HLMP-RL10-LMLDD [AVAGO]
SINGLE COLOR LED, AMBER, 4mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-RL10-LMLDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, AMBER, 4mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 光电 |
| 文件： | 总11页 (文件大小：618K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-RD11/SD11/RG10/SG10/RL10/SL10
4 mm Super Oval Precision Optical Performance
AlInGaP LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifi- • Well defined spatial radiation pattern
cally designed for Full Color/Video and Passenger Informa-
tion signs. The oval shaped radiation pattern (60° x 120°)
• Viewing angle:
major axis 120°
and high luminous intensity ensure that these devices
minor axis 60°
are excellent for wide field of view outdoor applications
• High luminous output
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched • Two red and amber intensity levels:
radiation patterns ensuring consistent color mixing in full
color applications, message uniformity across the viewing
angle of the sign.
AlInGaP (bright) and AlInGaP II (brightest)
• Colors:
626/630 nm red
590/592 nm amber
High efficiency LED materials are used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for Red
and Amber color. There are two families of red and amber
lamps, AlInGaP and the higher performance AlInGaP II.
Each lamp is made with an advanced optical grade epoxy
offering superior high temperature and high moisture
resistance in outdoor applications. The package epoxy
contains both uv-a and uv-b inhibitors to reduce the
effects of long term exposure to direct sunlight.
• Superior resistance to moisture
• UV resistant epoxy
Applications
• Full color signs
Benefits
• Viewing angle designed for wide field of view
Designers can select parallel (where the axis of the leads
is parallel to the wide axis of the oval radiation pattern)
or perpendicular orientation. Both lamps are available in
tinted version.
applications
• Superior performance for outdoor environments
Package Dimensions
ꢀ1.0
(0.ꢁꢀ78
MIN.
9.50 0.50
(0.374 0.0078
1.0
(0.0398
MIN.
A
6.30 0.ꢀ0
(0.ꢀ4ꢁ 0.00ꢁ8
CATHODE
LEAD
0.44 0.ꢀ0
(0.017 0.00ꢁ8
1.ꢀ5 0.ꢀ0
(0.049 0.00ꢁ8
4.0 0.ꢀ0
(0.157 0.00ꢁ8
∅
ꢀ.54 0.30
(0.100 0.01ꢀ8
0.ꢁ0
(0.0168
+0.10
0.40
+0.10
–0.04
MAX. EPOXY MENISCUS
0.45
–0
+0.004
+0.004
(0.016
(0.01ꢁ
–0.0008
–0.00ꢀ8
ꢀ1.0
MIN.
(0.ꢁꢀ78
9.50 0.50
(0.374 0.0078
1.0
(0.0398
MIN.
B
6.30 0.ꢀ0
(0.ꢀ4ꢁ 0.00ꢁ8
CATHODE
LEAD
0.44 0.ꢀ0
(0.017 0.00ꢁ8
1.ꢀ5 0.ꢀ0
(0.049 0.00ꢁ8
4.0 0.ꢀ0
(0.157 0.00ꢁ8
∅
ꢀ.54 0.30
(0.100 0.01ꢀ8
0.ꢁ0
(0.0168
+0.10
0.40
+0.10
–0.04
MAX. EPOXY MENISCUS
0.45
–0
+0.004
+0.004
(0.016
(0.01ꢁ
–0.0008
–0.00ꢀ8
Dimensions are in millimeters (inches).
2
Device Selection Guide for AlInGaP
Color and
Dominant
Wavelength
λd (nm) Typ.
Red 626
Luminous Intensity
Iv (mcd) at 20 mA
Leads with
Stand-Off
Leadframe
Orientation
Package
Drawing
Part Number
Min.
240
240
180
400
400
400
400
400
520
520
520
520
400
400
520
520
Max.
HLMP-SG10-JM0xx
HLMP-RG10-JM000
HLMP-SL10-HL0DD
HLMP-SL10-LM0DD
HLMP-SL10-LMKDD
HLMP-SL10-LMLDD
HLMP-SL10-LP0xx
HLMP-SL10-LPKDD
HLMP-SL10-MNKxx
HLMP-SL10-MP0DD
HLMP-SL10-MQ0DD
HLMP-SL10-MQLDD
HLMP-RL10-LMLDD
HLMP-RL10-LP0xx
HLMP-RL10-MP0DD
HLMP-RL10-MQLDD
680
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Perpendicular
Parallel
A
B
A
A
A
A
A
A
A
A
A
A
B
B
B
B
Red 626
680
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
520
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Parallel
680
680
680
1150
1150
880
1150
1500
1500
680
1150
1150
1500
Parallel
Parallel
Parallel
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
Device Selection Guide for AlInGaP II
Color and
Dominant
Wavelength
Luminous Intensity
I (mcd) at 20 mA
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
V
Part Number
λ (nm) Typ.
Min.
240
40
Max.
d
HLMP-RD11-J0000
HLMP-RD11-LP0xx
HLMP-RD11-LPTxx
HLMP-SD11-J0000
HLMP-SD11-LP000
HLMP-SD11-LPTxx
HLMP-SD11-MN0xx
Red 630
Red 630
Red 630
Red 630
Red 630
Red 630
Red 630
Red 630
-
Yes
Parallel B
1150
1150
-
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Parallel
B
B
A
A
A
A
A
400
240
400
400
520
520
Parallel
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
1150
1150
880
880
HLMP-SD11-MNTxx
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & V Selections
F
0: No Color Bin Limitation
T: Red Color with V Maximum of 2.6 V
F
K: Amber Color Bins 2 and 4
L: Amber Color BIns 4 and 6
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D: 630 nm Red
G: 626 nm Red
L: 590 nm Amber
Package
R: 4 mm 60° x 120°Oval, Parallel
S: 4 mm 60° x 120°Oval, Perpendicular
Absolute Maximum Ratings
T = 25°C
A
Parameter
DC Forward Current1
Amber and Red
50 mA
Peak Pulsed Forward Current
Average Forward Current
Reverse Voltage (IR = 100 µA)
Power Dissipation
100 mA
30 mA
5 V
120 mW
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130°C
–40°C to +100°C
–40°C to +100°C
Note:
1. Derate linearly as shown in Figures 4.
4
Electrical/Optical Characteristics
T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Typical Viewing Angle[1]
2θ
½
deg
Major
Minor
120
60
Forward Voltage
VF
V
IF = 20 mA
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
1.9
2.0
2.02
2.4
2.4[2]
2.4
Reverse Voltage
Amber and Red
VR
V
IR = 100 µA
5
20
Peak Wavelength
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
λPEAK
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
635
639
592
Spectral Halfwidth
Red (λd = 626/630 nm)
Amber (λd = 590 nm)
Δλ
nm
Wavelength Width at
Spectral Distribution
½ Power Point at IF = 20 mA
½
17
17
Capacitance
All Colors
C
pF
VF = 0, F = 1 MHz
40
Thermal Resistance
All Colors
RθJ-PIN
°C/W
lm/W
LED Junction-to-Cathode
Lead
240
Luminous Efficacy[3]
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
ηv
Emitted Luminous Power/
Emitted Radiant Power
150
155
480
Notes:
1. 2θ is the off-axis angle where the luminous intensity is the on-axis intensity.
½
2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, V , is 2.6 V. Please refer to V Bin Table below.
F
F
3. The radiant intensity, I , in watts per steradian, may be found from the equation I = I /η , where I is the luminous intensity in candelas and η is
e
e
v
v
v
v
the luminous efficacy in lumens/watt.
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
40
30
20
10
0
AMBER
RED
RED
AMBER
2.5
500
550
600
WAVELENGTH - nm
650
700
1.0
1.5
2.0
3.0
VF – FORWARD VOLTAGE – V
Figure 1. Relative intensity vs. wavelength.
Figure 2. Amber, Red forward current vs. forward voltage.
2.5
2.0
1.5
1.0
0.5
0
60
50
40
Rθj-a = 585° C/W
30
Rθj-a = 780° C/W
20
10
0
0
20
40
60
80
100
120
0
10
20
30
40
50
TA – AMBIENT TEMPERATURE – °C
IF – FORWARD CURRENT – mA
Figure 4. Amber, Red maximum forward current vs. ambient temperature.
Figure 3. Amber, Red relative luminous intensity vs. forward current.
1.0
0.8
0.6
0.4
0.2
0
1.0
0.8
0.6
0.4
0.2
0
-90
-90 -75 -60 -45 -30 -15
0
15 30 45 60 75 90
-75 -60 -45 -30 -15
0
15 30 45 60 75 90
ANGULAR DISPLACEMENT – DEGREES
ANGULAR DISPLACEMENT – DEGREES
Figure 5a. Representative spatial radiation pattern for major axis.
Figure 5b. Representative spatial radiation pattern for minor axis.
6
Intensity Bin Limits
Color Bin Limits
(mcd at 20 mA)
(nm at 20 mA)
Bin Name
Min.
180
240
310
400
520
680
880
Max.
240
310
400
520
680
880
1150
Amber
Colour Range (nm)
Min.
H
J
Bin ID
Max.
1
2
4
6
584.5
587.0
589.5
592.0
594.5
K
L
587.0
589.5
M
N
P
592.0
Tolerance for each bin limit is 0.5 nm.
Note:
Tolerance for each bin limit is 15ꢀ.
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representatives for further information.
2
VF Bin Table
Bin Name
Min.
2.0
2.2
2.4
Max.
2.2
VA
VB
2.4
VC
2.6
Tolerance for each bin is 0.05 V.
Note:
1. Bin categories are established for classification of products. Products
may not be available in all bin categories.
2. VF binning is applicable for part numbers with option -xxTxx.
7
Note:
Precautions:
Lead Forming:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
CATHODE
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
• Recommended PC board plated through holes (PTH)
Pre-heat temperature
Preheat time
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
-
size for LED component leads.
-
LED component
lead size
Plated through
hole diameter
Peak temperature
Dwell time
260 °C Max.
5 sec Max
Diagonal
0.45 x 0.45 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.636 mm
0.98 to 1.08 mm
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
8
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
6.35± ±.3ꢀ
±2.7ꢀ± ±.ꢀꢀ
ꢀ.5ꢀ± ꢀ.ꢀ39ꢁ
ꢀ.25± ꢀ.ꢀ5±2
CATHODE
2ꢀ.5± ±.ꢀꢀ
ꢀ.8ꢀ7±± ꢀ.ꢀ39ꢁ
9.±25± ꢀ.625
ꢀ.3593± ꢀ.ꢀ25
±8.ꢀꢀ± ꢀ.5ꢀ
ꢀ.7ꢀ87± ꢀ.ꢀ±97
±2.7ꢀ± ꢀ.3ꢀ
ꢀ.5ꢀ± ꢀ.ꢀ±±8
ꢁ.ꢀꢀ± ꢀ.2ꢀ
TYP.
Ø
ꢀ.±575± ꢀ.ꢀꢀ79
VIEW A - A
ꢀ.7ꢀ± ꢀ.2ꢀ
ꢀ.276± ꢀ.ꢀꢀ79
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
9
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
10
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4174EN
AV02-1544EN - February 20, 2009
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