ASMD-CWG7-NX7B2 [BOARDCOM]
Low-Power 3014 DFN2 Surface-Mount LED;型号: | ASMD-CWG7-NX7B2 |
厂家: | Broadcom Corporation. |
描述: | Low-Power 3014 DFN2 Surface-Mount LED |
文件: | 总20页 (文件大小:1046K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
ASMD-CWG7-NX7x2
Low-Power 3014 DFN2 Surface-Mount LED
Description
Features
High reliability package with enhanced silicone resin
encapsulation
®
The Broadcom ASMD-CWG7-NX7x2 surface-mount LEDs
use InGaN chip technology with superior package design to
enable them to produce higher light output with better
luminous intensity performance. They can be driven at high
current and are able to dissipate heat more efficiently
resulting in better performance with higher reliability.
Available in 2700K, 3000K, 3500K, 4000K, 4500K,
5000K, 5700K, 6500K, and 8000K CCT only
Wide viewing angle at 120°
Low package profile and large emitting area for better
uniformity in linear lighting
These LEDs operate under a wide range of environmental
conditions, making them ideal for various applications
including under-cabinet lighting, retail display lighting, and
panel lights.
Applications
Electronic signs and signals
– Channel lettering
– Contour lighting
To facilitate easy pick-and-place assembly, the LEDs are
packed in tape and reel. Every reel is shipped in single flux
and color bin, to provide close uniformity.
– Indoor variable message sign
Office automations, home appliances, industrial
equipment
– Front panel backlighting
– Pushbutton backlighting
– Display backlighting
– Scanner lighting
CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to
application note AN-1142 for additional details.
Broadcom
ASMD-CWG7-NX7x2-DS101
January 31, 2020
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 1: Package Drawing
NOTE:
1. All dimensions are in millimeters (mm).
2. Tolerance is ± 0.20 mm unless otherwise specified.
3. Encapsulation = silicone.
4. Terminal finish = silver plating.
5. Dimensions in bracket are for reference only.
Broadcom
ASMD-CWG7-NX7x2-DS101
2
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Device Selection Guide (T = 25°C, I = 20 mA)
J
F
Correlated Color
Temperature, CCT
(Kelvin)
Luminous Flux,
Luminous Intensity, IV (mcd)a, b
ΦV (lm)c
Part Number
Typ.
Min.
Typ.
Max.
Typ.
ASMD-CWG7-NX7A2
ASMD-CWG7-NX7B2
ASMD-CWG7-NX7C2
ASMD-CWG7-NX7D2
ASMD-CWG7-NX7E2
ASMD-CWG7-NX7F2
ASMD-CWG7-NX7G2
ASMD-CWG7-NX7H2
ASMD-CWG7-NX7J2
8000
6500
5700
5000
4500
4000
3500
3000
2700
2240
2240
2240
2240
2240
2240
2240
2240
2240
2700
2800
2800
2800
2800
2800
2700
2700
2700
4500
4500
4500
4500
4500
4500
4500
4500
4500
8.1
8.6
8.6
8.6
8.4
8.4
8.1
8.1
8.1
a. The luminous intensity, IV, is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the
spatial radiation pattern may not be aligned with the axis.
b. Luminous intensity tolerance is ± 12%.
c. For reference only.
Absolute Maximum Ratings
Parameters
ASMD-CWG7-NX7x2
Units
mA
DC Forward Currenta
30
Peak Forward Currentb
100
102
mA
Power Dissipation
mW
Reverse Voltage
Not designed for reverse bias operation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
a. Derate linearly as shown in Figure 14 and Figure 15.
b. Duty factor = 10%, frequency = 1 kHz.
110
°C
°C
°C
–40 to +85
–40 to +85
Broadcom
ASMD-CWG7-NX7x2-DS101
3
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Optical and Electrical Characteristics (T = 25°C, I = 20 mA)
J
F
Parameters
Min.
Typ.
Max.
Units
a
—
120
—
°
Viewing Angle, 2θ
½
b
2.60
—
2.80
—
3.40
10
V
A
Forward Voltage, VF
Reverse Current, IR at VR = 5Vc
Color Rendering Index, CRI
80
—
—
—
—
d
80
°C/W
Thermal Resistance, RθJ-S
a.
θ is the off-axis angle where the luminous intensity if half of the peak intensity.
½
b. Forward voltage tolerance is ±0.1V.
c. Indicates product final test condition. Long term reverse bias is not recommended.
d. Thermal resistance from LED junction to solder point.
Part Numbering System
A
S
M
D
-
C
W
x
7
-
N
x
x
x
4
2
1
2
3
Code
Description
Option
x1
Color Rendering Index
Minimum Intensity Bin
G
X
7
CRI ≥ 80
x2
x3
x4
Number of Intensity Bins
Color Correlated Temperature
3 intensity bins, starting from bin X2
A
B
C
D
E
F
8000K
6500K
5700K
5000K
4500K
4000K
3500K
3000K
2700K
G
H
J
Part Number Example
ASMD-CWG7-NX7H2
x : G
–
–
–
–
CRI ≥ 80
1
x : X
Minimum intensity bin X
2
x : 7
3 intensity bins, starting from bin X2
3
x : H
CCT 3000K with bin ID 8A1, 8A2, 8A3, 8A4, 8B1, 8B2, 8B3, 8B4, 8C1, 8C2, 8C3, 8C4, 8D1, 8D2, 8D3,
and 8D4
4
x : 2
–
Test current = 20 mA
5
Broadcom
ASMD-CWG7-NX7x2-DS101
4
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Bin Information
Luminous Intensity Bin Limits (CAT)
Forward Voltage Bin Limits (VF)
Luminous Intensity, IV (mcd)
Forward Voltage, VF (V)
Bin ID
Min.
Max.
Bin ID
Min.
Max.
X2
Y1
Y2
2240
2850
3550
2850
3550
4500
G01
G02
G03
G04
G05
G06
G07
G08
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
Tolerance = ± 12%.
Tolerance = ± 0.1V.
Example of bin information on reel and packaging label:
CAT : X2
BIN : 9D1
VF : G05
–
Intensity bin X2
Color bin 9D1
VF bin G05
—
—
Broadcom
ASMD-CWG7-NX7x2-DS101
5
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity Diagram (4500K to 4000K)
0.40
0.39
0.38
4500K
5000K
5C2
5C1
5D2
5D1
5B2
5B1
5A2
5A1
0.37
4C2
4C1
5700K
4B2
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
4D2
4B1
4A2
3C2
3C1
6500K
4D1
3B2
3B1
3A2
3A1
4A1
3D2
3D1
2C2
2C1
2D2
2D1
8000K
2B2
2B1
2A2
2A1
1C2
1C1
1D2
1D1
1B2
1B1
1A2
1A1
0.27
0.28
0.29
0.3
0.31
0.32
0.33
0.34
0.35
0.36
0.37
0.38
0.39
x
Broadcom
ASMD-CWG7-NX7x2-DS101
6
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity Diagram (2700K to 4000K)
0.45
0.44
0.43
2700K
3000K
9C3
9C2
9C4
3500K
9B3
9C1
9B2
8C3
0.42
8C2
8C4
8B3
8C1
8D3
9A1
9B4
8B2
8B4
8D2
8D4
9B1
0.41
0.40
0.39
0.38
0.37
0.36
0.35
7C3
8A2
4000K
7C2
7D3
9D3
9D2
9D4
9A3
9D1
8B1
8A3
8D1
7B3
7D2
9A2
9A4
7C4
8A1
7B2
7A3
7C1
7D4
6C3
7B4
6C2
7B1
6B3
8A4
6C4
6C1
6B2
7A2
6B4
7D1
6D3
7A4
6B1
6D2
7A1
6A3
6D4
6A2
6D1
6A4
6A1
0.35
0.36
0.37
0.38
0.39
0.40
0.41
0.42
0.43
0.44
0.45
0.46
0.47
0.48
0.49
x
Broadcom
ASMD-CWG7-NX7x2-DS101
7
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Color Bin Limits (BIN)
Chromaticity
Coordinates
Chromaticity
Coordinates
Chromaticity
Coordinates
CCT
Bin ID
x
y
CCT
Bin ID
x
y
CCT
Bin ID
x
y
8000K
1A1
0.2935
0.2997
0.3009
0.2950
0.2935
0.2920
0.2984
0.2997
0.2920
0.2908
0.2973
0.2984
0.2908
0.2973
0.2962
0.2895
0.2984
0.2973
0.3038
0.3048
0.2973
0.2962
0.3028
0.3038
0.3009
0.2997
0.3058
0.3068
0.2997
0.2984
0.3048
0.3058
0.3015
0.3088
0.3042
0.2970
0.3015
0.3060
0.3133
0.3088
0.3060
0.3098
0.3177
0.3133
0.3098
0.3177
0.3220
0.3135
0.3133
0.3177
0.3256
0.3207
0.3177
0.3220
0.3304
0.3256
0.3042
0.3088
0.3160
0.3113
0.3088
0.3133
0.3207
0.3160
6500K
2A1
0.3058
0.3137
0.3145
0.3068
0.3048
0.3131
0.3137
0.3058
0.3038
0.3123
0.3131
0.3048
0.3028
0.3117
0.3123
0.3038
0.3123
0.3209
0.3213
0.3131
0.3117
0.3205
0.3209
0.3123
0.3137
0.3217
0.3221
0.3145
0.3131
0.3213
0.3217
0.3137
0.3161
0.3238
0.3187
0.3113
0.3209
0.3290
0.3238
0.3161
0.3256
0.3341
0.3290
0.3209
0.3304
0.3393
0.3341
0.3256
0.3341
0.3426
0.3371
0.3290
0.3393
0.3481
0.3426
0.3341
0.3238
0.3316
0.3261
0.3187
0.3290
0.3371
0.3316
0.3238
5700K
3A1
0.3218
0.3293
0.3294
0.3222
0.3214
0.3293
0.3293
0.3218
0.3210
0.3292
0.3293
0.3214
0.3206
0.3292
0.3292
0.3210
0.3292
0.3374
0.3371
0.3293
0.3292
0.3374
0.3376
0.3292
0.3293
0.3369
0.3366
0.3294
0.3293
0.3371
0.3369
0.3293
0.3298
0.3364
0.3306
0.3243
0.3352
0.3423
0.3364
0.3298
0.3407
0.3481
0.3423
0.3352
0.3461
0.3539
0.3481
0.3407
0.3481
0.3554
0.3493
0.3423
0.3481
0.3554
0.3616
0.3539
0.3364
0.3431
0.3369
0.3306
0.3423
0.3493
0.3431
0.3364
1A2
1B1
1B2
1C1
1C2
1D1
1D2
2A2
2B1
2B2
2C1
2C2
2D1
2D2
3A2
3B1
3B2
3C1
3C2
3D1
3D2
Tolerance = ± 0.01.
Broadcom
ASMD-CWG7-NX7x2-DS101
8
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity
Coordinates
Chromaticity
Coordinates
Chromaticity
Coordinates
CCT
Bin ID
CCT
Bin ID
x
y
CCT
Bin ID
x
y
x
y
5000K
4A1
0.3369
0.3446
0.3441
0.3366
0.3371
0.3452
0.3446
0.3369
0.3374
0.3458
0.3452
0.3371
0.3374
0.3458
0.3464
0.3376
0.3542
0.3533
0.3452
0.3458
0.3458
0.3542
0.3551
0.3464
0.3446
0.3524
0.3515
0.3441
0.3452
0.3533
0.3524
0.3446
0.3431
0.3493
0.3428
0.3369
0.3493
0.3558
0.3493
0.3431
0.3554
0.3623
0.3558
0.3493
0.3554
0.3623
0.3688
0.3616
0.3692
0.3623
0.3558
0.3623
0.3623
0.3692
0.3760
0.3688
0.3493
0.3555
0.3487
0.3428
0.3558
0.3623
0.3555
0.3493
4500K
5A1
0.3521
0.3604
0.3591
0.3512
0.3530
0.3617
0.3604
0.3521
0.3539
0.3629
0.3617
0.3530
0.3548
0.3642
0.3629
0.3539
0.3629
0.3720
0.3703
0.3617
0.3642
0.3736
0.3720
0.3629
0.3604
0.3687
0.3670
0.3591
0.3617
0.3703
0.3687
0.3604
0.3533
0.3592
0.3522
0.3465
0.3601
0.3663
0.3592
0.3533
0.3668
0.3734
0.3663
0.3601
0.3736
0.3805
0.3734
0.3668
0.3734
0.3800
0.3726
0.3663
0.3805
0.3874
0.3800
0.3734
0.3592
0.3652
0.3578
0.3522
0.3663
0.3726
0.3652
0.3592
4000K
6A1
6A2
6A3
6A4
6B1
6B2
6B3
6B4
0.3670
0.3686
0.3744
0.3726
0.3686
0.3702
0.3763
0.3744
0.3744
0.3763
0.3825
0.3804
0.3726
0.3744
0.3804
0.3783
0.3702
0.3719
0.3782
0.3763
0.3719
0.3736
0.3802
0.3782
0.3782
0.3802
0.3869
0.3847
0.3763
0.3782
0.3847
0.3825
0.3578
0.3649
0.3685
0.3612
0.3649
0.3722
0.3760
0.3685
0.3685
0.3760
0.3798
0.3721
0.3612
0.3685
0.3721
0.3646
0.3722
0.3797
0.3837
0.3760
0.3797
0.3874
0.3916
0.3837
0.3837
0.3916
0.3958
0.3877
0.3760
0.3837
0.3877
0.3798
4A2
4B1
4B2
4C1
4C2
4D1
4D2
5A2
5B1
5B2
5C1
5C2
5D1
5D2
Tolerance = ± 0.01.
Broadcom
ASMD-CWG7-NX7x2-DS101
9
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity
Coordinates
Chromaticity
Coordinates
Chromaticity
Coordinates
CCT
Bin ID
x
y
CCT
Bin ID
x
y
CCT
Bin ID
x
y
4000K
6C1
0.3825
0.3847
0.3912
0.3887
0.3847
0.3869
0.3937
0.3912
0.3912
0.3937
0.4006
0.3978
0.3887
0.3912
0.3978
0.3950
0.3783
0.3804
0.3863
0.3840
0.3804
0.3825
0.3887
0.3863
0.3863
0.3887
0.3950
0.3924
0.3840
0.3863
0.3924
0.3898
0.3798
0.3877
0.3917
0.3836
0.3877
0.3958
0.4001
0.3917
0.3917
0.4001
0.4044
0.3958
0.3836
0.3917
0.3958
0.3875
0.3646
0.3721
0.3758
0.3681
0.3721
0.3798
0.3836
0.3758
0.3758
0.3836
0.3875
0.3794
0.3681
0.3758
0.3794
0.3716
3500K
7A1
0.3889
0.3915
0.3981
0.3953
0.3915
0.3941
0.4010
0.3981
0.3981
0.4010
0.4080
0.4048
0.3953
0.3981
0.4048
0.4017
0.3941
0.3968
0.4040
0.4010
0.3968
0.3996
0.4071
0.4040
0.4040
0.4071
0.4146
0.4113
0.4010
0.4040
0.4113
0.4080
0.3690
0.3768
0.3800
0.3720
0.3768
0.3848
0.3882
0.3800
0.3800
0.3882
0.3916
0.3832
0.3720
0.3800
0.3832
0.3751
0.3848
0.3930
0.3966
0.3882
0.3930
0.4015
0.4052
0.3966
0.3966
0.4052
0.4089
0.4001
0.3882
0.3966
0.4001
0.3916
3500K
7C1
0.4080
0.4113
0.4186
0.4150
0.4113
0.4146
0.4222
0.4186
0.4186
0.4222
0.4299
0.4259
0.4150
0.4186
0.4259
0.4221
0.4017
0.4048
0.4116
0.4082
0.4048
0.4080
0.4150
0.4116
0.4116
0.4150
0.4221
0.4183
0.4082
0.4116
0.4183
0.4147
0.3916
0.4001
0.4037
0.3950
0.4001
0.4089
0.4127
0.4037
0.4037
0.4127
0.4165
0.4073
0.3950
0.4037
0.4073
0.3984
0.3751
0.3832
0.3865
0.3782
0.3832
0.3916
0.3950
0.3865
0.3865
0.3950
0.3984
0.3898
0.3782
0.3865
0.3898
0.3814
6C2
6C3
6C4
6D1
6D2
6D3
6D4
7A2
7A3
7A4
7B1
7B2
7B3
7B4
7C2
7C3
7C4
7D1
7D2
7D3
7D4
Tolerance = ± 0.01.
Broadcom
ASMD-CWG7-NX7x2-DS101
10
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity
Coordinates
Chromaticity
Coordinates
Chromaticity
Coordinates
CCT
Bin ID
x
y
CCT
Bin ID
x
y
CCT
Bin ID
x
y
3000K
8A1
0.4147
0.4183
0.4242
0.4203
0.4183
0.4221
0.4281
0.4242
0.4242
0.4281
0.4342
0.4300
0.4203
0.4242
0.4300
0.4259
0.4221
0.4259
0.4322
0.4281
0.4259
0.4299
0.4364
0.4322
0.4322
0.4364
0.4430
0.4385
0.4281
0.4322
0.4385
0.4342
0.3814
0.3898
0.3919
0.3833
0.3898
0.3984
0.4006
0.3919
0.3919
0.4006
0.4028
0.3939
0.3833
0.3919
0.3939
0.3853
0.3984
0.4073
0.4096
0.4006
0.4073
0.4165
0.4188
0.4096
0.4096
0.4188
0.4212
0.4119
0.4006
0.4096
0.4119
0.4028
3000K
8C1
0.4342
0.4385
0.4449
0.4403
0.4385
0.4430
0.4496
0.4449
0.4449
0.4496
0.4562
0.4513
0.4403
0.4449
0.4513
0.4465
0.4259
0.4300
0.4359
0.4316
0.4300
0.4342
0.4403
0.4359
0.4359
0.4403
0.4465
0.4418
0.4316
0.4359
0.4418
0.4373
0.4028
0.4119
0.4141
0.4049
0.4119
0.4212
0.4236
0.4141
0.4141
0.4236
0.4260
0.4164
0.4049
0.4141
0.4164
0.4071
0.3853
0.3939
0.3960
0.3873
0.3939
0.4028
0.4049
0.3960
0.3960
0.4049
0.4071
0.3981
0.3873
0.3960
0.3981
0.3893
2700K
9A1
0.4373
0.4418
0.4475
0.4428
0.4418
0.4465
0.4523
0.4475
0.4475
0.4523
0.4582
0.4532
0.4428
0.4475
0.4532
0.4483
0.4465
0.4513
0.4573
0.4523
0.4513
0.4562
0.4624
0.4573
0.4573
0.4624
0.4687
0.4634
0.4523
0.4573
0.4634
0.4582
0.3893
0.3981
0.3994
0.3906
0.3981
0.4071
0.4085
0.3994
0.3994
0.4085
0.4099
0.4008
0.3906
0.3994
0.4008
0.3919
0.4071
0.4164
0.4178
0.4085
0.4164
0.4260
0.4274
0.4178
0.4178
0.4274
0.4289
0.4193
0.4085
0.4178
0.4193
0.4099
8A2
8A3
8A4
8B1
8B2
8B3
8B4
8C2
8C3
8C4
8D1
8D2
8D3
8D4
9A2
9A3
9A4
9B1
9B2
9B3
9B4
Tolerance = ± 0.01.
Broadcom
ASMD-CWG7-NX7x2-DS101
11
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Chromaticity
Coordinates
CCT
Bin ID
x
y
2700K
9C1
0.4582
0.4634
0.4695
0.4641
0.4634
0.4687
0.4750
0.4695
0.4695
0.4750
0.4813
0.4756
0.4641
0.4695
0.4756
0.4700
0.4483
0.4532
0.4589
0.4538
0.4532
0.4582
0.4641
0.4589
0.4589
0.4641
0.4700
0.4646
0.4538
0.4589
0.4646
0.4593
0.4099
0.4193
0.4207
0.4112
0.4193
0.4289
0.4304
0.4207
0.4207
0.4304
0.4319
0.4221
0.4112
0.4207
0.4221
0.4126
0.3919
0.4008
0.4021
0.3931
0.4008
0.4099
0.4112
0.4021
0.4021
0.4112
0.4126
0.4034
0.3931
0.4021
0.4034
0.3944
9C2
9C3
9C4
9D1
9D2
9D3
9D4
Tolerance = ± 0.01.
Broadcom
ASMD-CWG7-NX7x2-DS101
12
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 2: Spectral Power Distribution
Figure 3: Forward Current vs. Forward Voltage
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
120
100
80
60
40
20
0
2700K
3000K
6500K
380
430
480
530
580
630
680
730
780
0.0
1.0
2.0
3.0
4.0
5.0
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 4: Relative Luminous Intensity vs. Mono Pulse Current
Figure 5: Radiation Pattern
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
10
20
30
40
-90
-60
-30
0
30
60
90
MONO PULSE CURRENT- mA
ANGULAR DISPLACEMENT - DEGREE
Figure 6: Chromaticity Coordinate Shift vs. Mono Pulse
Current (2700K)
Figure 7: Chromaticity Coordinate Shift vs. Mono Pulse
Current (3000K)
0.010
0.008
0.006
0.010
0.008
0.006
0.004
0.004
Cx
Cx
Cy
Cy
0.002
0.000
0.002
0.000
-0.002
-0.004
-0.006
-0.008
-0.010
-0.002
-0.004
-0.006
-0.008
-0.010
0
10
20
30
40
0
10
20
30
40
MONO PULSE CURRENT - mA
MONO PULSE CURRENT - mA
Broadcom
ASMD-CWG7-NX7x2-DS101
13
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 8: Chromaticity Coordinate Shift vs. Mono Pulse
Current (6500K)
Figure 9: Forward Voltage Shift vs. Junction Temperature
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
0.010
0.008
0.006
0.004
0.002
0.000
-0.002
-0.004
Cy
Cx
-0.006
-0.008
-0.010
-50
-25
0
25
50
75
100
125
0
10
20
30
40
JUNCTION TEMPERATURE, TJ - °C
MONO PULSE CURRENT - mA
Figure 10: Relative Luminous Intensity vs Junction
Temperature
Figure 11: Chromaticity Coordinate Shift vs. Junction
Temperature (2700K)
0.008
0.006
0.004
0.002
0.000
-0.002
-0.004
120
100
80
60
40
20
0
-0.006
Cx
Cy
-0.008
-0.010
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE, TJ - °C
JUNCTION TEMPERATURE, TJ - °C
Figure 12: Chromaticity Coordinate Shift vs. Junction
Temperature (3000K)
Figure 13: Chromaticity Coordinate Shift vs. Junction
Temperature (6500K)
0.008
0.006
0.004
0.002
0.000
-0.002
-0.004
0.015
0.010
0.005
0.000
-0.005
Cx
-0.010
Cx
-0.006
-0.008
Cy
Cy
-0.015
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE, TJ - °C
JUNCTION TEMPERATURE, TJ - °C
Broadcom
ASMD-CWG7-NX7x2-DS101
14
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 14: Maximum Forward Current vs. Ambient
Temperature. Derated based on TJMAX = 110°C
Figure 15: Maximum Forward Current vs. Solder Point
Temperature. Derated based on TJMAX = 110°C, RθJ-S = 80°C/W
35
30
35
30
25
20
15
10
5
25
Rș-ꢀA = 300°C/W
Rș-ꢀA = 350°C/W
20
Rș-ꢀA = 400°C/W
15
10
5
0
0
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
AMBIENT TEMPERATURE, TA - °C
SOLDER POINT TEMPERATURE, TS - °C
Figure 16: Recommended Soldering Land Pattern
COPPER PAD
MAXIMIZE COPPER
PAD AREA FOR
BETTER HEAT
DISSIPATION
SOLDER MASK
NOTE: All dimensions are in millimeters (mm).
Broadcom
ASMD-CWG7-NX7x2-DS101
15
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 17: Carrier Tape Dimensions
F
P0
P1
P2
D0
E1
1.75±0.1
W
3.5±0.10
4.0±0.1
4.0±0.1
2.0±0.05
1.60±0.05
8.0±0.3
T
B0
K0
A0
0.2±0.05
3.25±0.1
0.95±0.1
1.6±0.1
NOTE: All dimensions are in millimeters (mm).
Figure 18: Reel Dimensions
9.0
PRODUCT LABEL
USER FEED DIRECTION
NOTE: All dimensions are in millimeters (mm).
Broadcom
ASMD-CWG7-NX7x2-DS101
16
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Precautionary Notes
Soldering
Handling Precautions
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling
moisture-sensitive device as stated in the following
section.
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant, which is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Refer to Broadcom Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions, for additional information.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
– Soldering iron tip temperature = 315°C maximum.
– Soldering duration = 3 seconds maximum.
– Number of cycles = 1 only
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and induce failures to the LED die or wire bond.
– Power of soldering iron = 50W maximum.
Do not touch the LED package body with the soldering
iron except for the soldering terminals, as it may cause
damage to the LED.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
Surface of silicone material attracts dust and dirt easier
than epoxy due to its surface tackiness. To remove
foreign particles on the surface of silicone, use a cotton
bud with isopropyl alcohol (IPA). During cleaning, rub
the surface gently without putting too much pressure on
the silicone. Ultrasonic cleaning is not recommended.
Figure 19: Recommended Lead-Free Reflow Soldering Profile
10 to 30 SEC.
255 – 260°C
3°C/SEC. MAX.
For automated pick and place, Broadcom has tested a
nozzle size with OD 1.5 mm to work with this LED.
However, due to the possibility of variations in other
parameters such as pick and place machine maker/
model, and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
217°C
200°C
6°C/SEC. MAX.
150°C
3°C/SEC. MAX.
100 SEC. MAX.
60 – 120 SEC.
TIME
Broadcom
ASMD-CWG7-NX7x2-DS101
17
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Storage:
Handling of Moisture-Sensitive Devices
The soldering terminals of these Broadcom LEDs are silver
plated. If the LEDs are exposed in an ambient environment
for too long, the silver plating might be oxidized, thus
affecting its solderability performance. As such, keep
unused LEDs in a sealed MBB with desiccant or in a
desiccator at <5% RH.
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Before use:
An unopened moisture barrier bag (MBB) can be stored
at <40°C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, it is
safe to reflow the LEDs per the original MSL rating.
Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
Do not open the MBB prior to assembly (for example,
for IQC). If unavoidable, the MBB must be properly
resealed with fresh desiccant and a HIC. The exposed
duration must be taken in as floor life.
Circuit design must cater to the whole range of forward
voltage (V ) of the LEDs to ensure the intended drive
F
current can always be achieved.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (such as intensity, wavelength,
and forward voltage). Set the application current as
close as possible to the test current to minimize these
variations.
Control after opening the MBB:
Read the HIC immediately upon opening of the MBB.
Keep the LEDs at <30°/60% RH at all times, and
complete all high temperature-related processes,
including soldering, curing, or rework within 168 hours.
Do not use the LED in the vicinity of material with sulfur
content or in environments of high gaseous sulfur
compounds and corrosive elements. Examples of
material that might contain sulfur are rubber gaskets,
room- temperature vulcanizing (RTV) silicone rubber,
rubber gloves, and so on. Prolonged exposure to such
environments may affect the optical characteristics and
product life.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or a
desiccator at <5% RH.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to other
high-temperature processes, store the PCB in a sealed
MBB with desiccant or desiccator at <5% RH to ensure that
all LEDs have not exceeded their floor life of 168 hours.
White LEDs must not be exposed to acidic
environments and must not be used in the vicinity of
any compound that may have acidic outgas, such as,
but not limited to, acrylate adhesive. These
environments have an adverse effect on LED
performance.
Baking is required if:
The HIC indicator indicates a change in color for 10%
and 5%, as stated on the HIC.
Avoid rapid changes in ambient temperature, especially
in high-humidity environments, because they cause
condensation on the LED.
The LEDs are exposed to conditions of >30°C/60% RH
at any time.
If the LED is intended to be used in harsh or outdoor
environments, protect the LED against damages
caused by rain, water, dust, oil, corrosive gases,
external mechanical stresses, and so on.
The LED's floor life exceeded 168 hours.
The recommended baking condition is: 60°C ± 5ºC for
20 hours.
Baking can only be done once.
Broadcom
ASMD-CWG7-NX7x2-DS101
18
ASMD-CWG7-NX7x2 Data Sheet
Low-Power 3014 DFN2 Surface-Mount LED
Figure 20: Solder Point Temperature on PCB
Thermal Management
POLARITY
MARK
The optical, electrical, and reliability characteristics of the
LED are affected by temperature. Keep the junction
Ts POINT
temperature (T ) of the LED below the allowable limit at all
J
times. T can be calculated as follows:
J
PRINTED
CIRCUIT
BOARD
T = T + R
× I × V
F Fmax
J
A
θJ-A
where:
T = Ambient temperature (°C)
A
T can be easily measured by mounting a thermocouple on
S
R
= Thermal resistance from LED junction to
θJ-A
the soldering joint as shown in preceding figure, while R
θJ-S
ambient (°C/W)
is provided in the data sheet. Verify the T of the LED in the
S
I = Forward current (A)
F
final product to ensure that the LEDs are operating within all
maximum ratings stated in the data sheet.
V
= Maximum forward voltage (V)
Fmax
The complication of using this formula lies in T and R
.
θJ-A
A
Eye Safety Precautions
Actual T is sometimes subjective and hard to determine.
A
R
varies from system to system depending on design
θJ-A
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
and is usually not known.
Another way of calculating T is by using the solder point
J
temperature, T as follows:
S
T = T + R
× I × V
F Fmax
J
S
θJ-S
where:
T = LED solder point temperature as shown in the
S
following figure (°C)
R
= Thermal resistance from junction to solder point
θJ-S
(°C/W)
I = Forward current (A)
F
V
= Maximum forward voltage (V)
Fmax
Broadcom
ASMD-CWG7-NX7x2-DS101
19
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