MF-MSMF150-24X [BOURNS]
Surface mount packaging for automated assembly; 表面贴装包装自动化装配
| 型号： | MF-MSMF150-24X |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Surface mount packaging for automated assembly |
| 文件： | 总5页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
in Automotive Applications
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 4532 mm (1812 mils) footprint
■ Patents pending
■ 100 % electrically compatible with all
previous generations of 1812 SMT devices
■ Compatible with Pb and Pb-free solder
reflow profiles
■ RoHS compliant* and halogen free**
MF-MSMF Series - PTC Resettable Fuses
Electrical Characteristics
Model
Tripped
Power
Max. Time
I
I
Resistance
hold
trip
To Trip
Dissipation
V max.
Volts
I max.
Amps
Amperes
at 23 °C
Ohms
Amperes Seconds
Watts
at 23 °C
at 23 °C
at 23 °C
at 23 °C
Hoꢂd
Trip
0.30
0.34
0.40
0.40
0.60
1.00
1.50
1.50
2.20
2.20
2.20
2.50
3.00
3.00
2.80
4.00
5.00
5.20
R
R
Tꢁp.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.0
0.8
0.8
1.2
0.8
Min.
1Max.
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
60.0
60.0
30.0
60.0
30.0
15.0
13.2
24.0
6.0
40
40
0.10
0.14
0.20
0.20
0.30
0.50
0.75
0.75
1.10
1.10
1.10
1.25
1.50
1.50
1.60
2.00
2.50
2.60
0.70
0.40
0.40
0.40
0.30
0.15
0.11
15.00
6.50
0.5
1.5
6.0
1.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.15
0.10
0.15
0.20
0.20
0.30
0.30
0.50
0.40
0.5
80
6.00
40
6.00
10
3.00
100
100
40
1.00
0.45
0.11
0.45
100
100
20
0.04
0.04
0.06
0.035
0.03
0.03
0.035
0.020
0.015
0.015
0.21
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
16.0
24.0
6.0
0.21
0.18
100
100
20
0.14
6.0
0.120
0.120
0.099
0.080
0.100
0.080
24.0
8.0
1.50
2.0
100
40
8.0
3.0
16.0
6.0
100
100
5.0
5.0
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging....................................................... +85 °C, 1000 hours............................................... 5 ꢀ tꢁpicaꢂ resistance change
Humiditꢁ Aging...................................................... +85 °C, 85 ꢀ R.H. 1000 hours ............................. 5 ꢀ tꢁpicaꢂ resistance change
Thermaꢂ Shock ..................................................... +85 °C to -40 °C, 20 times.................................... 10 ꢀ tꢁpicaꢂ resistance change
Soꢂvent Resistance............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visuaꢂ/Mech.......................................................... Verifꢁ dimensions and materiaꢂs........................... Per MF phꢁsicaꢂ description
Resistance............................................................ In stiꢂꢂ air @ 23 °C................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C......................... T ≤ max. time to trip (seconds)
Hoꢂd Current......................................................... 30 min. at Ihoꢂd ..................................................... No trip
Trip Cꢁcꢂe Life....................................................... Vmax, Imax, 100 cꢁcꢂes........................................ No arcing or burning
Trip Endurance..................................................... Vmax, 48 hours..................................................... No arcing or burning
Soꢂderabiꢂitꢁ.......................................................... ANSI/J-STD-002................................................... 95 ꢀ min. coverage
UL Fiꢂe Number .................................................... E174545
http://www.uꢂ.com/ Foꢂꢂow ꢂink to Certifications, then UL Fiꢂe No., enter E174545
CSA Fiꢂe Number.................................................. CA110338
http://directories.csa-internationaꢂ.org/ Under “Certification Record” and “Fiꢂe Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Foꢂꢂow ꢂink to “other certificates”, enter Fiꢂe No. 2057213
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Applications
■ Overcurrent and overtemperature
■ Point-of-sale (POS) equipment
■ PCMCIA cards
protection of automotive electronics
■ Hard disk drives
■ PC motherboards
■ PC peripherals
■ USB port protection - USB 2.0, 3.0 & OTG
■ HDMI 1.4 Source protection
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see next page for outline drawings)
A
B
C
D
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
Style
1
Min.
4.37
Max.
4.73
Min.
3.07
Max.
3.41
Min.
0.70
Max.
1.10
Min.
0.30
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.70
(0.043)
1.10
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.70
(0.043)
1.10
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.70
(0.043)
1.10
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.70
(0.043)
1.10
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.55
(0.043)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.015)
0.55
(0.033)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.015)
0.55
(0.033)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.015)
0.45
(0.033)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.018)
0.45
(0.033)
0.85
(0.012)
0.30
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
1
(0.172)
4.37
(0.186)
4.83
(0.121)
3.07
(0.134)
3.41
(0.018)
0.70
(0.033)
1.60
(0.012)
0.30
2
(0.172)
4.37
(0.190)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.55
(0.063)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.015)
0.55
(0.033)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.83
(0.121)
3.07
(0.134)
3.41
(0.015)
0.70
(0.033)
1.60
(0.012)
0.30
2
(0.172)
4.37
(0.190)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.55
(0.063)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.73
(0.121)
3.07
(0.134)
3.41
(0.015)
0.55
(0.033)
0.85
(0.012)
0.30
1
(0.172)
4.37
(0.186)
4.83
(0.121)
3.07
(0.134)
3.41
(0.015)
0.70
(0.033)
1.60
(0.012)
0.30
2
(0.172)
4.37
(0.190)
4.73
(0.121)
3.07
(0.134)
3.41
(0.028)
0.48
(0.063)
0.85
(0.012)
0.30
1
(0.172)
(0.186)
(0.121)
(0.134)
(0.019)
(0.033)
(0.012)
MM
(INCHES)
Packaging:
DIMENSIONS:
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel.
MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see previous page for dimensions)
Style 1
Terminal material:
Top and Bottom View
Side View
C
Recommended Pad Layout
Electroless Ni under immersion Au
A
ꢁ.5 ꢀ.ꢀ5
ꢁ.5 ꢀ.ꢀ5
(.ꢀ59 .ꢀꢀ2ꢂ
(.ꢀ59 .ꢀꢀ2ꢂ
Termination pad solderability:
Standard Au finish:
3.2 ꢀ.ꢁ
(ꢀ.ꢁ26 .ꢀꢀ4ꢂ
Meets ANSI/J-STD-002 Category 2.
B
D
Recommended Storage:
2.7 ꢀ.ꢁ
(.ꢁꢀ6 .ꢀꢀ4ꢂ
40 °C max./70 % RH max.
Style 2
Top View
Bottom View
Side View
Recommended Pad Layout
A
C
2.95 ꢀ.ꢁꢀ
(.ꢁꢁ4 .ꢀꢀ4ꢂ
8
B
C
ꢁ.68 ꢀ.ꢀ5
(.ꢀ66 .ꢀꢀ2ꢂ
3.ꢁ ꢀ.ꢁꢀ
(.ꢁ22 .ꢀꢀ4ꢂ
D
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
MF-MSMF010
MF-MSMF200
10
MF-MSMF030
1
MF-MSMF260
0.1
MF-MSMF160
MF-MSMF150
MF-MSMF125
0.01
MF-MSMF110
MF-MSMF075
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
MF-MSMF110/16
0.001
0.1
MF-MSMF050
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Thermal Derating Chart - I
hold
(Amps)
Ambient Operating Temperature
Model
-40 ˚C
0.16
0.23
0.29
0.29
0.44
0.77
1.15
1.15
1.59
1.59
2.00
1.80
2.17
2.10
2.30
3.08
3.90
4.00
-20 ˚C
0.14
0.19
0.26
0.26
0.39
0.68
1.01
1.01
1.43
1.43
1.70
1.63
1.95
1.90
2.20
2.71
3.42
3.52
0 ˚C
0.12
0.17
0.23
0.23
0.35
0.59
0.88
0.88
1.26
1.26
1.40
1.43
1.72
1.70
1.90
2.35
2.96
3.06
23 ˚C
0.10
0.14
0.20
0.20
0.30
0.50
0.75
0.75
1.10
1.10
1.10
1.25
1.50
1.50
1.60
2.00
2.50
2.60
40 ˚C
0.08
0.12
0.17
0.17
0.26
0.44
0.65
0.65
0.95
0.95
0.95
1.08
1.30
1.25
1.45
1.80
2.24
2.34
50 ˚C
0.07
0.10
0.15
0.15
0.23
0.40
0.60
0.60
0.87
0.87
0.88
0.99
1.18
1.13
1.30
1.60
1.98
2.08
60 ˚C
0.06
0.09
0.14
0.14
0.21
0.37
0.55
0.55
0.80
0.80
0.80
0.91
1.09
1.00
1.15
1.50
1.85
1.95
70 ˚C
0.05
0.08
0.12
0.12
0.18
0.33
0.49
0.49
0.71
0.71
0.73
0.81
0.97
0.88
1.03
1.40
1.29
1.39
85 ˚C
0.03
0.06
0.10
0.10
0.15
0.29
0.43
0.43
0.60
0.60
0.61
0.68
0.82
0.69
0.91
1.25
0.94
1.04
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
Solder Reflow Recommendations
Preheating
Soldering
Cooling
300
250
200
150
100
50
Notes:
•
MF-MSMF models cannot be wave soldered. Please contact Bourns for
hand soldering recommendations.
•
If reflow temperatures exceed the recommended profile, devices may
not meet the performance requirements.
•
•
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
®
soldering. Please refer to the Multifuse Polymer PTC product soldering
recommendation guidelines.
0
160–220
10–20
120
Time (seconds)
Typical Part Marking
How to Order
Represents total content. Layout may vary.
MF - MSMF 075/24 - 2
®
BI-WEEKLY DATE CODE:
WEEKS 49-50 = Y
Multifuse Product
PART IDENTIFICATION EXAMPLES:
MF-MSMF110/24X = 6
MF-MSMF150/24X = 8
Designator
Series
YEAR CODE:
5 = 2005
MF-MSMF250/16X = C
MSMF = 4532 mm (1812 mils)
Surface Mount Component
8
BI-WEEKLY DATE CODE:
WEEKS 5-6 = C
PART IDENTIFICATION EXAMPLES:
MF-MSMF050 = 50
C
Hold Current, Ihold
MF-MSMF075 = 75
010-260 (0.10 Amps - 2.60 Amps)
MF-MSMF110 = 11
MF-MSMF150 = 15
Higher Voltage Option
__ = Standard Voltage
/16 = 16 Volt Rated
/24 = 24 Volt Rated
/60 = 60 Volt Rated
MF-MSMF SERIES, REV. AD, 02/13
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
®
™
X =
Multifuse freeXpansion Design
MF-MSMF Series
Packaging
Packaged per EIA 481-1
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual
device performance may vary over time.
-2 = Tape and Reel
MF-MSMF Series Tape and Reel Specifications
MF-MSMF-110/24X
MF-MSMF150/24X
MF-MSMF250/16X
per EIA 481-1
12.0 0.ꢀ0
(0.472 0.012ꢁ
4.0 0.10
MF-MSMF010 -
MF-MSMF030
MF-MSMF050 -
MF-MSMF260
per EIA 481-1
12.0 0.ꢀ0
(0.472 0.012ꢁ
4.0 0.10
(0.157 0.004ꢁ
8.0 0.10
(0.ꢀ15 0.004ꢁ
2.0 0.05
(0.079 0.002ꢁ
ꢀ.66 0.15
(0.144 0.006ꢁ
4.98 0.10
(0.196 0.004ꢁ
5.9
Tape Dimensions
W
per EIA-481-1
12.0 0.ꢀ0
(0.472 0.012ꢁ
4.0 0.10
(0.157 0.004ꢁ
8.0 0.10
(0.ꢀ15 0.004ꢁ
2.0 0.05
(0.079 0.002ꢁ
ꢀ.58 0.10
(0.141 0.004ꢁ
4.9ꢀ 0.10
(0.194 0.004ꢁ
5.9
P
P
P
A
B
B
0
1
2
0
0
1
(0.157 0.004ꢁ
8.0 0.10
(0.ꢀ15 0.004ꢁ
2.0 0.05
(0.079 0.002ꢁ
ꢀ.70 0.10
(0.146 0.004ꢁ
5.10 0.10
(0.200 0.004ꢁ
5.9
max.
min.
(0.2ꢀ2ꢁ
(0.2ꢀ2ꢁ
(0.2ꢀ2ꢁ
1.5 + 0.10/-0.0
(0.059 + 0.004/-0ꢁ
5.5 0.05
(0.217 0.002ꢁ
1.75 0.10
(0.069 0.004ꢁ
10.25
1.5 + 0.10/-0.0
(0.059 + 0.004/-0ꢁ
5.5 0.05
(0.217 0.002ꢁ
1.75 0.10
(0.069 0.004ꢁ
10.25
1.5 + 0.10/-0.0
(0.059 + 0.004/-0ꢁ
5.5 0.05
D
F
0
(0.217 0.002ꢁ
1.75 0.10
(0.069 0.004ꢁ
10.25
E
E
1
2
(0.404ꢁ
(0.404ꢁ
(0.404ꢁ
0.6
0.6
0.6
T max.
max.
(0.024ꢁ
(0.024ꢁ
(0.024ꢁ
0.1
0.1
0.1
T
1
(0.004ꢁ
(0.004ꢁ
(0.004ꢁ
1.ꢀ0 0.10
(0.051 0.004ꢁ
ꢀ90
0.95 0.10
(0.0ꢀ7 0.004ꢁ
ꢀ90
1.50 0.10
(0.059 0.004ꢁ
ꢀ90
K
0
Leader min.
Trailer min.
Reel Dimensions
A max.
(15.ꢀ5ꢁ
(15.ꢀ5ꢁ
(15.ꢀ5ꢁ
160
160
160
(6.ꢀ0ꢁ
(6.ꢀ0ꢁ
(6.ꢀ0ꢁ
185
(7.28ꢁ
185
(7.28ꢁ
185
(7.28ꢁ
50
50
50
N min.
(1.97ꢁ
(1.97ꢁ
(1.97ꢁ
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0ꢁ
18.4
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0ꢁ
18.4
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0ꢁ
18.4
W
1
2
W
max.
(0.724ꢁ
(0.724ꢁ
(0.724ꢁ
MM
(INCHES)
DIMENSIONS:
P
0
T
D
0
P
2
E
1
W (MEASURED
2
AT HUB)
COVER
TAPE
F
A
N(HUB DIA.)
E
W
2
B
1
B
0
W
(MEASURED
AT HUB)
1
P
1
K
T
0
1
A
0
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
相关型号：
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