BL-HZP39M-TRB [BRTLED]
White Mono-color type Suitable for all SMT assembly methods.; 白单色型适用于所有的SMT装配方法。
| 型号： | BL-HZP39M-TRB |
| 厂家： | 
BRTLED |
| 描述： | White Mono-color type Suitable for all SMT assembly methods. |
| 文件： | 总9页 (文件大小：281K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
DATA SHEET
● DEVICE NUMBER：BL-HZP39M-TRB
SHEET
1
2
3
4
5
6
7
8
CONTENTS
DATE
2004.12.28 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
Preliminary
Add VF BIN;
2005.01.13 - 1.1 1.1 - - 1.1
-
-
Tapping Q’ty
佰鴻工業股份有限公司
BRIGHT LED ELECTRONICS CORP.
APPROVED
DRAWER
台北縣板橋市和平路 19 號 3 樓
3F., No. 19, Ho Ping Road, Pan Chiao City,
Taipei, Taiwan, R. O. C.
張
2005.01.13
雷
2005.01.13
艷 春
Tel: 886-2-29591090
孝 嚴
Fax: 886-2-29547006/29558809
www.brtled.com.
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Features:
1. Emitted Color : White
●Package Dimensions:
2. Mono-color type.
CATHODE MARK
3. Suitable for all SMT assembly methods.
4. Compatible with infrared and vapor phase
reflow solder process.
4-ψ0.95
5. Compatible with automatic placement
equipment.
6. This product doesn’t contain restriction
Substance, comply ROHS standard.
7. ESD≧6000V.
P1.P2
P3.P4
● Applications:
1. Flash light .
NOTES:
1.All dimensions are in millimeters.
2. Backlighting : LCDs.
3. Status indicators : Comsumer & industrial
electronics.
2.Tolerance is ±0.10mm unless otherwise specified.
3.Specifications are subject to change without notice.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Symbol
Pd
Rating
600
Unit
mW
mA
mA
V
Forward Current
IF
150
Peak Forward Current ＊1
Electro-static Discharge
Operating Temperature
Storage Temperature
Soldering Temperature
IFP
500
ESD
Topr
Tstg
Tsol
6000
-25℃~80℃
-30℃~85℃
See Page5
℃
℃
-
＊1 Condition for IFP is pulse of 1/10 duty and 30msec width.
Note: The values are based on 1-die performance.
Ver.1.0 Page 1 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Electrical and optical characteristics(Ta=25℃)
Parameter
Forward Voltage
Symbol
Condition
IPF=350mA
IPF=350mA
IPF=350mA
Min.
3.2
15
Typ.
3.8
-
Max.
4.2
-
Unit
V
VF
Luminous Intensity
Veiwing Angle
Iv
cd
2θ1/2
x
-
60
-
deg
0.26
0.26
0.30
0.30
0.32
0.32
Chromaticity Coordinates
IPF=350mA
-
y
＊IPF: test time=100ms.
● Typical Electro-Optical Characteristics Curves
Fig.2 VF-Ta Characteristics
Fig.1 IF-VF Characteristics
2000
1000
4.0
500
3.8
3.6
3.4
IPF=350mA
100
50
3.2
3.0
10
0
20
40
60
80
100
-20
2.5
3.0
3.5
4.0
4.5
5.0
VF (V)
Ta( C )
Fig.4 IV-Ta Characteristics
Fig.3 IV-IF Characteristics
10
5
200
100
50
1.0
0.5
0.1
20
50
100
500
1000
5000
-20
0
20
40
60
80
100
Ta( C)
IF(mA)
Fig.6 Radiation diagram
Fig.5 Max-Ta Characteristics
0
10
20
300
30
250
40
50
200
150
1.0
0.9
0.8
0.7
60
70
100
50
0
80
90
0.5
0.3
0.1
0.2
0.4
0.6
-20
0
20
40
60
80
100
Ta( C)
Ver.1.1 Page 2 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Tapping and packaging specifications(Units: mm)
±
17.2 1.2
USER DIRECTION OF FEED
±
1.7 0.1
5.3
START
END
TRAILER
LEADER
0.3
±
±
4.0 0.1
1.5 0.1
FIXING TAPE
±
4.0 0.1
±
2.0 0.05
NOTE: 1500 pcs PER REEL
●Package Method:(unit:mm)
12 bag/box
1500 pcs/reel
215
Bar Code Label
245
230
167
Aluminum Foil Bag
220
645
6 box/carton
230
334
Ver.1.1 Page 3 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Bin Limits
Intensity Bin Limits (@ IPF=350mA)
BIN CODE
Min. (cd)
Max. (cd)
ZB
15
-
VF Bin Limits (@ IPF=350mA)
BIN CODE
Min.(V)
3.2
Max.(V)
3.4
3.6
J
K
L
3.4
3.6
3.8
M
N
3.8
4.0
4.0
4.2
● BIN： x
x
x
VF BIN CODE
Color BIN CODE
Intensity BIN CODE
Ver1.1 Page 4 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
Color Bin Limits (IPF=350mA)
Chromaticity Coordinates
x
IN
Chromaticity Coordinates
x
0.28
0.26
0.28
0.28
0.30
0.26
0.30
0.28
0.30
0.30
0.32
0.28
0.32
0.30
0.26
0.26
0.26
0.28
0.28
0.26
0.28
0.28
0.28
0.30
0.30
0.28
0.30
0.30
0.26
0.28
0.26
0.30
0.28
0.28
0.28
0.30
0.28
0.32
0.30
0.30
0.30
0.32
0.28
0.28
0.28
0.30
0.30
0.28
0.30
0.30
0.30
0.32
0.32
0.30
0.32
0.32
F-1
y
x
y
x
y
x
y
x
y
x
y
x
y
F-2
F-3
F-4
F-5
F-6
F-7
Ver.1.0 Page 5 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
Connect with a power If=100mA
Ta=Under room temperature
Test time=1,000hrs
0/20
JIS-C-7021
:B-1
Ta=+65℃±5℃
High
Temperature MIL-STD-202:103B
RH=90%-95%
0/20
High Humidity JIS-C-7021
:B-11 Test time=240hrs
Endurance
Test
Storage
High
Temperature
Storage
Low
Temperature JIS-C-7021
Storage
Temperature MIL-STD-202:107D
Cycling
High Ta=+85℃±5℃
Test time=1,000hrs
MIL-STD-883:1008
JIS-C-7021 :B-10
0/20
0/20
Low Ta=-35℃±5℃
:B-12 Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
MIL-STD-750:1051
MIL-STD-883:1010
60min 20min
60min
20min
0/20
0/20
0/20
Test Time=5cycle
JIS-C-7021
:A-4
-35℃±5℃ ~+85℃±5℃
Thermal Shock MIL-STD-202:107D
Environmental
Test
MIL-STD-750:1051
MIL-STD-883:1011
20min
20min
Test Time=10cycle
Preheating：
Solder
MIL-STD-202:201A
Resistance
140℃-160℃,within 2 minutes.
Operation heating：
235℃(Max.), within 10seconds. (Max.)
MIL-STD-750:2031
JIS-C-7021
:A-1
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Luminous intensity
Symbol
VF ( V)
Iv (cd )
Measuring conditions
IPF=350mA
Judgement criteria for failure
Over Ux1.2
IPF=350mA
Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver1.0 Page 6 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
260℃ MAX.
140~160℃
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃ ±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Ver.1.0 Page 7 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HZP39M-TRB
● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 1500 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx
xx
xx
Year Month Day
Manufacture Location
Ver1.1 Page 8 of 8
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