ACMD-7605 [BOARDCOM]
Miniature UMTS Band 8 Duplexer;
| 型号： | ACMD-7605 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | Miniature UMTS Band 8 Duplexer |
| 文件： | 总13页 (文件大小：1185K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACMD-7605
Miniature UMTS Band 8 Duplexer
Data Sheet
Description
Features
The Avago Technologies’ ACMD-7605 is a miniature
duplexer designed for use in UMTS Band 8 (880 – 915
MHz UL, 925 – 960 MHz DL) handsets and mobile data
terminals.
•ꢀ Miniature Size
– 3.0 x 3.0 mm Max footprint
– 1.2 mm Max height
•ꢀ High Power Rating
– 33 dBm Abs Max Tx Power
The ACMD-7605 enhances the sensitivity and dynamic
range of handset receivers by providing more than 51 dB
attenuation of the transmitted signal at the receiver input
and more than 48 dB rejection of transmit-generated
noise in the receive band.
•ꢀ RoHS Compliant
Specifications
•ꢀ Rx Band Performance, 925-960 MHz, – 30 to +85°C
– Insertion Loss: 4.0 dB max
Maximum Insertion Loss in the Tx channel is only 3.5 dB,
which minimizes current drain from the power amplifier.
Insertion Loss in the Rx channel is a maximum of 4.0 dB,
thus improving receiver sensitivity.
– Rx Noise Blocking: 48 dB min
•ꢀ Tx Band Performance, 880-915 MHz, – 30 to +85°C
– Insertion Loss: 3.5 dB max
– Tx Interferer Blocking: 51 dB min
The ACMD-7605 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction of
their usual size. The excellent power handling capability of
the FBAR bulk-mode resonators supports the high output
power levels needed in handsets while adding virtually no
distortion.
Applications
Handsets or data terminals operating in UMTS Band 8
frequency range.
The ACMD-7605 also utilizes Avago Technologies’ innova-
tive Microcap bonded-wafer, chip scale packaging tech-
nology. This process allows the filters to be assembled in
a molded chip-on-board module that is less than 1.2 mm
high with a maximum footprint of only 3.0 mm x 3.0 mm.
Functional Block Diagram
Ant
Port 3
Tx
Rx
Port 1
Port 2
[2] [3]
[1]
ACMD-7605 Electrical Specifications
, Z =50 Ω, T as indicated
0 C
– 30°C
+25°C
Min
+85°C
Min
Symbol
Parameter
Units Min
Typ
Max
Typ
Max
Typ
Max
Antenna Port to Receive Port
S23
S22
S23
Insertion Loss in Receive Band
(925 – 960 MHz)
dB
4.0
1.4
17.3
57
4.0
4.0
Return Loss (SWR) of Receive Port in
Receive Band
dB
dB
8.5
48
(2.2)
8.5
48
(2.2)
8.5
48
(2.2)
Attenuation in Transmit Band
(880 – 915 MHz)
S23
S23
S23
S23
Attenuation, 0 – 835 MHz
Attenuation, 835 – 870 MHz
Attenuation, 1805 – 1875 MHz
dB
dB
dB
dB
20
30
30
30
20
30
30
30
30
48
34
51
20
30
30
30
Attenuation in Bluetooth Band
(2400 – 2500 MHz)
Transmit Port to Antenna Port
S31
S11
S31
Insertion Loss in Transmit Band
(880 – 915 MHz)
dB
dB
dB
3.5
1.3
13.8
59
3.0
3.5
Return Loss (SWR) of Transmit Port
in Transmit Band
8.5
45
(2.2)
8.5
45
(2.2)
8.5
45
(2.2)
Attenuation in Receive Band
(925 – 960 MHz)
S31
S31
Attenuation 0 – 820 MHz
dB
dB
27
22
27
22
38
31
27
22
Attenuation in GPS Band
(1574.42 – 1576.42 MHz)
S31
S31
Attenuation in Transmit 2nd
Harmonic Band
(1760 – 1830 MHz)
dB
dB
20
20
20
20
30
28
20
20
Attenuation in Bluetooth Band
(2400 – 2500 MHz)
Antenna Port
S33
S33
Return Loss (SWR) of Antenna Port
in Receive Band
(925 – 960 MHz)
dB
dB
8.5
7.5
(2.2)
(2.5)
8.5
7.5
17.1
13.6
(2.2)
(2.5)
8.5
7.5
(2.2)
(2.5)
Return Loss (SWR) of Antenna Port
in Transmit Band
(880 – 915 MHz)
Isolation Transmit Port to Receive Port
S21
Tx-Rx Isolation in Receive Band
(925 – 960 MHz)
dB
dB
48
51
48
51
57
59
48
51
S21
Tx-Rx Isolation in Transmit Band
(880 – 915 MHz)
Notes:
1.
T is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
C
2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx
frequencies unless otherwise noted.
3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time.
2
ACMD-7605
Absolute Maximum Ratings
[1]
Parameter
Unit
°C
Value
Storage temperature
–65 to +125
+33
Maximum RF Input Power to Tx Port
dBm
[2]
Maximum Recommended Operating Conditions
Parameter
Unit
°C
Value
Operating temperature, Tc [3], Tx Power ≤ 29 dBm
–40 to +100
–40 to +85
Operating temperature, Tc [3], Tx Power ≤ 30 dBm
°C
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. The device will function over the recommended range without degradation in reliability or permanent
change in performance, but is not guaranteed to meet electrical specifications.
3.
T is defined as case temperature, the temperature of the underside of the duplexer where it makes contact
C
with the circuit board.
3
ACMD-7605 Typical Performance at T = 25°C
c
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
880
885
890
895
900
905
910
915
925
930
935
940
945
950
955
960
Frequency (MHz)
Frequency (MHz)
Figure 1. Tx–Ant Insertion Loss.
Figure2. Ant–Rx Insertion Loss.
0
-5
0
-10
-20
-30
-40
-50
-60
-10
-15
-20
-25
-70
850
900
950
1000
850
900
950
1000
Frequency (MHz)
Frequency (MHz)
Figure 3. Tx and Rx Port Return Loss.
Figure 4. Tx Rejection in Rx Band and Rx Rejection in Tx Band.
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
0
-5
-10
-15
-20
-25
850
900
950
1000
850
900
950
1000
Frequency (MHz)
Frequency (MHz)
Figure 5. Tx–Rx Isolation.
Figure 6. Antenna Port Return Loss.
4
ACMD-7605 Typical Performance at T = 25°C
c
-20
-22
-24
-26
-28
-30
-32
-34
-36
-38
0
-10
-20
-30
-40
-50
-60
-40
1760 1770 1780 1790 1800 1810 1820
Frequency (MHz)
1
2
3
4
5
Frequency (GHz)
Figure 7. Tx–Ant Rejection at Tx Second Harmonic.
Figure 8. Tx–Ant and Ant–Rx Wideband Insertion Loss.
0
-10
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
-50
-60
0.2
0.4
0.6
0.8
0.2
0.4
0.6
0.8
Frequency (GHz)
Frequency (GHz)
Figure 9. Tx–Ant Low Frequency Rejection.
Figure 10. Ant–Rx Low Frequency Rejection.
-30
-35
-40
-45
-50
-55
-60
-20
-22
-24
-26
-28
-30
-32
-34
-36
-38
-40
2.42
2.44
2.46
2.48
2.42
2.44
2.46
2.48
Frequency (GHz)
Frequency (GHz)
Figure 11. Tx Rejection in Bluetooth Band
Figure 12. Rx Rejection in Bluetooth Band
5
1
1
0.8
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
4
5
5
10
20
50
10
20
50
0.2
0.4 0.6 0.8 1
1.5 2 3 4 5 102050
0.2
0.4 0.6 0.8 1
1.5 2 3 4 5 102050
-50
-50
-20
-10
-20
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1
-1
Figure 13. Tx Port Impedance in Tx Band.
Figure 14. Rx Port Impedance in Rx Band.
1
1
0.8
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
4
5
5
10
10
20
20
50
50
0.2
0.4 0.6 0.8 1
1.5 2 3 4 5 102050
0.2
0.4 0.6 0.8 1
1.5 2 3 4 5 102050
-50
-50
-20
-20
-10
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1
-1
Figure 15. Ant Port Impedance in Tx Band.
Figure 16. Ant Port Impedance in Rx Band.
6
2.80
3.0
1.40
MAX
1.2
MAX
0.90
0.75
0.55
ANT
PRODUCT
MARKING
3.0
MAX
Ø 0.25
(SIGNAL VIA)
0.35
0.35
TX
RX
PACKAGE
ORIENTATION
2.45
BOTTOM VIEW
TOP VIEW
SIDE VIEW
0.16
Notes:
1. Dimensions in millimeters
Tolerance: X.X 0.1 mm
X.XX 0.05 mm
0.16
0.20
2. Dimensions nominal unless otherwise noted
3. I/O Pads (3 ea)
0.05
Size: 0.35 X 0.35 mm, chamfer: 0.05 X 0.05 mm
Spacing to ground metal: 0.20 mm
0.20
4. Signal via (1 ea) is covered with solder mask and shown for reference
only. PCB metal under signal via does not need to be voided.
5. Contact areas are gold plated.
0.05
DETAIL OF IO PAD AREA
Figure 17. Package Outline Drawing.
PACKAGE
ORIENTATION
S
= ACMD-7605
= Avago ID
= Year
RX
TX
FB
Y
WW = Work Week
DC = Date Code
NNNN = Lot Number
ANT
Figure 18. Product Marking.
7
0.25
0.30
Ant
Ø 0.30 VIA ARRAY
HORIZ PITCH = 0.40
VERT PITCH = 0.40
0.25
0.35
0.30
G
2.28
Notes:
1. Dimensions in mm
2. Transmission line Gap (G) adjusted for Zo =
50 ohms
3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer
0.03
4. Ground vias positioned to maximize port-
to-port isolation
Tx
Rx
G
5. Tx connection on optionally placed in
buried metal layer
0.35
Figure 19. PCB Layout (top view).
2.10
A PCB layout using the principles illustrated in Figure
15 is recommended to optimize performance of the
ACMD-7605.
Dependingontraceroutingbeyondtheimmediatevicinity
of the duplexer, it may be advisable to place the Rx (Tx)
trace in a different metal layer than the Rx (Tx). Having the
Tx and Rx traces in different layers helps prevent leakage
of the Tx signal into other components that could result
in the creation of intermodulation products and degrada-
tion of overall system performance.
It is important to maximize isolation between the Tx con-
nection to the duplexer and the Rx port. High isolation is
achieved by: (1) maintaining a continuous ground plane
around the duplexer mounting area, and (2) surrounding
the I/O ports with sufficient ground vias to enclose the A sufficient number of vias should be used to ensure
connections in a “Faraday cage.”
excellent RF grounding as well as good heat sinking for
the device.
Note: It is not necessary to void the PCB ground plane under the metal
void shown in Fig 13.
8
Figure 20. ACMD-7605 Superposed on PCB Layout (top view).
> 0.30
TYP
0.45
0.45
2.90
0.25
0.25
2.90
> 0.30
TYP
Notes:
Dimensions in mm
Figure 21. Recommended Solder Mask.
Figure 22. Solder Mask Superposed on ACMD-7605.
9
STENCIL
BOUNDARY
0.20
0.10
0.10
Notes:
1. Chamfer or radius all corners 0.05 mm
min
2. Stencil openings aligned to Boundary
rectangle or center lines
3. Non-I/O pad stencil openings aligned
to 0.52 x 0.55 grid (i.e., spacing between
openings: 0.2 vertical, 0.5 horizontal)
2.80
2.80
Stencil Opening ID
A (I/O pad areas)
All other openings
Qty
3
Width (mm)
0.35
Length (mm)
0.35
9
0.50
0.50
Figure 23. Recommended Solder Stencil.
Figure 24. Solder Stencil Overlaid on ACMD-7605 Bottom Metal Pattern.
10
Figure 25. SMD Tape Packing.
SPROCKET HOLES
PACKAGE PIN 1
ORIENTATION
TAPE
WIDTH
POCKET
CAVITY
Figure 26. Unit Orientation in Tape.
11
FRONT VIEW
NOTES:
1. Reel shall be labeled with the following
information (as a minimum).
a. manufacturers name or symbol
b. Avago Technologies part number
c. purchase order number
d. date code
e. quantity of units
2. A certificate of compliance (c of c) shall
be issued and accompany each shipment
of product.
1.5 min.
3. Reel must not be made with or contain
ozone depleting materials.
4. All dimensions in millimeters (mm)
13.0 0.2
21.0 0.8
Figure 27. Reel Drawing, Front View.
BACK VIEW
Shading indicates
thru slots
18.4 max.
+0.4
178
-0.2
50 min.
25
min wide (ref)
Slot for carrier tape
insertion for attachment
to reel hub (2 places 180° apart)
+2.0
12.4
-0.0
Figure 28. Reel Drawing, Back View.
12
Package Moisture Sensitivity
Feature
Test Method
Performance
Moisture Sensitivity Level (MSL) at 260°C
JESD22-A113D
Level 3
300
250
200
150
100
50
Tested profile shown.
0
0
50
100
150
200
250
300
PROFILE.GRF
PROFILE. WMF
6 February 2003
R. Waugh
Time, seconds
Figure 29. Verified SMT Solder Profile.
Ordering Information
Part Number
No. of Devices
Container
ACMD-7605-BLK
ACMD-7605-TR1
25
Anti-static Bag
7-inch Reel
1000
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1743EN - January 12, 2009
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