CMF-SDP10 [BOURNS]
Telecom CPTC Resettable Fuses; 电信CPTC自恢复保险丝
| 型号： | CMF-SDP10 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Telecom CPTC Resettable Fuses |
| 文件： | 总3页 (文件大小：371K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
Used as a secondary overcurrent protection
device in:
■ Two resistance-matched PTCs in a
plastic housing
■ Narrow resistance tolerance
■ RoHS compliant*
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Access equipment
CMF-SDP Series - Telecom CPTC Resettable Fuses
Electrical Characteristics
Typical
Time to Trip
@ Imax/
Induction
Voltage
Withstand Voltage
Rated
Resistance
(RN)
Resistance
Matching
In Housing
Rated
Hold
Current
Trip
Current
Imax @
230 VAC
Model
230 VAC
VAC
Volts
Ohms Tolerance
Ohms
Amps @ 25 °C Amps @ 25 °C
Amps
Seconds
CMF-SDP07
CMF-SDP10
CMF-SDP10A
CMF-SDP25
CMF-SDP25A
CMF-SDP35
CMF-SDP35A
CMF-SDP50
CMF-SDP50A
CMF-SDP75
600
600
600
600
600
600
600
600
600
600
230
230
230
230
230
230
230
230
230
230
7
10
10
25
25
35
35
50
50
75
20 ꢀ
20 ꢀ
20 ꢀ
20 ꢀ
20 ꢀ
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
0ꢁ5
1
0ꢁ150
0ꢁ180
0ꢁ150
0ꢁ130
0ꢁ130
0ꢁ110
0ꢁ110
0ꢁ090
0ꢁ090
0ꢁ070
0ꢁ350
0ꢁ360
0ꢁ360
0ꢁ260
0ꢁ260
0ꢁ230
0ꢁ230
0ꢁ190
0ꢁ190
0ꢁ150
3ꢁ0
1ꢁ0
1ꢁ0
2ꢁ8
2ꢁ8
4ꢁ6
4ꢁ6
2ꢁ5
2ꢁ5
2ꢁ5
0ꢁ45
3ꢁ8
3ꢁ8
0ꢁ2
0ꢁ3
0ꢁ06
0ꢁ04
0ꢁ13
0ꢁ1
+15/-20 ꢀ
+15/-20 ꢀ
15 ꢀ
15 ꢀ
20 ꢀ
0ꢁ12
Operating Temperature Range: -40°C to +125 °C
Test Procedures And Requirements For Model CMF-SDP Series
Primary
Test
Protection
Test Condition
Requirements
Mains Power Contact - ITU-T K.20, K.21 ....None................230 V rms, 10 ohms, 15 Min.......................................................(Ri-Rf) / Ri < 10 ꢀ
Power Induction - ITU-T K.20, K.21..............None................600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < 10 ꢀ
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < 10 ꢀ
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < 10 ꢀ
Lightning Surge - ITU-T K.20, K.21 ......................................10/700 µs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ..................(Ri-Rf) / Ri < 10 ꢀ
Lightning Surge......................................................................10/100 µs, 25 ohms, 1.5 kV, 30 Tests, every 3 Min. ..................(Ri-Rf) / Ri < 10 ꢀ
Ri = R initial
Rf = R final
Typical Part Marking
How to Order
CMF - SD P 35 A -XX - 2
Represents total contentꢁ Layout may varyꢁ
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION:
Product Designator
Style
07P = CMF-SDP07
10P = CMF-SDP10
10PA = CMF-SDP10A
25P = CMF-SDP25
25PA = CMF-SDP25A
35P = CMF-SDP35
35PA = CMF-SDP35A
50P = CMF-SDP50
50PA = CMF-SDP50A
75P = CMF-SDP75
SD = Surface Mount
Dual Pkgꢁ
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
35P8G
Housing
P = Plastic
Asia-Pacific:
YEAR CODE:
8 = 2008
Rated Resistance (RN)
7-75 (7-75 Ohms)
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Footprint and Height Option
Blank = Standard Product
A = Reduced Footprint and Height
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
Resistance Tolerance Option
Blank = Standard
-XX = XX ꢀ; eꢁgꢁ -10 = 10 ꢀ
Packaging Options
- 2 = Tape & Reel
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
Preheating
Soldering
Cooling
300
250
200
150
100
50
Solder reflow
•
•
Recommended reflow methods: IR, vapor phase oven, hot air oven.
Devices are not designed to be wave soldered to the bottom side of the
board.
•
•
•
Gluing the devices is not recommended.
Recommended maximum paste thickness is 0.25 mm (.010 inch).
Devices can be cleaned using standard industry methods and solvents.
Note:
If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
•
0
160–220
120
10–20
Time (seconds)
Product Dimensions
CMF-SDP10A, 25A, 35A & 50A
CMF-SDP07, 10, 25, 35, 50 & 75
8.75
(.344)
MAX.
11.5
(.453)
MAX.
10.2
(402)
MAX.
2.6
(.102)
9.0
(.354)
MAX.
2.4
(.094)
5.0
(.197)
11.0
0.5
(.020)
2 PLCS.
7.2
(.283)
MAX.
3.9
(.154)
MAX.
(.433)
Recommended Pad Layout
Recommended Pad Layout
9.0
7.2
(.354)
(.283)
MAX.
MAX.
8.75
(.344)
11.0
(.433)
7.6
(.299)
6.3
(.248)
3.9
(.154)
5.0
(.197)
2.4
(.094)
3.2
(.126)
2.0
8.2
(.323)
2.6
(.102)
3.2
(.126)
(.079)
2.0
10.0
(.394)
(.079)
MM
(INCHES)
DIMENSIONS =
Packaging options: TAPE & REEL: 350 pcsꢁ per reel
Packaging options: TAPE & REEL: 400 pcsꢁ per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SDP Series Tape and Reel Specifications
CMF-SDP10-2, CMF-SDP25-2,
CMF-SDP-35-2, CMF-SDP50-2,
CMF-SDP10A-2, CMF-SDP25A-2,
CMF-SDP35A-2, CMF-SDP50A-2
Tape Dimensions per EIA 481-2
CMF-SDP75-2
24.0 0.ꢀ
24.0 0.ꢀ
W
(0.94ꢀ 0.020 )
(0.94ꢀ 0.020 )
4.0
(0.1ꢀ7)
4.0
(0.1ꢀ7)
P
0
16.0
(0.630)
16.0
(0.630)
P
2.0
(0.079)
2.0
(0.079)
P
2
9.1 0.2
(0.3ꢀ8 0.008)
7.ꢀ 0.2
(0.29ꢀ 0.008)
A
0
11.20 0.2
(0.441 0.008)
9.0 0.2
(0.3ꢀ4 0.008)
B
0
1.ꢀ
(0.0ꢀ9)
1.ꢀ
(0.0ꢀ9)
D
0
11.ꢀ
(0.4ꢀ3)
11.ꢀ
(0.4ꢀ3)
F
1.7ꢀ
(0.069)
1.7ꢀ
(0.069)
E
1
0.ꢀ 0.1ꢀ
(0.020 0.006)
0.ꢀ 0.1ꢀ
(0.020 0.006)
t
1
11.7 0.2
(0.433 0.008)
10.0 0.2
(0.394 0.008)
K
0
D
-0.4
T
P
P
E
2
0
(-.016)
F
W
B
0
P
K
0
A
0
MM
DIMENSIONS =
(INCHES)
330 -2/+0
(12.99 -.079/+0)
DIA.
24.4
(.961)
MIN.
13.2 +0.2/-0
(.520 +.008/-0
30.4
(1.197)
MAX.
100 1.5
(3.94 .059)
DIA.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
相关型号：
©2020 ICPDF网 联系我们和版权申明