BL-XS1361-TR7 [BRTLED]

LED LAMPS SPECIFICATION; LED灯规格


型号：	BL-XS1361-TR7
厂家：	BRTLED
描述：	LED LAMPS SPECIFICATION LED灯规格光电
文件：	总6页 (文件大小：196K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BRIGHT LED ELECTRONICS CORP.

LED LAMPS SPECIFICATION

●COMMODITY：AXIAL TYPE LAMP

●DEVICE NUMBER：BL-XS1361-F7

PAGE:

●ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25℃)

REVISION: 1.1

Chip

Absolute Maximun

Electro-optical

Data (At 20mA)

Viewing

Angle

2θ1/2

(deg)

Rating

Lens

Peak

Wave

Length

Dominant

Want

Length

Emitted

Color

Vf(V)

Iv(mcd)

Appearance

Δλ

(nm)

Peak

(mW) (mA) If(mA)

λp(nm) λd(nm)

Typ. Max. Min Typ.

2.0 2.6 28.0 60.0

Super Red

660

638-648 Water Clear 20

100

Remark：1.Viewing angle is the Off-axis angle at which the luminous intensity is half the axial luminous intensity

2.This product doesn’t contain restriction Substance, comply ROHS standard.

●ABSOLUTE MAXIMUN RATINGS (Ta=25℃)

Reverse Voltage ………………………………………..……………………………….…..……………………….… 5V

Reverse Current (VR=5V) …………………………………………….………………………………………….. 100µA

Operating Temperature Range ……………………………………………..……….……………..…… -25℃ ～ 80℃

Storage Temperature Range ……………………………………………………………………..…… -30℃ ～ 85℃

Lead Soldering Temperature ………………………………..……………..……………………… 260℃ For 5 Seconds

●PACKAGE DIMENSIONS

NOTES: 1.All dimensions are in millimeters (inches).

2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.

3.Lead spacing is measured where the leads emerge from the package.

4.Specifications are subject to change without notice.

BRIGHT LED ELECTRONICS CORP.

LED LAMP SPECIFICATION

●COMMODITY：AXIAL TYPE LED LAMP

PAGE:

●DEVICE NUMBER：BL-XS1361-TR7

REVISION:

1.0

660

BRIGHT LED ELECTRONICS CORP.

AXIAL LED LAMP SPECIFICATION

●COMMODITY：AXIAL TYPE LED LAMP

●DEVICE NUMBER：BL-XS1361-TR7

PAGE:

● TAPPING AND PACKAGING SPECIFICA

RERSION: 1.0

SPECIFICATION

ITEM

SYMBOL

Minimum

Maximum

inch

1.40

1.65

5.45

3.10

3.00

3.90

1.95

－

inch

1.55

1.85

5.55

3.30

3.20

4.10

2.05

0.30

12.30

180.0

13.50

21.50

9.30

17.00

2.40

4.10

Tape Feed Hole Diameter (DIA)

Feed Hole Location

D₀

0.055

0.065

0.215

0.122

0.118

0.153

0.076

－

0.061

0.072

0.218

0.130

0.126

0.161

0.080

0.012

0.484

7.087

0.531

0.846

0.366

0.669

0.094

0.161

Centers Line Dimensions Length Direction

Compartment Depth

K₀

Carrier Tape Overall Thickness

Compartment Pitch

Sprocket Hole Diameter

Centers Line Dimensions Length Direction

Carrier Tape Thickness

Carrier Tape Width

P₀

P₂

12.00

178.0

12.50

20.00

9.00

16.00

2.20

3.90

0.472

7.008

0.492

0.788

0.354

0.629

0.087

0.154

Flange Diameter

Hub Spindle Hole

Hub Diameter

D₂

W₁

Fixing Tape Width

Flange Space Between Flanges

Compartment Length

A₀

B₀

Compartment Width

Anode

Cathode

BRIGHT LED ELECTRONICS CORP.

SURFACE MOUNT CHIP LED LAMP SPECIFICATION

RELIABILITY TEST

PAGE:

REVISION:

1.0

Classification

Test Item

Reference Standard

Test Conditions

Result

Operation Life MIL-STD-750:1026 Connect with a power If=20mA

MIL-STD-883:1005 Ta=Under room temperature

0/20

JIS C 7021 :B-1

Test time=1,000hrs

Ta=+65℃±5℃

High

Temperature MIL-STD-202:103B

RH=90%-95%

0/20

High Humidity JIS C 7021

:B-11

Test time=240hrs

Endurance

Test

Storage

High

Temperature

Storage

Low

High Ta=+85℃±5℃

MIL-STD-883:1008

JIS C 7021 :B-10

0/20

Test time=1,000hrs

Low Ta=-35℃±5℃

Temperature JIS-C-7021 :B-12

Storage

Test time=1,000hrs

-35℃ ~ +25℃ ~ +85℃ ~ +25℃

Temperature MIL-STD-202:107D

Cycling

MIL-STD-750:1051

MIL-STD-883:1010

JIS C 7021 :A-4

MIL-STD-202:107D

MIL-STD-750:1051

MIL-STD-883:1011

60min 20min

Test Time=5cycle

60min

20min

0/20

-35℃±5℃ ~+85℃±5℃

Thermal Shock

Environmental

Test

20min

Test Time=10cycle

Preheating：

140℃-160℃,within 2 minutes.

Operation heating：

20min

Solder

Resistance

MIL-STD-202:201A

MIL-STD-750:2031

JIS C 7021 :A-1

260℃(Max.), within 10seconds. (Max.)

JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY

Measuring items

Forward voltage

Reverse current

Symbol

V_F( V)

Ir(uA)

Measuring conditions

If=20mA

Judgement criteria for failure

Over Ux1.2

Vr=5V

Over Ux2

Luminous intensity

Iv ( mcd )

If=20mA

Below SX0.5

Note: 1.U means the upper limit of specified characteristics. S means initial value.

2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal

ambient conditions after completion of each test.

BRIGHT LED ELECTRONICS CORP.

SURFACE MOUNT CHIP LED LAMP SPECIFICATION

PAGE:

REVISION:

1.0

1. SOLDERING:

● Manual Of Soldering

The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3

seconds per solder-land is to be observed.

● Reflow Soldering

Preheating : 140℃~160℃±5℃,within 2 minutes.

Operation heating : 260℃(MAX.) within 10 seconds.(Max)

Gradual Cooling (Avoid quenching).

10 SEC. MAX.

260℃ MAX

140~160℃

4℃ /SEC. MAX.

OVER 2 MIN.

TIME

● DIP soldering (Wave Soldering)

Preheating : 120℃~150℃,within 120~180 sec.

Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)

Gradual Cooling (Avoid quenching).

Soldering heat Max. 260

℃

245

within 5 sec.

±5℃

120~150

℃

Preheat

120~180 sec.

TIME

2. Handling :

Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to

high temperature.

Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such

as the sand blast and the metal hook.

BRIGHT LED ELECTRONICS CORP.

SURFACE MOUNT CHIP LED LAMP SPECIFICATION

PAGE:

REVISION:

1.0

3. Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT

LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with

instantaneous voltage at the turning ON and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the rated figures.

Also, the circuit should be designed so as be subjected to reverse voltage when turning off the

BRIGHT LEDs.

4. Storage:

In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as

possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.

(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or

equivalent soldering process must be:

a. Completed within 24 hours.

b. Stored at less than 30% RH.

(3) Devices require baking before mounting, if:

(2) a or (2) b is not met.

(4) If baking is required, devices must be baked under below conditions:

12 hours at 60℃±3℃.

5. Package and Label of Products:

(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on

each bag.

(2) Label:

BRIGHT LED LOGO

Part No.

Quantity

BIN.

Sealing Date

Year Month Day

Manufacture Location

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