HLMP-CM15-WZ0XX [AVAGO]
T-13/4 (5 mm) Precision Optical Performance InGaN Blue, Green and Cyan Lamps; T- 13/4 （ 5毫米）的精密光学性能的InGaN蓝色，绿色和青色灯
| 型号： | HLMP-CM15-WZ0XX |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-13/4 (5 mm) Precision Optical Performance InGaN Blue, Green and Cyan Lamps |
| 文件： | 总10页 (文件大小：379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-Cxxx
3
T-1 / (5 mm)ExtraBrightPrecisionOptical
4
Performance InGaN LED Lamps
DataSheet
HLMP-CB11, HLMP-CB12, HLMP-CM11,
HLMP-CM12, HLMP-CE11, HLMP-CE12,
HLMP-CB26, HLMP-CB27, HLMP-CM26,
HLMP-CM27, HLMP-CE26, HLMP-CE27,
HLMP-CB36, HLMP-CB37, HLMP-CM36,
HLMP-CM37, HLMP-CE36, HLMP-CE37
Description
Features
These high intensity blue, green, and cyan LEDs
are based on the most efficient and cost effective
InGaN material technology. The 470 nm typical
dominant wave–length for blue and 525 nm typical
wavelength for green is well suited to color mixing
in full color signs. The 505 nm typical dominant
wavelength for cyan is suitable for traffic signal
application.
• Well defined spatial radiation pattern
• High luminous output
• Available in blue, green, and cyan color
°
°
°
• Viewing angle: 15 , 23 and 30
• Standoff or non-standoff leads
• Superior resistance to moisture
These LED lamps are untinted, non-diffused, T-13/4
packages incorporating second generation optics
which produce well-defined spatial radiation
patterns at specific viewing cone angles.
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicator
These lamps are made with an advanced optical
grade epoxy, offering superior temperature and
moisture resistance in outdoor signal and sign
applications. The high maximum LED junction
temperature limit of +110°C enables high
temperature operation in bright sunlight
conditions.
CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during
handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package A
2.35 (0.093)
MAX.
5.80 ± 0.20
(0.228 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
0.70 (0.028)
MAX.
4.90 ± 0.20
(0.193 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.61 ± 0.20
CATHODE
FLAT
(0.339 ± 0.008)
31.60
(1.244)
MIN.
Package B
5.80 ± 0.20
(0.228 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
0.70 (0.028)
MAX.
4.90 ± 0.20
NOTE 1
2.54 ± 0.38
(0.100 ± 0.015)
(0.192 ± 0.008)
CATHODE
LEAD
8.61 ± 0.20
(0.339 ± 0.008)
CATHODE
FLAT
1.00
(0.039)
MIN.
DIMENSION H
31.60
(1.244)
MIN.
DIMENSION H:
15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH)
23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH)
30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH)
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
2
Device Selection Guide
Typical
Viewing Angle,
2q1/ 2 (Degree)
Intensity (cd) at 20 mA
Package
Part Number
Color
Min.
2.5
3.2
2.5
9.3
12.0
9.3
7.2
7.2
1.9
2.5
1.9
7.2
9.3
7.2
5.5
5.5
1.15
1.5
1.5
1.5
1.5
7.2
7.2
7.2
7.2
7.2
5.5
5.5
Max.
7.2
Standoff
No
Dimension Lens
HLMP-CB11-TW0xx
HLMP-CB11-UVAxx
HLMP-CB12-TW0xx
HLMP-CM11-Y20xx
HLMP-CM11-Z1Cxx
HLMP-CM12-Y20xx
HLMP-CE11-X10xx
HLMP-CE12-X10xx
HLMP-CB26-SV0xx
HLMP-CB26-TUDxx
HLMP-CB27-SV0xx
HLMP-CM26-X10xx
HLMP-CM26-YZCxx
HLMP-CM27-X10xx
HLMP-CE26-WZ0xx
HLMP-CE27-WZ0xx
HLMP-CB36-QT0xx
HLMP-CB36-RSAxx
HLMP-CB36-RSBxx
HLMP-CB37-RU0xx
HLMP-CB37-RSDxx
HLMP-CM36-X10xx
HLMP-CM36-XYCxx
HLMP-CM37-X10xx
HLMP-CM37-XYCxx
HLMP-CM37-XYDxx
HLMP-CE36-WZ0xx
HLMP-CE37-WZ0xx
Blue
15
15
15
15
15
15
15
15
23
23
23
23
23
23
23
23
30
30
30
30
30
30
30
30
30
30
30
30
A
A
B
A
A
B
A
B
A
A
B
A
A
B
A
B
A
A
A
B
B
A
A
B
B
B
A
B
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Blue
5.5
No
Blue
7.2
Yes
No
Green
Green
Green
Cyan
Cyan
Blue
27.0
21.0
27.0
21.0
21.0
5.5
No
Yes
No
Yes
No
Blue
4.2
No
Blue
5.5
Yes
No
Green
Green
Green
Cyan
Cyan
Blue
21.0
16.0
21.0
16.0
16.0
3.2
No
Yes
No
Yes
No
Blue
2.5
No
Blue
2.5
No
Blue
4.2
Yes
Yes
No
Blue
2.5
Green
Green
Green
Green
Green
Cyan
Cyan
21.0
12.0
21.0
12.0
12.0
16.0
16.0
No
Yes
Yes
Yes
No
Yes
Notes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper
safety equipment.
5. 2q1/ 2 is the off-axis angle where the luminous intensity is 1/ 2 the on-axis intensity.
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
A: Color Bin 1 and 2
B: Color Bin 2 and 3
C: Color Bin 3 and 4
D: Color Bin 4 and 5
Maximum Intensity Bin
0: No Maximum Intensity Bin Limitation
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Intensity Bin
11: 15° Without Standoff
12: 15° With Standoff
26: 23° Without Standoff
27: 23° With Standoff
36: 30° Without standoff
37: 30° With Standoff
Color
B: Blue 470 nm
M: Green 525 nm
E: Cyan 505 nm
Package
C: T-13/4 (5 mm) Round Lamp
4
Absolute Maximum Rating at TA = 25°C
Parameters
Value
30
Unit
mA
mA
mW
°C
DC Forward Current [1]
Peak Pulsed Forward Current[2]
Power Dissipation
100
116
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
–40 to +85
–40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty factor 10%, frequency 1 KHz.
Electrical/Optical Characteristics
TA = 25oC
Blue
Green
Cyan
Parameters
Symbol Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Test Condition
Forward Voltage
Reverse Voltage[1]
V
3.2 3.85
240
3.3 3.85
240
3.2 3.85
240
V
V
IF = 20 mA
F
V
R
5.0
5.0
5.0
IR = 10 µA
Thermal Resistance RqJ-PIN
oC/ W LED Junction to
Anode Lead
Dominant
ld
460 470 480
464
520 525 540
516
490 505 508
501
nm
IF = 20 mA
Wavelength[2]
Peak Wavelength
lPEAK
nm
Peak of Wavelength
of Spectral Distribu-
tion at IF = 20 mA
Spectral Half Width Dl1/ 2
23
74
32
30
nm
Wavelength Width
at Spectral Distribu-
tion Power Point
at IF = 20 mA
Luminous Efficacy[3] hv
484
319
lm/ W Emitted Luminous
Power/ Emitted
Radiant Power
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA.
2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts/ steradian, may be found from the equation Ie = Iv/ hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/ watt.
5
1.0
0.8
0.6
0.4
35
30
25
20
15
10
5
CYAN
GREEN
BLUE
Rθ
= 780 °C/ W
J-A
0.2
0
0
380
430
480
530
580
630
680
0
10 20 30 40 50 60 70 80 90
– AMBIENT TEMPERATURE – °C
WAVELENGTH – nm
T
A
Figure 2. Forward current vs. ambient temperature.
Figure 1. Relative intensity vs. wavelength.
35
30
25
20
15
10
5
1.035
1.030
CYAN
1.025
1.020
GREEN
1.015
1.010
1.005
BLUE
1.000
0.995
0.990
0
0
1.0
2.0
3.0
4.0
0
5
10
15
20
25
30
FORWARD VOLTAGE – V
DC FORWARD CURRENT – mA
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative dominant wavelength vs. DC forward current.
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
DC FORWARD CURRENT – mA
Figure 5. Relative intensity vs. DC forward current.
6
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Spatial radiation pattern for Cx11 and Cx12.
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Spatial radiation pattern for Cx26 and Cx27.
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 8. Spatial radiation pattern for Cx36 and Cx37.
7
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Min Max
680 880
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.1818
0.1374
0.1766
0.1291
0.1699
0.1187
0.1616
0.1063
0.1517
0.0297
0.0904
0.0374
0.0966
0.0495
0.1062
0.0671
0.1209
0.0945
0.1423
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
Bin
N
P
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
Q
R
S
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
T
U
V
W
X
Y
Z
Tolerance for each bin limit is ±0.5 nm.
Green Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
1
520.0
524.0
0.0743
0.1650
0.1060
0.1856
0.1387
0.2068
0.1702
0.2273
0.2003
0.2469
0.8338
0.6586
0.8292
0.6556
0.8148
0.6463
0.7965
0.6344
0.7764
0.6213
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
Tolerance for each bin limit is ±15%.
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is ±0.5 nm.
Cyan Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
490.0
495.0
0.0454
0.1318
0.0345
0.1164
0.0082
0.1057
0.0039
0.1027
0.0132
0.1092
0.0040
0.1028
0.2945
0.306
0.1164
0.0235
0.1057
0.0082
0.1027
0.0039
0.1097
0.0139
0.1028
0.0040
0.1056
0.0080
0.3889
0.4127
0.4769
0.5384
0.5584
0.6548
0.6251
0.7502
0.5273
0.6104
0.6007
0.7153
2
3
4
7
8
495.0
500.0
505.0
498.0
503.0
500.0
505.0
510.0
503.0
508.0
0.4127
0.3889
0.5384
0.4769
0.6548
0.5584
0.4882
0.4417
0.6104
0.5273
Tolerance for each bin limit is ±0.5 nm.
8
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
Diagonal
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
• Recommended soldering conditions:
0.508 x 0.508 mm
0.718 mm
1.049 to 1.150 mm
(0.041 to 0.045 inch)
(0.020 x 0.020 inch)
(0.028 inch)
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max.
–
Note: Refer to application note AN1027 for more
information on soldering LED components.
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
260 °C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
50
30
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 9. Recommended wave soldering profile.
9
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3337EN
5989-4115EN June 26, 2006
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