HLMP-CM25-X10DD [AVAGO]
Precision Optical Performance Blue and Green; 精密光学性能的蓝色和绿色
| 型号： | HLMP-CM25-X10DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Precision Optical Performance Blue and Green |
| 文件： | 总10页 (文件大小：626K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CBxx, HLMP-CMxx
Precision Optical Performance Blue and Green
Data Sheet
Description
Features
This high intensity blue and green LEDs are based on the
most efficient and cost effective InGaN material tech-
nology. This LED lamps is untinted and non-diffused, T-
1 ¾ packages incorporating second-generation optics
• Well defined spatial radiation pattern
• High luminous output
• Untinted, Non-diffused
producing well defined spatial radiation patterns at • Viewing angle: 15º, 23º and 30º
specific viewing cone angles.
• Standoff or non-standoff leads
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture re-
sistance in outdoor signal and sign applications. The
package epoxy contains both UV-A and UV-B inhibitors
to reduce the effects of long term exposure to direct
sunlight.
• Superior resistance to moisture
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicator
Package Dimensions
5.00 0.20
5.00 0.20
(0.197 0.008)
(0.197 0.008)
8.71 0.20
1.14 0.20
8.71 0.20
(0.343 0.008)
(0.045 0.008)
(0.343 0.008)
d
1.14 0.20
2.35 (0.093)
MAX.
(0.045 0.008)
1.50 0.15
0.70 (0.028)
MAX.
(0.059 0.006)
31.60
31.60
MIN.
MIN.
(1.244)
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 0.10
(0.020 0.004)
0.50 0.10
SQ. TYP.
SQ. TYP.
1.00
MIN.
1.00
MIN.
(0.020 0.004)
(0.039)
(0.039)
5.80 0.20
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
(0.228 0.008)
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
2.54 0.38
(0.100 0.015)
PACKAGE DIMENSION A
PACKAGE DIMENSION B
HLMP-Cx25
HLMP-Cx14
HLMP-Cx35
d = 12.6 0.25 d = 12.52 0.25 d = 11.96 0.25
(0.496 0.010) (0.493 0.010) (0.471 0.010)
Notes:
1. Measured just above flange.
2. All dimensions are in millimeters (inches).
3. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN 1142 for details.
Device Selection Guide
Intensity ꢁmcdꢂ at 20 mA
Typical Viewing Angle,
2�ꢀ ꢁDegreeꢂ
Leads with
Stand-Offs
Part Number
Color
Blue
Min.
Max.
HLMP-CB13-UX0xx
HLMP-CB14-UX0xx
HLMP-CB22-SV0xx
HLMP-CB25-SV0xx
HLMP-CB34-RU0xx
HLMP-CB35-RU0xx
HLMP-CM13-Z30xx
HLMP-CM14-Z30xx
HLMP-CM22-X10xx
HLMP-CM25-X10xx
HLMP-CM34-X10xx
15º
15º
23º
23º
30º
30º
15º
15º
23º
23º
30º
30º
3200
3200
1900
1900
1500
1500
12000
12000
7200
7200
7200
7200
9300
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
Blue
9300
Blue
5500
Blue
5500
Blue
4200
Blue
4200
Green
Green
Green
Green
Green
Green
35000
35000
21000
21000
21000
21000
HLMP-CM35-X10xx
Notes:
1. Tolerance for luminous intensity measurement is 15ꢀ
2. The optical axis is closely aligned with the package mechanical axis.
3. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper
safety equipment.
4. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity.
Part Numbering System
HLMP - x x xx - x x x xx
Packaging Option
DD: Ammopacks
Color Bin Selection
0 : Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle
13: 15º without standoff
14: 15º with standoff
22: 23º without standoff
25: 23º with standoff
34: 30º without standoff
35: 30º with standoff
Color
B: Blue 470nm
M: Green 525nm
Package
C: 5mm round Lamps
Note: Please refer to AB 5337 for complete information on part numbering system.
ꢀ
Absolute Maximum Rating ꢁT = 25ꢃCꢂ
A
Parameters
Value
Unit
mA
mA
mW
°C
DC forward current [1]
Peak pulsed forward current [2]
Power dissipation
30
100
116
LED junction temperature
Operating temperature range
Storage temperature range
110
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in figure 2.
2. Duty factor 10ꢀ, frequency 1KHz.
Electrical/Optical Characteristics ꢁT = 25ꢃCꢂ
A
Blue and Green
Parameters
Symbol
VF
Min
2.8
5.0
Typ
Max
Units
V
Test Condition
Forward Voltage
Reverse Voltage[1]
Thermal resistance
3.2
3.8
IF = 20 mA
VR
V
IR = 10 µA
RθJ-PIN
λd
240
°C/W
nm
LED Junction to cathode lead
IF = 20 mA
Dominant wavelength [2]
Blue
Green
460
520
470
525
480
540
λPEAK
Dλ1/2
ηv
nm
Peak of wavelength of spectral distribu-
tion at IF = 20 mA
Peak wavelength
Blue
464
516
Green
Wavelength width at spectral distribu-
tion 1/2 power point at IF = 20 mA
Spectral half width
Blue
Green
22
35
lm/W
mlm
Emitted luminous power/Emitted
radiant power
Luminous Efficacy [3]
Blue
Green
78
545
φV
If = 20mA
Luminous Flux
Blue
830
Green
3500
ηe
lm/W
Luminous Flux/Electrical Power at IF =
20mA
Luminous Efficiency[4]
Blue
Green
13
56
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I = 10 µA
R
2. The dominant wavelength λd is derived from the Chromaticy Diagram and represents the color pf the lamp.
3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/η , where Iv is the luminous intensity in candelas and η is the
v
v
luminous efficacy in lumens/watt.
4. η = φ / I x V where φ is the emitted luminous flux, I is electrical forward current and V is the forward voltage.
e
V
F
F
V
F
F
ꢁ
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
35
30
25
20
15
10
5
Blue
Green
0
380
430
480
530
580
630
680
730
780
0
20
40
60
80
100
T - AMBIENT TEMPERATURE - °C
WAVELENGTH - nm
A
Figure 1. Relative Intensity vs. Wavelength
Figure 2. Forward Current vs. Ambient Temperature
35
30
25
20
15
10
5
16
14
12
10
8
Green
6
4
Blue
2
0
-2
-4
0
0
1
2
3
4
0
5
10
15
20
25
30
35
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 3. Forward Current vs. Forward Voltage
Figure 4. Relative Dominant Wavelength vs. DC Forward Current
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
DC FORWARD CURRENT - mA
Figure 5. Relative Intensity vs. DC Forward Current
ꢂ
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Spatial Radiation Pattern for 15° lamps
Figure 7. Spatial Radiation Pattern for 23° lamps
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
30
60
90
120
150
180
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Spatial Radiation Pattern for 30° lamps
Note:
All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information
ꢃ
Intensity Bin Limit Table
Green Color Bin Table
Bin Min Dom Max Dom Xmin
Ymin
Xmax Ymax
Intensity ꢁmcdꢂ at 20 mA
1
2
3
4
5
520.0
524.0
528.0
532.0
536.0
524.0
528.0
532.0
536.0
540.0
0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Bin
R
Min
Max
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
27000
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
27000
35000
S
T
U
V
W
X
Y
Z
1
Tolerance for each bin limit is 0.5nm
2
Blue Color Bin Table
3
Tolerance for each bin limit is +/- 15ꢀ
Bin Min Dom Max Dom Xmin
Ymin
Xmax Ymax
0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
1
2
3
4
5
460.0
464.0
468.0
472.0
476.0
464.0
468.0
472.0
476.0
480.0
0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is 0.5nm
Relative Light Output vs. Junction Temperature
10
Green
Blue
1
0.1
-40
-20
0
20
40
60
80
100
120
TJ - JUNCTION TEMPERATURE- °C
ꢄ
Note:
Precautions:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Avago Technologies LED configuration
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
CATHODE
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59mm
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
• Recommended soldering condition:
LED component
lead size
Plated through
hole diameter
Diagonal
Wave
Soldering
Manual Solder
Dipping
0.45 x 0.45 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.636 mm
0.98 to 1.08 mm
[1, 2]
Pre-heat temperature 105 °C Max.
-
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Preheat time
Peak temperature
Dwell time
60 sec Max
250 °C Max.
3 sec Max.
-
260 °C Max.
5 sec Max
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
ꢅ
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
100
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
12.70±1.00
0.50±0.0394
6.35±1.30
0.25±0.0512
CATHODE
20.50±1.00
0.807±0.039
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
∅4.00±0.20TYP.
0.1575±0.008
A
A
12.70±0.30
0.50±0.0118
VIEW A-A
0.70±0.20
0.0276±0.0079
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff.
ꢆ
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE�
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
ꢇ
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-
PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © ꢀ00ꢃ-ꢀ00ꢆ Avago Technologies. All rights reserved.
AV0ꢀ-0ꢄꢅꢆEN - November ꢀ1, ꢀ00ꢆ
相关型号：
©2020 ICPDF网 联系我们和版权申明