BL-HUBG6B433T-TRB [BRTLED]
Green and Super BlueSuitable for all SMT assembly methods.; 绿色超级BlueSuitable所有SMT装配方法。
| 型号： | BL-HUBG6B433T-TRB |
| 厂家： | 
BRTLED |
| 描述： | Green and Super BlueSuitable for all SMT assembly methods. |
| 文件： | 总8页 (文件大小：395K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
●Package Dimensions:
● Features:
1. Emitted Color : Super Red; Green
and Super Blue
2. Lens Appearance : Water Clear
3. Multi-color type.
4. 3.2x2.7x1.1mm(1210) standard package
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
GREEN
ANODE
MARK
7. Compatible with automatic placement
equipment.
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
NOTES:
● Applications:
1.All dimensions are in millimeters (inches).
2.Tolerance is ± 0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
1. Automotive : Dashboards, stop lamps,
turn signals.
2. Backlighting : LCDs, Key pads advertising.
3. Status indicators : Comsumer & industrial
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Symbol
Pd
Super Red
Green
120
Super Blue
Unit
mW
mA
mA
V
80
120
Forward Current
IF
30
30
30
Peak Forward Current ＊1
Reverse Volage
IFP
100
100
100
VR
5
-25℃~80℃
-30℃~85℃
See Page5
Operating Temperature
Storage Temperature
Soldering Temperature
Topr
Tstg
Tsol
-
-
-
＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.
Ver.1.1 Page 1 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Color
Min.
Typ.
Max.
Unit
Hi-Eff Red
2.1
3.2
3.2
50
2.6
3.6
3.6
Forward Voltage
Vf
IF=20mA
Green
-
V
Super Blue
Hi-Eff Red
Green
28
94
28
Luminous Intensity
Reverse Current
Iv
IF=20mA
VR=5V
180
40
-
mcd
µA
Super Blue
Hi-Eff Red
Green
100
1
IR
-
-
Super Blue
Hi-Eff Red
Green
1
645
525
470
λp
λd
Δλ
2θ1/2
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Veiwing Angle
IF=20mA
IF=20mA
IF=20mA
IF=20mA
-
-
nm
nm
nm
deg
Super Blue
Hi-Eff Red
Green
627
520
465
637
535
470
-
Super Blue
Hi-Eff Red
Green
22
30
30
-
-
Super Blue
Hi-Eff Red
Green
-
120
-
Super Blue
● Typical Electro-Optical Characteristics Curves
Ver.1.2 Page 2 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Tapping and packaging specifications(Units: mm)
13.0±0.5
USER DIRECTION OF FEED
1.27±0.1
COMMON ANODE
2.82
±0.1
START
END
TRAILER
cathode
LEADER
4.0 ±0.1
1.5±0.1
2.0±0.05
0.3
FIXING TAPE
4.0 ±0.1
NOTE: 3000 pcs PER REEL
●Package Method:(unit:mm)Vacuum
12 bag/box
3000 pcs/reel
200
Bar Code Label
245
220
185
Aluminum Foil Bag
220
645
6 box/carton
210
470
Ver.1.1 Page 3 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Bin Limits
Intensity Bin Limits (UB) (20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
42.0
M
N
P
28.0
42.0
63.0
94.0
63.0
94.0
140.0
Q
Tolerance for each Bin limit is ± 15 %.
Intensity Bin Limits (G6) (20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
140.0
Q
R
S
T
94.0
140.0
210.0
317.0
210.0
317.0
475.0
Tolerance for each Bin limit is ± 15 %.
Color Bin Limits (G6) (20mA)
BIN CODE
Min. (nm)
520
Max. (nm)
6
7
8
525
530
535
525
530
Tolerance for each Bin limit is ± 1nm.
VF Bin Limits (G6) (20mA)
BIN CODE
Min.(v)
2.8
Max.(v)
3.0
G
H
J
3.0
3.2
3.2
3.4
K
3.4
3.6
Tolerance for each Bin limit is ± 0.05V.
Ver.1.2 Page
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Bin Limits
Intensity Bin Limits (B4) (20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
42.0
M
N
P
28.0
42.0
63.0
94.0
63.0
94.0
140.0
Q
Tolerance for each Bin limit is ± 15 %.
Color Bin Limits (B4) (20mA)
BIN CODE
Min. (nm)
Max. (nm)
4
465
470
Tolerance for each Bin limit is ± 1nm.
VF Bin Limits (B4) (20mA)
BIN CODE
Min.(v)
2.8
Max.(v)
3.0
G
H
J
3.0
3.2
3.2
3.4
K
3.4
3.6
Tolerance for each Bin limit is ±0.05V.
● BIN： x-x x x-x x x
VF BIN CODE(B4)
Color BIN CODE(B4)
Intensity BIN CODE(B4)
VF BIN CODE(G6)
Color BIN CODE(G6)
Intensity BIN CODE(G6)
Intensity BIN CODE(UB)
Ver.1.2 Page 5 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
0/20
JIS-C-7021
:B-1
Ta=+65℃±5℃
High
Temperature MIL-STD-202:103B
RH=90%-95%
0/20
High Humidity JIS-C-7021
:B-11 Test time=240hrs
Endurance
Test
Storage
High
Temperature
Storage
Low
Temperature JIS-C-7021
Storage
Temperature MIL-STD-202:107D
Cycling
High Ta=+85℃±5℃
Test time=1,000hrs
MIL-STD-883:1008
JIS-C-7021 :B-10
0/20
0/20
Low Ta=-35℃±5℃
:B-12 Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
MIL-STD-750:1051
MIL-STD-883:1010
60min 20min
60min
20min
0/20
0/20
0/20
Test Time=5cycle
JIS-C-7021
:A-4
-35℃±5℃ ~+85℃±5℃
Thermal Shock MIL-STD-202:107D
Environmental
Test
MIL-STD-750:1051
MIL-STD-883:1011
20min
20min
Test Time=10cycle
Preheating：
Solder
MIL-STD-202:201A
Resistance
140℃-160℃,within 2 minutes.
Operation heating：
260℃(Max.), within 10seconds. (Max.)
MIL-STD-750:2031
JIS-C-7021
:A-1
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
VF ( V)
IR(uA)
Measuring conditions
IF=20mA
Judgement criteria for failure
Over Ux1.2
VR=5V
IF=20mA
Over Ux2
Below SX0.5
Iv ( mcd )
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.0 Page 6 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
260℃ MAX.
140~160℃
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Ver.1.0 Page 7 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HUBG6B433T-TRB
● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx
xx
xx
Year Month Day
Manufacture Location
Ver.1.0 Page 8 of 8
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