CM1220-04CP [CALMIRCO]
4 and 8-Channel ESD Protection Arrays in CSP; 4和8通道ESD保护阵列的CSP
| 型号： | CM1220-04CP |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | 4 and 8-Channel ESD Protection Arrays in CSP |
| 文件： | 总6页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM1220
4 and 8-Channel ESD Protection Arrays in CSP
Product Description
Features
•
•
•
4 and 8 channels of ESD protection
California Micro Devices' CM1220 ESD protection
arrays are available in four and eight channel configu-
rations. Each ESD channel features a nominal capaci-
tance of 14pF making these devices ideal for
protecting high speed I/O ports and LCD and camera
data lines without significantly affecting signal integrity.
The CM1220 integrates avalanche-type ESD diodes
on every channel, providing a very high level of protec-
tion for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). These
diodes safely dissipate ESD strikes of 15kV, exceed-
ing the maximum requirement of the IEC61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, these devices protect for contact dis-
charges at greater than 30kV.
OptiGuard™ coated for improved reliability
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Chip Scale Package features extremely low
lead inductance for optimum ESD protection
5 bump, 0.960mm X 1.330mm CSP footprint
for CM1220-04
•
•
•
•
•
10 bump, 1.960mm X 1.330mm CSP footprint
for CM1220-08
Lead-free version available
Applications
•
•
LCD and camera datalines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-
to-use pin assignments. In particular, the CM1220 is
ideal for protecting high speed I/O ports and data and
control lines for the LCD display and camera interface
in mobile handsets.
•
•
•
•
Keypads and buttons
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
These devices incorporate CMD’s OptiGuard™ coating
for improved reliability at assembly. The CM1220 is
available in a space-saving, low-profile Chip Scale
Packages with optional lead-free finishing.
Electrical Schematic
ESD_1 ESD_2 ESD_3 ESD_4 ESD_5 ESD_6 ESD_7 ESD_8
ESD_1 ESD_2 ESD_3 ESD_4
A5
A7
C5
C7
A1
A3
C1
C3
C1
C3
A1
A3
B2, B6
B2
GND
GND
CM1220-08
CM1220-04
© 2006 California Micro Devices Corp. All rights reserved.
02/03/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CM1220
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
1 2 3
Marking
(see note 2)
C1
C3
A
B
C
B2
Orientation
Marking
A1
A3
CM1220-04
A1
5 Bump CSP Package
with OptiGuard
™
Orientation
Marking(see note 2)
1 2 3
5 6 7
A
B
C
C1
A1
C3
A3
C5
A5
C7
A7
B2
B6
L208
Orientation
Marking
CM1220-08
A1
10 Bump CSP Package
with OptiGuard
™
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a " " character for the top side orientation mark.
+
PIN DESCRIPTIONS
CM1220-08
PINS NAME
CM1220-04
PINS NAME
CM1220-08
CM1220-04
DESCRIPTION
PINS
C1
NAME
PINS
NAME
ESD3
ESD4
−
DESCRIPTION
ESD Channel
ESD Channel
ESD Channel
ESD Channel
Device Ground
A1
A3
A5
A7
B2
ESD1
ESD2
ESD3
ESD4
GND
A1
A3
−
ESD1 ESD Channel
ESD2 ESD Channel
ESD5
ESD6
ESD7
ESD8
GND
C1
C3
−
C3
ESD Channel
C5
−
ESD Channel
C7
−
−
−
−
B2
GND
Device Ground
B6
−
−
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
Bumps
Package
CSP
Part Marking
Part Marking
5
CM1220-04CS
CM1220-08CS
J
CM1220-04CP
CM1220-08CP
J
10
CSP
L208
L208
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2006 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 02/03/06
CM1220
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP MAX UNITS
CDIODE Diode (Channel) Capacitance
At 2.5VDC Reverse
11
14
17
pF
Bias, 1MHz, 30mVAC
VDIODE Diode Standoff Voltage
IDIODE = 10μA
6.0
0.1
V
ILEAK
Diode Leakage Current
1
μA
VIN = +3.3V
(reverse bias voltage)
VSIG
Signal Clamp Voltage
Positive Clamp
IDIODE = 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
Negative Clamp
VESD
In-system ESD Withstand Voltage
Note 2
a) Human Body Model, MIL-STD-883, Method 3015
b) Contact Discharge per IEC 61000-4-2
30
15
kV
kV
RDYN
Dynamic Resistance
Positive
2.3
0.9
Ω
Ω
Negative
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. These parameters are
guaranteed by design and characterization.
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
DC Voltage
Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
© 2006 California Micro Devices Corp. All rights reserved.
02/03/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CM1220
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.275mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50μm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 2. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 3. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 4. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 02/03/06
CM1220
Mechanical Details
The CM1220 is supplied in custom Chip Scale Pack-
ages (CSP) depending on the channel count. Dimen-
sions for these packages are presented in the following
pages.
Mechanical Package Diagrams
OptiGuard™ Coated CSP
CM1220-04CS/CP Mechanical Specifications
BOTTOM VIEW
A1
Mechanical dimensions for the CM1220-04CS/CP are
presented below.
OptiGuardTM
Coating
C1
B2
B1
PACKAGE DIMENSIONS
C
B
A
Package
Bumps
Custom CSP
5
Millimeters
Nom Max
Inches
Nom
Dim
Min
Min
Max
3
2
1
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1220-04CS/CP Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1220-04
1.33 X 0.96 X 0.644 1.42 X 1.07 X 0.740
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
±
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 5. Tape and Reel Mechanical Data
© 2006 California Micro Devices Corp. All rights reserved.
02/03/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CM1220
Mechanical Details (cont’d)
CM1220-08CS/CP Mechanical Specifications
Mechanical dimensions for the CM1220-08CS/CP are
presented below.
Mechanical Package Diagrams
OptiGuard™ Coated CSP
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
10
BOTTOM VIEW
A1
OptiGuardTM
Coating
C1
Millimeters
Nom Max
Inches
Nom
B2
B1
Dim
Min
Min
Max
C
B
A
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
1 2 3 5 6 7
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
# per tape and
reel
3500 pieces
Package dimensions for CM1220-08CS/CP
Chip Scale Package
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1220-08
1.96 X 1.33 X 0.644 2.08 X 1.45 X 0.740
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
±
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2006 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 02/03/06
相关型号：
©2020 ICPDF网 联系我们和版权申明