BCG13D [BEREX]
5-4000 MHz Cascadeable InGaP HBT Gain Block; 5-4000兆赫可级联的InGaP HBT增益模块![BCG13D](http://pdffile.icpdf.com/pdf1/p00170/img/icpdf/BCG13_952316_icpdf.jpg)
型号: | BCG13D |
厂家: | ![]() |
描述: | 5-4000 MHz Cascadeable InGaP HBT Gain Block |
文件: | 总6页 (文件大小:279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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BeRex
BCG13D
5-4000 MHz Cascadeable InGaP HBT Gain Block
Device Features
• 33 dBm Output IP3 at 5dBm/tone
• 24.9 dB Gain at 900 MHz
• 18 dBm P1dB
• Highly Reliable InGaP/GaAs HBT Technology
• 50 ohm Cascadeable
• Application: commercial wireless system
Target Device Performance (Ta = 25°C)
Symbols
Test Conditions
Min
Typ
Max
Unit
Frequency Range
5
4000
25.9
24.0
22.6
MHz
900 MHz
23.9
22.0
20.6
24.9
23.0
21.6
-11.7
-10.4
-11.9
-7.6
-13.4
-12.0
33.0
32.7
31.5
18.3
18.2
17.4
69
Gain
S11
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
Vc = 5.0V
dB
dB
S22
dB
31.0
30.7
29.5
17.3
17.2
16.4
59
OIP3
P1dB
dBm
dBm
Ic
Vc
79
mA
V
5.0
dG/dT
Rth
-0.007
85
dB/°C
°C/W
Thermal Resistance
Test conditions unless otherwise noted.
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. OIP3 measured with two tones at an output power of 5 dBm/tone separated by 1 MHz.
Absolute Maximum Ratings
Parameter
Rating
Operating Case temperature
-40 to +85°C
-40 to +155°C
+5.5V
Storage Temperature
Operating Voltage
Supply Current
150 mA
Input RF Power
23dBm
Operation of this device above any of these parameters may result in permanent damage.
http: //www.berex.com
BeRex
BCG13D
S-parameter test circuit
Chip attachment on PF083
Generic PF083 Evaluation Board
(31mil thick FR4)
I-V characteristics
Application Circuit: 5-4000 MHz
Typical Performance (Vc = 5V, Ic = 69mA, T = 25°C)
Freq
MHz
900
1900
2450
S21
S11
S22
P1
dB
dB
dB
dBm
dBm
24.9
-11.7
-7.6
19.0
32.0
23.0
-10.4
-13.4
19.0
32.0
22.5
-11.9
-12.0
19.0
31.0
OIP3
http: //www.berex.com
BeRex
BCG13D
Schematic Diagram
BOM
100pF
Tolerance
C1
C2
C3
C4
C5
L1*
±5%
100pF
100pF
1000pF
10uF
±5%
±5%
±5%
±20%
5%
39nH
*Note:
1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at both input and
output.
2. Less than 20nH improves RF performance at frequencies over 1.9GHz.
3. 40nH or higher value L1 improves RF performance at frequencies under 500MHz.
4. Optimum value of L1 may vary with board design.
Typical Device Data
S-parameters (Vc=5V, Ic=65mA, T=25°C)
http: //www.berex.com
BeRex
BCG13D
Device Performance
P1dB-Gain
P1
Gain
OIP3
http: //www.berex.com
BeRex
BCG13D
ACPR
S-Parameter
(Vdevice = 5.0V, Icc = 69mA, T = 25 °C, calibrated to device leads)
Freq
S11
S11
S21
S21
S12
S12
S22
S22
[MHz]
[dB]
[Ang]
[dB]
[Ang]
[dB]
[Ang]
[dB]
[Ang]
100
500
-4.678
-11.610
-12.057
-13.053
-9.849
-25.54
-16.90
-12.98
16.38
17.27
-27.86
25.672
25.427
24.828
23.968
22.767
21.639
20.413
19.346
18.256
176.84
159.35
141.93
124.40
109.52
96.24
-35.909
-30.250
-29.445
77.16
-25.07
50.31
-1.418
-6.267
-8.236
173.59
29.56
1000
1500
2000
2500
3000
3500
4000
-7.08
-30.025 -114.05 -12.494
-29.185 -159.59 -12.806
-26.17
-17.49
-64.24
-130.88
-170.03
-12.146
-28.649
-29.741
-28.948
-24.947
158.92
116.90
77.73
-11.873
-9.756
-8.579
-13.490 -123.12
-9.805 -167.89
-11.035 -160.29
84.08
73.06
63.61
32.85
-14.089 -165.34
* Note : S-parameter includes 1 mil thick and 16-mil long Au wire
http: //www.berex.com
BeRex
BCG13D
Die Outline
NOTES:
1) DIE THICKNESS 100um
2) BONDPAD METAL
THICKNESS 2.8um
3) BACKSIDE METAL Au, 5um
4) DEVICE IS GROUNDED
THROUGH VIA HOLES
ESD Rating
ESD Rating:
Value:
Class 1C
Passes <2000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114B
NATO CAGE code:
2
N
9
6
F
NOTICE
BeRex Corporation reserves the right to make changes of product specification or to
discontinue product at any time without notice.
http: //www.berex.com
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