TISP7400H3SL [BOURNS]

TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS; TRIPLE元的双向晶闸管过电压保护
TISP7400H3SL
型号: TISP7400H3SL
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TRIPLE元的双向晶闸管过电压保护

文件: 总13页 (文件大小:391K)
中文:  中文翻译
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TISP7070H3SL THRU TISP7095H3SL,  
TISP7125H3SL THRU TISP7220H3SL,  
TISP7250H3SL THRU TISP7400H3SL  
VERSIONS  
*RoHS COMPLIANT  
AVAILABLE  
TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR  
OVERVOLTAGE PROTECTORS  
TISP7xxxH3SL Overvoltage Protector Series  
TISP7xxxH3SL Overview  
®
This TISP device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The  
TISP7xxxH3SL has the same symmetrical bidirectional protection on any terminal pair; R-T, R-G and T-G. In addition, the device is rated for  
simultaneous R-G and T-G impulse conditions. The TISP7xxxH3SL is available in a wide range of voltages and has a high current capability,  
allowing minimal series resistance to be used. These protectors have been specified mindful of the following standards and recommendations:  
GR-1089-CORE, FCC Part 68, UL1950, EN 60950, IEC 60950, ITU-T K.20, K.21 and K.45. The TISP7350H3SL meets the FCC Part 68 “B”  
ringer voltage requirement and survives both Type A and B impulse tests. These devices are housed in a through-hole 3-pin single-in-line  
(SL) plastic package.  
Summary Electrical Characteristics  
V
V
V @ I  
T
I
I
I
I
H
C @ -2 V  
o
Functionally  
Replaces  
DRM  
V
(BO)  
V
T
DRM  
µA  
(BO)  
T
Part #  
V
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
mA  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
A
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
mA  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
pF  
140  
140  
140  
74  
TISP7070H3  
TISP7080H3  
TISP7095H3  
TISP7125H3  
TISP7135H3  
TISP7145H3  
TISP7165H3  
TISP7180H3  
TISP7200H3  
TISP7210H3  
TISP7220H3  
TISP7250H3  
TISP7290H3  
TISP7300H3  
TISP7350H3  
TISP7400H3  
58  
65  
75  
70  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
80  
95  
100  
110  
120  
130  
145  
150  
160  
170  
200  
230  
230  
275  
300  
125  
135  
145  
165  
180  
200  
210  
220  
250  
290  
300  
350  
400  
74  
74  
74  
P1553AC†  
P1803AC†  
74  
74  
74  
74  
P2103AC†  
P2353AC†  
P2703AC†  
62  
62  
62  
62  
P3203AC  
P3403AC  
62  
† Bourns' part has an improved protection voltage  
Summary Current Ratings  
Parameter  
I
I
di/dt  
A/µs  
TSP  
A
TSM  
A
Waveshape  
Value  
2/10  
500  
1.2/50, 8/20  
350  
10/160  
250  
5/320  
200  
10/560  
130  
10/1000  
100  
1 cycle 60 Hz 2/10 Wavefront  
60 400  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
ITU-T K.20/21 Rating . . . . . . . . 8 kV 10/700, 200 A 5/310  
SL Package (Top View)  
Ion-Implanted Breakdown Region  
Precise and Stable Voltage  
Low Voltage Overshoot under Surge  
1
2
3
T
G
R
V
V
DRM  
V
(BO)  
V
Device  
‘7070  
‘7080  
‘7095  
‘7125  
‘7135  
‘7145  
‘7165  
‘7180  
‘7200  
‘7210  
‘7220  
‘7250  
‘7290  
‘7350  
‘7400  
58  
65  
75  
70  
MDXXAGA  
80  
95  
Device Symbol  
100  
110  
120  
130  
145  
150  
160  
170  
200  
230  
275  
300  
125  
135  
145  
165  
180  
200  
210  
220  
250  
290  
350  
400  
R
T
SD7XAB  
G
Terminals T, R and G correspond to the  
alternative line designators of A, B and C  
Rated for International Surge Wave Shapes  
- Single and Simultaneous Impulses  
I
3-Pin Through-Hole Packaging  
- Compatible with TO-220AB pin-out  
TSP  
Waveshape  
Standard  
A
2/10 µs  
8/20 µs  
GR-1089-CORE  
IEC 61000-4-5  
FCC Part 68  
500  
350  
250  
-Low Height .................................................................... 8.3 mm  
Low Differential Capacitance ....................................... < 72 pF  
10/160 µs  
FCC Part 68  
10/700 µs  
200  
.............................................. UL Recognized Component  
ITU-T K.20/21  
FCC Part 68  
10/560 µs  
130  
100  
10/1000 µs  
GR-1089-CORE  
Description  
The TISP7xxxH3SL limits overvoltages between the telephone line Ring and Tip conductors and Ground. Overvoltages are normally caused by  
a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line.  
Each terminal pair, T-G, R-G and T-R, has a symmetrical voltage-triggered bidirectional thyristor protection characteristic. Overvoltages are  
initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on  
state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar  
holding current prevents d.c. latchup as the diverted current subsides.  
How To Order  
For Standard  
For Lead Free  
Termination Finish Termination Finish  
Device  
Package  
Carrier  
Order As  
Order As  
TISP7xxxH3  
SL (Single-in-Line)  
Tube  
TISP7xxxH3SL  
TISP7xxxH3SL-S  
Insert xxx value corresponding to protection voltages of 070, 080, 095, 125 etc.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Description (continued)  
This TISP7xxxH3SL range consists of fifteen voltage variants to meet various maximum system voltage levels (58 V to 300 V). They are  
guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These high current protection devices are in  
a 3-pin single-in-line (SL) plastic package and are supplied in tube pack. For alternative impulse rating, voltage and holding current values in  
SL packaged protectors, consult the factory. For lower rated impulse currents in the SL package, the 45 A 10/1000 TISP7xxxF3SL series is  
available.  
These monolithic protection devices are fabricated in ion-implanted planar structures to ensure precise and matched breakover control and are  
virtually transparent to the system in normal operation.  
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)  
A
Rating  
Symbol  
Value  
± 58  
± 65  
Unit  
‘7070  
‘7080  
‘7095  
‘7125  
‘7135  
‘7145  
‘7165  
‘7180  
‘7200  
‘7210  
‘7220  
‘7250  
‘7290  
‘7350  
‘7400  
± 75  
±100  
±110  
±120  
±130  
±145  
±150  
±160  
±170  
±200  
±230  
±275  
±300  
Repetitive peak off-state voltage, (see Note 1)  
V
V
DRM  
Non-repetitive peak on-state pulse current (see Notes 2, and 3)  
2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape)  
500  
350  
250  
225  
200  
200  
200  
130  
100  
8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator)  
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)  
4/250 (ITU-T K.20/21, 10/700 voltage wave shape, dual)  
0.2/310 (CNET I 31-24, 0.5/700 voltage wave shape)  
5/310 (ITU-T K.20/21, 10/700 voltage wave shape, single)  
5/320 µs (FCC Part 68, 9/720 µs voltage wave shape)  
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)  
10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape)  
Non-repetitive peak on-state current (see Notes 2, 3 and 4)  
20 ms (50 Hz) full sine wave  
I
A
TSP  
55  
60  
I
A
16.7 ms (60 Hz) full sine wave  
TSM  
0.9  
1000 s 50 Hz/60 Hz a.c.  
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A  
Junction temperature  
di /dt  
400  
A/µs  
°C  
T
T
-40 to +150  
-65 to +150  
J
Storage temperature range  
T
°C  
stg  
NOTES: 1. Derate value at -0.13%/°C for temperatures below 25 °C.  
2. Initially the TISP7xxxH3 must be in thermal equilibrium.  
3. These non-repetitive rated currents are peak values of either polarity. The rated current values may be applied to any terminal  
pair. Additionally, both R and T terminals may have their rated current values applied simultaneously (in this case the G terminal  
return current will be the sum of the currents applied to the R and T terminals). The surge may be repeated after the  
TISP7xxxH3 returns to its initial conditions.  
4. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring  
track widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Electrical Characteristics for any Terminal Pair, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
Min  
Typ  
Max  
±5  
±10  
Unit  
Repetitive peak off-  
state current  
T = 25 °C  
A
I
V
= V  
DRM  
µA  
DRM  
D
T = 85 °C  
A
‘7070  
‘7080  
‘7095  
‘7125  
‘7135  
‘7145  
‘7165  
‘7180  
‘7200  
‘7210  
‘7220  
‘7250  
‘7290  
‘7350  
‘7400  
‘7070  
‘7080  
‘7095  
‘7125  
‘7135  
‘7145  
‘7165  
‘7180  
‘7200  
‘7210  
‘7220  
‘7250  
‘7290  
‘7350  
‘7400  
±70  
±80  
±95  
±125  
±135  
±145  
±165  
±180  
±200  
±210  
±220  
±250  
±290  
±350  
±400  
±78  
V
Breakover voltage  
dv/dt = ±750 V/ms,  
R
= 300  
V
(BO)  
SOURCE  
±88  
±103  
±134  
±144  
±154  
±174  
±189  
±210  
±220  
±231  
±261  
±302  
±362  
±414  
±0.8  
±5  
dv/dt ±1000V/µs, Linear voltage ramp,  
Maximum ramp value = ±500 V  
di/dt = ±20 A/µs, Linear current ramp,  
Maximum ramp value = ±10 A  
Impulse breakover  
voltage  
V
V
(BO)  
I
Breakover current  
On-state voltage  
Holding current  
dv/dt = ±750 V/ms,  
R
= 300 Ω  
±0.1  
A
V
A
(BO)  
SOURCE  
V
I = ±5 A, t = 100 µs  
T
T
W
I
I = ±5 A, di/dt = - /+30 mA/ms  
±0.15  
±5  
±0.6  
H
T
Critical rate of rise of  
off-state voltage  
Off-state current  
dv/dt  
Linear voltage ramp, Maximum ramp value < 0.85V  
kV/µs  
µA  
DRM  
I
V
= ±50 V  
T = 85 °C  
±10  
D
D
A
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Electrical Characteristics for any Terminal Pair, T = 25 °C (Unless Otherwise Noted)  
A
A
Parameter  
Test Conditions  
f = 1 MHz, V = 1 V rms, V = 0,  
Min  
Typ  
Max  
170  
90  
84  
150  
79  
67  
140  
74  
62  
73  
Unit  
‘7070 thru ‘7095  
‘7125 thru ‘7220  
‘7250 thru ‘7400  
‘7070 thru ‘7095  
‘7125 thru ‘7220  
‘7250 thru ‘7400  
‘7070 thru ‘7095  
‘7125 thru ‘7220  
‘7250 thru ‘7400  
‘7070 thru ‘7095  
‘7125 thru ‘7220  
‘7250 thru ‘7400  
‘7125 thru ‘7220  
‘7250 thru ‘7400  
d
D
f = 1 MHz, V = 1 V rms, V = -1 V  
d
D
f = 1 MHz, V = 1 V rms, V = -2 V  
d
D
C
Off-state capacitance  
pF  
off  
f = 1 MHz, V = 1 V rms, V = -50 V  
d
D
35  
28  
33  
26  
f = 1 MHz, V = 1 V rms, V = -100 V  
d
D
(see Note 5)  
NOTE 5: To avoid possible voltage clipping, the ‘7125 is tested with V = -98 V.  
D
Thermal Characteristics  
Parameter  
Test Conditions  
EIA/JESD51-3 PCB, I = I  
Min  
Typ  
Max  
Unit  
,
TSM(1000)  
T
R
Junction to free air thermal resistance  
50  
°C/W  
θJA  
T = 25 °C, (see Note 6)  
A
NOTE 6: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Parameter Measurement Information  
+i  
Quadrant I  
Switching  
ITSP  
Characteristic  
ITSM  
IT  
V(BO)  
VT  
I(BO)  
IH  
IDRM  
ID  
VDRM  
VD  
-v  
+v  
ID  
VD  
VDRM  
IDRM  
IH  
I(BO)  
VT  
V(BO)  
IT  
ITSM  
Quadrant III  
ITSP  
VD = ±50 V and ID = ±10 µA  
used for reliability release  
Switching  
Characteristic  
-i  
PM4XAAC  
Figure 1. Voltage-current Characteristic for Terminal Pairs  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Typical Characteristics  
OFF-STATE CURRENT  
vs  
NORMALIZED BREAKOVER VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
TC7AAA  
TC7AABA  
1.10  
1.05  
1.00  
0.95  
10  
1
'7125 THRU '7220  
VD = +50 V  
'7250 THRU '7400  
VD = -50 V  
0·1  
'7070 THRU '7095  
'7250 THRU '7400  
0·01  
0·001  
0·0001  
-25  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
Figure 2.  
Figure 3.  
NORMALIZED HOLDING CURRENT  
vs  
NORMALIZED BREAKOVER CURRENT  
vs  
JUNCTION TEMPERATURE  
TC7AAC  
TC7AADA  
JUNCTION TEMPERATURE  
2.0  
1.5  
4.0  
+ I(BO), - I(BO) '7070 THRU '7220  
3.0
2.0  
1.5  
1.0  
0.9  
0.8  
0.7  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
+ I(BO), - I(BO) '7250 THRU '7400  
0.6  
0.5  
0.4  
0.4  
-25  
25  
75  
-25  
0
25  
50  
75  
100  
125  
150  
0
50  
100 125 150  
T - Junction Temperature - °C  
J
TJ - Junction Temperature - °C  
Figure 4.  
Figure 5.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Typical Characteristics  
NORMALIZED CAPACITANCE  
vs  
DIFFERENTIAL OFF-STATE CAPACITANCE  
vs  
OFF-STATE VOLTAGE  
RATED REPETIVE PEAK OFF-STATE VOLTAGE  
TC7AAIA  
80  
75  
70  
65  
60  
55  
50  
45  
40  
35  
30  
1
0.9  
TJ = 25°C  
Vd = 1 Vrms  
0.8  
0.7  
0.6  
0.5  
C = Coff(-2 V) - Coff(-50 V)  
'7070 THRU '7095  
0.4  
0.3  
'7125 THRU '7220  
'7250 THRU '7400  
0.2  
50 60 70 80 100  
150  
200 250 300  
400  
1
2
3
5
10  
20 30 50  
100 150  
VDRM - Repetitive Peak Off-State Voltage - V  
VD - Off-state Voltage - V  
Figure 6.  
Figure 7.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Rating and Thermal Information  
NON-REPETITIVE PEAK ON-STATE CURRENT  
vs  
CURRENT DURATION  
TI7AB  
30  
VGEN = 600 V rms, 50/60 Hz  
RGEN = 1.4*VGEN/ITSM(t)  
20  
15  
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB, TA = 25 °C  
SIMULTANEOUS OPERATION  
OF R AND T TERMINALS. G  
TERMINAL CURRENT = 2xITSM(t)  
10  
9
8
7
6
5
4
3
2
1.5  
1
0.9  
0.8  
0·1  
1
10  
100  
1000  
t - Current Duration - s  
Figure 8.  
V
DERATING FACTOR  
vs  
IMPULSE RATING  
DRM  
vs  
MINIMUM AMBIENT TEMPERATURE  
AMBIENT TEMPERATURE  
TI7AACA  
TC7HAA  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.93  
700  
600  
TELCORDIA 2/10  
IEC 1.2/50, 8/20  
500  
400  
300  
250  
FCC 10/160  
ITU-T 10/700  
'7070 THRU '7095  
200  
150  
120  
FCC 10/560  
TELCORDIA 10/1000  
'7125 THRU '7220  
100  
90  
80  
'7250 THRU '7400  
-40 -35 -30 -25 -20 -15 -10 -5  
70  
0
5
10 15 20 25  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80  
TAMIN - Minimum Ambient Temperature - °C  
TA - Ambient Temperature - °C  
Figure 9.  
Figure 10.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
APPLICATIONS INFORMATION  
Deployment  
These devices are three terminal overvoltage protectors. They limit the voltage between three points in the circuit. Typically, this would be the  
two line conductors and protective ground (Figure 11).  
Th3  
Th1  
Th2  
Figure 11. MULTI-POINT PROTECTION  
In Figure 11, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the ±V  
(BO)  
of the individual protector.  
Protector Th1 limits the maximum voltage between the two conductors to its ±V  
value.  
(BO)  
Manufacturers are being increasingly required to design in protection coordination. This means that each protector is operated at its design  
level and currents are diverted through the appropriate protector, e.g. the primary level current through the primary protector and lower levels  
of current may be diverted through the secondary or inherent equipment protection. Without coordination, primary level currents could pass  
through the equipment only designed to pass secondary level currents. To ensure coordination happens with fixed voltage protectors, some  
resistance is normally used between the primary and secondary protection. The values given in this data sheet apply to a 400 V (d.c.  
sparkover) gas discharge tube primary protector and the appropriate test voltage when the equipment is tested with a primary protector.  
Impulse Testing  
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms.  
The table below shows some common values.  
Voltage  
Peak Voltage  
Peak Current  
Current  
Waveform  
µs  
TISP7xxxH3  
25 °C Rating  
A
Series  
Resistance  
Coordination  
Resistance  
(Min.)  
Standard  
Setting  
V
Value  
A
Waveform  
µs  
2500  
1000  
1500  
800  
2/10  
500  
100  
2/10  
10/1000  
10/160  
10/560  
5/320 †  
5/320 †  
4/250  
500  
100  
GR-1089-CORE  
0
NA  
10/1000  
10/160  
10/560  
9/720 †  
(SINGLE)  
(DUAL)  
0.5/700  
10/700  
(SINGLE)  
(SINGLE)  
(DUAL)  
200  
250  
100  
130  
FCC Part 68  
(March 1998)  
0
NA  
1000  
1500  
1500  
1500  
1000  
1500  
4000  
4000  
25  
200  
200  
2 x 225  
200  
37.5  
2 x 27  
37.5  
25  
37.5  
100  
I 31-24  
0.2/310  
5/310  
5/310  
5/310  
4/250  
0
0
NA  
NA  
NA  
4.5  
6.0  
200  
200  
200  
2 x 225  
ITU-T K.20/K.21  
2 x 72  
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator  
NA = Not Applicable, primary protection removed or not specified.  
If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the  
protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following  
calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated  
current. The impulse generator’s fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the  
minimum total circuit impedance to give the required value of series resistance. In some cases, the equipment will require verification over a  
temperature range. By using the rated waveform values from Figure 10, the appropriate series resistor value can be calculated for ambient  
temperatures in the range of -40 °C to 85 °C.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
APPLICATIONS INFORMATION  
AC Power Testing  
The protector can withstand the G return currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times  
must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are  
overcurrent protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to  
one ampere. In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The  
current versus time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases there may be a further  
time limit imposed by the test standard (e.g. UL 1459 wiring simulator failure).  
Capacitance  
The protector characteristic off-state capacitance values are given for d.c. bias voltage, V , values of 0, -1 V, -2 V and -50 V. Where possible,  
D
values are also given for -100 V. Values for other voltages may be calculated by multiplying the V = 0 capacitance value by the factor given in  
D
Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly  
dependent on connection inductance. For example, a printed wiring (PW) trace of 10 cm could create a circuit resonance with the device  
capacitance in the region of 50 MHz. In many applications, the typical conductor bias voltages will be about -2 V and -50 V. Figure 7 shows the  
differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V.  
Normal System Voltage Levels  
The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the  
line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the  
ring trip circuit.  
Figure 9 allows the calculation of the protector V  
value at temperatures below 25 °C. The calculated value should not be less than the  
maximum normal system voltages. The TISP7290H3, with a V of 230 V, can be used for the protection of ring generators producing  
DRM  
DRM  
105 V rms of ring on a battery voltage of -58 V. The peak ring voltage will be 58 + 1.414*105 = 206.5 V. However, this is the open circuit voltage  
and the connection of the line and its equipment will reduce the peak voltage.  
For the extreme case of an unconnected line, the temperature at which clipping begins can be calculated using the data from Figure 9. To  
possibly clip, the V  
value has to be 206.5 V. This is a reduction of the 230 V 25 °C V  
value by a factor of 206.5/230 = 0.90. Figure 9  
DRM  
DRM  
shows that a 0.90 reduction will occur below an ambient temperature of -40 °C. For this example, the TISP7290H3 will allow normal equipment  
operation, even on an open-circuit line, down to below -40 °C.  
JESD51 Thermal Measurement Method  
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard  
3
3
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m (1 ft ) cube which contains the test PCB (Printed Circuit Board)  
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for  
packages smaller than 27 mm (1.06 ) on a side and the other for packages up to 48 mm (189 ). The thermal measurements used the smaller  
76.2 mm x 114.3 mm (3.0 ’ x 4.5 ) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resis-  
tance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and  
so can dissipate higher power levels than indicated by the JESD51 values.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
Typical Circuits  
TIP  
WIRE  
F1a  
F1b  
R1a  
R1b  
Th3  
Th1  
PROTECTED  
EQUIPMENT  
E.G. LINE CARD  
Th2  
AI7XBK  
RING  
WIRE  
TISP7xxxH3  
Figure 12. Protection Module  
R1a  
R1b  
Th3  
SIGNAL  
Th1  
Th2  
AI7XBL  
TISP7150H3  
D.C.  
Figure 13. ISDN Protection  
OVER-  
CURRENT  
PROTECTION  
SLIC  
PROTECTION  
RING/TEST  
PROTECTION  
TEST  
RELAY  
RING  
RELAY  
SLIC  
RELAY  
TIP  
WIRE  
S3a  
R1a  
Th4  
Th5  
Th3  
S1a  
S2a  
COORDI-  
NATION  
RESISTANCE  
Th1  
Th2  
SLIC  
R1b  
RING  
WIRE  
S3b  
TISP7xxxH3  
TISP6xxxx,  
TISPPBLx,  
1/2TISP6NTP2  
S1b  
S2b  
VBAT  
C1  
220 nF  
TEST  
EQUIP-  
MENT  
RING  
GENERATOR  
AI7XBJ  
Figure 14. Line Card Ring/Test Protection  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP7xxxH3SL Overvoltage Protector Series  
MECHANICAL DATA  
SL003 3-pin Plastic Single-in-line Package  
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will  
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high  
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.  
METRIC  
(INCHES)  
DIMENSIONS ARE:  
SL003  
3.20 - 3.40  
(0.126 - 0.134)  
9.25 - 9.75  
(0.364 - 0.384)  
6.10 - 6.60  
(0.240- 0.260)  
Index  
Notch  
8.31  
(0.327)  
MAX.  
12.9  
(0.492)  
MAX.  
4.267  
(0.168)  
MIN.  
2
1
3
2.54  
(0.100)  
Typical  
0.203 - 0.356  
(0.008- 0.014)  
(See Note A)  
2 Places  
1.854  
(0.073)  
MAX.  
0.559 - 0.711  
(0.022 - 0.028)  
3
Places  
MDXXCE  
NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position.  
B. Body molding flash of up to 0.15 (0.006) may occur in the package lead plane.  
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.  
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.  
MARCH 1999 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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