CM3018-33CP [CALMIRCO]
Micropower, 150mA Low Noise CMOS Regulator with Fast Response; 微器，150mA低噪声CMOS稳压器，具有快速响应
| 型号： | CM3018-33CP |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | Micropower, 150mA Low Noise CMOS Regulator with Fast Response |
| 文件： | 总11页 (文件大小：302K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY
CM3018
Micropower, 150mA Low Noise CMOS Regulator
with Fast Response
Features
Product Description
•
Available with 1.5V, 1.8V, 2.5V, 2.6V, 2.8V, 2.85V,
2.9V, 3.0V, 3.1V or 3.3V outputs
Fast (60µs) V response when enabled
The CM3018 is a very low dropout, low noise regulator
that delivers up to 150mA of load current at a fixed out-
put voltage.
•
•
•
•
•
•
•
•
•
•
•
OUT
Ultra low noise (35µV rms typ.)
A dedicated control input (EN, Active High) provides
power-up sequencing flexibility. When this input is
taken low, the regulator is disabled. In this state, the
supply current will drop to near zero. An internal dis-
charge MOSFET resistance (300Ω) will force the out-
put to ground whenever the device is disabled.
Delivers up to 150mA output current
Very low dropout (150mV at 150mA)
Low quiescent operating current (110µA)
Stable with low-ESR ceramic capacitors
“Zero” disable mode current consumption
Thermal overload protection
Foldback overload current protection
-40°C to +85°C temperature operation
Available in a 5-pin SOT23 and 5-bump Chip Scale
Packages (CSP)
An optional bypass pin is provided for further improve-
ment of noise performance and to maximize the power
supply ripple rejection.
The CM3018 is fully protected, offering both overload
current limiting and high temperature thermal shut-
down.
•
Lead-free versions available
Applications
•
Wireless handsets, PDAs, MP3 players, digital
cameras
PCs and notebooks
Graphics cards, set-top boxes
Compact Flash memory cards
Battery-powered devices
PC cards
The CM3018 is available in a tiny 5 lead SOT-23 pack-
age or a 5-bump CSP and is ideal for space critical
applications. The CSP version of the CM3018 incorpo-
rates OptiGuardTM technology to provide increased reli-
ability at assembly.
•
•
•
•
•
All versions of the CM3018 are now available with
optional lead-free finishing.
Typical Application Circuit
Simplified Electrical Schematic
CM3018
V
V
OUT
IN
EN
V
IN
V
OUT
OUT
EN
+
C
BYP
IN
+
+
C
OUT
BYP
+
VREF
1
µF
-
GND
-
1
µF
C
BYP
10nF
GND
1x
GND
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
1
PRELIMINARY
CM3018
Pin / Bump Descriptions
PIN / BUMP DESCRIPTIONS
SOT23-5
PIN
CSP
BUMP
NAME
DESCRIPTION
1
C3
VIN
The input power supply for the regulator. If this input is within a few inches of the main
supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of
approximately 1µF will ensure adequate filtering.
2
3
B2
A1
GND
EN
The negative reference for all voltages.
A logic input control to enable the regulator output. When EN is asserted (logic high), it
allows output regulation to commence. When EN is deasserted (logic low), the regula-
tor pass transistor is forced into a high impedance mode, and an internal discharge
resistance (300Ω) is applied to the output.
4
5
A3
C1
BYP
This pin is connected to the internal voltage reference of the regulator. An external
bypass capacitor CBYP of 10nF is recommended to improve the noise performance
and to maximize the power supply ripple rejection.
VOUT
The regulator voltage output used to power the load. A nominal output capacitor of 1µF
is sufficient to minimize any transient disturbances under normal operating conditions.
Additional output capacitance can be used to further improve transient load response.
Package / Ordering Information
SOT23-5 Package
PACKAGE / PINOUT DIAGRAM
Top View
1
2
3
5
VIN
GND
EN
VOUT
4
BYP
5-pin SOT23
Note: This drawing is not to scale.
SOT-23 PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
Ordering Part
Number1
SOT23-5
PKG.
Pins
Ordering Part
Number1
Output Voltage
1.5V
Package
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
Part Marking
EA15
Part Marking
EG15
5
5
5
5
5
5
5
5
CM3018-15ST
CM3018-18ST
CM3018-25ST
CM3018-28ST
CM3018-29ST
CM3018-30ST
CM3018-31ST
CM3018-33ST
CM3018-15SO
CM3018-18SO
CM3018-25SO
CM3018-28SO
CM3018-29SO
CM3018-30SO
CM3018-31SO
CM3018-33SO
1.8V
EA18
EG18
2.5V
EA25
EG25
2.8V
EA28
EG28
2.9V
EA29
EG29
3.0V
EA30
EG30
3.1V
EA31
EG31
3.3V
EA33
EG33
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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07/29/04
PRELIMINARY
CM3018
Package / Ordering Information (Cont’d)
Chip Scale Package
PACKAGE / PINOUT DIAGRAM
TOP VIEW
(Bumps Down View)
BOTTOM VIEW
(Bumps Up View)
Orientation
Marking
(see note 2)
1 2 3
VOUT
VIN
C1
C3
A
B
C
GND
B2
EN
BYP
Pin "A1"
Marking
A1
A1
A3
CM3018
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
CSP
BUMPS
Output Voltage
1.5V
Package
CSP
CSP
CSP
CSP
CSP
CSP
CSP
CSP
CSP
CSP
Part Marking
Number1
Part Marking
5
5
5
5
5
5
5
5
5
5
CM3018-15CS
CM3018-18CS
CM3018-25CS
CM3018-26CS
CM3018-28CS
CM3018-2JCS
CM3018-29CS
CM3018-30CS
CM3018-31CS
CM3018-33CS
MA
MB
MC
MD
ME
MF
MG
MH
MJ
CM3018-15CP
CM3018-18CP
CM3018-25CP
CM3018-26CP
CM3018-28CP
CM3018-2JCP
CM3018-29CP
CM3018-30CP
CM3018-31CP
CM3018-33CP
MA
MB
MC
MD
ME
MF
MG
MH
MJ
1.8V
2.5V
2.6V
2.8V
2.85V
2.9V
3.0V
3.1V
3.3V
MK
MK
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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3
PRELIMINARY
CM3018
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
ESD Protection (HBM)
+2000
V
Pin Voltages
VIN (pin 1)
[GND - 0.6] to [+6.0]
[GND - 0.6] to [VIN + 0.6]
[GND - 0.6] to [VIN + 0.6]
V
V
V
EN (pin 3)
VOUT (pin 5)
Storage Temperature Range
-65 to +150
°C
Operating Temperature Range
Ambient
Junction
-40 to +85
0 to +130
°C
°C
Power Dissipation (Notes 1,2)
Internally Limited
W
Note 1: The CM3018 contains a thermal overload circuit that automatically disables the device thereby preventing excessive junc-
tion temperature. For example, a SOT23-5 packaged device mounted on a typical multi-layer board with a moderate heat
spreading copper area (2 square inches) will allow up to 0.315W to be safely dissipated, maintaining a safe operating tem-
perature. Please consult with factory for thermal evaluation assistance.
Note 2: Consult CAMD Technical Support to obtain detailed power dissipation information for the CM3018 packaged in the SOT23
and CSP packages.
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
VIN
2.7 to 5.5
V
Ambient Operating Temperature Range
-40 to +85
0 to +150
1 20%
°C
mA
µF
Load Current
COUT
© 2004 California Micro Devices Corp. All rights reserved.
4
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07/29/04
PRELIMINARY
CM3018
Specifications (continued)
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VOUT
Regulator Output Voltage
TA = 25°C;
-1%
+1%
V
0mA < ILOAD < 150mA; VIN-VOUT = 1V
0°C < TA < 125°C;
0mA < ILOAD < 150mA; VIN-VOUT = 1V
-2%
-3%
+2%
+3%
V
V
-40°C < TA < 125°C;
0mA < ILOAD < 150mA; VIN-VOUT = 1V
VOUTRT
Regulator Response Time
No Load; COUT = 1µf Ceramic Cap
0mA < ILOAD < 150mA
60
1
µs
Ω
RDROPOUT Dropout Resistance
VR LOAD Load Regulation
1.3
VIN-VOUT = 1V; 10mA < ILOAD < 150mA
3.3V < VIN < 4.3V; ILOAD = 5mA
.25
%
VR LINE
ILIM
Line Regulation
0.15
400
200
300
100
110
%/V
mA
mA
Ω
Overload Current Limit
Short Circuit Current Limit
Discharge Resistance
Ground Current
ISC
VOUT < 1V
RDISCH
IGND
EN tied to ground; VIN = 3.0V
with EN tied to VIN; ILOAD = 0mA:
with EN tied to VIN; ILOAD = 150mA:
200
250
µA
µA
with EN tied to GND (Disable Mode):
Regulator enabled
0.1
0.8
10
µA
VIH
VIL
IEN
Enable High Threshold
Enable Low Threshold
Enable Input Current
1.2
V
Regulator shutdown
VEN > 0.8V
0.4
0.7
.01
150
15
V
µA
°C
°C
dB
TDISABLE Shutdown Temperature
THYST
PSRR
Thermal Hysteresis
Ripple Rejection
60
ƒ = 120Hz; VIN − VOUT = 1V;
ILOAD= 100µA; COUT = 1µF Ceramic;
CBYP = 10nF
eN
Output Noise
300Hz-100kHz; COUT = 10µF Ceramic;
35
µVrms
CBYP = 10nF
Note 1: Electrical operating characteristics are guaranteed over standard operating conditions unless otherwise noted.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
PRELIMINARY
CM3018
Performance Information
Typical Noise Characteristics
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Power Supply Ripple Rejection
Power Supply Ripple Rejection
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
100uA
1mA
100uA
1mA
150mA
Vin = 4.3V, Vout = 3.3V
10mA
10mA
Vin = 4.3V, Vout = 3.3V
Cout = 10uF cer.
Cbyp = 10nF
Cout = 1uF cer.
Cbyp = 10nF
150mA
10
100
1000
Frequency [Hz]
10000
100000
10
100
1000
Frequency [Hz]
10000
100000
Power Supply Ripple Rejection
80
70
60
50
40
30
20
10
0
100uA
1mA
10mA
Vin = 4.3V, Vout = 3.3V
Cout = 1uF cer.
NO Byp cap
150mA
10
100
1000
Frequency [Hz]
10000
100000
Noise Performance
Noise Performance
1.E-05
1.E-06
1.E-07
1.E-08
1.E-05
1.E-06
1.E-07
1.E-08
Vin = 4.8V, Vout = 3.3V
Vin = 4.8V Vout = 3.3V
Cout = 1uF cer.
Cbyp = 10nF
100uA load
Cout = 10uF cer.
Cbyp = 10nF
100uA load
100
1000
10000
100000
100
1000
10000
100000
frequency [Hz]
frequency [Hz]
© 2004 California Micro Devices Corp. All rights reserved.
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▲
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07/29/04
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical DC Characteristics (nominal conditions unless otherwise specified)
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Ground Current vs. Input (5mA Load)
Ground Current vs. Load (VIN = 5V)
150
125
100
75
150
100
50
0
50
25
0
0
50
100
Load Current [mA]
150
200
0
1
2
3
4
INPUT VOLTAGE [V]
5
6
Load Regulation (VIN = 5V)
Dropout Voltage vs. Load Current (VOUT = 3.25V)
3.40
3.35
3.30
3.25
3.20
200
150
100
50
0
0
100 200
LOAD CURRENT [mA]
300
0
50
100
150
200
LOAD CURRENT [mA]
Line Regulation (5mA Load)
Foldback Current Limiting (VIN = 3.8V)
4.0
3.7
3.5
3.3
3.1
2.9
2.7
2.5
3.0
2.0
1.0
0.0
0
100
200
300
LOAD CURRENT [mA]
400
500
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT VOLTAGE [V]
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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7
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical Transient Characteristics (nominal conditions unless specified otherwise)
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Load transient (10% to 100%) Step Response
Line Transient (1Vpp) Step Response
Enable Response (CBYP = 10nF)
Disable Response (CBYP = 10nF)
EN
EN
VOUT
VOUT
NO Load
NO Load
COUT = 1uF Cer.
COUT = 1uF Cer.
© 2004 California Micro Devices Corp. All rights reserved.
8
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▲
Tel: 408.263.3214
▲
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▲
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07/29/04
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical Thermal Characteristics
Ground Current vs. Temperature
The overall junction to ambient thermal resistance (θ )
(VIN=5V)
JA
for device power dissipation (P ) consists primarily of
two paths in series. The first path is the junction to the
D
100
80
60
40
20
0
case (θ ) which is defined by the package style, and
JC
the second path is case to ambient (θ ) thermal resis-
CA
tance which is dependent on board layout. The final
operating junction temperature for any set of conditions
can be estimated by the following thermal equation:
T
= T
+ P ∗ (θ ) + P ∗ (θ
)
CA
JUNC
AMB
D
JC
D
= T
+ P ∗ (θ )
D JA
AMB
0
25
50
75
100
125
SOT-23 Package Considerations
TEMPERATURE [oC]
When the SOT23 version of the CM3018 is mounted
on a double-sided printed circuit board with two square
inches of copper allocated for "heat spreading", the
Output Voltage Change vs. Temperature
(VIN=5V, 1mA Load)
50
resulting θ is 175°C/W.
JA
40
30
Based on a maximum power dissipation of 320mW
20
(Load x V -V
= 150mA x 2.2V) with an ambient of
IN OUT
10
70°C the resulting junction temperature will be:
0
T
= T + P ∗ (θ )
-10
-20
-30
-40
-50
JUNC
AMB
D
JA
= 70°C + 315mW ∗ (175°C/W)
= 70°C + 57.75°C = 127.75°C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
-50 -25
0
25
50
75 100 125
TEMPERATURE [oC]
Measurements showing performance up to a junction
temperature of 125°C were performed under light load
conditions (1mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the CM3018 in a
SOT23 package with an overall θ of 175°C/W, which
JA
allows up to 450mW to be dissipated safely.
Please consult CAMD Technical Support for assistance
with thermal analysis of the CM3018 with respect to a
specific application.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
9
PRELIMINARY
CM3018
Mechanical Details
SOT23 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for CM3018 devices packaged in 5-pin
SOT23 packages are presented below.
TOP VIEW
For complete information on the SOT23 package, see
the California Micro Devices SOT23 Package Informa-
tion document.
e1
e
5
1
4
3
PACKAGE DIMENSIONS
E1
E
2
Package
Pins
SOT23 (JEDEC name is MO-178)
5
Millimeters
Inches
Max
b
Dimensions
Min
Max
1.45
0.15
0.50
0.22
3.05
3.00
1.75
Min
--
A
A1
b
--
0.057
0.006
0.020
0.009
0.120
0.118
0.069
SIDE VIEW
0.00
0.30
0.08
2.75
2.60
1.45
0.000
0.012
0.003
0.108
0.102
0.057
D
c
A
D
E
E1
e
A1
0.95 BSC
0.0374 BSC
e1
L
1.90 BSC
0.60 REF
0.0748 BSC
0.0236 REF
END VIEW
# per tape
and reel
3000 pieces
c
Controlling dimension: inches
L1
Package Dimensions for SOT23-5.
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
07/29/04
PRELIMINARY
CM3018
Mechanical Details
CSP Mechanical Specifications
CM3018CS/CP devices are packaged in a custom
TM
Chip Scale Package (CSP) with OptiGuard
coating.
Mechanical Package Diagrams
Dimensions are presented below. For complete infor-
mation on CSP packaging, see the California Micro
Devices CSP Package Information document.
BOTTOM VIEW
A1
OptiGuardTM
Coating
C1
B2
B1
PACKAGE DIMENSIONS
C
Package
Bumps
Custom CSP
5
B
A
Millimeters
Nom Max
Inches
Nom
Dim
3
2
1
Min
Min
Max
D1
D2
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
0.961 1.006 1.051 0.0378 0.0396 0.0414
1.418 1.463 1.508 0.0558 0.0576 0.0594
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.203 0.253 0.303 0.0080 0.0100 0.0119
0.247 0.297 0.347 0.0097 0.0117 0.0136
0.600 0.670 0.739 0.0236 0.0264 0.0291
0.394 0.445 0.495 0.0155 0.0175 0.0195
0.30 DIA.
63/37 Sn/Pb
SIDE
VIEW
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Custom 5-Bump Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
PART
NUMBER
TAPE WIDTH
W
REEL
DIAMETER
QTYPER
REEL
B0 X A0 X K0
P0
P1
CHIP SIZE (mm)
CM3018
1.463 X 1.006 X 0.670
1.67 X 1.17 X 0.730
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For Tape Feeder Reference
Embossment
Only including Draft.
P
Center Lines
of Cavity
1
Concentric Around B.
User Direction of Feed
Figure 1. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
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▲
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11
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SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
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