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2NBS16-TF3-751751 [BOURNS]

RESISTOR, NETWORK, FILM, TERMINATOR, 1W, SURFACE MOUNT, 1639, SOIC;
2NBS16-TF3-751751
型号： 2NBS16-TF3-751751
厂家： BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述：

RESISTOR, NETWORK, FILM, TERMINATOR, 1W, SURFACE MOUNT, 1639, SOIC
文件： 总4页 (文件大小：350K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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Features  
Applications  
■ Lead free versions available  
■ RoHS compliant (lead free version)*  
■ Multiple SCSI termination resistors  
■ Stable thin-film-on-silicon technology  
■ Single-ended SCSI termination  
■ SCSI host adaptor cards  
■ All SCSI bus devices  
■ Ultra-miniature packages to JEDEC  
standards  
Thin Film on Silicon 2QSP / 2NBS-XX3 Dual Terminator  
General Information  
Package Schematic  
16  
9
Dual Terminator networks are used to correctly terminate  
single-ended SCSI bus lines. The standard R1, R2 combina-  
tion ensures that the high frequency component of a signal  
transition will see an impedance at the termination equal to  
the characteristic impedance of the line. Fabricated with  
Tantalum Nitride on Silicon, these resistors feature excellent  
stability, TCR and tracking performance. The JEDEC  
standard miniature packages offer the most space-efficient  
Dual Terminator resistor array available.  
R1 R2  
R1  
R2  
1
8
Electrical & Environmental Characteristics  
Electrical Characteristics  
Symbol  
Minimum  
Nominal  
Maximum  
Unit  
Resistance Range  
R
220  
750  
Ω
Tolerance:  
Absolute  
Ratio  
1 %  
0.5 %  
5 %  
2 %  
Ω
Ω
TCR:  
Absolute  
Tracking  
100  
25  
ppm/°C  
ppm/°C  
Operating Voltage  
50  
V
Environmental Characteristics  
ESD  
2 K  
-55  
-65  
V
°C  
Operating Temperature  
T
J
+125  
+150  
0.1  
Storage Temperature  
T
°C  
stg  
Power Rating per Resistor @ 70 °C  
Power Rating per Package @ 70 °C:  
Watt  
QSOP:  
16 Pin  
20, 24 Pin  
28 Pin  
0.75  
1.00  
1.12  
Watt  
Watt  
Watt  
NBSOIC: 8 Pin  
14, 16 Pin  
0.60  
1.00  
Watt  
Watt  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator  
Mechanical Characteristics  
QSOP Package Dimensions  
Narrow-Body SOIC Package Dimensions  
A
A
1.27  
(.050)  
.635  
(.025)  
TYP.  
TYP.  
3.81 - 3.99  
3.81 - 3.99  
(.150 - .157)  
(.150 - .157)  
.21 - .31  
(.008 - .012)  
0.36 - 0.46  
(.014 - .018)  
PIN 1  
PIN 1  
1.35 - 1.75  
(.053 - .069)  
1.35 - 1.75  
(.053 - .069)  
.10 - .25  
(.004 - .010)  
.10 - .25  
(.004 - .010)  
.19 - .25  
(.007 - .010)  
0-8 °  
.19 - .25  
(.007 - .010)  
0-8 °  
.41 - 1.27  
(.016 - .050)  
5.80 - 6.20  
(.228 - .244)  
.41 - 1.27  
(.016 - .050)  
5.80 - 6.20  
(.228 - .244)  
Model  
2QSP16  
2QSP20  
2QSP24  
2QSP28  
A
Model  
2NBS08  
2NBS14  
2NBS16  
A
4.80 - 4.98 (.189 - .196)  
8.56 - 8.74 (.337 - .344)  
8.56 - 8.74 (.337 - .344)  
9.80 - 9.98 (.386 - .393)  
4.80 - 4.98 (.189 - .196)  
8.56 - 8.74 (.337 - .344)  
9.80 - 9.98 (.386 - .393)  
Governing dimensions are in mm. Dimensions in  
parentheses are in inches and are approximate.  
Governing dimensions are in mm. Dimensions in  
parentheses are in inches and are approximate.  
JEDEC Reference Number MS-012.  
JEDEC Reference Number MO-137.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator  
QSOP Package Power Temperature Derating Curve  
Narrow-Body SOIC Package Power Temperature Derating Curve  
1.25  
1.0  
.75  
.50  
.25  
1.0  
.8  
2QSP28  
2NBS14, 2NBS16  
2NBS08  
2QSP20, 2QSP24  
2QSP16  
.6  
.4  
.2  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
°
AMBIENT TEMPERATURE ( C )  
°
AMBIENT TEMPERATURE ( C )  
Schematic  
R
R
2
1
R
R
1
2
8 PIN  
14 PIN  
16 PIN  
20 PIN  
24 PIN  
28 PIN  
Typical Part Marking  
Standard Resistance Values  
Represents total content. Layout may vary.  
Resistor  
Designator  
Resistance  
(ohms)  
Resistance  
Code  
PIN COUNT  
R1  
R2  
220  
330  
221  
331  
MODEL  
GRADE  
QSP16J  
3-221331  
YYWW  
CIRCUIT  
RESISTANCE  
CODE  
R1  
R2  
330  
680  
331  
681  
PIN 1 INDICATOR  
(MOLDED INDENT)  
DATE CODE  
MANUFACTURER'S  
TRADEMARK  
R1  
R2  
750  
750  
751  
751  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator  
Dispensing  
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).  
A
0
DIMENSIONS = MM (INCHES)  
B
0
K
0
No. of Pieces No. of Pieces  
Package  
A
B
K
0
Width  
Pitch  
0
0
per 13 reel  
per tube  
QSOP  
16 Pin  
6.4 (0.252)  
6.5 (0.256)  
6.5 (0.256) 10.3 (0.406) 2.1 (0.083)  
5.2 (0.205)  
9.0 (0.354)  
2.1 (0.083)  
2.1 (0.083)  
12 (0.472)  
16 (0.630)  
16 (0.630)  
8 (0.315)  
8 (0.315)  
8 (0.315)  
3,500  
3,500  
3,500  
98  
56  
49  
20, 24 Pin  
28 Pin  
NBSOIC  
8 Pin  
6.4 (0.252)  
6.5 (0.256)  
6.5 (0.256)  
9.0 (0.354)  
9.0 (0.354)  
9.0 (0.354)  
2.1 (0.083)  
2.1 (0.083)  
2.1 (0.083)  
12 (0.472)  
16 (0.630)  
16 (0.630)  
8 (0.315)  
8 (0.315)  
8 (0.315)  
3,500  
3,500  
3,500  
98  
56  
49  
14 Pin  
16 Pin  
How To Order  
2 QSP 20 - T J 3 - 221331 __  
Product Class  
Thin-Film-on-Silicon  
Standard Package Style  
QSP = QSOP  
NBS = Narrow-Body SOIC  
Pin Count  
QSP = 16, 20, 24, 28  
NBS = 8, 14, 16  
Dispensing  
R = Reel  
T
= Tube  
Asia-Pacific:  
Standard Grade  
Tolerance  
J =  
G =  
F =  
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116  
5 %  
2 %  
1 %  
Europe:  
Tel: +41-41 768 5555 • Fax: +41-41 768 5510  
The Americas:  
Tel: +1-951 781-5500 • Fax: +1-951 781-5700  
www.bourns.com  
Circuit  
3 = Dual Terminator  
Resistance Value Code  
1st three digits specify R1 resistance code.  
Last three digits specify R2 resistance code.  
Terminations  
• LF = 100 % Sn (lead free)  
• Blank = Sn/Pb  
REV. 01/07  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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