CSPESD304G [CALMIRCO]
The CSPESD304 is a quad ESD transient voltage supression diode array.; 该CSPESD304是一款四ESD瞬态电压压抑二极管阵列。
| 型号： | CSPESD304G |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | The CSPESD304 is a quad ESD transient voltage supression diode array. |
| 文件： | 总6页 (文件大小：301K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSPESD304
4-Channel ESD Array in CSP
Product Description
Features
•
Four channels of ESD protection
The CSPESD304 is a quad ESD transient voltage
supression diode array. Each diode provides a very
high level of protection for sensitive electronic compo-
nents that may be subjected to electrostatic discharge
(ESD). These diodes are designed and characterized
to safely dissipate ESD strikes of 15kV, exceeding the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 30kV.
•
+15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+30kV ESD protection on each channel (HBM)
Chip Scale Package features extremely low
lead inductance for optimum ESD protection
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
•
•
•
•
Lead-free version available
Applications
The CSPESD304 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
•
•
ESD protection for sensitive electronic equipment
I/O port and keypad and button circuitry
protection for portable devices
Can be used for EMI filtering when combined
with external series resistance
Wireless Handsets
•
The CSPESD304 is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
•
•
•
•
•
•
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
Electrical Schematic
ESD_1 ESD_2 ESD_3 ESD_4
C1
C3
A1
A3
B2
GND
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
1
CSPESD304
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1 2 3
ESD_3
ESD_4
C1
C3
A
B
C
GND
B2
ESD_1
ESD_2
Orientation
Marking
A1
A3
A1
CSPESD304
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
A1
A3
B2
C1
C3
NAME
ESD1
ESD2
GND
DESCRIPTION
ESD Channel1
ESD Channel 2
Device Ground
ESD Channel 3
ESD Channel 4
ESD3
ESD4
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
Ordering Part
Ordering Part
1
1
Bumps
Package
Number
Part Marking
Number
Part Marking
5
CSP
CSPESD304
E
CSPESD304G
E
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPESD304
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-65 to +150
200
UNITS
°C
Storage Temperature Range
DC Package Power Rating
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
1
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
= 10µA
MIN
TYP
MAX
UNITS
V
Diode Reverse Breakdown Voltage
I
5.5
V
DIODE
DIODE
I
Diode Leakage Current
V =3.3V, T =25°C
100
nA
LEAK
IN
A
V
Signal Voltage
Positive Clamp
Negative Clamp
I
= 10mA
SIG
DIODE
5.6
-0.4
6.8
-0.8
9.0
-1.5
V
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2, 3 and 4
Notes 2, 3 and 4
ESD
+30
+15
kV
kV
b) Contact Discharge per IEC 61000-4-2
V
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
CL
+15
-8
V
V
Negative Transients
C
Diode Capacitance
At 2.5VDC Reverse Bias,
1MHz, 30mVAC
22
27
32
pF
DIODE
Note 1: TA=-40 to +85°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open
Note 4: These parameters are guaranteed by design and characterization.
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPESD304
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
DC Voltage
Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Figure 2. Frequency Response (single channel vs. GND, in 50Ω system)
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPESD304
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
CSPESD304
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CSPESD304 devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
BOTTOM VIEW
A1
SIDE
C1
B2
B1
VIEW
C
PACKAGE DIMENSIONS
B
A
Package
Bumps
Custom CSP
5
Millimeters
Nom Max
Inches
Nom
3
2
1
Dim
Min
Min
Max
D1
D2
0.30 DIA.
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPESD304 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
P
1
PART NUMBER
CHIP SIZE (mm)
0
0
0
0
CSPESD304
1.33 X 0.96 X 0.6
1.42 X 1.07 X 0.74
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
Center Lines
of Cavity
P
1
Concentric around B.
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
相关型号：
CSPLARH-150.000
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 150MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-155.520
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 155.52MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-156.250
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 156.25MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-161.1328
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 161.1328MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-212.500
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 212.5MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-312.500
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 312.5MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARH-FREQ
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARI-150.000
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 150MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARI-155.520
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 155.52MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
CSPLARI-156.250
PECL Output Clock Oscillator, 150MHz Min, 700MHz Max, 156.25MHz Nom, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN
RALTRON
©2020 ICPDF网 联系我们和版权申明