ALMD-EG3D-VX002 [BOARDCOM]
High Brightness SMT Round LED Lamps Amber, Red, Green and Blue Tinted LEDs;
| 型号： | ALMD-EG3D-VX002 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | High Brightness SMT Round LED Lamps Amber, Red, Green and Blue Tinted LEDs PC 光电 |
| 文件： | 总12页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
High Brightness SMT Round LED Lamps
Amber, Red, Green and Blue Tinted LEDs
Data Sheet
Description
Features
The new Avago ALMD-xx3D LED series has the same or xꢀ Compact form factor
just slightly less luminous intensity than conventional
high brightness, through-hole LEDs.
xꢀ High brightness material
xꢀ Available in Red, Amber, Green and Blue color
The new LED lamps can be assembled using common
SMT assembly processes and are compatible with indus-
trial reflow soldering processes.
xꢀ Red AlInGaP 626 nm
xꢀ Amber AlInGaP 590 nm
xꢀ Green InGaN 525 nm
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
xꢀ Blue InGaN 470 nm
xꢀ JEDEC MSL 2A
For easy pick and place assembly, the LEDs are shipped
in EIA-compliant tape and reel. Every reel is shipped from
a single intensity and color bin– except the red color–for
better uniformity.
xꢀ Compatible with industrial reflow soldering process
xꢀ Typical Viewing angle: 30q
xꢀ Tinted, non-diffused
Package Dimensions
Applications
Package Marking
xꢀ Variable Message Signs
A
A
C
4.20 0.20
C
A: Anode
C: Cathode
4.20 0.20
4.75 0.50
6.50 0.50
3.40 0.50
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is 0.20 mm unless other speciꢀed.
A
C
2.50 0.20
1.4 (4x)
3. Copper leadframe.
CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
CAUTION: Customer is advised to keep the LED in the MBB when not in use as prolonged exposure to environment might cause
the silver plated leads to tarnish, which might cause difficulties in soldering.
Device Selection Guide
[1,2,5]
Luminous Intensity Iv (mcd)
Viewing Angle
Typ (°)
Part Number
Color and Dominant Wavelength
[4]
[3]
O (nm)Typ
d
Min
Max
ALMD-EG3D-VX002
ALMD-EL3D-VX002
ALMD-CM3D-Y1002
ALMD-CB3D-SU002
Notes:
Red 626
4200
4200
9300
1900
9300
9300
30q
Amber 590
Green 525
Blue 470
21000
4200
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is 15ꢁ
Part Numbering System
A
L
M
D
-
x1 x2 x3 x4
-
x5 x6 x7 x8 x9
Code
Description
Option
x1
Package type
E
C
Round AlInGaP
Round InGaN
x2
Color
B
G
L
Blue
Red
Amber
Green
M
x3
Viewing angle
3
30°
x4
Product speciꢀc designation
Minimum intensity bin
Maximum intensity bin
Color bin selection
D
x5
Refer to device selection guide
Refer to device selection guide
x6
x7
0
Full distribution
x8x9
Packaging option
02
Tested 20mA, 13inch carrier tape
2
Absolute Maximum Rating, T = 25 qC
J
Parameter
Red and Amber
Blue and Green
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
50
100 [2]
30
100 [3]
120
114
Reverse Voltage
5 (IR = 100 PA) [4]
5 (IR = 10 PA) [4]
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
110
qC
-40 to +85
-40 to +100
qC
qC
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9.
2. Duty Factor 30ꢁ, frequency 1 kHz.
3. Duty Factor 10ꢁ, frequency 1 kHz.
4. Indicates product ꢀnal testing; long-term reverse bias is not recommended.
Electrical / Optical Characteristics, T = 25 qC
J
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Red
Amber
Green
VF
V
IF = 20 mA
1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
Blue
Reverse Voltage
Red & Amber
Green & Blue
VR
5
5
V
IF = 100 PA
IF = 10 PA
Dominant Wavelength [1]
Red
Amber
Green
Blue
Od
IF = 20 mA
618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
630.0
594.5
539.0
480.0
Peak Wavelength
Red
Amber
Green
Blue
OPEAK
634
594
516
464
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance
RTJ-PIN
130
qC/W
LED Junction-to-Pin
Luminous Efficacy [2]
Red
Amber
Green
Blue
KV
200
520
530
65
lm/W
Emitted Luminous Power/Emitted
Radiant Power
Thermal coefficient of Od
nm/qC IF = 20 mA ; +25 qC ≤ TJ ≤ +100 qC
Red
0.059
0.103
0.028
0.024
Amber
Green
Blue
Notes:
1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
2. The radiant intensity, I in watts per steradian, may be found from the equation I = I /K where I is the luminous intensity in candelas and K is
e
e
V
V
V
V
the luminous efficacy in lumens/watt.
3
AlInGaP
1
100
80
60
40
20
0
0.8
0.6
0.4
0.2
0
Amber
Red
0
0.5
1
1.5
2
2.5
3
500
550
600
650
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs ForwardVoltage
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
60
50
40
30
20
10
0
Amber
Red
0
20
40
60
80
100
0
20
TA - AMBIENT TEMPERATURE (°C)
Note: RTJ-A = 460 qC/W
40
60
80
100
FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
1.6
1.4
1.2
1.0
0.8
Amber
0.6
0.4
0.2
0.0
Red
-0.2
-0.4
-0.6
0
20
40
60
80
100
FORWARD CURRENT - mA
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
4
InGaN
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
80
60
40
20
0
BLUE
GREEN
380
430
480
530
580
630
0
1
2
3
4
5
WAVELENGTH - nm
FORWARD VOLTAGE-V
Figure 6. Relative Intensity vs Wavelength
Figure 7. Forward Current vs ForwardVoltage
35
30
25
20
15
10
5
3.5
Blue
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Green
0
0
20
40
60
80
100
120
0
20
40
60
80
100
DC FORWARD CURRENT-mA
TA - AMBIENT TEMPERATURE - °C
Figure 8. Relative Intensity vs Forward Current
Figure 9. Maximum Forward Current vs Ambient Temperature
10
5
Green
Blue
0
-5
-10
0
20
40
60
80
100
FORWARD CURRENT-mA
Figure 10. Dominant Wavelength Shift vs Forward Current
5
1.0
0.8
0.6
0.4
0.2
0.0
Package Marking
A
A
C
X
X
C
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT-DEGREE
Figure 11a. Radiation Pattern for X axis
Figure 11b. Component Axis for Radiation Pattern
10
0.3
Red
Amber
Blue
Green
Red
Amber
Green
Blue
0.2
0.1
0
1
-0.1
-0.2
-0.3
0.1
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ - JUNCTION TEMPERATURE
TJ - JUNCTION TEMPERATURE
Figure 12. Relative Intensity Shift vs Junction Temperature
Figure 13. ForwardVoltage Shift vs Junction Temperature
2.1
5.2
Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum
and above.
Figure 14. Recommended Soldering Land Pattern
6
4.00 0.ꢀ0
ꢀ.00 0.ꢀ0
0.50 0.10
1.55 0.ꢀ0
1.75 0.ꢀ0
1.80 0.ꢀ0
7.50 0.ꢀ0
5.ꢀ0 0.ꢀ0
8.00 0.ꢀ0
ꢀ.ꢀ0 0.ꢀ0
4.50 0.ꢀ0
16.00 0.ꢁ0
1.60 0.ꢀ0
5.ꢁ0 0.ꢀ0
7.10 0.ꢀ0
Figure 15. Carrier Tape Dimension
16.40 0.ꢀ0
1ꢁ.00 0.ꢀ0
Figure 16. Reel Dimension
ꢀ anode leads lead unreeling direction
Figure 17. Unit Orientation from reel
7
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Intensity (mcd) at 20 mA
V Bin Table (V at 20 mA) for Red & Amber
F
Bin ID
VD
Min
1.8
2.0
2.2
Max
2.0
2.2
2.4
Bin
S
Min
Max
1900
2500
3200
4200
5500
7200
9300
12000
16000
2500
3200
4200
5500
7200
9300
12000
16000
21000
VA
T
VB
U
V
Tolerance for each bin limit is 0.05V
W
X
Y
Z
1
Tolerance for each bin limit is 15ꢁ
Red Color Range
Green Color Range
Min Dom Max Dom X min
Y Min
X max
Y max
Min
Bin Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
618.0
630.0
0.6872
0.6690
0.3126
0.3149
0.6890
0.7080
0.2943
0.2920
1
2
3
4
5
519.0
523.0
527.0
531.0
535.0
523.0
527.0
531.0
535.0
539.0
0.0667 0.8323 0.1450 0.7319
0.1200 0.7375 0.0979 0.8316
0.0979 0.8316 0.1711 0.7218
0.1450 0.7319 0.1305 0.8189
0.1305 0.8189 0.1967 0.7077
0.1711 0.7218 0.1625 0.8012
0.1625 0.8012 0.2210 0.6920
0.1967 0.7077 0.1929 0.7816
0.1929 0.7816 0.2445 0.6747
0.2210 0.6920 0.2233 0.7600
Tolerance for each bin limit is 0.5nm
Amber Color Range
Min
Bin Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is 0.5nm
Blue Color Range
Min
Max
Bin Dom
Dom
Xmin
Ymin
Xmax
Ymax
Tolerance for each bin limit is 0.5nm
1
2
3
4
5
460.0
464.0
468.0
472.0
476.0
464.0
468.0
472.0
476.0
480.0
0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is 0.5nm
8
Packing Label
(i) Mother Label (Available on MBB bag)
STANDARD LABEL LS0002
RoHS Compliant
(Q) QTY: Quantity
e4 Max Temp 260C MSL 2a
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(9D) Date Code: Date Code
(V) Vendor ID:
DeptID: OEAT01
Made In: Country of Origin
(ii) Baby Label (Available on Plastic Reel)
(1P) PART #: Part Number
(1T) Lot #: Lot Number
BABY LABEL COSBOO1B V0.0
(Q) QTY: Quantity
(9D)MFG Date: Manufacturing Date
(9D) Date Code: Date Code
C/0: Country of Origin
CAT Intensity Bin
(1T) TAPE DATE: Taping Date
BIN Refer to Below information
Note: Acronyms and Deꢀnition:
BIN:
Example:
a. Color bin only or VF bin only
BIN: 4 (represent color bin 4 only)
BIN: VA (represent VF bin “VA”only)
b. Color bin incorporate with VF bin
(i) Color bin only or VF bin only
(Applicable for part number with color bins but with-
out VF bin OR part number with VF bins and no color
bin)
BIN: 4 VA
(ii) Color bin incorporated with VF bin
Applicable for part number that have both color bin
and VF bin
VA: VF bin “VA”
4: Color bin 4 only
9
Soldering
Recommended reflow soldering condition:
(i) Leaded reflow soldering:
(ii) Lead-free reflow soldering:
20 SEC. MAX.
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
255 - 260 °C
3°C/SEC. MAX.
217°C
200°C
183°C
100-150°C
6°C/SEC. MAX.
150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
120 SEC. MAX.
TIME
60-150 SEC.
TIME
a. Reflow soldering must not be done more than two c. Do not apply any pressure or force on the LED during
times. Make sure you take the necessary precautions
for handling a moisture-sensitive device, as stated in
the following section.
reflow and after reflow when the LED is still hot.
d. It is preferred that you use reflow soldering to
solder the LED. Use hand soldering only for rework
if unavoidable but must be strictly controlled to the
following conditions:
b. Recommended board reflow direction:
-
-
-
-
Soldering iron tip temperature = 320 °C max.
Soldering duration = 3 sec max.
Number of cycles = 1 only
Power of soldering iron = 50 W max.
e. Do not touch the LED body with a hot soldering iron
except the soldering terminals as this may damage the
LED.
f. For de-soldering, it is recommended that you use a
double flat tip.
g. Please conꢀrm beforehand whether the functionality
and performance of the LED is affected by hand
soldering.
REFLOW SOLDERING
10
PRECAUTIONARY NOTES
d. Control of assembled boards
1. Handling precautions
For automated pick and place, Avago has tested nozzle
size below made with urethane material to be working
ꢀne with this LED. However, due to the possibility of
variations in other parameters such as pick and place
machine maker/model and other settings of the ma-
chine, customer is recommended to verify the nozzle
selected.
-
If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB need to be stored in sealed MBB with
desiccant or desiccator at <5ꢁRH to ensure that
all LEDs have not exceeded their floor life of 672
hours.
e. Baking is required if:
Pick & Place nozzle
-
-
-
The HIC indicator is not BROWN at 10ꢁ and is
AZURE at 5ꢁ.
The LEDs are exposed to condition of >30°C /
60ꢁ RH at any time.
4.8 mm
>3.5mm
The LED floor life exceeded 672hrs.
The recommended baking condition is: 60 5ꢂC
for 20hrs. Baking should only be done once.
4.4 mm
3.9 mm
LED flange
f. Storage
Note:
-
The soldering terminals of these Avago LEDs
a. Nozzle tip should touch the LED flange during pick and place.
b. Outer dimensions of the nozzle should be able to ꢀt into the carrier
tape pocket.
are silver plated. If the LEDs are being exposed
in ambient environment for too long, the silver
plating might be oxidized and thus affecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5ꢁRH.
2. Handling of moisture-sensitive device
This product has a Moisture Sensitive Level 2a rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
3. Application precautions
a. Drive current of the LED must not exceed the
maximum allowable limit across temperature as
stated in the datasheet. Constant current driving is
recommended to ensure consistent performance.
a. Before use
-
An unopened moisture barrier bag (MBB) can
be stored at <40°C/90ꢁRH for 12 months. If the
actual shelf life has exceeded 12 months and
the humidity Indicator Card (HIC) indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
b. LED is not intended for reverse bias. Do use other
appropriate components for such purpose. When
driving the LED in matrix form, it is crucial to ensure
that the reverse bias voltage is not exceeding the
allowable limit of the LED.
c. Avoid rapid change in ambient temperature
especially in high humidity environment as this will
cause condensation on the LED.
-
It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
b. Control after opening the MBB
d. If the LED is intended to be used in outdoor or harsh
environment, the LED leads must be protected
with suitable potting material against damages
caused by rain water, oil, corrosive gases etc. It is
recommended to have louver or shade to reduce
direct sunlight on the LEDs.
-
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
-
The LEDs must be kept at <30°C / 60ꢁRH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
4. Eye safety precautions
LEDs may pose optical hazards when in operation. It is
not advisable to view directly at operating LEDs as it
may be harmful to the eyes. For safety reasons, use ap-
propriate shielding or personal protective equipments.
c. Control for unꢀnished reel
-
Unused LEDs must be stored in a sealed MBB
with desiccant or desiccator at <5ꢁRH.
11
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-2372EN - April 21, 2015
相关型号：
©2020 ICPDF网 联系我们和版权申明