
A2  
A
SYMBOL  
MIN  
0.70  
0.00  
0.45  
NOM  
0.75  
MAX  
A
A1  
A2  
A3  
b
0.80  
0.05  
0.65  
0.02  
A1  
A3  
FRONT VIEW  
0.55  
0.20 REF  
0.30  
b
0.25  
2.90  
0.90  
4.80  
0.90  
0.35  
3.10  
1.10  
5.00  
1.10  
D
3.00  
D2  
E
1.00  
L
4.90  
E2  
e
1.00  
e
0.65 TYP  
0.60  
DETAIL A  
L
0.50  
0.70  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/docꢂmeꢃts/tapeaꢃdreel.pdꢆ  
notes:  
(ꢀ) All dimensions are in milimiters.  
(2) Complies with JEDEC MO-229.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
ꢀ4  
CAT24C256  
ORDERIng InfORMATIOn  
Prefix  
Device #  
24C256  
Suffix  
CAT  
W
I
G
T3  
Company ID  
Temperature Range  
I = Industrial (-40°C to +85°C)  
Product  
Number  
Tape & Reel  
T: Tape & Reel  
2: 2000/Reel(4)(5)  
3: 3000/Reel  
Package  
Lead Finish  
L: PDIP  
Blank: Matte-Tin(4)  
G: NiPdAu  
W: SOIC, JEDEC  
X: SOIC, EIAJ(4)  
Y: TSSOP  
ZD2: TDFN (3x4.9mm)(5)  
notes:  
(ꢀ) All packages are RoHS-compliant (Lead-free, Halogen-free).  
(2) The standard lead finish is NiPdAu.  
(3) The device used in the above example is a CAT24C256WI-GT3 (SOIC-JEDEC, Industrial Temperature, NiPdAu, Tape & Reel).  
(4) For SOIC, EIAJ (X) package the standard lead finish is Matte-Tin. This package is available in 2000 pcs/reel, i.e. CAT24C256XI-T2.  
(5) The TDFN 3x4.9mm (ZD2) package is available in 2000 pcs/reel, i.e., CAT24C256ZD2I-GT2.  
(6) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. MD-ꢀꢀ04, Rev. F  
ꢀ5  
CAT24C256  
REVISIOn HISTORy  
Date  
Revisioꢃ Commeꢃts  
ꢀ0/07/05  
A
B
C
Initial Issue  
Update Ordering Information  
Add Tape and Reel Specifications  
ꢀꢀ/ꢀ6/05  
02/02/06  
Update Ordering Information  
Update Package Outlines. Add SOIC, EIAJ Package Outlines  
Update A.C. Characteristics. Add A.C. Test Conditions  
Update Figures ꢀ, 3 and 4  
0ꢀ/ꢀ2/07  
D
Delete Package Marking. Deleted Tape and Reel  
Update Ordering Information  
Update Features/Packages  
Update Pin Configuration  
Update Pin Impedance Characteristics  
Add Power-On Reset (POR) text.  
Update Hardware Write Protection  
05/08/07  
08/ꢀ5/07  
E
F
Add WP Timing (Figure 8) (Renumbered Figures 9 & ꢀꢀ)  
Add 8-Lead TSSOP Package Outline  
Add 8-pad TDFN 3x4.9mm Package Outline  
Updated Ordering Information  
Updated PDIP, SOIC, TSSOP, and TDFN Package Outline Drawings  
© Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. MD-ꢀꢀ04, Rev. F  
ꢀ6  
Copyrights, Trademarks and Patents  
© Catalyst Semiconductor, Inc.  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
Beyond Memory™, DPP™, EZDim™, LDD™, MiniPot™ and Quad-Mode™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS  
FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD  
PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANYAND ALL LIABILITYARISING OUT OF ANY SUCH USE OR  
APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where personal injury or death  
may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled “Advance  
Information” or “Preliminary” and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor  
applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
2975 Stender Way  
Santa Clara, CA 95054  
Phone: 408.542.ꢀ000  
Fax: 408.542.ꢀ200  
www.catsemi.com  
Publication #: MD-ꢀꢀ04  
Revison:  
F
Issue date:  
08/ꢀ5/07  

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