HLMP-EG3B-WX0DD [AVAGO]
New T-1 3/4 (5mm) Extra High Brightness AlInGaP LED Lamps; 新的T-1 3/4 （5毫米）超高亮度的AlInGaP LED灯
| 型号： | HLMP-EG3B-WX0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | New T-1 3/4 (5mm) Extra High Brightness AlInGaP LED Lamps |
| 文件： | 总11页 (文件大小：487K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EGxx, HLMP-ELxx
New T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps
Data Sheet
Description
Features
Theseꢁ Precisionꢁ Opticalꢁ Performanceꢁ AlInGaPꢁ LEDsꢁ •ꢁ Viewingꢁangle:ꢁꢀ5°,ꢁ23°,ꢁ30°
provideꢁsuperiorꢁlightꢁoutputꢁforꢁexcellentꢁreadabilityꢁinꢁ
sunlightꢁ andꢁ areꢁ extremelyꢁ reliable.ꢁ AlInGaPꢁ LEDꢁ tech-
nologyꢁprovidesꢁextremelyꢁstableꢁlightꢁoutputꢁoverꢁlongꢁ
periodsꢁ ofꢁ time.ꢁ Precisionꢁ Opticalꢁ Performanceꢁ lampsꢁ
utilizeꢁtheꢁaluminumꢁindiumꢁgalliumꢁphosphideꢁ(AlInGaP)ꢁ
technology.ꢁ
•ꢁ Highꢁluminousꢁoutput
•ꢀ Colors:
ꢁ
ꢁ
590nmꢁAmber
626nmꢁRed
•ꢀ Packageꢁoptions:
ꢁ
Withꢁorꢁwithoutꢁleadꢁstandoff
Theseꢁ LEDꢁ lampsꢁ areꢁ untinted,ꢁT-ꢀ¾ꢁ packagesꢁ incorpo-
ratingꢁsecondꢁgenerationꢁopticsꢁproducingꢁwellꢁdefinedꢁ
spatialꢁradiationꢁpatternsꢁatꢁspecificꢁviewingꢁconeꢁangles.
•ꢀ Superiorꢁresistanceꢁtoꢁmoisture
•ꢀ Untintedꢁforꢁꢀ5°,ꢁ23°ꢁandꢁ30°ꢁlamps
Theseꢁ lampsꢁ areꢁ madeꢁ withꢁ anꢁ advancedꢁ opticalꢁ gradeꢁ
epoxyꢁ offeringꢁ superiorꢁ highꢁ temperatureꢁ andꢁ highꢁ
moistureꢁ resistanceꢁ performanceꢁ inꢁ outdoorꢁ signalꢁ andꢁ
signꢁ application.ꢁ Theꢁ maximumꢁ LEDꢁ junctionꢁ tempera-
tureꢁlimitꢁofꢁ+ꢀ30°Cꢁenablesꢁhighꢁtemperatureꢁoperationꢁ
inꢁ brightꢁ sunlightꢁ conditions.ꢁ Theꢁ epoxyꢁ containsꢁ bothꢁ
uv-aꢁ andꢁ uv-bꢁ inhibitorsꢁ toꢁ reduceꢁ theꢁ effectsꢁ ofꢁ longꢁ
termꢁexposureꢁtoꢁdirectꢁsunlight.
Applications
•ꢀꢀ Trafficꢁmanagement:
-ꢁ Trafficꢁsignals
-ꢁ Pedestrianꢁsignals
-ꢁ Workꢁzoneꢁwarningꢁlights
-ꢁ Variableꢁmessageꢁsigns
•ꢁ SolarꢁPowerꢁsignsꢁ
•ꢁ Commercialꢁoutdoorꢁadvertising
-ꢁ Signs
Benefits
•ꢀꢀ Superiorꢁperformanceꢁforꢁoutdoorꢁenvironments
•ꢀꢀ Suitableꢁforꢁauto-insertionꢁontoꢁPCꢁboard
-ꢁ Marquees
ꢀ
Package Dimension
A: Non-standoff
B: Standoff
5.00 0.20
(0.197 0.008)
5.00 0.20
(0.197 0.008)
1.14 0.20
(0.045 0.008)
8.71 0.20
(0.343 0.008)
8.71 0.20
(0.343 0.008)
d
1.14 0.20
(0.045 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 0.15
(0.059 0.006)
31.60
MIN.
31.60
(1.244)
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 0.10
(0.020 0.004)
0.50 0.10
(0.020 0.004)
SQ. TYP.
SQ. TYP.
1.00
MIN.
1.00
(0.039)
MIN.
(0.039)
5.80 0.20
(0.228 0.008)
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
2.54 0.38
(0.100 0.015)
Viewing Angle
d
ꢀ5°
ꢀ2.39 0.25
(0.476 0.0ꢀ0)
23°ꢁ&ꢁꢁ30°
ꢀꢀ.96 0.25
(0.459 0.0ꢀ0)
Notes:
ꢀ.ꢁ Allꢁdimensionsꢁareꢁinꢁmillimetersꢁ(inches)ꢁ
2.ꢁ Leadsꢁareꢁmildꢁsteelꢁwithꢁtinꢁplating.
3.ꢁ Theꢁepoxyꢁmeniscusꢁisꢁꢀ.2ꢀmmꢁmax
4.ꢁ Forꢁ Identificationꢁ ofꢁ polarityꢁ afterꢁ theꢁ
leadsꢁareꢁtrimmedꢁoff,ꢁpleaseꢁreferꢁtoꢁtheꢁ
illustrationꢁbelow:
CATHODE
ANODE
2
Device Selection Guide
Typical viewing
Luminous Intensity
Color and Dominant
Wavelength (nm),
Typ
Lamps without Standoff
on leads
(Package drawing A)
Lamps with Standoff
on leads
(Package drawing B)
[1,2,5]
Iv (mcd)
at 20 mA
Angle
[4]
[3]
2θ (Deg)
Min
Max
1/2
ꢀ5°
23°
30°
Amberꢁ590
HLMP-ELꢀA-ZꢀKDD
HLMP-ELꢀA-ZꢀLDD
HLMP-EGꢀA-Zꢀ0DD
HLMP-EL2A-XYKDD
HLMP-EL2A-XYLDD
HLMP-EG2A-XY0DD
HLMP-EL3A-VWKDD
HLMP-EL3A-VWLDD
HLMP-EL3A-WXKDD
HLMP-EL3A-WXLDD
HLMP-EG3A-VW0DD
HLMP-EG3A-WX0DD
HLMP-ELꢀB-ZꢀKDD
HLMP-ELꢀB-ZꢀLDD
HLMP-EGꢀB-Zꢀ0DD
HLMP-EL2B-XYKDD
HLMP-EL2B-XYLDD
HLMP-EG2B-XY0DD
HLMP-EL3B-VWKDD
HLMP-EL3B-VWLDD
HLMP-EL3B-WXKDD
HLMP-EL3B-WXLDD
HLMP-EG3B-VW0DD
HLMP-EG3B-WX0DD
ꢀ2000
ꢀ2000
ꢀ2000
7200
7200
7200
4200
4200
5500
5500
4200
5500
2ꢀ000
2ꢀ000
2ꢀ000
ꢀ2000
ꢀ2000
ꢀ2000
7200
7200
9300
9300
7200
7200
Redꢁꢁ626
Amberꢁ590
Redꢁꢁ626
Amberꢁ590
Redꢁꢁ626
Notes:
ꢀ.ꢁ Theꢁluminousꢁintensityꢁisꢁmeasuredꢁonꢁtheꢁmechanicalꢁaxisꢁofꢁtheꢁlampꢁpackageꢁandꢁitꢁisꢁtestedꢁwithꢁpulsingꢁcondition.
2.ꢁ Theꢁopticalꢁaxisꢁisꢁcloselyꢁalignedꢁwithꢁtheꢁpackageꢁmechanicalꢁaxis.
3.ꢁ Dominantꢁwavelength,ꢁλ ,ꢁisꢁderivedꢁfromꢁtheꢁCIEꢁChromaticityꢁDiagramꢁandꢁrepresentsꢁtheꢁcolorꢁofꢁtheꢁlamp.
d
4.ꢁ θ ꢁisꢁtheꢁoff-axisꢁangleꢁwhereꢁtheꢁluminousꢁintensityꢁisꢁhalfꢁtheꢁon-axisꢁintensity.ꢁ
½
5.ꢁ Toleranceꢁforꢁeachꢁbinꢁlimitꢁisꢁ ꢁꢀ5%
Part Numbering System
HLMP – E x xx - x x x xx
Mechanical Options
DD : Ammo Pack
Color Bin Selections
0 : Full color distribution
K : Color Bin 2 & 4
L : Color Bin 4 & 6
Maximum Intensity Bin
0 : No maximum intensity limit (Refer to Selection Guide)
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
2A: 23° without lead standoff
2B: 23° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
G : Red 626nm
L : Amber 590nm
Note:ꢁPleaseꢁreferꢁtoꢁABꢁ5337ꢁforꢁcompleteꢁinformationꢁonꢁpartꢁnumberingꢁsystem.
3
Absolute Maximum Ratings
TJꢁ=ꢁ25°C
Parameter
Red/Amber
50
ꢀ00ꢁ[ꢀ]
Unit
mA
mA
mA
mW
V
DCꢁForwardꢁCurrentꢁ[2]
PeakꢁForwardꢁCurrent
Averageꢁforwardꢁcurrent
PowerꢁDissipation
30
ꢀ20
ReverseꢁVoltageꢁ
5ꢁ
OperatingꢁTemperatureꢁRange
StorageꢁTemperatureꢁRange
-40ꢁtoꢁ+ꢀ00
-40ꢁtoꢁ+ꢀ00
°C
°C
Notes:
ꢀ.ꢁ DutyꢁFactorꢁ30%,ꢁfrequencyꢁꢀKHz.
2.ꢁ DerateꢁlinearlyꢁasꢁshownꢁinꢁFigureꢁ4
Electrical / Optical Characteristics
T ꢁ=ꢁ25°C
J
Parameter
Symbol
Min
Typ.
Max
Units
Test Conditions
ForwardꢁVoltage
ꢁꢁꢁꢁꢁꢁAmber
ꢁꢁꢁꢁꢁꢁRed
IFꢁ=ꢁ20ꢁmA
VF
ꢀ.8
ꢀ.8
2.ꢀ
2.ꢀ
2.4
2.4
V
ReverseꢁVoltage
DominantꢁWavelengthꢁ[ꢀ]
ꢁꢁꢁꢁꢁꢁAmber
VR
5
V
IRꢁ=ꢁꢀ00ꢁμA
IFꢁ=ꢁ20ꢁmA
ld
nm
584.5
6ꢀ8.0
590.0
626.0
594.5
630.0
ꢁꢁꢁꢁꢁꢁRed
PeakꢁWavelength
ꢁꢁꢁꢁꢁꢁAmber
ꢁꢁꢁꢁꢁꢁRed
lPEAK
nm
nm
PeakꢁofꢁWavelengthꢁofꢁSpectralꢁ
DistributionꢁatꢁIFꢁ=ꢁ20ꢁmA
594
634
SpectralꢁHalfwidth
ꢁꢁꢁꢁꢁꢁAmber
ꢁꢁꢁꢁꢁꢁRed
Δlꢀ/2
IFꢁ=ꢁ20ꢁmA
ꢀ3
ꢀ4
Thermalꢁresistance
LuminousꢁEfficacyꢁ[2]
ꢁꢁꢁꢁꢁꢁAmber
RqJ-PIN
240
°C/W
lm/W
LEDꢁjunctionꢁtoꢁanodeꢁlead
ηv
EmittedꢁLuminousꢁFlux/Emittedꢁ
RadiantꢁFlux
500
200
ꢁꢁꢁꢁꢁꢁRed
LuminousꢁFlux
ꢁꢁꢁꢁꢁꢁAmber
ꢁꢁꢁꢁꢁꢁRed
LuminousꢁEfficiencyꢁ[3]
ꢁꢁꢁꢁꢁꢁAmber
Φv
ηe
mlm
IFꢁ=ꢁ20ꢁmA
2000
ꢀ900
lm/W
nm/°C
EmittedꢁLuminousꢁFlux/Electricalꢁ
Power
47
45
ꢁꢁꢁꢁꢁꢁRed
Thermalꢁcoefficientꢁofꢁld
ꢁꢁꢁꢁꢁꢁAmber
ꢁꢁꢁꢁꢁꢁRed
IFꢁ=ꢁ20ꢁmAꢁ;ꢁ+25°Cꢁ≤ꢁTJꢁ≤ꢁ+ꢀ00°C
0.08
0.05
Notes:
ꢀ.ꢁ Theꢁdominantꢁwavelength,ꢁλ ꢁisꢁderivedꢁfromꢁtheꢁCIEꢁChromaticityꢁDiagramꢁreferencedꢁtoꢁIlluminantꢁE.ꢁToleranceꢁforꢁeachꢁcolorꢁofꢁdominantꢁ
d
wavelengthꢁisꢁ+/-ꢁ0.5nm.
2.ꢁ Theꢁradiantꢁintensity,ꢁI ꢁinꢁwattsꢁperꢁsteradian,ꢁmaybeꢁfoundꢁfromꢁtheꢁequationꢁI ꢁ=ꢁI ꢁ/ꢁη ꢁwhereꢁIvꢁisꢁtheꢁluminousꢁintensityꢁinꢁcandelaꢁandꢁη ꢁisꢁ
e
e
v
V
V
theꢁluminousꢁefficacyꢁinꢁlumens/ꢁwatt.
3.ꢁ η ꢁ=ꢁΦ ꢁ/I ꢁꢁxꢁV ꢁwhereꢁΦ ꢁisꢁtheꢁemittedꢁluminousꢁflux,ꢁꢁI ꢁisꢁelectricalꢁforwardꢁcurrentꢁandꢁV ꢁisꢁtheꢁforwardꢁvoltage.
e
v
F
F
v
F
F
4
100
80
60
40
20
0
1.0
0.8
0.6
0.4
0.2
0.0
Amber
Red
0
1
2
3
500
550
600
650
700
FORWARD VOLTAGE-V
WAVELENGTH - nm
Figure 1. Relative Intensity vs Peak Wavelength
Figure 2. Forward Current vs Forward Voltage
60
50
40
30
20
10
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE - -C
DC FORWARD CURRENT - mA
Figure 3. Relative Luminous Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT-DEGREE
ANGULAR DISPLACEMENT-DEGREE
Figure 5.Radiation Pattern for 15° Viewing Angle Lamp
Figure 6. Radiation Pattern for 23° Viewing Angle Lamp
5
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT-DEGREE
Figure 7. Radiation Pattern for 30° Viewing Angle Lamp
Relative Light Output vs Junction Temperature
10
Red
Amber
1
0.1
-40
-20
0
20
40
60
80
100
120
140
TJ-JUNCTION TEMPERATURE - °C
Relative Forward Voltage vs Junction Temperature
0.20
Red
Amber
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-40
-20
0
20
40
60
80
100
120
140
TJ - JUNCTION TEMPERATURE - °C
6
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Intensity (mcd) at 20mA
Red Color Range
Max
Min Dom Dom
X min
Y Min
X max
Y max
Bin
V
Min
Max
6ꢀ8
630
0.6872
0.6690
0.3ꢀ26
0.3ꢀ49
0.6890
0.7080
0.2943
0.2920
4200
5500
7200
9300
ꢀ2000
ꢀ6000
5500
7200
9300
ꢀ2000
ꢀ6000
2ꢀ000
W
X
Toleranceꢁforꢁeachꢁbinꢁlimitꢁisꢁ ꢁ0.5nm
Y
Z
Amber Color Range
ꢀ
Min
Dom
Max
Dom
Toleranceꢁforꢁeachꢁbinꢁlimitꢁisꢁ ꢁꢀ5%
Bin
Xmin
Ymin
Xmax Ymax
ꢀ
584.5
587
0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
0.5720 0.4270 0.5820 0.4ꢀꢀ0
0.5670 0.4250 0.5870 0.4ꢀ30
0.5870 0.4ꢀ30 0.5950 0.3980
0.5820 0.4ꢀꢀ0 0.6000 0.3990
VF Bin Table (V at 20mA)
2
4
6
587
589.5
592
Bin ID
VD
Min
ꢀ.8
2.0
2.2
Max
2.0
2.2
2.4
589.5
592
VA
VB
594.5
Toleranceꢁforꢁeachꢁbinꢁlimitꢁisꢁ ꢁ0.05V
Toleranceꢁforꢁeachꢁbinꢁlimitꢁisꢁ ꢁ0.5nm
Note:
Allꢁbinꢁcategoriesꢁareꢁestablishedꢁforꢁclassificationꢁofꢁproducts.ꢁProductsꢁ
mayꢁ notꢁ beꢁ availableꢁ inꢁ allꢁ binꢁ categories.ꢁ Pleaseꢁ contactꢁ Avagoꢁ
representativeꢁforꢁfurtherꢁinformation.ꢁ
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.480
0.460
1
0.440
Amber
2
0.420
0.400
0.380
0.360
0.340
0.320
0.300
0.280
4
6
Red
0.500
0.550
0.600
0.650
0.700
0.750
0.800
X
7
Precautions:
Lead Forming:
Note:ꢁ
•ꢁ TheꢁleadsꢁofꢁanꢁLEDꢁlampꢁmayꢁbeꢁpreformedꢁorꢁcutꢁtoꢁ
ꢀ.ꢁ PCBꢁ withꢁ differentꢁ sizeꢁ andꢁ designꢁ (componentꢁ density)ꢁ willꢁ haveꢁ
differentꢁ heatꢁ massꢁ (heatꢁ capacity).ꢁThisꢁ mightꢁ causeꢁ aꢁ changeꢁ inꢁ
temperatureꢁ experiencedꢁ byꢁ theꢁ boardꢁ ifꢁ sameꢁ waveꢁ solderingꢁ
settingꢁisꢁused.ꢁSo,ꢁitꢁisꢁrecommendedꢁtoꢁre-calibrateꢁtheꢁsolderingꢁ
profileꢁagainꢁbeforeꢁloadingꢁaꢁnewꢁtypeꢁofꢁPCB.
2.ꢁ AvagoꢁTechnologies’ꢁhighꢁbrightnessꢁLEDꢁareꢁusingꢁhighꢁefficiencyꢁ
LEDꢁdieꢁwithꢁsingleꢁwireꢁbondꢁasꢁshownꢁbelow.ꢁCustomerꢁisꢁadvisedꢁ
toꢁtakeꢁextraꢁprecautionꢁduringꢁwaveꢁsolderingꢁtoꢁensureꢁthatꢁtheꢁ
maximumꢁwaveꢁtemperatureꢁdoesꢁnotꢁexceedꢁ260°Cꢁandꢁtheꢁsolderꢁ
contactꢁ timeꢁ doesꢁ notꢁ exceedingꢁ 5sec.ꢁ Over-stressingꢁ theꢁ LEDꢁ
duringꢁsolderingꢁprocessꢁmightꢁcauseꢁprematureꢁfailureꢁtoꢁtheꢁLEDꢁ
dueꢁtoꢁdelamination.
lengthꢁpriorꢁtoꢁinsertionꢁandꢁsolderingꢁonꢁPCꢁboard.
•ꢁ Forꢁ betterꢁ control,ꢁ itꢁ isꢁ recommendedꢁ toꢁ useꢁ properꢁ
toolꢁtoꢁpreciselyꢁformꢁandꢁcutꢁtheꢁleadsꢁtoꢁapplicableꢁ
lengthꢁratherꢁthanꢁdoingꢁitꢁmanually.
•ꢁ Ifꢁmanualꢁleadꢁcuttingꢁisꢁnecessary,ꢁcutꢁtheꢁleadsꢁafterꢁ
theꢁsolderingꢁprocess.ꢁTheꢁsolderꢁconnectionꢁformsꢁaꢁ
mechanicalꢁgroundꢁwhichꢁpreventsꢁmechanicalꢁstressꢁ
dueꢁtoꢁleadꢁcuttingꢁfromꢁtravelingꢁintoꢁLEDꢁpackage.ꢁ
Thisꢁisꢁhighlyꢁrecommendedꢁforꢁhandꢁsolderꢁoperation,ꢁ
asꢁtheꢁexcessꢁleadꢁlengthꢁalsoꢁactsꢁasꢁsmallꢁheatꢁsink.
Avago Technologies LED Configuration
Soldering and Handling:
•ꢁ Careꢁ mustꢁ beꢁ takenꢁ duringꢁ PCBꢁ assemblyꢁ andꢁ
solderingꢁ processꢁ toꢁ preventꢁ damageꢁ toꢁ theꢁ LEDꢁ
component.ꢁ
•ꢁ LEDꢁ componentꢁ mayꢁ beꢁ effectivelyꢁ handꢁ solderedꢁ
toꢁ PCB.ꢁ However,ꢁ itꢁ isꢁ onlyꢁ recommendedꢁ underꢁ
unavoidableꢁcircumstancesꢁsuchꢁasꢁrework.ꢁTheꢁclosestꢁ
manualꢁ solderingꢁ distanceꢁ ofꢁ theꢁ solderingꢁ heatꢁ
sourceꢁ (solderingꢁ iron’sꢁ tip)ꢁ toꢁ theꢁ bodyꢁ isꢁ ꢀ.59mm.ꢁ
SolderingꢁtheꢁLEDꢁusingꢁsolderingꢁironꢁtipꢁcloserꢁthanꢁ
ꢀ.59mmꢁmightꢁdamageꢁtheꢁLED.
Anode
ꢁ
Note:ꢁElectricalꢁconnectionꢁbetweenꢁbottomꢁsurfaceꢁofꢁLEDꢁdieꢁandꢁ
theꢁleadꢁframeꢁisꢁachievedꢁthroughꢁconductiveꢁpaste.
•ꢁ Anyꢁ alignmentꢁ fixtureꢁ thatꢁ isꢁ beingꢁ appliedꢁ duringꢁ
waveꢁ solderingꢁ shouldꢁ beꢁ looselyꢁ fittedꢁ andꢁ shouldꢁ
notꢁapplyꢁweightꢁorꢁforceꢁonꢁLED.ꢁNonꢁmetalꢁmaterialꢁ
isꢁ recommendedꢁ asꢁ itꢁ willꢁ absorbꢁ lessꢁ heatꢁ duringꢁ
waveꢁsolderingꢁprocess.
1.59mm
•ꢁ ESDꢁ precautionꢁ mustꢁ beꢁ properlyꢁ appliedꢁ onꢁ theꢁ
solderingꢁ stationꢁ andꢁ personnelꢁ toꢁ preventꢁ ESDꢁ
damageꢁtoꢁtheꢁLEDꢁcomponentꢁthatꢁisꢁESDꢁsensitive.ꢁ
DoꢁreferꢁtoꢁAvagoꢁapplicationꢁnoteꢁANꢁꢀꢀ42ꢁforꢁdetails.ꢁ
Theꢁsolderingꢁironꢁusedꢁshouldꢁhaveꢁgroundedꢁtipꢁtoꢁ
ensureꢁelectrostaticꢁchargeꢁisꢁproperlyꢁgrounded.
ꢁ
Note:ꢁInꢁorderꢁtoꢁfurtherꢁassistꢁcustomerꢁinꢁdesigningꢁjigꢁaccuratelyꢁ
thatꢁ fitꢁ AvagoꢁTechnologies’ꢁ product,ꢁ 3Dꢁ modelꢁ ofꢁ theꢁ productꢁ isꢁ
availableꢁuponꢁrequest.
•ꢁ Atꢁ elevatedꢁ temperature,ꢁ LEDꢁ isꢁ moreꢁ susceptibleꢁ toꢁ
mechanicalꢁstress.ꢁTherefore,ꢁPCBꢁmustꢁallowedꢁtoꢁcoolꢁ
downꢁ toꢁ roomꢁ temperatureꢁ priorꢁ toꢁ handling,ꢁ whichꢁ
includesꢁremovalꢁofꢁalignmentꢁfixtureꢁorꢁpallet.
•ꢁ Recommendedꢁsolderingꢁcondition:
•ꢁ IfꢁPCBꢁboardꢁcontainsꢁbothꢁthroughꢁholeꢁ(TH)ꢁLEDꢁandꢁ
otherꢁsurfaceꢁmountꢁcomponents,ꢁitꢁisꢁrecommendedꢁ
thatꢁ surfaceꢁ mountꢁ componentsꢁ beꢁ solderedꢁ onꢁ theꢁ
topꢁsideꢁofꢁtheꢁPCB.ꢁIfꢁsurfaceꢁmountꢁneedꢁtoꢁbeꢁonꢁtheꢁ
bottomꢁ side,ꢁ theseꢁ componentsꢁ shouldꢁ beꢁ solderedꢁ
usingꢁreflowꢁsolderingꢁpriorꢁtoꢁinsertionꢁtheꢁTHꢁLED.
Wave Soldering Manual Solder
[1, 2]
Dipping
Pre-heatꢁtemperature ꢀ05ꢁ°CꢁMax.
-
Preheatꢁtime
Peakꢁtemperature
Dwellꢁtime
60ꢁsecꢁMax
260ꢁ°CꢁMax.
5ꢁsecꢁMax.
-
260ꢁ°CꢁMax.
5ꢁsecꢁMax
•ꢁ RecommendedꢁPCꢁboardꢁplatedꢁthroughꢁholesꢁ(PTH)ꢁ
sizeꢁforꢁLEDꢁcomponentꢁleads.
Note:ꢁ
ꢀ)ꢁ Aboveꢁ conditionsꢁ refersꢁ toꢁ measurementꢁ withꢁ thermocoupleꢁ
mountedꢁatꢁtheꢁbottomꢁofꢁPCB.
2)ꢁ Itꢁisꢁrecommendedꢁtoꢁuseꢁonlyꢁbottomꢁpreheatersꢁinꢁorderꢁtoꢁreduceꢁ
thermalꢁstressꢁexperiencedꢁbyꢁLED.
LED component
lead size
Plated through
hole diameter
Diagonal
0.45ꢁxꢁ0.45ꢁmm
0.636ꢁmm
0.98ꢁtoꢁꢀ.08ꢁmm
(0.0ꢀ8xꢁ0.0ꢀ8ꢁinch) (0.025ꢁinch)
0.50ꢁxꢁ0.50ꢁmm 0.707ꢁmm
(0.020xꢁ0.020ꢁinch) (0.028ꢁinch)
(0.039ꢁtoꢁ0.043ꢁinch)
•ꢁ Waveꢁ solderingꢁ parametersꢁ mustꢁ beꢁ setꢁ andꢁ
maintainedꢁ accordingꢁ toꢁ theꢁ recommendedꢁ
temperatureꢁ andꢁ dwellꢁ time.ꢁ Customerꢁ isꢁ advisedꢁ
toꢁ performꢁ dailyꢁ checkꢁ onꢁ theꢁ solderingꢁ profileꢁ toꢁ
ensureꢁthatꢁitꢁisꢁalwaysꢁconformingꢁtoꢁrecommendedꢁ
solderingꢁconditions.
ꢀ.05ꢁtoꢁꢀ.ꢀ5ꢁmm
(0.04ꢀꢁtoꢁ0.045ꢁinch)
•ꢁ Over-sizingꢁ theꢁ PTHꢁ canꢁ leadꢁ toꢁ twistedꢁ LEDꢁ afterꢁ
clinching.ꢁOnꢁtheꢁotherꢁhandꢁunderꢁsizingꢁtheꢁPTHꢁcanꢁ
causeꢁdifficultyꢁinsertingꢁtheꢁTHꢁLED.
8
ReferꢁtoꢁapplicationꢁnoteꢁAN5334ꢁforꢁmoreꢁinformationꢁaboutꢁsolderingꢁandꢁhandlingꢁofꢁhighꢁbrightnessꢁTHꢁLEDꢁlamps.ꢁ
Example of Wave Soldering Temperature Profile for TH LED
260 °C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105 °C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
Note:ꢁTheꢁammo-packsꢁdrawingꢁisꢁapplicableꢁforꢁpackagingꢁoptionꢁ–DDꢁ&ꢁ-ZZꢁandꢁregardlessꢁstandoffꢁorꢁnon-standoff
9
Packaging Box for Ammo Packs
Note:ꢁTheꢁdimensionꢁforꢁammoꢁpackꢁisꢁapplicableꢁforꢁtheꢁdeviceꢁwithꢁstandoffꢁandꢁwithoutꢁstandoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
ꢀ0
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢁ
Example:ꢁ
(i)ꢁColorꢁbinꢁonlyꢁorꢁVFꢁbinꢁonly
(i)ꢁColorꢁbinꢁonlyꢁorꢁVFꢁbinꢁonly
(Applicableꢁ forꢁ partꢁ numberꢁ withꢁ colorꢁ binsꢁ butꢁ
withoutꢁVFꢁbinꢁORꢁpartꢁnumberꢁwithꢁVFꢁbinsꢁandꢁnoꢁ
colorꢁbin)
ꢁ
ꢁ
BIN:ꢁ2ꢁ(representꢁcolorꢁbinꢁ2ꢁonly)
BIN:ꢁVBꢁ(representꢁVFꢁbinꢁ“VB”ꢁonly)
(ii)ꢁColorꢁbinꢁincorporateꢁwithꢁVFꢁBin
ORꢁ
ꢁ
ꢁ
ꢁ
BIN:ꢁ2VB
(ii)ꢁColorꢁbinꢁincorporatedꢁwithꢁVFꢁBin
VB:ꢁVFꢁbinꢁ“VB”
(Applicableꢁ forꢁ partꢁ numberꢁ thatꢁ haveꢁ bothꢁ colorꢁ
binꢁandꢁVFꢁbin)
2:ꢁꢁColorꢁbinꢁ2ꢁonly
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1687EN - December 12, 2008
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