HLMP-EG3H-VX0DD [AVAGO]
T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs;
| 型号： | HLMP-EG3H-VX0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs |
| 文件： | 总11页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EGxx, HLMP-ELxx
T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs
provide superior light output for excellent readability in
sunlight and are extremely reliable. AlInGaP LED tech-
nology provides extremely stable light output over long
periods of time. Precision Optical Performance lamps
utilize the aluminum indium gallium phosphide (AlInGaP)
technology.
xꢀ Viewing angle: 15°, 23° and 30°
xꢀ Well defined spatial radiation pattern
xꢀ High brightness material
xꢀ Available in Red and Amber
– Red AlInGaP 626 nm
– Amber AlInGaP 590 nm
These LED lamps are untinted. T-1¾ packages incorpo-
rating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
xꢀ Superior resistance to moisture
xꢀ Standoff and non-standoff Package
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction tempera-
ture limit of +130° C enables high temperature operation
in bright sunlight conditions. The epoxy contains uv
inhibitor to reduce the effects of long term exposure to
direct sunlight.
Applications
xꢀ Traffic management:
– Traffic signals
– Pedestrian signals
– Work zone warning lights
– Variable message signs
xꢀ Solar Power signs
xꢀ Commercial outdoor advertising
– Signs
Benefits
xꢀ Superior performance for outdoor environment
xꢀ Suitable for auto-insertion onto PC board
– Marquee
Package Dimension
A: Non-standoff
B: Standoff
5.00 0.20
(0.197 0.00ꢀ8
5.00 0.20
(0.197 0.00ꢀ8
1.14 0.20
(0.045 0.00ꢀ8
ꢀ.71 0.20
(0.343 0.00ꢀ8
ꢀ.71 0.20
(0.343 0.00ꢀ8
d
1.14 0.20
(0.045 0.00ꢀ8
2.35 (0.0938
MAX.
0.70 (0.02ꢀ8
MAX.
1.50 0.15
(0.059 0.0068
31.60
MIN.
31.60
MIN.
(1.2448
(1.2448
0.70 (0.02ꢀ8
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 0.10
(0.020 0.0048
0.50 0.10
(0.020 0.0048
SQ. TYP.
SQ. TYP.
1.00
MIN.
1.00
(0.0398
MIN.
(0.0398
5.ꢀ0 0.20
(0.22ꢀ 0.00ꢀ8
5.ꢀ0 0.20
(0.22ꢀ 0.00ꢀ8
CATHODE
FLAT
CATHODE
FLAT
2.54 0.3ꢀ
(0.100 0.0158
2.54 0.3ꢀ
(0.100 0.0158
Part Number
Dimension ‘d’
HLMP-EG1H-xxxxx
12.30 0.25mm
12.64 0.25mm
12.10 0.25mm
12.14 0.25mm
12.10 0.25mm
HLMP-EL1H-xxxxx
HLMP-EG2H-xxxxx
HLMP-EL2H-xxxxx
HLMP-EG3H-xxxxx/HLMP-EL3H-xxxxx
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is 0.20 mm unless other specified.
3. Leads are mild steel with tin plating.
4. The epoxy meniscus is 1.21 mm max.
5. For identification of polarity after the leads are trimmed off, please
refer to the illustration below:
CATHODE
ANODE
2
Device Selection Guide
Luminous Intensity Iv (mcd) at
20 mA
Color and Dominant
[1,2,5]
Wavelength O (nm)
Typical Viewing
angle (°)
d
[3]
[4]
Part Number
Typ
Min
Max
Standoff
HLMP-EG1G-Y10DD
HLMP-EG1H-Y10DD
HLMP-EL1G-Y10DD
HLMP-EL1H-Y10DD
HLMP-EG2G-XZ0DD
HLMP-EG2H-XZ0DD
HLMP-EL2G-WY0DD
HLMP-EL2H-WY0DD
HLMP-EG3G-VX0DD
HLMP-EG3H-VX0DD
HLMP-EL3G-VX0DD
HLMP-EL3H-VX0DD
Notes:
Red 626
9300
9300
9300
9300
7200
7200
5500
5500
4200
4200
4200
4200
21000
21000
21000
21000
16000
16000
12000
12000
9300
No
Yes
15
23
30
Red 626
Amber 590
Amber 590
Red 626
No
Yes
No
Yes
Red 626
Amber 590
Amber 590
Red 626
No
Yes
No
Yes
Red 626
9300
Amber 590
Amber 590
No
9300
Yes
9300
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, O , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4.
T is the off-axis angle where the luminous intensity is half the on-axis intensity.
½
5. Tolerance for each bin limit is 15ꢀ
Part Numbering System
HLMP – E x xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
K: Color bin 2 and 4
L: Color bin 4 and 6
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoff
1G : 15 without standoff
1H : 15 with standoff
2G : 23 without standoff
2H : 23 with standoff
3G : 30 without standoff
3H : 30 with standoff
Color
G : Red
L : Amber
Package
E: 5 mm Standard Round
Note: Refer to AB 5337 for complete information on the part numbering system.
3
Absolute Maximum Ratings
T = 25° C
J
Parameter
Red/ Amber
50
100 [2]
Unit
mA
mA
mW
°C
DC Forward Current [1]
Peak Forward Current
Power Dissipation
120
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
-40 to +100
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30ꢀ, frequency 1 kHz.
Electrical / Optical Characteristics
T = 25° C
J
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Red & Amber
VF
1.8
2.1
2.4
V
IF = 20 mA
Reverse Voltage [3]
Red & Amber
VR
5
V
IR = 100 PA
Dominant Wavelength [1]
Od
nm
IF = 20 mA
Red
Amber
618.0
584.5
626.0
590.0
630.0
594.5
Peak Wavelength
Red
OPEAK
nm
Peak of Wavelength of Spec-
tral Distribution at IF = 20 mA
634
594
Amber
Thermal resistance
Luminous Efficacy [2]
RTJ-PIN
240
°C/W
lm/W
LED junction to pin
Kv
Emitted Luminous Power/
Emitted Radiant Power
Red
Amber
190
490
Thermal coefficient of Od
nm/°C
IF = 20 mA;
+25° C ≤ TJ ≤ +100° C
Red
Amber
0.05
0.09
Notes:
1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, I in watts per steradian, maybe found from the equation I = I / K where I is the luminous intensity in candela and K is
e
e
v
V
v
V
the luminous efficacy in lumens/ watt.
3. Indicates product final testing condition, long term reverse bias is not recommended.
4
1.0
0.8
0.6
0.4
0.2
0.0
100
80
60
40
20
0
Amber
Red
500
550
600
650
700
0
1
2
3
WAVELENGTH - nm
FORWARD VOLTAGE-V
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
60
50
40
30
20
10
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
0
20
40
60
80
100
DC FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - C
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Representative Radiation pattern for 15° Viewing Angle Lamp
Figure 6. Representative Radiation pattern for 23° Viewing Angle Lamp
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
1
Amber
Red
0.1
-90
-60
-30
0
30
60
90
-40 -20
0
20
40
60
80 100 120 140
ANGULAR DISPLACEMENT - DEGREES
TJ - JUNCTION TEMPERATURE
Figure 7. Representative Radiation pattern for 30° Viewing Angle Lamp
Figure 8. Relative Light Output vs Junction Temperature
0.6
Amber
Red
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-40 -20
0
20
40
60
80 100 120 140
TJ - JUNCTION TEMPERATURE
Figure 9. Forward Voltage Shift vs Junction Temperature
6
Intensity Bin Limit Table (1.3 : 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Red Color Range
Min
Dom
Max
Dom
X min
Y Min
X max
Y max
Bin
U
V
Min
Max
618.0
630.0
0.6872
0.6690
0.3126
0.3149
0.6890
0.7080
0.2943
0.2920
3200
4200
5500
7200
9300
12000
16000
4200
5500
7200
9300
12000
16000
21000
Tolerance for each bin limit is 0.5 nm
W
X
Amber Color Range
Y
Min
Dom
Max
Dom
Z
Bin
Xmin
Ymin
Xmax Ymax
1
1
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is 15ꢀ
2
4
6
V Bin Table (V at 20 mA)
F
Bin ID
VD
Min
Max
2.0
2.2
2.4
1.8
2.0
2.2
VA
VB
Tolerance for each bin limit is 0.5 nm
Tolerance for each bin limit is 0.05 V
Note:
All bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact your Avago
representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.480
0.460
1
0.440
Amber 2
0.420
4
6
0.400
0.380
0.360
0.340
0.320
0.300
0.280
Red
0.500
0.550
0.600
0.650
0.700
0.750
0.800
X
7
Precautions:
Lead Forming:
Note:
x The leads of an LED lamp may be preformed or cut to
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED Configuration
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
Anode
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
1.59 mm
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x Recommended soldering condition:
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
Wave Soldering Manual Solder
[1, 2]
Dipping
Pre-heat temperature 105 °C Max.
-
Preheat time
Peak temperature
Dwell time
60 sec Max
260 °C Max.
5 sec Max.
-
260 °C Max.
5 sec Max
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Plated through
hole diameter
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 inch)
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
8
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260 °C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105 °C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
6.35 1.30
0.250 0.051
12.70 1.00
0.500 0.039
CATHODE
20.5 1.00
0.8070 0.0394
9.125 0.625
0.3595 0.0245
18.00 0.50
0.7085 0.0195
4.00 0.20
0.1575 0.0075
0.70 0.20
0.0275 0.0075
ø
TYP.
12.70 0.30
0.500 0.012
A
A
VIEW A-A
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
9
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
10
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2 VB
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-3139EN - May 30, 2013
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