BS616LV1611FAG70 [BSI]
SRAM;型号: | BS616LV1611FAG70 |
厂家: | BRILLIANCE SEMICONDUCTOR |
描述: | SRAM 静态存储器 |
文件: | 总11页 (文件大小:127K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Very Low Power CMOS SRAM
1M X 16 bit
BS616LV1611
Pb-Free and Green package materials are compliant to RoHS
n FEATURES
ŸWide VCC operation voltage : 2.4V ~ 5.5V
n DESCRIPTION
The BS616LV1611 is a high performance, very low power CMOS
Static Random Access Memory organized as 1,048,576 by 16 bits
and operates form a wide range of 2.4V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both
high speed and low power features with typical CMOS standby
current of 1.5uA at 3.0V/25OC and maximum access time of 55ns at
3.0V/125OC.
ŸVery low power consumption :
VCC = 3.0V
VCC = 5.0V
Operation current : 46mA (Max.)at 55ns
2mA (Max.)at 1MHz
1.5uA (Typ.) at 25 OC
Standby current :
Operation current : 115mA (Max.)at 55ns
10mA (Max.)at 1MHz
Standby current :
ŸHigh speed access time :
6.0uA (Typ.) at 25OC
Easy memory expansion is provided by an active LOW chip enable
(CE1), active HIGH chip enable (CE2) and active LOW output
enable (OE) and three-state output drivers.
-55
-70
55ns(Max.) at VCC=3.0~5.5V
70ns(Max.) at VCC=2.7~5.5V
ŸAutomatic power down when chip is deselected
ŸEasy expansion with CE2, CE1 and OE options
ŸI/O Configuration x8/x16 selectable by LB and UB pin.
ŸThree state outputs and TTL compatible
The BS616LV1611 has an automatic power down feature, reducing
the power consumption significantly when chip is deselected.
The BS616LV1611 is available in 48-pin TSOP Type I package and
48-ball BGA package.
ŸFully static operation, no clock, no refresh
ŸData retention supply voltage as low as 1.5V
n POWER CONSUMPTION
POWER DISSIPATION
STANDBY
Operating
PRODUCT
FAMILY
OPERATING
TEMPERATURE
PKG TYPE
(ICC, Max)
(IC CSB1, Typ.)
(ICCSB1, Max)
VCC=5.0V
1MHz f M ax.
VCC=3.0V
f Max.
VCC=5.0V V CC=3.0V VCC=5.0V VCC=3.0V
1MHz
2mA
Automotive
Grade
BS616LV1611FA
BGA-48-0912
TSOP I-48
6.0uA
1.5uA
220uA
120uA
10mA
115mA
46mA
BS616LV1611TA -40OC to +125OC
n PIN CONFIGURATIONS
n BLOCK DIAGRAM
A4
A3
A2
A1
A0
1
2
3
4
5
6
7
8
48
A5
A6
A7
OE
UB
LB
CE2
NC
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
A8
47
46
45
4 4
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
A13
A12
A11
CE1
DQ0
DQ1
DQ2
DQ3
VCC
NC
VSS
DQ4
DQ5
DQ6
DQ7
A19
WE
A10
A9
A8
A7
A6
A5
A4
Address
Input
1024
Mem oryArray
10
Row
Decoder
9
10
11
12
13
14
15
16
17
18
19
20
21
Buffer
1024 x 16384
BH616LV1611TC
BH616LV1611TI
16384
DQ0
Column I/O
16
16
Data
Input
Buffer
.
.
.
.
A18
A17
A9
A10
Write Driver
Sense Am p
A16
A15
A14
22
23
24
27
26
25
A11
A12
A13
.
.
.
.
16
16
Data
Output
Buffer
.
.
.
1024
.
Column Decoder
10
1
2
3
4
5
6
DQ15
A
B
C
LB
OE
A0
A1
A2
CE2
CE2
CE1
WE
OE
UB
Address Input Buffer
D8
D9
UB
A3
A5
A4
A6
CE1
D1
D0
D2
Control
D10
LB
A14 A15 A16 A17 A18 A0 A1 A2 A3 A19
VCC
V
SS
D
E
F
VSS
VCC
D14
D15
A18
D11
D12
D13
A19
A8
A17
NC
A14
A12
A9
A7
D3
D4
VCC
VSS
D6
A16
A15
A13
A10
D5
G
H
WE
A11
D7
NC
48-ball BGA top view
Brilliance Semiconductor, Inc.
reserves the right to change products and specifications without notice.
R0201-BS616LV1611A
Revision 2.2A
1
Mar.
2006
BS616LV1611
n PIN DESCRIPTIONS
Name
Function
These 20 address inputs select one of the 1,048,576 x 16 bit in the RAM
A0-A19 Address Input
CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when
data read form or write to the device. If either chip enable is not active, the device is
deselected and is in standby power mode. The DQ pins will be in the high impedance
state when the device is deselected.
CE1 Chip Enable 1 Input
CE2 Chip Enable 2 Input
The write enable input is active LOW and controls read and write operations. With the
chip selected, when WE is HIGH and OE is LOW, output data will be present on the
DQ pins; when WE is LOW, the data present on the DQ pins will be written into the
selected memory location.
WE Write Enable Input
The output enable input is active LOW. If the output enable is active while the chip is
selected and the write enable is inactive, data will be present on the DQ pins and they
will be enabled. The DQ pins will be in the high impendence state when OE is inactive.
Lower byte and upper byte data input/output control pins.
OE Output Enable Input
LB and UB Data Byte Control Input
16 bi-directional ports are used to read data from or write data into the RAM.
DQ0-DQ15 Data Input/Output
Ports
VCC
Power Supply
Ground
VSS
n TRUTH TABLE
MODE
CE2
DQ0~DQ7 DQ8~DQ15 VCC CURRENT
CE1
WE
OE
LB
UB
H
X
L
X
X
X
X
High Z
High Z
High Z
High Z
High Z
DOUT
High Z
DOUT
DIN
High Z
High Z
High Z
High Z
High Z
DOUT
DOUT
High Z
DIN
ICCSB, ICCSB1
Chip De-selected
(Power Down)
X
X
L
L
X
X
H
H
X
X
H
H
X
H
L
X
H
X
L
ICCSB, ICCSB1
X
H
H
ICCSB, ICCSB1
ICC
ICC
ICC
ICC
ICC
ICC
ICC
ICC
Output Disabled
Read
X
L
L
L
L
H
H
H
L
L
H
L
L
H
L
L
Write
X
H
L
L
X
DIN
H
DIN
X
NOTES: H means VIH ; L means VIL; X means don’t care (Must be VIH or VIL state)
Revision 2.2A
R0201-BS616LV1611A
2
Mar.
2006
BS616LV1611
n ABSOLUTE MAXIMUM RATINGS (1)
n OPERATING RANGE
AMBIENT
TEMPERATURE
-40OC to + 125OC
SYMBOL
VTERM
TBIAS
PARAMETER
RATING
-0.5(2) to 7.0
-40 to +125
-60 to +150
1.0
UNITS
V
RANG
VCC
Terminal Voltage with
Respect to GND
Automotive
2.4V ~ 5.5V
Temperature Under
Bias
OC
n CAPACITANCE (1) (TA = 25OC, f = 1.0MHz)
TSTG
Storage Temperature
Power Dissipation
DC Output Current
OC
PT
W
SYMBOL PAMAMETER CONDITIONS MAX. UNITS
IOUT
20
mA
Input
CIN
CIO
VIN = 0V
VI/O = 0V
6
8
pF
pF
Capacitance
Input/Output
Capacitance
1. Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
1. This parameter is guaranteed and not 100% tested.
2. –2.0V in case of AC pulse width less than 30 ns.
n DC ELECTRICAL CHARACTERISTICS (TA = -40OC to +125OC)
PARAMETER
PARAMETER
TEST CONDITIONS
MIN.
2.4
-0.5(2)
2.2
--
TYP.(1)
MAX.
UNITS
V
NAME
VCC
Power Supply
--
--
--
--
--
--
--
--
--
--
5.5
VIL
VIH
Input Low Voltage
0.8
V
Input High Voltage
VCC+0.3(3)
V
VIN = 0V to VCC
,
IIL
Input Leakage Current
Output Leakage Current
Output Low Voltage
Output High Voltage
1
1
uA
uA
V
CE1 = VIH or CE2 = VIL
VI/O = 0V to VCC
,
ILO
--
CE1 = VIH or CE2 = VIL or OE = VIH
VOL
VOH
ICC
VCC = Max, IOL = 2.0mA
--
0.4
--
VCC = Min, IOH = -1.0mA
CE1 = VIL and CE2 = VIH ,
2.4
--
V
VCC=3.0V
VCC=5.0V
VCC=3.0V
VCC=5.0V
VCC=3.0V
VCC=5.0V
VCC=3.0V
VCC=5.0V
46
115
2
Operating Power Supply
Current
mA
mA
mA
uA
(4)
IDQ = 0mA, f = FMAX
CE1 = VIL and CE2 = VIH ,
IDQ = 0mA, f = 1MHz
Operating Power Supply
Current
ICC1
ICCSB
ICCSB1
--
10
1.0
2.0
120
220
CE1 = VIH , or CE2 = VIL,
IDQ = 0mA
Standby Current – TTL
--
≧
≦
1.5
6.0
CE1 VCC -0.2V or CE2 0.2V,
Standby Current – CMOS
--
V
IN≧VCC-0.2V or VIN≦0.2V
1. Typical characteristics are at TA=25OC and not 100% tested.
2. Undershoot: -1.0V in case of pulse width less than 20 ns.
3. Overshoot: VCC+1.0V in case of pulse width less than 20 ns.
4. FMAX=1/tRC.
Revision 2.2A
Mar. 2006
R0201-BS616LV1611A
3
BS616LV1611
n DATA RETENTION CHARACTERISTICS (TA = -40OC to +125OC)
SYMBOL
VDR
PARAMETER
VCC for Data Retention
Data Retention Current
TEST CONDITIONS
MIN.
1.5
--
TYP. (1)
MAX.
UNITS
CE1≧VCC -0.2V or CE2≦0.2V,
VIN≧VCC-0.2V or VIN≦0.2V
CE1≧VCC -0.2V or CE2≦0.2V,
--
0.8
--
--
80
--
V
ICCDR
tCDR
uA
ns
ns
IN≧
IN≦
0.2V
V
VCC-0.2V or V
Chip Deselect to Data
Retention Time
0
See Retention Waveform
(2)
tR
Operation Recovery Time
tRC
--
--
1. VCC=1.5V, TA=25OC and not 100% tested.
2. tRC = Read Cycle Time.
n LOW VCC DATA RETENTION WAVEFORM (1) (CE1 Controlled)
Data Retention Mode
V
DR≧1.5V
VCC
VCC
tR
VCC
tCDR
CE1≧VCC - 0.2V
VIH
VIH
CE1
n LOW VCC DATA RETENTION WAVEFORM (2) (CE2 Controlled)
Data Retention Mode
V
DR≧1.5V
VCC
tCDR
VCC
tR
VCC
CE2≦0.2V
CE2
VIL
VIL
n AC TEST CONDITIONS
n KEY TO SWITCHING WAVEFORMS
(Test Load and Input/Output Reference)
WAVEFORM
INPUTS
OUTPUTS
Input Pulse Levels
Vcc / 0V
1V/ns
MUST BE
STEADY
MUST BE
STEADY
Input Rise and Fall Times
Input and Output Timing
Reference Level
0.5Vcc
MAY CHANGE
WILL BE CHANGE
FROM “H” TO “L”
FROM “H” TO “L”
tCLZ, tOLZ, tCHZ, tOHZ, tWHZ
CL = 5pF+1TTL
CL = 30pF+1TTL
Output Load
Others
MAY CHANGE
WILL BE CHANGE
FROM “L” TO “H”
FROM “L” TO “H”
ALL INPUT PULSES
DON’T CARE
ANY CHANGE
PERMITTED
CHANGE :
STATE UNKNOW
VCC
1 TTL
90%
90%
10%
10%
Output
GND
CENTER LINE IS
HIGH INPEDANCE
“OFF” STATE
(1)
®
¬
®
¬
DOES NOT
APPLY
CL
Rise Time:
1V/ns
Fall Time:
1V/ns
1. Including jig and scope capacitance.
Revision 2.2A
R0201-BS616LV1611A
4
Mar.
2006
BS616LV1611
n AC ELECTRICAL CHARACTERISTICS (TA = -40OC to +125OC)
READ CYCLE
CYCLE TIME : 55ns CYCLE TIME : 70ns
(VCC=3.0~5.5V) (VCC=2.7~5.5V)
JEDEC
PARAMETER
NAME
PARANETER
DESCRIPTION
UNITS
NAME
MIN. TYP. MAX. MIN. TYP. MAX.
tAVAX
tAVQX
tRC
tAA
Read Cycle Time
55
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
55
55
55
55
30
--
70
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
70
70
70
70
35
--
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address Access Time
Chip SelectAccess Time
Chip SelectAccess Time
Data Byte Control Access Time
(CE1)
(CE2)
tELQV1
tELQV2
tBLQV
tGLQV
tELQX1
tELQX2
tBLQX
tGLQX
tEHQZ1
tEHQZ2
tBHQZ
tGHQZ
tAVQX
tACS1
tACS2
tBA
--
--
--
--
(LB, UB)
--
--
tOE
Output Enable to Output Valid
Chip Select to Output Low Z
Chip Select to Output Low Z
--
--
(CE1)
(CE2)
tCLZ1
tCLZ2
tBE
10
10
10
5
10
10
10
5
--
--
Data Byte Control to Output Low Z (LB, UB)
Output Enable to Output Low Z
--
--
tOLZ
tCHZ1
tCHZ2
tBDO
tOHZ
tOH
--
--
Chip Select to Output High Z
Chip Select to Output High Z
(CE1)
(CE2)
--
30
30
30
25
--
--
35
35
35
30
--
--
--
Data Byte Control to Output High Z (LB, UB)
Output Enable to Output High Z
--
--
--
--
Data Hold from Address Change
10
10
n SWITCHING WAVEFORMS (READ CYCLE)
(1,2,4)
READ CYCLE 1
tRC
ADDRESS
tAA
tOH
tOH
DOUT
Revision 2.2A
Mar. 2006
R0201-BS616LV1611A
5
BS616LV1611
(1,3,4)
READ CYCLE 2
CE1
tACS1
CE2
DOUT
tACS2
(5)
tCHZ
(5)
tCLZ
(1, 4)
READ CYCLE 3
tRC
ADDRESS
OE
tAA
tOH
tOE
tOLZ
CE1
(5)
tACS1
tOHZ
tCHZ
(5)
(1,5)
tCLZ1
CE2
tACS2
(5)
tCLZ2
(2,5)
tCHZ2
tBA
tBE
LB, UB
DOUT
tBDO
NOTES:
1. WE is high in read Cycle.
2. Device is continuously selected when CE1 = VIL and CE2= VIH.
3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high.
4. OE = VIL.
5. Transition is measured ± 500mV from steady state with CL = 5pF.
The parameter is guaranteed but not 100% tested.
Revision 2.2A
R0201-BS616LV1611A
6
Mar.
2006
BS616LV1611
n AC ELECTRICAL CHARACTERISTICS (TA = -40OC to +125OC)
WRITE CYCLE
CYCLE TIME : 55ns CYCLE TIME : 70ns
(VCC=3.0~5.5V) (VCC=2.7~5.5V)
MIN. TYP. MAX. MIN. TYP. MAX.
JEDEC
PARAMETER
NAME
PARANETER
DESCRIPTION
UNITS
NAME
tAVAX
tAVWL
tAVWH
tELWH
tBLWH
tWLWH
tWHAX1
tWHAX2
tWLQZ
tDVWH
tWHDX
tGHQZ
tWHQX
tWC
tAS
Write Cycle Time
55
0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
70
0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address Set up Time
Address Valid to End of Write
55
55
25
30
0
--
70
70
30
35
0
--
tAW
tCW
tBW
tWP
tWR1
tWR2
tWHZ
tDW
tDH
Chip Select to End of Write
--
--
Data Byte Control to End of Write
(LB, UB)
--
--
Write Pulse Width
--
--
Write Recovery Time
(CE1, WE)
(CE2)
--
--
Write Recovery Time
0
--
0
--
Write to Output High Z
--
25
--
--
30
--
Data to Write Time Overlap
Data Hold from Write Time
Output Disable to Output in High Z
End of Write to Output Active
25
0
30
0
--
--
tOHZ
tOW
--
25
--
--
30
--
5
5
n SWITCHING WAVEFORMS (WRITE CYCLE)
WRITE CYCLE 1 (1)
tWC
ADDRESS
OE
(3)
tWR1
(11)
tCW
(5)
(5)
CE1
CE2
(11)
tCW
(3)
tWR2
tBW
LB, UB
tAW
(2)
tWP
WE
tAS
(4,10)
tOHZ
DOUT
tDH
tDW
DIN
Revision 2.2A
Mar. 2006
R0201-BS616LV1611A
7
BS616LV1611
WRITE CYCLE 2 (1,6)
ADDRESS
tWC
(11)
tCW
(5)
CE1
CE2
(11)
tCW
(3)
tWR
tBW
(12)
LB, UB
WE
tAW
(2)
tWP
tAS
(4,10)
tWHZ
(7)
(8)
tOW
DOUT
tDW
tDH
(8,9)
DIN
NOTES:
1. WE must be high during address transitions.
2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and
WE low. All signals must be active to initiate a write and any one signal can terminate a
write by going inactive. The data input setup and hold timing should be referenced to the
second transition edge of the signal that terminates the write.
3. tWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of
write cycle.
4. During this period, DQ pins are in the output state so that the input signals of opposite
phase to the outputs must not be applied.
5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low
transitions or after the WE transition, output remain in a high impedance state.
6. OE is continuously low (OE = VIL ).
7. DOUT is the same phase of write data of this write cycle.
8. DOUT is the read data of next address.
9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the
data input signals of opposite phase to the outputs must not be applied to them.
10.Transition is measured ± 500mV from steady state with CL = 5pF.
The parameter is guaranteed but not 100% tested.
11.tCW is measured from the later of CE1 going low or CE2 going high to the end of write.
12.The change of Read/Write cycle must accompany with CE or address toggled.
Revision 2.2A
R0201-BS616LV1611A
8
Mar.
2006
BS616LV1611
n ORDERING INFORMATION
BS616LV1611
X
X
Z Y Y
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green, RoHS Compliant
P: Pb free, RoHS Compliant
GRADE
A: -40OC to +125OC
(Automotive Grade)
PACKAGE
F: BGA-48-0912
T: TSOP I-48
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does
not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result
in significant injury or death, including life-support systems and critical medical instruments.
n PACKAGE DIMENSIONS
NOTES:
1: CONTROLLING DIMENSIONSARE IN MILLIMETERS.
2: PIN#1 DOTMARKING BYLASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
SIDE VIEW
D
0.1
N
D
E
D1
E1
e
D1
3.375
48
12.0
9.0
5.25
3.75
0.75
SOLDER BALL 0.35 ±0.05
VIEW A
48 mini-BGA (9mm x 12mm)
Revision 2.2A
R0201-BS616LV1611A
9
Mar.
2006
BS616LV1611
n PACKAGE DIMENSIONS
TSOP I-48 Pin (12mm x 20mm)
Revision 2.2A
R0201-BS616LV1611A
10
Mar.
2006
BS616LV1611
n Revision History
Revision No.
2.2.A
History
Draft Date
Mar. 27,2006
Remark
Add Automotive
Revision 2.2A
R0201-BS616LV1611A
11
Mar.
2006
相关型号:
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