BL-HG036D-TRB [BRTLED]
Yellow Green Suitable for all SMT assembly methods.; 黄绿色适合所有SMT装配方法。型号: | BL-HG036D-TRB |
厂家: | BRTLED |
描述: | Yellow Green Suitable for all SMT assembly methods. |
文件: | 总7页 (文件大小:216K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Features:
●Package Dimensions:
1. Emitted Color : Yellow Green
2. Lens Appearance : Water Clear.
3. Mono-color type.
4. 1.6x0.8x0.8mm(0603) standard package.
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
7. Compatible with automatic placement
equipment.
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
● Applications:
1. Automotive : Dashboards, stop lamps,
NOTES:
turn signals.
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
2. Backlighting : LCDs, Key pads advertising.
3. Status indicators : Comsumer & industrial
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Symbol
Rating
Unit
Pd
IF
80
mW
Forward Current
30
100
mA
Peak Forward Current *1
Reverse Volage
IFP
VR
Topr
Tstg
Tsol
-
mA
5
V
-55℃~85℃
-55℃~85℃
See Page6
0.6
Operating Temperature
Storage Temperature
Soldering Temperature
Derating Linear From 25℃
Infrared Soldering Condition
Vapor Soldering Condition
-
-
-
mA/℃
240℃(for 10 Seconds)
215℃(for 3Minutes)
-
-
-
-
*1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.2.1 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Electrical and optical characteristics(Ta=25℃)
Parameter
Forward Voltage
Symbol
Vf
Condition
IF=20mA
IF=20mA
VR=5V
Min.
Typ.
2.0
10.0
-
Max.
Unit
V
-
2.6
Luminous Intensity
Reverse Current
Iv
3.7
-
mcd
µA
IR
-
100
λp
λd
Δλ
2θ1/2
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Veiwing Angle
IF=20mA
IF=20mA
IF=20mA
IF=20mA
-
568
-
nm
nm
nm
deg
566
576
-
-
30
-
-
120
● Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
vs. ambient temperature
Fig.1 Relative intensity vs. wavelength
1.0
60
50
40
30
20
0.5
10
0
0
515
568
615
20
40
60
80
100
Wavelength (nm)
Ambient temperature Ta( C)
Fig.4 Relative luminous intensity vs.
ambient temperature
Fig.3 Forward current vs. forward voltage
50
40
30
20
10
0
3.0
2.5
2.0
1.5
1.0
0.5
0
1
2
3
4
5
-40
-20
0
20
40
60
Ambient temperature Ta( C)
Forward voltage(V)
RADIATION DIAGRAM
Fig.5 Relative luminous intensity
vs. forward current
0
10
20
4.0
30
3.0
2.0
40
50
1.0
0.9
0.8
60
70
1.0
0.7
80
90
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.2.0 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
13.0± 0.5
1.04± 0.1
1.08± 0.1
START
END
TRAILER
4.0 ±0.1
1.5± 0.1
LEADER
0.3
FIXING TAPE
4.0 ±0.1
2.0± 0.05
NOTE: 3000 pcs PER REEL
●Package Method:(unit:mm)
12 bag/box
3000 pcs/reel
200
Bar Code Label
245
220
187
Aluminum Foil Bag
220
645
6 box/carton
210
470
Ver.2.0 Page 3 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Bin Limits
Intensity Bin Limits (At 20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
G
H
J
3.2
6.3
4.8
9.4
7.0
14.0
21.0
K
11.0
Color Bin Limits (At 20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
4
5
6
7
8
565
567
569
571
573
569
571
573
575
577
BIN: x
x
Color BIN CODE
Intensity BIN CODE
Ver.2.0 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life
Ta=Under RoomTemperature As Per Data
Sheet Maximum Rating
Test Time=1000HRS(-24HRS,+72HRS)@
20mA
MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021 :B-1
0/20
High
Ta=+65℃±5℃
Temperature
High Humidity
Storage
MIL-STD-202:103B
JIS-C-7021 :B-11
RH=90%-95%
Test time=240hrs±2HRS
0/20
Endurance
Test
High
Temperature
Storage
High Ta=+105℃±5℃
Test time=1,000hrs(-24HRS,+72HRS)
MIL-STD-883:1008
JIS-C-7021 :B-10
0/20
0/20
Low
Temperature
Storage
Low Ta=-55℃±5℃
Test time=1,000hrs(-24HRS,+72HRS)
JIS-C-7021 :B-12
Temperature
Cycling
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021 :A-4
+105℃ ~ +25℃ ~ -55℃ ~ +25℃
30min
5min 30min 5min
0/20
0/20
Test Time=10cycle
Thermal Shock MIL-STD-202:107D
MIL-STD-750:1051
IR-Reflow In-Board,
2
Times 85±5 ℃
(10min)~-40±5℃(10min)
Test Time=10cycle
T.sol=260±5℃
MIL-STD-883:1011
Solder
Resistance
MIL-STD-202:201A
MIL-STD-750:2031
JIS-C-7021 :A-1
Dwell Time=10±1secs
0/20
0/20
IR-Reflow
Ramp-up rate(183℃ to Peak)+3℃ 1sec
max
Environmental
Test
-
Temp maintain at125±25℃ 120sec max
Temp maintain above 183℃ 60~150sec
Peak temperature range 235℃~240℃
Time within5℃ of actual Pwck
Temperature10-30sec
Ramp-down rate+6℃ 1sec max
T.sol=235±5℃
Immesion time 2±0.5sec
0/20
0/20
0/20
Solderability
Solderability
-
0/20
0/20
0/20
0/20
0/20
0/20
-
Immesion rate 25±2.5mm/sec
Coverage≧95% of the dipped surface
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
VF ( V)
Measuring conditions
IF=20mA
Judgement criteria for failure
Over Ux1.2
IR(uA)
VR=5V
Over Ux2
Iv ( mcd )
IF=20mA
Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.2.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
5 SEC. MAX.
260 MAX.
℃
140~160
℃
4
℃
/SEC. MAX.
4
℃
/SEC. MAX.
OVER 2 MIN.
Time
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Ver.2.0 Page 6 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Customer: xxx
Cus Part.NO: XX
Material No: BL-Hxxxxx-TRB
Part No.
Quantity
BIN.
Quantity:xxxx
Batch(BIN): x
Sealing date:xxxxxx
Lot NO:X
Sealing Date
xx xx
Year Month Day
x
xx
Manufacture Location
Ver.2.0 Pag 7 of 7
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