BL-HG635A-TRB [BRTLED]

Green Suitable for all SMT assembly methods.; 绿色适合所有SMT装配方法。
BL-HG635A-TRB
型号: BL-HG635A-TRB
厂家: BRTLED    BRTLED
描述:

Green Suitable for all SMT assembly methods.
绿色适合所有SMT装配方法。

光电
文件: 总6页 (文件大小:189K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Features:  
Package Dimensions:  
1. Emitted Color : Green.  
2. Lens Appearance : Water Clear.  
3. Mono-color type.  
2.0(.079)± 0.2  
Cathode Mark  
1.2(.047)  
4. 2.0x1.25x1.0mm(0805) standard package.  
5. Suitable for all SMT assembly methods.  
6. Compatible with infrared and vapor phase  
reflow solder process.  
LED die  
1.25(.049)± 0.2  
2-R0.05(.002) MAX.  
2-R0.05(.002) MAX  
3°  
1.0(.039)± 0.2  
7. Compatible with automatic placement  
equipment.  
For reflow soldering  
0.9(.035)  
1.2(.047)  
1.2(.047)  
0.3(.012)  
1.4(.055)  
8. This product doesn’t contain restriction  
Substance, comply ROHS standard.  
1.25(.049)  
Cathode Mark  
0.4(.016)  
0.4(.016)  
Applications:  
1. Automotive : Dashboards, stop lamps,  
NOTES:  
1.All dimensions are in millimeters (inches).  
turn signals.  
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.  
3.Specifications are subject to change without notice.  
2. Backlighting : LCDs, Key pads advertising.  
3. Status indicators : Comsumer & industrial  
electronics.  
4. General use.  
Absolute Maximum Ratings(Ta=25)  
Parameter  
Power Dissipation  
Symbol  
Pd  
Rating  
120  
Unit  
mW  
mA  
mA  
V
Forward Current  
IF  
30  
Peak Forward Current 1  
Reverse Volage  
IFP  
100  
VR  
5
-25~80℃  
-30~85℃  
See Page6  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
Topr  
Tstg  
Tsol  
-
-
-
1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.  
Ver.1.0 Page 1 of 7  
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Electrical and optical characteristics(Ta=25)  
Parameter Symbol Condition  
Forward Voltage  
Min.  
Typ.  
3.2  
180  
-
Max.  
Unit  
V
Vf  
Iv  
IF=20mA  
IF=20mA  
VR=5V  
-
3.6  
Luminous Intensity  
Reverse Current  
94  
-
mcd  
µA  
IR  
-
1
λp  
λd  
Δλ  
2θ1/2  
Peak Wave Length  
Dominant Wave Length  
Spectral Line Half-width  
Veiwing Angle  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
-
525  
-
-
nm  
nm  
nm  
deg  
520  
530  
-
-
35  
-
-
120  
Typical Electro-Optical Characteristics Curves  
Fig.2 Forward current derating curve  
vs. ambient temperature  
Fig.1 Relative intensity vs. wavelength  
1.0  
60  
50  
40  
30  
20  
0.5  
10  
0
0
475  
525  
575  
20  
40  
60  
80  
100  
Wavelength (nm)  
Ambient temperature Ta( C)  
Fig.4 Relative luminous intensity vs.  
ambient temperature  
Fig.3 Forward current vs. forward voltage  
50  
40  
30  
20  
10  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
1
2
3
4
5
-40  
-20  
0
20  
40  
60  
Forward voltage(V)  
Ambient temperature Ta( C)  
Fig.5 Relative luminous intensity  
vs. forward current  
Fig.6 Radiation diagram  
0
10  
20  
2.0  
30  
1.5  
1.0  
40  
50  
1.0  
0.9  
0.8  
60  
70  
0.5  
0
0.7  
80  
90  
0.5  
0.3  
0.1  
0.2  
0.4  
0.6  
10  
20  
30  
40  
50  
Forward current (mA)  
Ver.1.1 Page 2 of 7  
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Tapping and packaging specifications(Units: mm)  
USER DIRECTION OF FEED  
13.0± 0.5  
1.3± 0.1  
1.42  
±0.1  
START  
END  
TRAILER  
4.0 ±0.1  
1.5± 0.1  
LEADER  
0.3  
FIXING TAPE  
4.0 ±0.1  
2.0± 0.05  
NOTE: 3000 pcs PER REEL  
Package Method:(unit:mm)  
12 bag/box  
3000 pcs/reel  
200  
Bar Code Label  
245  
220  
185  
Aluminum Foil Bag  
220  
645  
6 box/carton  
210  
470  
Ver.1.0 Page 3 of 7  
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Bin Limits  
Intensity Bin Limits (At 20mA)  
BIN CODE  
Min. (mcd)  
82.0  
Max. (mcd)  
160.0  
Q
R
S
T
120.0  
240.0  
180.0  
360.0  
280.0  
550.0  
Color Bin Limits (20mA)  
BIN CODE  
Min. (nm)  
519  
Max. (nm)  
526  
6
7
524  
531  
VF Bin Limits (20mA)  
BIN CODE  
Min.(v)  
2.75  
Max.(v)  
3.05  
G
H
J
3.25  
2.95  
3.15  
3.45  
K
3.35  
3.65  
BINx  
x
x
VF BIN CODE  
Color BIN CODE  
Intensity BIN CODE  
Ver.1.1 Page 4 of 7  
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Reliability Test  
Classification  
Test Item  
Reference Standard  
Test Conditions  
Result  
Operation Life MIL-STD-750:1026  
MIL-STD-883:1005  
Connect with a power If=20mA  
Ta=Under room temperature  
Test time=1,000hrs  
0/20  
JIS-C-7021  
:B-1  
Ta=+65±5℃  
High  
Temperature MIL-STD-202:103B  
RH=90%-95%  
0/20  
High Humidity JIS-C-7021  
:B-11 Test time=240hrs  
Endurance  
Test  
Storage  
High  
Temperature  
Storage  
Low  
High Ta=+85±5℃  
MIL-STD-883:1008  
JIS-C-7021 :B-10  
Test time=1,000hrs  
0/20  
0/20  
Low Ta=-35±5℃  
Temperature JIS-C-7021  
Storage  
:B-12 Test time=1,000hrs  
-35~ +25~ +85~ +25℃  
60min 20min 60min 20min  
Test Time=5cycle  
Temperature MIL-STD-202:107D  
Cycling  
MIL-STD-750:1051  
MIL-STD-883:1010  
0/20  
0/20  
0/20  
JIS-C-7021  
:A-4  
-35±5~+85±5℃  
Thermal Shock MIL-STD-202:107D  
MIL-STD-750:1051  
Environmental  
Test  
20min  
20min  
MIL-STD-883:1011  
Test Time=10cycle  
Preheating:  
140-160,within 2 minutes.  
Operation heating:  
260(Max.), within 10seconds. (Max.)  
Solder  
MIL-STD-202:201A  
Resistance  
MIL-STD-750:2031  
JIS-C-7021  
:A-1  
Judgment criteria of failure for the reliability  
Measuring items  
Forward voltage  
Reverse current  
Luminous intensity  
Symbol  
VF ( V)  
Measuring conditions  
IF=20mA  
Judgement criteria for failure  
Over Ux1.2  
IR(uA)  
VR=5V  
Over Ux2  
Iv ( mcd )  
IF=20mA  
Below SX0.5  
Note: 1.U means the upper limit of specified characteristics. S means initial value.  
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to  
normal ambient conditions after completion of each test.  
Ver.1.0 Page 5 of 7  
BRIGHT LED ELECTRONICS CORP.  
SINCE 1981  
BL-HG635A-TRB  
Soldering :  
1. Manual Of Soldering  
The temperature of the iron tip should not be higher than 300(572) and Soldering within 3  
seconds per solder-land is to be observed.  
2. Reflow Soldering  
Preheating : 140~160±5,within 2 minutes.  
Operation heating : 260(Max.) within 10 seconds.(Max)  
Gradual Cooling (Avoid quenching).  
10 SEC. MAX.  
260MAX.  
140~160℃  
4/SEC. MAX.  
4/SEC. MAX.  
OVER 2 MIN.  
Time  
3. DIP soldering (Wave Soldering) :  
Preheating : 120~150,within 120~180 sec.  
Operation heating : 245℃±5within 5 sec.260(Max)  
Gradual Cooling (Avoid quenching).  
Soldering heat Max. 260 ℃  
245 ±5℃ within 5 sec.  
120~150℃  
Preheat  
120~180 sec.  
Time  
Handling :  
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to  
high temperature.  
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such  
as the sand blast and the metal hook.  
Ver.1.0 Page 6 of 7  

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