HLMP-CM1A-560DD [AVAGO]

New 5mm Blue and Green LED Lamps; 新的5mm蓝和绿色LED灯


型号：	HLMP-CM1A-560DD
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	New 5mm Blue and Green LED Lamps 新的5mm蓝和绿色LED灯
文件：	总12页 (文件大小：381K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HLMP-Cx1A/1B/2A/2B/3A/3B

New 5mm Blue and Green LED Lamps

Data Sheet

Description

Features

These high intensity blue and green T-1¾ package LEDs

are untinted and non-diﬀused. Based on the most eﬃcient

and cost eﬀective InGaN material technology and incor-

porating second generation optics they produce well

•ꢀ Well deﬁned spatial radiation pattern

•ꢀ High luminous output

•ꢀ Untinted, Non-diﬀused

deﬁned spatial radiation patterns at speciﬁc viewing cone •ꢀ Available in Color:

angles.

– Blue 470nm

– Green 525nm

Advancedopticalgradeepoxyconstructionoﬀerssuperior

high temperature and moisture resistance performance in

outdoor signal and sign applications. The epoxy contains

UV inhibitor ro reduce the eﬀects of long term exposure

to direct sunlight.

•ꢀ Viewing Angle: 15°, 23° and 30°

•ꢀ Standoﬀ or non-standoﬀ

•ꢀ Superior resistance to moisture

Applications

•ꢀ Commercial outdoor advertising

•ꢀ Traﬃc Sign

•ꢀ Variable Message Sign

CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.

Package Dimensions

Drawing A (Non-standoﬀ)

1.00 0.20

0.039 0.008

5.80 0.20

8.70 0.20

0.343 0.008

0.228 0.008

0.70 max

0.028

0.50 0.10 sq. typ.

0.020 0.004

5.00 0.20

2.54 0.38

0.197 0.008

0.100 0.015

Cathode

31.60 min

1.244

1.00 min

0.039

cathode

ﬂat

Drawing B (Standoﬀ)

1.00 0.20

0.039 0.008

1.30 0.15

0.051 0.006

5.80 0.20

0.228 0.008

8.70 0.20

0.343 0.008

0.70 max

0.028

0.50 0.10 sq. typ.

0.020 0.004

5.00 0.20

2.54 0.38

0.197 0.008

0.100 0.015

Cathode

1.00 min

0.039

cathode

ﬂat

31.60 min

1.244

Viewing Angle

HLMP-Cx1B

12.96 0.25

(0.510 0.010ꢀ

HLMP-Cx2B

HLMP-Cx3B

12.32 0.25

(0.485 0.010ꢀ

Notes:

1. All dimensions are in millimeters (inchesꢀ

2. Leads are mild steel with tin plating.

3. The epoxy meniscus is 1.50mm max

12.00 0.25

(0.472 0.010ꢀ

Device Selection Guide

Luminous Intensity I (mcd) at 20

[1,2,5]

Typical Viewing

Standoﬀ /

Non Standoﬀ

Package

drawing

[4]

Part Number

Color

angle, 2θ (°)

Min

Max

HLMP-CB1A-XY0DD

HLMP-CB1A-XYBDD

HLMP-CB1A-XYCDD

HLMP-CB1B-XY0DD

HLMP-CB1B-XYBDD

HLMP-CB1B-XYCDD

HLMP-CB2A-VW0DD

HLMP-CB2A-VWBDD

HLMP-CB2A-VWCDD

HLMP-CB2B-VW0DD

HLMP-CB2B-VWBDD

HLMP-CB2B-VWCDD

HLMP-CB3A-UV0DD

HLMP-CB3A-UVBDD

HLMP-CB3A-UVCDD

HLMP-CB3B-UV0DD

HLMP-CB3B-UVBDD

HLMP-CB3B-UVCDD

HLMP-CM1A-560DD

HLMP-CM1B-560DD

HLMP-CM2A-230DD

HLMP-CM2B-230DD

HLMP-CM3A-Z10DD

HLMP-CM3A-Z1BDD

HLMP-CM3A-Z1CDD

HLMP-CM3B-Z10DD

HLMP-CM3B-Z1BDD

HLMP-CM3B-Z1CDD

Notes:

Blue

15°

23°

30°

7200

12000

Non Standoﬀ

Standoﬀ

4200

3200

7200

5500

Non Standoﬀ

Standoﬀ

Non Standoﬀ

Standoﬀ

Green

15°

23°

30°

45000

21000

12000

76000

35000

21000

Non Standoﬀ

Standoﬀ

Non Standoﬀ

Standoﬀ

Non Standoﬀ

Standoﬀ

1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.

2. The optical axis is closely aligned with the package mechanical axis.

3. Dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

θ is the oﬀ-axis angle where the luminous intensity is half the on-axis intensity.

5. Tolerance for each bin limit is 15ꢁ

Part Numbering System

HLMP  C x xx  x x x xx

Packaging Option

DD: Ammo Pack

Color Bin Selection

0: Full Distribution

B: Color Bin 2 & 3

C: Color Bin 3 & 4

Maximum Intensity Bin

0: No maximum intensity limit (refer to selection guide)

Minimum Intensity Bin

Refer to Device Selection Guide

Viewing Angle and Lead Standoﬀs

1A: 15° without lead standoﬀ

1B: 15° with lead standoﬀ

2A: 23° without lead standoﬀ

2B: 23° with lead standoﬀ

3A: 30° without lead standoﬀ

3B: 30° with lead standoﬀ

Color

B: Blue 470

M: Green 525

Note: please refer to AB 5337 for complete information on part numbering system

Absolute Maximum Ratings

T = 25°C

Parameter

Blue / Green

100 ^[2]

Unit

DC Forward Current ^[1]

Peak Forward Current

Power Dissipation

116

Reverse Voltage

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

110

°C

-40 to + 85

-40 to + 100

°C

Notes:

1. Derate linearly as shown in ﬁgure 4.

2. Duty Factor 10ꢁ, frequency 1KHz.

Electrical / Optical Characteristics

T = 25°C

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Forward Voltage

Green / Blue

V_F

I_F= 20 mA

2.8

3.2

3.8

Reverse Voltage

V_R

I_R= 10 µA

Dominant Wavelength^[1]

Green

Blue

λ_d

I_F= 20 mA

519.0

460.0

525.0

470.0

539.0

480.0

Peak Wavelength

Green

Blue

λ_PEAK

Peak of Wavelength of Spectral

Distribution at I_F= 20 mA

516

464

Spectral Half Width

Δλ_1/2

I_F= 20mA

Green

Blue

Thermal Resistance

Luminous Eﬃcacy ^[2]

Green

Blue

Rθ_J-PIN

240

°C/W

lm/W

LED Junction-to-Pin

η_V

Emitted Luminous Flux /

Emitted Radiant Flux

518

Thermal coeﬃcient of λ_d

Green

Blue

nm/°C

I_F= 20 mA ; +25°C ≤ T_J≤ +100°C

0.028

0.024

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp

2. The radiant intensity, I in watts per steradian, may be found from the equation I = I /η where I is the luminous intensity in candelas and η is

the luminous eﬃcacy in lumens/watt.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

100

BLUE

GREEN

380

430

480

530

580

630

WAVELENGTH - nm

FORWARD VOLTAGE-V

Figure 1. Relative Intensity vs Wavelength

Figure 2. Forward Current vs Forward Voltage

3.5

BLUE

3.0

2.5

2.0

1.5

1.0

0.5

0.0

GREEN

100

120

100

DC FORWARD CURRENT-mA

_A- AMBIENT TEMPERATURE - °C

Figure 3. Relative Intensity vs Forward Current

Figure 4. Maximum Forward Current vs Ambient Temperature

1.0

0.8

0.6

0.4

0.2

0.0

GREEN

BLUE

-5

-10

100

-90

-60

-30

FORWARD CURRENT-mA

ANGULAR DISPLACEMENT -DEGREE

Figure 5. Relative Dominant Wavelength Shift vs Forward Current

Figure 6. Radiation Pattern for 15°

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREE

Figure 7. Radiation Pattern for 23°

Figure 8. Radiation Pattern for 30°

0.3

0.2

0.1

Blue

Green

Blue

Green

-0.1

-0.2

-0.3

0.1

-40

-20

100 120

-40

-20

100 120

T_J- JUNCTION TEMPERATURE

Figure 9. Relative Light Output vs Junction Temperature

Figure 10. Relative Forward Voltage vs Junction Temperature

Intensity Bin Limit Table (1.3:1 Iv bin ratio)

Intensity (mcd) at 20mA

Bin

Min

3200

Max

4200

5500

7200

9300

12000

16000

21000

27000

35000

45000

59000

76000

12000

16000

21000

27000

35000

45000

59000

Tolerance for each bin limit is 15ꢁ

Green Color Bin Table

Min Max Corner

Bin Dom Dom Point Chromaticity Coordinate

Blue Color Bin Table

Min Max Corner

Bin Dom Dom Point Chromaticity Coordinate

519 523

523 527

527 531

531 535

535 539

0.0667 0.1200 0.1450 0.0979

0.8323 0.7375 0.7319 0.8316

0.0979 0.1450 0.1711 0.1305

0.8316 0.7319 0.7218 0.8189

0.1305 0.1711 0.1967 0.1625

0.8189 0.7218 0.7077 0.8012

0.1625 0.1967 0.2210 0.1929

0.8012 0.7077 0.6920 0.7816

0.1929 0.2210 0.2445 0.2233

0.7816 0.6920 0.6747 0.7600

460 464

464 468

468 472

472 476

476 480

0.1440 0.1818 0.1766 0.1374

0.0297 0.0904 0.0966 0.0374

0.1374 0.1766 0.1699 0.1291

0.0374 0.0966 0.1062 0.0495

0.1291 0.1699 0.1616 0.1187

0.0495 0.1062 0.1209 0.0671

0.1187 0.1616 0.1517 0.1063

0.0671 0.1209 0.1423 0.0945

0.1063 0.1517 0.1397 0.0913

0.0945 0.1423 0.1728 0.1327

Tolerance for each bin limit is 0.5 nm.

Tolerance for each bin limit is 0.5 nm

Note:

1. All bin categories are established for classiﬁcation of products. Products may not be available in all bin categories. Please contact your Avago

representative for further information.

Precautions:

Lead Forming:

• The leads of an LED lamp may be preformed or cut to

Note:

1. PCB with diﬀerent size and design (component densityꢀ will have

diﬀerent heat mass (heat capacityꢀ. This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

proﬁle again before loading a new type of PCB.

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

Avago Technologies LED Conﬁguration

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Soldering and Handling:

CATHODE

• Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.

• LED component may be eﬀectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat source

(soldering iron’s tipꢀ to the body is 1.59mm. Soldering

the LED using soldering iron tip closer than 1.59mm

might damage the LED.

InGaN Device

• Any alignment ﬁxture that is being applied during

wave soldering should be loosely ﬁtted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during wave

soldering process.

• ESD precaution must be properly applied on the

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment ﬁxture or pallet.

1.59mm

• If PCB board contains both through hole (THꢀ LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reﬂow soldering prior to insertion the TH LED.

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

• Recommended PC board plated through holes (PTHꢀ

• Recommended soldering condition:

size for LED component leads.

Wave

Soldering

Manual Solder

Dipping

[1, 2]

LED component

lead size

Plated through

hole diameter

Diagonal

Pre-heat temperature 105°C Max.

0.45 x 0.45 mm

0.636 mm

0.98 to 1.08 mm

(0.039 to 0.043 inchꢀ

Preheat time

Peak temperature

Dwell time

60 sec Max

260°C Max.

5 sec Max.

(0.018x 0.018 inchꢀ (0.025 inchꢀ

0.50 x 0.50 mm 0.707 mm

(0.020x 0.020 inchꢀ (0.028 inchꢀ

260°C Max.

5 sec Max

1.05 to 1.15 mm

(0.041 to 0.045 inchꢀ

• Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diﬃculty inserting the TH LED.

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

Refer to application note AN5334 for more information about

soldering and handling of high brightness TH LED lamps.

• Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. Customer is advised to perform daily check on the

soldering proﬁle to ensure that it is always conforming

to recommended soldering conditions.

Example of Wave Soldering Temperature Proﬁle for TH LED

260°C Max

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin ﬂux

Solder bath temperature: 255°C 5°C

(maximum peak temperature = 260°C)

105°C Max

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

60 sec Max

Note: Allow for board to be suﬃciently

cooled to room temperature before

exerting mechanical force.

TIME (sec)

Ammo Packs Drawing

6.35 ꢀ.3ꢁ

ꢁ.25ꢁ ꢁ.ꢁ5ꢀ

ꢀ2.7ꢁ ꢀ.ꢁꢁ

ꢁ.5ꢁꢁ ꢁ.ꢁ3ꢂ

CATHODE

2ꢁ.5 ꢀ.ꢁꢁ

ꢁ.8ꢁ7ꢁ ꢁ.ꢁ3ꢂꢃ

ꢂ.ꢀ25 ꢁ.625

ꢁ.35ꢂ5 ꢁ.ꢁ2ꢃ5

ꢀ8.ꢁꢁ ꢁ.5ꢁ

ꢁ.7ꢁ85 ꢁ.ꢁꢀꢂ5

ꢃ.ꢁꢁ ꢁ.2ꢁ

ꢁ.ꢀ575 ꢁ.ꢁꢁ75

ꢁ.7ꢁ ꢁ.2ꢁ

ꢁ.ꢁ275 ꢁ.ꢁꢁ75

TYP.

ꢀ2.7ꢁ ꢁ.3ꢁ

ꢁ.5ꢁꢁ ꢁ.ꢁꢀ2

VIEW AA

Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoﬀ or non-standoﬀ

Packaging Box for Ammo Packs

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

LABEL ON THIS

SIDE OF BOX

ANODE LEAD LEAVES

THE BOX FIRST.

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label

(iꢀ Avago Mother Label: (Available on packaging box of ammo pack and shipping boxꢀ

STANDARD LABEL LS0002

RoHS Compliant

(1P) Item: Part Number

max temp 260C

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Color Bin

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

(iiꢀ Avago Baby Label (Only available on bulk packagingꢀ

RoHS Compliant

e3 max temp 260C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

BIN: Color Bin

Supplier Code:

DATECODE: Date Code

DISCLAIMER: Avago’s products and software are not speciﬁcally designed, manufactured or authorized for

sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a

nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to

make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-2228EN - May 22, 2013

HLMP-CM1A-560DD [AVAGO]

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