HLMP-CW30-STB00 [AVAGO]
T-1 3/4 SINGLE COLOR LED, BLUE, 5mm;
| 型号： | HLMP-CW30-STB00 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, BLUE, 5mm 光电 |
| 文件： | 总12页 (文件大小：298K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CWxx
3
T-1 / Precision Optical Performance
4
White LED Lamps
Data Sheet
HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24,
HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72
Description
Features
• Highly luminous white emission
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated by
a phosphor to produce white. The typical resulting color
is described by the coordinates x = 0.32, y = 0.32 using
the 1931 CIE Chromaticity Diagram.
• 15°, 23°, 30°, and 70° viewing angle
Applications
• Indoor Electronic signs and signals
• Small area illumination
• Legend backlighting
3⁄
TheseT-1 4lampsareuntinted,nondiffused,andincorpo-
ratepreciseopticsproducingwelldefinedspatialradiation
patterns at specific viewing cone angle.
• General purpose indicators
Benefit
• Reduced power consumption, higher reliability, and in-
creasedoptical/mechanicaldesignflexibilitycompared
to incandescent bulbs and other alternative white light
sources
CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling
and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Min. Luminous Intensity
Iv (mcd) @ 20 mA
Viewing Angle
Typ.
Part Number
Min.
Max.
7200
7200
5500
7200
12000
12000
12000
12000
-
Standoff Leads
No
Package Dimension
HLMP-CW15-TW0xx
HLMP-CW15-TW0xx
HLMP-CW15-UV0xx
HLMP-CW15-VWBxx
HLMP-CW15-VY0xx
HLMP-CW15-VYBxx
HLMP-CW15-VYGxx
HLMP-CW15-VYKxx
HLMP-CW16-R00xx
HLMP-CW16-TW0xx
HLMP-CW16-VY0xx
HLMP-CW23-SV0xx
HLMP-CW23-SVKxx
HLMP-CW23-TW0xx
HLMP-CW24-SV0xx
HLMP-CW24-TW0xx
HLMP-CW30-PS0xx
HLMP-CW30-RU0xx
HLMP-CW30-STBxx
HLMP-CW30-SV0xx
HLMP-CW31-M00xx
HLMP-CW31-PS0xx
HLMP-CW31-SV0xx
HLMP-CW70-LMBxx
HLMP-CW70-LP0xx
HLMP-CW72-LP0xx
Notes:
15°
15°
15°
15°
15°
15°
15°
15°
15°
15°
15°
23°
23°
23°
23°
23°
30°
30°
30°
30°
30°
30°
30°
70º
70º
70º
2500
2500
3200
4200
4200
4200
4200
4200
1500
2500
4200
1900
1900
2500
1900
2500
880
A
A
A
A
A
A
A
A
B
B
B
A
A
A
B
B
A
A
A
A
B
B
B
A
A
B
No
No
No
No
No
No
No
Yes
Yes
Yes
No
7200
12000
5500
5500
7200
5500
7200
2500
4200
3200
5500
-
No
No
Yes
Yes
No
1500
1900
1900
520
No
No
No
Yes
Yes
Yes
No
880
2500
5500
680
1900
400
400
1150
1150
No
400
Yes
1. Tolerance for each intensity limit is 15ꢀ.
2. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
2
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
Package Dimensions
5.ꢀꢀ ꢀ.ꢁꢀ
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
(ꢀ.197 ꢀ.ꢀꢀ08
d
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
ꢁ.35 (ꢀ.ꢀ938
MAX.
1.5ꢀ ꢀ.15
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
31.6ꢀ
(1.ꢁ448
MIN.
31.6ꢀ
MIN.
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
(1.ꢁ448
MAX.
CATHODE
LEAD
CATHODE
LEAD
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
1.ꢀꢀ
MIN.
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
(ꢀ.ꢀ398
1.ꢀꢀ
MIN.
(ꢀ.ꢀ398
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
CATHODE
FLAT
CATHODE
FLAT
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
PACKAGE DIMENSION A
PACKAGE DIMENSION B
NOTES:
HLMP-CW16
HLMP-CWꢁ4
HLMP-CW31
HLMP-CW7ꢁ
d = 1ꢁ.6 ꢀ.ꢁ5 d = 1ꢁ.5ꢁ ꢀ.ꢁ5 d = 11.96 ꢀ.ꢁ5 d = 1ꢁ.5ꢁ ꢀ.ꢁ5
(ꢀ.496 ꢀ.ꢀ1ꢀ8 (ꢀ.493 ꢀ.ꢀ1ꢀ8 (ꢀ.471 ꢀ.ꢀ1ꢀ8 (ꢀ.493 ꢀ.ꢀ1ꢀ8
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES8.
ꢁ. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (ꢀ.ꢀ4ꢀ"8 DOWN THE LEADS.
3
Part Numbering System
HLMP
– C Wxx - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Option
0: Full color bin distribution
B: Color bins 2 & 3
G: Color bins 2, 3 & 4
K: Color bins 2 & 4
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle and Standoff Option
15: 15° without standoffs
16: 15° with standoffs
23: 23° without standoffs
24: 23° with standoffs
30: 30° without standoffs
31: 30° with standoffs
70: 50° without standoffs
72: 50° with standoffs
Note: Please refer to AB 5337 for complete information about part numbering system.
4
Absolute Maximum Ratings
T = 25˚C
A
Parameter
Value
30
Units
mA
mA
mW
V
oC
oC
DC Forward Current[1]
Peak Forward Current[2]
Power Dissipation
100
111
Reverse Voltage (IR = 10 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
5
110
–40 to +80
–40 to +100
oC
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty factor 10ꢀ Frequency 1 kHz.
Electrical Characteristics
T = 25°C
A
Forward Voltage,
Reverse Breakdown,
Capacitance, C (pF),
V = 0, f = 1 MHz
F
Thermal Resistance
Rθ (°C/W)
V (V) @ I = 20 mA
V (V) @ I = 10 µA
F
F
R
R
J-PIN
Typ.
Max.
Min.
Typ.
Typ.
3.2
3.7
5
70
240
Optical Characteristics
T = 25°C
A
Typical Chromaticity
Coordinates
Viewing Angle
2θ Degrees
1/2
[1]
[2]
Part Number
X
Y
Typ.
HLMP-CW3x-xxxxx
HLMP-CW2x-xxxxx
HLMP-CW1x-xxxxx
HLMP-CW7x-xxxxx
Notes:
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
30
23
15
50
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
1
2. θ is the off-axis angle where the luminous intensity is
⁄ the peak intensity.
2
1/2
5
1.ꢀ
ꢀ.0
ꢀ.6
ꢀ.4
ꢀ.ꢁ
ꢀ
35
3ꢀ
ꢁ5
ꢁꢀ
15
1ꢀ
1.5
1.ꢁ
ꢀ.9
ꢀ.6
ꢀ.3
ꢀ
5
ꢀ
30ꢀ
40ꢀ
50ꢀ
60ꢀ
70ꢀ
ꢀ
1
ꢁ
3
4
ꢀ
1ꢀ
ꢁꢀ
3ꢀ
FORWARD VOLTAGE – V
FORWARD CURRENT – mA
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength
Figure 2. Forward current vs. forward voltage
Figure 3. Relative lv vs. forward current
ꢀ.ꢀꢁ5
ꢀ.ꢀꢁꢀ
ꢀ.ꢀ15
35
30
25
20
15
10
5
1 mA
5 mA
ꢀ.ꢀ1ꢀ
1ꢀ mA
15 mA
ꢀ.ꢀꢀ5
ꢀ
ꢁꢀ mA
ꢁ5 mA
-ꢀ.ꢀꢀ5
-ꢀ.ꢀ1ꢀ
3ꢀ mA
0
0
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE -
-ꢀ.ꢀꢀ4
-ꢀ.ꢀꢀꢁ
ꢀ
ꢀ.ꢀꢀꢁ
ꢀ.ꢀꢀ4
°
C
X-COORDINATES
(X,Y8 VALUES @ ꢁꢀ mA REFERENCE TO (ꢀ,ꢀ8
Figure 4. Chromaticity shift vs. current
Figure 5. Maximum forward current vs. temperature
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT – DEGREES
Figure 6a. CW1x spatial radiation pattern
6
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
6ꢀ
6ꢀ
9ꢀ
9ꢀ
9ꢀ
ANGULAR DISPLACEMENT – DEGREES
Figure 6b. CW2x spatial radiation pattern
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW3x spatial radiation pattern
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW7x spatial radiation pattern
7
Intensity Bin Limits
Color Bin Limit Table
(mcd at 20 mA)
Rank
Limits (Chromaticity Coordinates)
1
x
y
0.330
0.360
0.330
0.318
0.356
0.351
0.361
0.385
Bin
L
Min.
Max.
520
400
2
3
4
x
y
0.287
0.295
0.296
0.276
0.330
0.318
0.330
0.339
M
N
P
520
680
680
880
x
y
0.264
0.267
0.280
0.248
0.296
0.276
0.283
0.305
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
x
y
0.283
0.305
0.287
0.295
0.330
0.339
0.330
0.360
Q
R
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
Tolerance for each bin limit is 0.01.
S
T
Note:
U
V
Bin categories are established for classification of products. Products may not be available in all
bin categories. Please contact your Avago representative for information on currently available
bins.
W
X
Y
Color Bin Limits with Respect to CIE
1931 Chromaticity Diagram
Z
ꢀ.4ꢀ
Tolerance for each bin limit is 1ꢀ5%
ꢀ.35
1
4
BLACK
BODY
CURVE
ꢁ
ꢀ.3ꢀ
ꢀ.ꢁ5
ꢀ.ꢁꢀ
3
ꢀ.ꢁ6
ꢀ.3ꢀ
ꢀ.34
ꢀ.30
X-COORDINATE
Relative Light Output vs. Junction Temperature
10
1
0.1
-40
-20
0
20
40
60
80
100
TJ - JUNCTION TEMPERATURE - °C
8
Note:
Precautions:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
CATHODE
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
1.59mm
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
Pre-heat temperature 105 °C Max.
-
Preheat time
Peak temperature
Dwell time
60 sec Max
250 °C Max.
3 sec Max.
-
• Recommended PC board plated through holes (PTH)
260 °C Max.
5 sec Max
size for LED component leads.
LED component
lead size
Plated through
hole diameter
Diagonal
Note:
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
9
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
PREHEAT
0
80
90
10
30
40
50
70
100
20
60
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
A
4.00 ± 0.20
(0.1575 ± 0.008)
12.70 ± 0.30
(0.50 ± 0.0118)
∅
TYP.
VIEW A–A
0.70 ± 0.20
(0.0276 ± 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammopacks drawing is applicable to option -DD & -ZZ and regardless of standoff or non standoff.
10
Packaging Box Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
+
A
C
AVAGO
TECHNOLOGIES
ANODE
–
CATHODE
ANODE LEAD LEAVES
THE BOX FIRST.
MOTHER LABEL
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN
(Q) QTY: Quantity
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID
BIN: Refer to below information
REV:
DeptID:
Made In: Country of Origin
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-
CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries%
Data subject to change% Copyright © 200ꢀ-2008 Avago Technologies Limited% All rights reserved% Obsoletes ꢀ989-412ꢀEN
AV02-0214EN - April 4, 2008
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