HLMP-CW12-YZ0DD [AVAGO]
T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-CW12-YZ0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2 |
| 文件： | 总14页 (文件大小：419K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CWxx
Precision Optical Performance
White LED Lamps
Data Sheet
HLMP-CW11, HLMP-CW12, HLMP-CW26, HLMP-CW27, HLMP-CW36, HLMP-CW37,
HLMP-CW46, HLMP-CW47, HLMP-CW76, HLMP-CW77, HLMP-FW66, HLMP-FW67
Description
Features
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated by
phosphor to produce white. The typical resulting color is
described by the coordinates x = 0.31, y = 0.31 using the
• Well defined spatial radiation pattern
• High luminous white emission
• Viewing angle: 15°, 23° and 30°, 50°, 70°, 85°
1931 CIE Chromaticity Diagram. These T-1 ¾ lamps are • Standoff or non-standoff leads
untinted, non-diffused, and incorporate precise optics
which produce well-defined spatial radiation patterns at
• Superior resistance to moisture
specific viewing cone angle.
Applications
• Indoor electronic signs and signals
• Small area illumination
Benefits
• Reduced power consumption, higher reliability,
and increased optical/mechanical design flexibility
compared to incandescent bulbs and other alternative
white light sources.
• Legend backlighting
• General purpose indicators
Caution: InGaN devices are Class 1C HBM ESD Sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
For 5mm Round 15°, 23° & 30° Package
Package Dimension B
Package Dimension A
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
8.71 ± 0.20
(0.343 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
(0.045 ± 0.008)
DIMENSION H
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
31.60
(1.244)
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
1.00
MIN.
SQ. TYP.
1.00
(0.039)
MIN.
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
2.54 ± 0.38
(0.100 ± 0.015)
DIMENSIONH:
15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches)
23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches)
30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches)
ꢀ
For 5mm Round 50° and 70° Package
Package Dimension C
Package Dimension D
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
DIMENSION H
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
31.60
(1.244)
31.60
MIN.
(0.059 ± 0.006)
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
1.00
MIN.
SQ. TYP.
1.00
MIN.
(0.039)
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
2.54 ± 0.38
(0.100 ± 0.015)
DIMENSION H:
Notes:
1 . All dimensions are in millimeters /inches.
2 . Epoxy meniscus may extend about 1mm
(0.040") down the leads.
50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches)
70°: 11.09 ± 0.25mm (0.4365 ± 0.01 inches)
3 . If heat-sinking application is required, the
terminal for heat sink is anode.
ꢁ
For Flat Top 85° Package
Package Dimension E
Package Dimension F
5.00±0.20
5.00±0.20
[ 0.197±0.008 ]
[ 0.197±0.008 ]
7.00±0.20
[ 0.278±0.008 ]
11.02±0.25
[ 0.434±0.010 ]
1.14±0.20
[ 0.045±0.008 ]
1.14±0.20
[ 0.045±0.008 ]
31.60 MIN.
[ 1.244 ]
31.60 MIN.
[ 1.244 ]
CATHODE
LEAD
CATHODE�
LEAD
1.00
MIN.
0.50±0.10
[ 0.020±0.004 ]
1.00
MIN.
0.50±0.10
[ 0.020±0.004 ]
SQ. TYP.
SQ. TYP.
[ 0.038 ]
[ 0.038 ]
5.72±0.20
[ 0.225±0.008 ]
5.72±0.20
[ 0.225±0.008 ]
CATHODE
FLAT
CATHODE
FLAT
2.54±0.38
[ 0.100±0.015 ]
2.54±0.38
[ 0.100±0.015 ]
Notes:
1. All dimensions are in millimeters /inches.
2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
3. If heat-sinking application is required, the terminal for heat sink is anode.
ꢂ
Part Numbering System
HLMP - x W xx - x x x x x
Packaging Option
00: Flexi Ammo packs
DD: Ammo Packs
Color Bin Selection
0: Open distribution
B: Color Bin 2 & 3
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Devise Selection Guide
Viewing Angle and Standoff Option
11: 15° without standoff
12: 15° with standoff
26: 23° without standoff
27: 23° with standoff
36: 30° without standoff
37: 30° with standoff
46: 50° without standoff
47: 50° with standoff
76: 70° without standoff
77: 70° with standoff
66: 85° Flat top without standoff
67: 85° Flat top with standoff
Package
C: 5mm Round
F: 5mm Flat Top
Note: Please refer to AB 5337 for complete information about part numbering system.
ꢃ
Device Selection Guide
Luminous Intensity (mcd) at 20mA
Typical Viewing
Part Number
Angle 2θ (Degree)
Min.
7200
9300
9300
7200
9300
9300
4200
5500
5500
4200
5500
3200
3200
4200
4200
3200
4200
4200
1500
1900
1900
1900
1500
1900
1900
1150
1150
1500
1500
1150
1500
1500
520
Max.
21000
21000
16000
21000
16000
16000
12000
9300
9300
12000
9300
9300
9300
7200
7200
9300
7200
7200
4200
3200
3200
5500
4200
3200
3200
3200
3200
2500
2500
3200
2500
2500
1500
1150
1150
1500
1150
1150
Standoff
No
Package Dimension
1/2
HLMP-CW11-X10xx
HLMP-CW11-Y1Bxx
HLMP-CW11-YZ0xx
HLMP-CW12-X10xx
HLMP-CW12-YZ0xx
HLMP-CW12-YZBxx
HLMP-CW26-VY0xx
HLMP-CW26-WX0xx
HLMP-CW26-WXBxx
HLMP-CW27-VY0xx
HLMP-CW27-WX0xx
HLMP-CW36-UX0xx
HLMP-CW36-UXBxx
HLMP-CW36-VW0xx
HLMP-CW36-VWBxx
HLMP-CW37-UX0xx
HLMP-CW37-VW0xx
HLMP-CW37-VWBxx
HLMP-CW46-RU0xx
HLMP-CW46-ST0xx
HLMP-CW46-STBxx
HLMP-CW46-SVBxx
HLMP-CW47-RU0xx
HLMP-CW47-ST0xx
HLMP-CW47-STBxx
HLMP-CW76-QT0xx
HLMP-CW76-QTBxx
HLMP-CW76-RS0xx
HLMP-CW76-RSBxx
HLMP-CW77-QT0xx
HLMP-CW77-RS0xx
HLMP-CW76-RSBxx
HLMP-FW66-MQ0xx
HLMP-FW66-NP0xx
HLMP-FW66-NPBxx
HLMP-FW67-MQ0xx
HLMP-FW67-NP0xx
HLMP-FW67-NPBxx
15
15
15
15
15
15
23
23
23
23
23
30
30
30
30
30
30
30
50
50
50
50
50
50
50
70
70
70
70
70
70
70
85
85
85
85
85
85
A
A
A
B
B
B
A
A
A
B
B
A
A
A
A
B
B
B
C
C
C
C
D
D
D
C
C
C
C
D
D
D
E
No
No
Yes
Yes
Yes
No
No
No
Yes
Yes
No
No
No
No
Yes
Yes
Yes
No
No
No
No
Yes
Yes
Yes
No
No
No
No
Yes
Yes
Yes
No
680
No
E
680
No
E
520
Yes
Yes
Yes
F
680
F
680
F
Note: Please refer to AN 5352 for detail information on the features of stand-off and non stand-off LEDs.
ꢄ
Absolute Maximum Rating, T = 25°C
A
Parameter
White
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
30
100 [2]
120
Reverse Voltage
5 (IR = 10 μA)
110
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 2
2. Duty Factor 10%, frequency 1kHz.
Optical/ Electrical Performance at 25°C
Parameter
Symbol
VF
Min
Typ
Max
Units
V
Test Condition
IF = 20 mA
Forward Voltage
Reverse Voltage
Thermal Resistance
Chromaticity Coordinate
3.2
4.0
VR
5.0
V
IR = 10 µA
RθJ-PIN
240
˚C/W
LED junction to anode lead
IF = 20 mA
X
y
0.31
0.31
Capacitance
Note:
C
70
VF = 0,cf= 1MHz
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
ꢅ
1.0
35
30
25
20
15
10
5
0.8
0.6
0.4
0.2
0.0
0
0
20
40
60
80
100
380
480
580
680
780
WAVELENGTH - nm
TA - AMBIENT TEMPERATURE - °C
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Ambient Temperature
0.025
0.020
1.5
1.2
0.9
0.6
0.3
0
1mA
0.015
5mA
0.010
10mA
0.005
0.000
20mA
-0.005
30mA
-0.010
0
10
20
30
-0.005
0.000
0.005
0.010
0.015
FORWARD CURRENT - mA
X-COORDINATES
Figure 3. Relative Intensity vs DC Forward Current
Figure 4. Chromaticity shift vs Forward Current
30
25
20
15
10
5
0
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
VF - FORWARD VOLTAGE - VOLTS
Figure 5. Forward Current vs Forward Voltage
ꢆ
1
0.5
0
1
0.5
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT (°)
ANGULAR DISPLACEMENT (°)
Figure 6. Radiation Pattern for HLMP-CW1x
Figure 7. Radiation Pattern for HLMP-CW2x
1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.5
0.1
0
0
-90
-60
-30
0
30
60
90
100° 90° 80° 70° 60° 50° 40° 30° 20° 10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
ANGULAR DISPLACEMENT (°)
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Radiation Pattern for HLMP-CW3x
Figure 9. Radiation Pattern for HLMP-CW4x
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1.0
0.5
0.0
0.1
0
100° 90° 80° 70° 60° 50° 40° 30° 20° 10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR REPLACEMENT - DEGREE
Figure 10. Radiation Pattern for HLMP-CW7x
Figure 11. Radiation Pattern for HLMP-FW6x
ꢇ
Intensity Bin Limit Table at 20mA
Color Bin Limit Table
Intensity (mcd) at 20 mA
Rank
Limits (Chromaticity Coordinates)
Bin
M
N
P
Min
520
Max
680
1
X
Y
X
Y
X
Y
X
Y
0.330
0.360
0.287
0.295
0.264
0.267
0.283
0.305
0.330
0.318
0.296
0.276
0.280
0.248
0.287
0.295
0.356
0.351
0.330
0.318
0.296
0.276
0.330
0.339
0.361
0.385
0.330
0.339
0.283
0.305
0.330
0.360
680
880
2
3
4
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
Q
R
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
S
T
U
V
W
X
Tolerance for each bin limit is ± 0.01
Note:
Y
1. Bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact your Avago
Technologies representative for information on currently available
bins.
Z
1
Tolerance for each bin limit is ± 15%
Relative Light Output vs Junction Temperature
Color Bin Limits with Respect to CIE 1931 Chromaticity
Diagram
10
0.40
1
0.35
1
4
BLACK
BODY
CURVE
2
0.30
0.1
-40
-20
0
20
40
60
80
100
3
TJ - JUNCTION TEMPERATURE - ˚C
0.25
0.20
0.26
0.30
0.34
0.38
X-COORDINATE
Note:
Bin categories are established for classification of products. Products
may not be available in all bin categories.
Please contact your Avago representative for information on currently
available bins.
10
Note:
Precautions:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
Anode
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
1.59mm
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Manual Solder
Dipping
[1, 2]
Soldering
Pre-heat temperature
Preheat time
10ꢃ °C Max.
ꢄ0 sec Max
ꢀꢃ0 °C Max.
ꢁ sec Max.
-
-
• Recommended PC board plated through holes (PTH)
Peak temperature
Dwell time
ꢀꢄ0 °C Max.
ꢃ sec Max
size for LED component leads.
LED component
lead size
Plated through
hole diameter
Diagonal
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
0.ꢂꢃ x 0.ꢂꢃ mm
(0.01ꢆx 0.01ꢆ inch)
0.ꢄꢁꢄ mm
(0.0ꢀꢃ inch)
0.ꢇꢆ to 1.0ꢆ mm
(0.0ꢁꢇ to 0.0ꢂꢁ inch)
0.ꢃ0 x 0.ꢃ0 mm
0.ꢅ0ꢅ mm
1.0ꢃ to 1.1ꢃ mm
(0.0ꢀ0x 0.0ꢀ0 inch)
(0.0ꢀꢆ inch)
(0.0ꢂ1 to 0.0ꢂꢃ inch)
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
11
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
PREHEAT
0
80
90
10
30
40
50
70
100
20
60
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.807 0.039
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
ø\C7;4.00 0.20TYP.
0.1575 0.008
A
A
12.70 0.30
0.50 0.0118
VIEW A-A
0.70 0.20
0.0276 0.0079
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
1ꢀ
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVETAPE MUST BE
FACING UPWARDS.
LABEL ONTHIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN
(Q) QTY: Quantity
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID
BIN: Refer to below information
REV:
DeptID:
Made In: Country of Origin
1ꢁ
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICA-
TIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS
SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © ꢀ00ꢃ-ꢀ00ꢆ Avago Technologies Limited. All rights reserved.
AV0ꢀ-0ꢁꢄꢆEN - April 1, ꢀ00ꢆ
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
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SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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