AEMD-LL3K-XYK02 [BOARDCOM]
High Brightness Red and Amber SMT Oval Lamps;型号: | AEMD-LL3K-XYK02 |
厂家: | Broadcom Corporation. |
描述: | High Brightness Red and Amber SMT Oval Lamps |
文件: | 总12页 (文件大小:996K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
AEMD-LG3K, AEMD-LL3K
High Brightness Red and Amber SMT Oval Lamps
Description
Features
®
The new Broadcom series is essentially like a conventional
high brightness though hole LED in the form of a surface
mount device. It can be assembled using common SMT
assembly processes and is compatible with the industrial
reflow soldering process.
High brightness AlInGaP
Available in Red and Amber
Typical viewing angle: 95° × 45°
Tinted and diffused appearance
Surface mountable
Compatible with industrial reflow soldering process
MSL 3
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications. For
easy pick-and-place assembly, the LEDs are shipped in
tape and reel. Every reel is shipped from a single intensity
and color bin for better uniformity.
Applications
Gas price signs
Monocolor signs
Full color signs
CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to
application note AN-1142 for additional details.
CAUTION! Keep the LED in a moisture barrier bag is < 5% RH when not in use because prolonged exposure to the
environment might cause the leads to tarnish or rust, which might cause difficulties in soldering.
Broadcom
AEMD-LX3K-DS101
March 29, 2018
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Figure 1: Package Drawing
Lead Configuration
Pin 1
Pin 2
Pin 3
Anode
Cathode
Anode
NOTE:
1. All dimensions in millimeters (mm).
2. Tolerance is ±0.50 mm unless otherwise specified.
Device Selection Guide
T = 25°C, I = 20 mA.
J
F
Luminous Intensity, IV (mcd)a, b
Dominant Wavelength, d (nm)c
Part Number
Color
Min.
Max.
Min.
Max.
AEMD-LG3K-XZ002
AEMD-LG3K-XY002
AEMD-LL3K-XZ002
AEMD-LL3K-XYK02
AEMD-LL3K-XYL02
Red
Red
1660
1660
1660
1660
1660
2900
2400
2900
2400
2400
618.0
618.0
584.5
587.0
589.5
630.0
630.0
594.5
592.0
594.5
Amber
Amber
Amber
a. The luminous intensity, IV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual
peak of the spatial radiation pattern may not be aligned with the axis.
b. Tolerance is ±15%.
c. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
Broadcom
AEMD-LX3K-DS101
2
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Absolute Maximum Ratings
Parameters
Red/Amber
Units
mA
DC Forward Currenta
50
Peak Forward Currentb
100
120
mA
Power Dissipation
mW
Reverse Voltage
Not recommended for reverse bias
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
a. Derate linearly as shown in Figure 9.
b. Duty factor = 10%, frequency = 1 kHz.
110
°C
–40 to +85
–40 to +100
°C
°C
Optical and Electrical Characteristics
T = 25°C.
J
Parameters
Min.
Typ.
Max.
Units
Test Condition
IF = 20 mA
a
—
95 × 45
—
°
Viewing Angle, 2θ
½
b
nm
IF = 20 mA
Dominant Wavelength, d
618.0
584.5
621.0
590.0
630.0
594.5
Red
Amber
Peak Wavelength, p
nm
V
IF = 20 mA
IF = 20 mA
—
—
630
594
—
—
Red
Amber
c
Forward Voltage, VF
1.8
1.8
2.1
2.1
2.4
2.4
Red
Amber
d
V
IR = 100 µA
Reverse Voltage, VR
5
5
—
—
—
—
Red
Amber
e
°C/W
LED junction to pin
Thermal Resistance, RθJ-P
—
—
270
270
—
—
Red
Amber
a. θ is the off-axis angle where the luminous intensity is ½ the peak intensity.
½
b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
c. Forward voltage tolerance is ±0.1V.
d. Indicates product final test condition. Long-term reverse bias is not recommended.
e. Thermal resistance from LED junction to pin.
Broadcom
AEMD-LX3K-DS101
3
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Part Numbering System
x1
x2
x3
x4
x5
x6
x7
x8
A
E
M
D
-
K
-
Code
x1
Description
Package Type
Color
Option
L
Oval AlInGaP
x2
G
L
Red
Amber
95° × 45°
x3
x4
x5
x6
Viewing Angle
3
Minimum Intensity Bin
Maximum Intensity Bin
Color Bin Option
Refer to Intensity Bin Limits (CAT) table
0
Full distribution
K
L
Color bins 2 and 4
Color bins 4 and 6
Tested at 20 mA
x7 x8
Packaging Option
02
Part Number Example
AEMD-LL3K-XYK02
x : L
–
–
–
–
–
–
–
Oval AlInGaP
Amber color
1
x : L
2
x : 3
95° × 45° viewing angle
Minimum intensity bin X
Maximum intensity binY
Color bins 2 and 4
3
x : X
4
x : Y
5
x : K
6
x x : 02
Tested at 20 mA
7
8
Broadcom
AEMD-LX3K-DS101
4
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Bin Information
Intensity Bin Limits (CAT)
Forward Voltage Bin Limits (VF)
Luminous Intensity, Iv (mcd)
Forward Voltage, VF (V)
Bin ID
Min.
Max.
Bin ID
Min.
Max.
X
Y
Z
1660
1990
2400
1990
2400
2900
VD
VA
VB
1.8
2.0
2.2
2.0
2.2
2.4
Tolerance = ±15%
Tolerance = ±0.1V
Color Bin Limits (BIN)
Dominant Wavelength, d (nm)
Bin ID
Min.
Max.
Red
—
618.0
630.0
Amber
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
Tolerance = ±1.0 nm
Example of bin information on reel and packaging label:
CAT : Y
BIN : 2
VF: VA
–
–
–
Intensity bin Y
Color bin 2
Forward voltage bin VA
Broadcom
AEMD-LX3K-DS101
5
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Figure 2: Spectral Power Distribution
Figure 3: Forward Current vs. Forward Voltage
Figure 4: Relative Luminous Intensity vs. Mono Pulse Current
Figure 5: Dominant Wavelength Shift vs. Mono Pulse Current
Figure 6: Relative Light Output vs. Junction Temperature
Figure 7: Forward Voltage Shift vs. Junction Temperature
Broadcom
AEMD-LX3K-DS101
6
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Figure 8: Radiation Pattern
Figure 9: Maximum Forward Current vs. Ambient
Temperature. Derated based on TJMAX = 110°C
Figure 10: Recommended Soldering Land Pattern
NOTE: All dimensions are in millimeters (mm).
Broadcom
AEMD-LX3K-DS101
7
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Figure 11: Carrier Tape Dimensions
NOTE:
1. All dimensions in millimeters (mm).
2. Tolerance is ±0.10 mm unless otherwise specified.
Figure 12: Reel Dimensions
NOTE: All dimensions are in millimeters (mm).
Broadcom
AEMD-LX3K-DS101
8
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Precautionary Notes
Figure 14: Recommended Nozzle Dimension
PICK AND PLACE NOZZLE
Soldering
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling moisture-
sensitive devices as stated in the following section.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
>3.90
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
LED FLANGE
– Soldering iron tip temperature = 315°C max.
– Soldering duration = 3s max.
– Number of cycles = 1 only
– Power of soldering iron = 50W max.
> 3.90
Do not touch the LED package body with the soldering
iron except for the soldering terminals, as it may cause
damage to the LED.
4.96
NOTE:
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
1. The nozzle tip must touch the LED flange
during pick and place.
2. The outer dimensions of the nozzle tip must be
able to fit into the carrier tape pocket until it
touches the LED flange.
Figure 13: Recommended Lead-Free Reflow Soldering Profile
10 to 30 SEC.
3. All dimensions are in millimeters (mm).
255 – 260°C
3°C/SEC. MAX.
217°C
200°C
Handling of Moisture-Sensitive Devices
6°C/SEC. MAX.
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
150°C
3°C/SEC. MAX.
60 – 120 SEC.
100 SEC. MAX.
TIME
Before use:
– An unopened moisture barrier bag (MBB) can be
stored at < 40°C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, it is safe to reflow the LEDs per the original
MSL rating.
Handling Precautions
For automated pick-and-place, Broadcom has tested the
following nozzle size to work well with this LED. However,
due to the possibility of variations in other parameters, such
as pick-and-place machine maker/model, and other settings
of the machine, verify that the selected nozzle performs as
per requirements.
– Do not open the MBB prior to assembly (for
example, for IQC). If unavoidable, MBB must be
properly resealed with fresh desiccant and HIC. The
exposed duration must be taken in as floor life.
Broadcom
AEMD-LX3K-DS101
9
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Control after opening the MBB:
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
– Read the HIC immediately upon opening of MBB.
– Keep the LEDs at < 30°/60% RH at all times, and
complete all high temperature-related processes,
including soldering, curing or rework within
168 hours.
As the actual application might not be exactly similar to
the test conditions, verify that the LED will not be
damaged by prolonged exposure in the intended
environment.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or a
desiccator at < 5% RH.
Avoid rapid change in ambient temperatures, especially
in high-humidity environments, because they cause
condensation on the LED.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at < 5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
If the LED is intended to be used in harsh or outdoor
environments, protect the LED against damage caused
by rain water, water, dust, oil, corrosive gases, external
mechanical stresses, and so on.
The number of reflow cycles and reflow temperature
condition used may affect optical characteristics of the
LED. Use LEDs with the same number of reflow cycle
and same reflow temperature condition within the same
finished good.
Baking is required if the following conditions exist:
– The HIC indicator indicates a change in color for
10% and 5%, as stated on the HIC.
– The LEDs are exposed to conditions of > 30°C/60%
RH at any time.
– The LED's floor life exceeded 168 hours.
Thermal Management
The recommended baking condition is: 60°C ± 5ºC for
20 hours.
The optical, electrical, and reliability characteristics of the
LED are affected by temperature. Keep the junction
Baking can only be done once.
temperature (T ) of the LED below the allowable limit at all
Storage:
J
times. T can be calculated as follows:
J
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed in an ambient
environment for too long, the silver plating might be
oxidized, thus affecting its solderability performance.
Therefore, keep unused LEDs in a sealed MBB with
desiccant or in a desiccator at < 5% RH.
T = T + R
× I × V
F Fmax
J
A
θJ-A
where;
T = Ambient temperature (°C)
A
R
= Thermal resistance from LED junction to
θJ-A
ambient (°C/W)
Application Precautions
I = Forward current (A)
F
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
V
= Maximum forward voltage (V)
Fmax
The complication of using this formula lies in T and R
.
A
θJ-A
recommended to ensure consistent performance.
Actual T is sometimes subjective and hard to determine.
A
Circuit design must cater to the whole range of forward
R
varies from system to system depending on design
θJ-A
voltage (V ) of the LEDs to ensure the intended drive
F
and is usually not known.
current can always be achieved.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (meaning: intensity,
wavelength, and forward voltage). Set the application
current as close as possible to the test current to
minimize these variations.
Broadcom
AEMD-LX3K-DS101
10
AEMD-LG3K, AEMD-LL3K Data Sheet
High Brightness Red and Amber SMT Oval Lamps
Another way of calculating T is by using the solder point
J
Eye Safety Precautions
temperature, T as follows:
S
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
T = T + R
× I × V
F Fmax
J
S
θJ-S
where;
T = LED solder point temperature as shown in the
S
following figure (°C)
R
= Thermal resistance from junction to solder point
θJ-S
(°C/W)
I = Forward current (A)
F
V
= Maximum forward voltage (V)
Fmax
Figure 15: Solder Point Temperature on PCB
T can be easily measured by mounting a thermocouple on
S
the soldering joint as shown in preceding figure, while R
θJ-S
is provided in the data sheet. Verify the T of the LED in the
S
final product to ensure that the LEDs are operating within all
maximum ratings stated in the data sheet.
Broadcom
AEMD-LX3K-DS101
11
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