HLMP-RD11-LNTDD [AVAGO]
Single Color LED, Red, Tinted, 4mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-RD11-LNTDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Single Color LED, Red, Tinted, 4mm, PLASTIC PACKAGE-2 |
| 文件： | 总11页 (文件大小：541K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-RD11/SD11/RG10/SG10/RL10/SL10
4 mm Super Oval Precision Optical Performance
AlInGaP LEDs
Data Sheet
Description
Features
TheseꢀPrecisionꢀOpticalꢀPerformanceꢀOvalꢀLEDsꢀareꢀspecifi- •ꢀ Wellꢀdefinedꢀspatialꢀradiationꢀpattern
callyꢀdesignedꢀforꢀFullꢀColor/VideoꢀandꢀPassengerꢀInforma-
•ꢀ Viewingꢀangle:ꢀ
majorꢀaxisꢀ120°ꢀ
minorꢀaxisꢀ60°
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
tionꢀsigns.ꢀTheꢀovalꢀshapedꢀradiationꢀpatternꢀ(60°ꢀxꢀ120°)ꢀ
andꢀ highꢀ luminousꢀ intensityꢀ ensureꢀ thatꢀ theseꢀ devicesꢀ
areꢀexcellentꢀforꢀwideꢀfieldꢀofꢀviewꢀoutdoorꢀapplicationsꢀ
whereꢀaꢀwideꢀviewingꢀangleꢀandꢀreadabilityꢀinꢀsunlightꢀ
•ꢀ Highꢀluminousꢀoutput
areꢀ essential.ꢀ Theseꢀ lampsꢀ haveꢀ veryꢀ smooth,ꢀ matchedꢀ •ꢀ Twoꢀredꢀandꢀamberꢀintensityꢀlevels:ꢀ
ꢀ
radiationꢀpatternsꢀensuringꢀconsistentꢀcolorꢀmixingꢀinꢀfullꢀ
colorꢀapplications,ꢀmessageꢀuniformityꢀacrossꢀtheꢀviewingꢀ
angleꢀofꢀtheꢀsign.
AlInGaPꢀ(bright)ꢀandꢀAlInGaPꢀIIꢀ(brightest)
•ꢀ Colors:ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
626/630ꢀnmꢀredꢀ
590/592ꢀnmꢀamber
Highꢀ efficiencyꢀ LEDꢀ materialsꢀ areꢀ usedꢀ inꢀ theseꢀ lamps:ꢀ
AluminumꢀIndiumꢀGalliumꢀPhosphideꢀ(AlInGaP)ꢀforꢀRedꢀ
andꢀAmberꢀcolor.ꢀThereꢀareꢀtwoꢀfamiliesꢀofꢀredꢀandꢀamberꢀ
lamps,ꢀ AlInGaPꢀ andꢀ theꢀ higherꢀ performanceꢀ AlInGaPꢀ II.ꢀ
Eachꢀlampꢀisꢀmadeꢀwithꢀanꢀadvancedꢀopticalꢀgradeꢀepoxyꢀ
offeringꢀ superiorꢀ highꢀ temperatureꢀ andꢀ highꢀ moistureꢀ
resistanceꢀ inꢀ outdoorꢀ applications.ꢀ Theꢀ packageꢀ epoxyꢀ
containsꢀ bothꢀ uv-aꢀ andꢀ uv-bꢀ inhibitorsꢀ toꢀ reduceꢀ theꢀ
effectsꢀofꢀlongꢀtermꢀexposureꢀtoꢀdirectꢀsunlight.
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture
•ꢀ UVꢀresistantꢀepoxy
Applications
•ꢀ Fullꢀcolorꢀsigns
Benefits
•ꢀ Viewingꢀ angleꢀ designedꢀ forꢀ wideꢀ fieldꢀ ofꢀ viewꢀ
Designersꢀcanꢀselectꢀparallelꢀ(whereꢀtheꢀaxisꢀofꢀtheꢀleadsꢀ
isꢀparallelꢀtoꢀtheꢀwideꢀaxisꢀofꢀtheꢀovalꢀradiationꢀpattern)ꢀ
orꢀperpendicularꢀorientation.ꢀBothꢀlampsꢀareꢀavailableꢀinꢀ
tintedꢀversion.
applications
•ꢀ Superiorꢀperformanceꢀforꢀoutdoorꢀenvironments
Package Dimensions
ꢀ1.0
(0.ꢁꢀ78
MIN.
9.50 0.50
(0.374 0.0078
1.0
(0.0398
MIN.
A
6.30 0.ꢀ0
(0.ꢀ4ꢁ 0.00ꢁ8
CATHODE
LEAD
0.44 0.ꢀ0
(0.017 0.00ꢁ8
1.ꢀ5 0.ꢀ0
(0.049 0.00ꢁ8
4.0 0.ꢀ0
(0.157 0.00ꢁ8
∅
ꢀ.54 0.30
(0.100 0.01ꢀ8
0.ꢁ0
(0.0168
+0.10
0.40
+0.10
–0.04
MAX. EPOXY MENISCUS
0.45
–0
+0.004
+0.004
(0.016
(0.01ꢁ
–0.0008
–0.00ꢀ8
ꢀ1.0
MIN.
(0.ꢁꢀ78
9.50 0.50
(0.374 0.0078
1.0
(0.0398
MIN.
B
6.30 0.ꢀ0
(0.ꢀ4ꢁ 0.00ꢁ8
CATHODE
LEAD
0.44 0.ꢀ0
(0.017 0.00ꢁ8
1.ꢀ5 0.ꢀ0
(0.049 0.00ꢁ8
4.0 0.ꢀ0
(0.157 0.00ꢁ8
∅
ꢀ.54 0.30
(0.100 0.01ꢀ8
0.ꢁ0
(0.0168
+0.10
0.40
+0.10
–0.04
MAX. EPOXY MENISCUS
0.45
–0
+0.004
+0.004
(0.016
(0.01ꢁ
–0.0008
–0.00ꢀ8
Dimensions are in millimeters (inches).
2
Device Selection Guide for AlInGaP
Color and
Dominant
Wavelength
λd (nm) Typ.
Redꢀ626
Luminous Intensity
Iv (mcd) at 20 mA
Leads with
Stand-Off
Leadframe
Orientation
Package
Drawing
Part Number
Min.
240
240
180
400
400
400
400
400
520
520
520
520
400
400
520
520
Max.
HLMP-SG10-JM0xx
HLMP-RG10-JM000
HLMP-SL10-HL0DD
HLMP-SL10-LM0DD
HLMP-SL10-LMKDD
HLMP-SL10-LMLDD
HLMP-SL10-LP0xx
HLMP-SL10-LPKDD
HLMP-SL10-MNKxx
HLMP-SL10-MP0DD
HLMP-SL10-MQ0DD
HLMP-SL10-MQLDD
HLMP-RL10-LMLDD
HLMP-RL10-LP0xx
HLMP-RL10-MP0DD
HLMP-RL10-MQLDD
680
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Perpendicular
Parallel
A
B
A
A
A
A
A
A
A
A
A
A
B
B
B
B
Redꢀ626
680
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
520
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Parallel
680
680
680
1150
1150
880
1150
1500
1500
680
1150
1150
1500
Parallel
Parallel
Parallel
Notes:
1.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
2.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
3.ꢀꢀ Theꢀdominantꢀwavelength,ꢀλ ,ꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
Device Selection Guide for AlInGaP II
Color and
Dominant
Wavelength
Luminous Intensity
I (mcd) at 20 mA
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
V
Part Number
λ (nm) Typ.
d
Min.
Max.
HLMP-RD11-J0000ꢀ
HLMP-RD11-LP0xxꢀ
HLMP-RD11-LPTxxꢀ
HLMP-SD11-J0000ꢀ
HLMP-SD11-LP000ꢀ
HLMP-SD11-LPTxxꢀ
HLMP-SD11-MN0xxꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
Redꢀ630ꢀ
240ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ -ꢀ
ꢀ
Yesꢀ
Parallelꢀ B
40ꢀ
1150ꢀ
Yesꢀ
Yesꢀ
Yesꢀ
Yesꢀ
Yesꢀ
Yesꢀ
Yesꢀ
Parallelꢀ
B
B
A
A
A
A
A
400ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1150ꢀ
240ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ -ꢀ
400ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1150ꢀ
400ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1150ꢀ
520ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 880ꢀ
520ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 880ꢀ
Parallelꢀ
Perpendicularꢀ
Perpendicularꢀ
Perpendicularꢀ
Perpendicularꢀ
Perpendicularꢀ
HLMP-SD11-MNTxxꢀ
Notes:
1.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
2.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
3.ꢀꢀ Theꢀdominantꢀwavelength,ꢀλ ,ꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.ꢀ
d
3
Part Numbering System
HLMPꢀ -ꢀ xꢀ xꢀ xxꢀ -ꢀ xꢀ xꢀ xꢀ xx
Mechanical Options
00:ꢀBulkꢀPackaging
DD:ꢀAmmoꢀPack
YY:ꢀFlexi-Bin;ꢀBulkꢀPackaging
ZZ:ꢀFlexi-Bin;ꢀAmmoꢀPack
Color Bin & V Selections
F
ꢀ
0:ꢀNoꢀColorꢀBinꢀLimitation
T:ꢀRedꢀColorꢀwithꢀV ꢀMaximumꢀofꢀ2.6ꢀV
F
K:ꢀAmberꢀColorꢀBinsꢀ2ꢀandꢀ4
L:ꢀAmberꢀColorꢀBInsꢀ4ꢀandꢀ6
Maximum Intensity Bin
0:ꢀNoꢀIvꢀBinꢀLimitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D:ꢀ630ꢀnmꢀRed
G:ꢀ626ꢀnmꢀRed
L:ꢀ590ꢀnmꢀAmber
Package
R:ꢀ4ꢀmmꢀ60°ꢀxꢀ120°Oval,ꢀParallel
S:ꢀ4ꢀmmꢀ60°ꢀxꢀ120°Oval,ꢀPerpendicular
Absolute Maximum Ratings
T ꢀ=ꢀ25°C
A
Parameter
Amber and Red
50ꢀmA
DCꢀForwardꢀCurrent1ꢀꢀꢀꢀꢀ
PeakꢀPulsedꢀForwardꢀCurrentꢀꢀ
AverageꢀForwardꢀCurrentꢀꢀꢀ
ReverseꢀVoltageꢀ(IRꢀ=ꢀ100ꢀµA)ꢀ
PowerꢀDissipationꢀ
100ꢀmA
30ꢀmA
5ꢀV
120ꢀmW
LEDꢀJunctionꢀTemperatureꢀ
OperatingꢀTemperatureꢀRangeꢀ
StorageꢀTemperatureꢀRangeꢀ
130°C
–40°Cꢀtoꢀ+100°C
–40°Cꢀtoꢀ+100°C
Note:
1.ꢀꢀ DerateꢀlinearlyꢀasꢀshownꢀinꢀFiguresꢀ4.
4
Electrical/Optical Characteristics
T ꢀ=ꢀ25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
TypicalꢀViewingꢀAngle[1]
ꢀꢀMajorꢀ
ꢀꢀMinorꢀ
ꢀ
2θ ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
degꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
½
120ꢀ
60
ForwardꢀVoltageꢀ
VFꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
ꢀ
ꢀ
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ626ꢀnm)ꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ630ꢀnm)ꢀ
ꢀꢀAmberꢀ(λdꢀ=ꢀ590ꢀnm)ꢀ
ꢀ
ꢀ
ꢀ
1.9ꢀ
2.0ꢀ
2.02ꢀ
2.4ꢀ
2.4[2]
2.4
ꢀ
ReverseꢀVoltageꢀ
ꢀꢀAmberꢀandꢀRedꢀ
VRꢀ
ꢀ
ꢀ
5ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
ꢀ
IRꢀ=ꢀ100ꢀµAꢀ ꢀ
ꢀ
20ꢀ
ꢀ
ꢀ
PeakꢀWavelengthꢀ
λ
ꢀ
ꢀ
PEAKꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
PeakꢀofꢀWavelengthꢀofꢀ
SpectralꢀDistributionꢀ
atꢀIFꢀ=ꢀ20ꢀmAꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ626ꢀnm)ꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ630ꢀnm)ꢀ
ꢀꢀAmberꢀ(λdꢀ=ꢀ590ꢀnm)ꢀ
635ꢀ
639ꢀ
592ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
SpectralꢀHalfwidthꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ626/630ꢀnm)ꢀ
ꢀꢀAmberꢀ(λdꢀ=ꢀ590ꢀnm)ꢀ
Δλ ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
ꢀ
ꢀ
WavelengthꢀWidthꢀatꢀ
SpectralꢀDistributionꢀꢀ
½ꢀPowerꢀPointꢀatꢀIFꢀ=ꢀ20ꢀmA
½
17ꢀ
17ꢀ
Capacitanceꢀ
ꢀꢀAllꢀColorsꢀ
Cꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
pFꢀ
VFꢀ=ꢀ0,ꢀFꢀ=ꢀ1ꢀMHzꢀ
ꢀ
40
ThermalꢀResistanceꢀ
ꢀꢀAllꢀColorsꢀ
RθJ-PINꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
°C/Wꢀ
ꢀ
LEDꢀJunction-to-Cathodeꢀ
Lead
240ꢀ
LuminousꢀEfficacy[3]ꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ626ꢀnm)ꢀ
ꢀꢀRedꢀ(λdꢀ=ꢀ630ꢀnm)ꢀ
ꢀꢀAmberꢀ(λdꢀ=ꢀ590ꢀnm)ꢀ
ηvꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
lm/Wꢀ
EmittedꢀLuminousꢀPower/ꢀ
EmittedꢀRadiantꢀPowerꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
150ꢀ
155ꢀ
480ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Notes:
1.ꢀꢀꢀ2θ ꢀisꢀtheꢀoff-axisꢀangleꢀwhereꢀtheꢀluminousꢀintensityꢀisꢀtheꢀon-axisꢀintensity.
½
2.ꢀꢀꢀForꢀoptionsꢀ-xxRxx,ꢀ-xxTxx,ꢀandꢀ-xxVxx,ꢀmaximumꢀforwardꢀvoltage,ꢀV ,ꢀisꢀ2.6ꢀV.ꢀPleaseꢀreferꢀtoꢀV ꢀBinꢀTableꢀbelow.ꢀ
ꢀꢀ
F
F
3.ꢀꢀ Theꢀradiantꢀintensity,ꢀI ,ꢀinꢀwattsꢀperꢀsteradian,ꢀmayꢀbeꢀfoundꢀfromꢀtheꢀequationꢀI ꢀ=ꢀI /η ,ꢀwhereꢀI ꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelasꢀandꢀη ꢀisꢀ
e
e
v
v
v
v
theꢀluminousꢀefficacyꢀinꢀlumens/watt.
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
40
30
20
10
0
AMBER
RED
RED
AMBER
2.5
500
550
600
WAVELENGTH - nm
650
700
1.0
1.5
2.0
3.0
VF – FORWARDVOLTAGE –V
Figure 1. Relative intensity vs. wavelength.
Figure 2. Amber, Red forward current vs. forward voltage.
2.5
2.0
1.5
1.0
0.5
0
60
50
40
Rθj-a = 585° C/W
30
Rθj-a = 780° C/W
20
10
0
0
20
40
60
80
100
120
0
10
20
30
40
50
TA – AMBIENTTEMPERATURE – °C
IF – FORWARD CURRENT – mA
Figure 4. Amber, Red maximum forward current vs. ambient temperature.
Figure 3. Amber, Red relative luminous intensity vs. forward current.
1.0
0.8
0.6
0.4
0.2
0
1.0
0.8
0.6
0.4
0.2
0
-90
-90 -75 -60 -45 -30 -15
0
15 30 45 60 75 90
-75 -60 -45 -30 -15
0
15 30 45 60 75 90
ANGULAR DISPLACEMENT – DEGREES
ANGULAR DISPLACEMENT – DEGREES
Figure 5a. Representative spatial radiation pattern for major axis.
Figure 5b. Representative spatial radiation pattern for minor axis.
6
Intensity Bin Limits
Color Bin Limits
(mcdꢀatꢀ20ꢀmA)
(nmꢀatꢀ20ꢀmA)
Bin Name
Min.
180ꢀ
240ꢀ
310ꢀ
400ꢀ
520ꢀ
680ꢀ
880ꢀ
Max.
240
310
400
520
680
880
1150
Amber
Bin ID
ꢀ 1ꢀ
Colour Range (nm)
Min.
Hꢀ
Jꢀ
Max.
584.5ꢀ
587.0
589.5
592.0
594.5
Kꢀ
Lꢀ
ꢀ 2ꢀ
587.0ꢀ
ꢀ 4ꢀ
589.5ꢀ
Mꢀ
Nꢀ
Pꢀ
ꢀ 6ꢀ
592.0ꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ 0.5ꢀnm.
Note:
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ15%.
1.ꢀ Allꢀ binꢀ categoriesꢀ areꢀ establishedꢀ forꢀ classificationꢀ ofꢀ products.ꢀ
Productsꢀmayꢀnotꢀbeꢀavailableꢀinꢀallꢀbinꢀcategories.ꢀPleaseꢀcontactꢀ
yourꢀAvagoꢀrepresentativesꢀforꢀfurtherꢀinformation.
2
VF Bin Table
Bin Name
Min.
2.0ꢀ
2.2ꢀ
2.4ꢀ
Max.
2.2
ꢀ VAꢀ
ꢀ VBꢀ
ꢀ VCꢀ
2.4
2.6
Toleranceꢀforꢀeachꢀbinꢀisꢀ 0.05ꢀV.
Note:
1.ꢀꢀ Binꢀcategoriesꢀareꢀestablishedꢀforꢀclassificationꢀofꢀproducts.ꢀProductsꢀ
mayꢀnotꢀbeꢀavailableꢀinꢀallꢀbinꢀcategories.
2.ꢀ VFꢀbinningꢀisꢀapplicableꢀforꢀpartꢀnumbersꢀwithꢀoptionꢀ-xxTxx.
7
Note:ꢀ
Precautions:
Lead Forming:
1.ꢀ PCBꢀ withꢀ differentꢀ sizeꢀ andꢀ designꢀ (componentꢀ density)ꢀ willꢀ haveꢀ
differentꢀ heatꢀ massꢀ (heatꢀ capacity).ꢀThisꢀ mightꢀ causeꢀ aꢀ changeꢀ inꢀ
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ
settingꢀisꢀused.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.
•ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
2.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLEDꢀareꢀusingꢀhighꢀefficiencyꢀ
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀtakeꢀextraꢀprecautionꢀduringꢀwaveꢀsolderingꢀtoꢀensureꢀthatꢀtheꢀ
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀsolderꢀ
contactꢀtimeꢀdoesꢀnotꢀexceedingꢀ3sec.ꢀOver-stressingꢀtheꢀLEDꢀduringꢀ
solderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLEDꢀdueꢀtoꢀ
delamination.
•ꢀ Forꢀ betterꢀ control,ꢀ itꢀ isꢀ recommendedꢀ toꢀ useꢀ properꢀ
toolꢀtoꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀ
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀaꢀ
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ
dueꢀtoꢀleadꢀcuttingꢀfromꢀtravelingꢀintoꢀLEDꢀpackage.ꢀ
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀoperation,ꢀ
asꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀsink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ CareꢀmustꢀbeꢀtakenꢀduringꢀPCBꢀassemblyꢀandꢀsolderingꢀ
processꢀtoꢀpreventꢀdamageꢀtoꢀtheꢀLEDꢀcomponent.ꢀ
•ꢀ LEDꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ
toꢀ PCB.ꢀ However,ꢀ itꢀ isꢀ onlyꢀ recommendedꢀ underꢀ
unavoidableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀ
manualꢀsolderingꢀdistanceꢀofꢀtheꢀsolderingꢀheatꢀsourceꢀ
(solderingꢀiron’sꢀtip)ꢀtoꢀtheꢀbodyꢀisꢀ1.59mm.ꢀSolderingꢀ
theꢀLEDꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ1.59mmꢀ
mightꢀdamageꢀtheꢀLED.
CATHODE
ꢀ
Note:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ
waveꢀ solderingꢀ shouldꢀ beꢀ looselyꢀ fittedꢀ andꢀ shouldꢀ
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLED.ꢀNonꢀmetalꢀmaterialꢀ
isꢀrecommendedꢀasꢀitꢀwillꢀabsorbꢀlessꢀheatꢀduringꢀwaveꢀ
solderingꢀprocess.
1.59mm
•ꢀ Atꢀ elevatedꢀ temperature,ꢀ LEDꢀ isꢀ moreꢀ susceptibleꢀ toꢀ
mechanicalꢀstress.ꢀTherefore,ꢀPCBꢀmustꢀallowedꢀtoꢀcoolꢀ
downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ whichꢀ
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
•ꢀ ESDꢀ precautionꢀ mustꢀ beꢀ properlyꢀ appliedꢀ onꢀ theꢀ
solderingꢀ stationꢀ andꢀ personnelꢀ toꢀ preventꢀ ESDꢀ
damageꢀtoꢀtheꢀLEDꢀcomponentꢀthatꢀisꢀESDꢀsensitive.ꢀ
DoꢀreferꢀtoꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀ
Theꢀsolderingꢀironꢀusedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀ
ensureꢀelectrostaticꢀchargeꢀisꢀproperlyꢀgrounded.
•ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ
thatꢀ surfaceꢀ mountꢀ componentsꢀ beꢀ solderedꢀ onꢀ theꢀ
topꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀ
bottomꢀ side,ꢀ theseꢀ componentsꢀ shouldꢀ beꢀ solderedꢀ
usingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.
•ꢀ Recommendedꢀsolderingꢀcondition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
Pre-heatꢀtemperature
Preheatꢀtime
105ꢀ°CꢀMax.
60ꢀsecꢀMax
250ꢀ°CꢀMax.
3ꢀsecꢀMax.
-
sizeꢀforꢀLEDꢀcomponentꢀleads.
-
LED component
lead size
Plated through
hole diameter
Peakꢀtemperature
Dwellꢀtime
260ꢀ°CꢀMax.
5ꢀsecꢀMax
Diagonal
0.45ꢀxꢀ0.45ꢀmm
(0.018xꢀ0.018ꢀinch) (0.025ꢀinch) (0.039ꢀtoꢀ0.043ꢀinch)
0.636ꢀmm
0.98ꢀtoꢀ1.08ꢀmm
Note:ꢀ
1)ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.
2)ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ
thermalꢀstressꢀexperiencedꢀbyꢀLED.
0.50ꢀxꢀ0.50ꢀmm 0.707ꢀmm 1.05ꢀtoꢀ1.15ꢀmm
(0.020xꢀ0.020ꢀinch) (0.028ꢀinch) (0.041ꢀtoꢀ0.045ꢀinch)
•ꢀ Waveꢀsolderingꢀparametersꢀmustꢀbeꢀsetꢀandꢀmaintainedꢀ
accordingꢀtoꢀtheꢀrecommendedꢀtemperatureꢀandꢀdwellꢀ
time.ꢀCustomerꢀisꢀadvisedꢀtoꢀperformꢀdailyꢀcheckꢀonꢀtheꢀ
solderingꢀprofileꢀtoꢀensureꢀthatꢀitꢀisꢀalwaysꢀconformingꢀ
toꢀrecommendedꢀsolderingꢀconditions.
•ꢀ Over-sizingꢀ theꢀ PTHꢀ canꢀ leadꢀ toꢀ twistedꢀ LEDꢀ afterꢀ
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀ
causeꢀdifficultyꢀinsertingꢀtheꢀTHꢀLED.
8
ReferꢀtoꢀapplicationꢀnoteꢀAN5334ꢀforꢀmoreꢀinformationꢀaboutꢀsolderingꢀandꢀhandlingꢀofꢀhighꢀbrightnessꢀTHꢀLEDꢀlamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
6.35 1.30
0.25 0.0512
12.70 1.00
0.50 0.0394
CATHODE
20.5 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.025
18.00 0.50
0.7087 0.0197
12.70 0.30
0.50 0.0118
4.00 0.20
TYP.
Ø
0.1575 0.0079
VIEW A - A
0.70 0.20
0.276 0.0079
Note:ꢀTheꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ-ZZꢀandꢀregardlessꢀstandoffꢀorꢀnon-standoff
9
Packaging Box for Ammo Packs
Note:ꢀForꢀInGaNꢀdevice,ꢀtheꢀammoꢀpackꢀpackagingꢀboxꢀcontainꢀESDꢀlogo
Packaging Label
(i)ꢀ AvagoꢀMotherꢀLabel:ꢀ(Availableꢀonꢀpackagingꢀboxꢀofꢀammoꢀpackꢀandꢀshippingꢀbox)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
10
(ii)ꢀAvagoꢀBabyꢀLabelꢀ(Onlyꢀavailableꢀonꢀbulkꢀpackaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢀ
Example:
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀwithꢀcolorꢀbinsꢀbutꢀwithoutꢀ
VFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀcolorꢀbin)
ꢀ
ꢀ
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)
ORꢀꢀꢀꢀꢀꢀꢀꢀꢀ
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin
ꢀ
ꢀ
ꢀ
BIN:ꢀ2VBꢀꢀ
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀthatꢀhaveꢀbothꢀcolorꢀbinꢀ
andꢀVFꢀbin)
ꢀ
ꢀ
VB:ꢀVFꢀbinꢀ“VB”
2:ꢀꢀColorꢀbinꢀ2ꢀonly
DISCLAIMER
AVAGO’SꢀPRODUCTSꢀANDꢀSOFTWAREꢀAREꢀNOTꢀSPECIFICALLYꢀDESIGNED,ꢀMANUFACTUREDꢀORꢀAUTHORIZEDꢀFORꢀ
SALEꢀASꢀPARTS,ꢀCOMPONENTSꢀORꢀASSEMBLIESꢀFORꢀTHEꢀPLANNING,ꢀCONSTRUCTION,ꢀMAINTENANCEꢀORꢀDIRECTꢀ
OPERATIONꢀOFꢀAꢀNUCLEARꢀFACILITYꢀORꢀFORꢀUSEꢀINꢀMEDICALꢀDEVICESꢀORꢀAPPLICATIONS.ꢀꢀCUSTOMERꢀISꢀSOLELYꢀ
RESPONSIBLE,ꢀANDꢀWAIVESꢀALLꢀRIGHTSꢀTOꢀMAKEꢀCLAIMSꢀAGAINSTꢀAVAGOꢀORꢀITSꢀSUPPLIERS,ꢀFORꢀALLꢀLOSS,ꢀ
DAMAGE,ꢀEXPENSEꢀORꢀLIABILITYꢀINꢀCONNECTIONꢀWITHꢀSUCHꢀUSE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4174EN
AV02-1544EN - September 18, 2008
相关型号：
©2020 ICPDF网 联系我们和版权申明