HLMP-C415-M0D000 [AVAGO]
Single Color LED, Orange, Microtinted Nondiffused, T-1 3/4, 5mm, PLASTIC PACKAGE-2;型号: | HLMP-C415-M0D000 |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | Single Color LED, Orange, Microtinted Nondiffused, T-1 3/4, 5mm, PLASTIC PACKAGE-2 |
文件: | 总11页 (文件大小:136K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215,
HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415,
HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615,
HLMP-C623
T-1¾ Super Ultra-Bright LED Lamps
Data Sheet
Description
Features
Thesenon-diffusedlampsaredesignedtoproduceabright Very high intensity
light source and smooth radiation pattern. This lamp has
been designed with a 20mil lead frame, enhanced flange,
and tight meniscus controls, making it compatible with
radial lead automated insertion equipment.
Exceptional uniformity
Consistent viewability
All colors:
AlGaAs Red
High Efficiency Red
Yellow
Orange
Applications
Ideal for backlighting front panels*
Green
Used for lighting switches
Emerald Green
Adapted for indoor and outdoor signs
15° and 25° family
Tape and reel options available
Binned for color and intensity
Selection Guide
Part Number
HLMP-
Luminous Intensity Iv (mcd)
1/2[1]
Color
2
Standoff Leads
Min.
Max.
DH AS AlGaAs
15
No
C115
290.0
290.0
290.0
290.0
90.2
–
C115-O00xx
C115-OP0xx
C117-OP0xx
C123
–
1000.0
Yes
No
1000.0
25
15
–
C123-L00xx
C215
90.2
–
Red
No
No
No
No
No
138.0
138.0
138.0
90.2
–
C215-M00xx
C215-MN0xx
C223
–
400.0
25
15
25
15
–
C223-L00xx
C223-MN0xx
C315
90.2
–
138.0
147.0
147.0
147.0
96.2
400.0
Yellow
Orange
–
C315-L00xx
C315-LM0xx
C323
–
424.0
–
C323-K00xx
C323-KL0xx
C415
96.2
–
96.2
294.0
138.0
138.0
138.0
138.0
90.2
–
C415-M00xx
C415-M0D0xx
C415-MN0xx
C423
–
–
400.0
25
15
25
No
No
No
–
C423-L00xx
C423-LM0xx
C515
90.2
–
90.2
276.0
–
Green
170.0
170.0
170.0
69.8
C515-L00xx
C515-LM0xx
C523
490.0
–
C523-J00xx
C523-KL0xx
C615
69.8
–
111.7
17.0
340.0
Emerald Green
15
25
No
No
–
–
–
–
C615-G00xx
C623
17.0
6.7
C623-E00xx
6.7
2
Part Numbering System
HLMP - C x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B2: Right Angle Housing, Even Leads
UQ: Ammo Pack, Horizontal Leads
Color Bin Options
0: Full Color Bin Distribution
D: Color Bins 4 & 5 only
Maximum Iv Bin Options
0: Open (No Maximum Limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle & Standoffs Options
15: 15 Degree, without Standoffs
17: 15 Degree, with Standoffs
23: 25 Degree, without Standoffs
Color Options
1. AS AlGaAs Red
2. High Efficiency Red
3. Yellow
4. Orange
5. Green
6. Emerald Green
Package Options
C: T-1 3/4 (5 mm)
3
Package Dimensions
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
(NOTE 18
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
1ꢁ.6ꢀ ꢀ.10
(ꢀ.496 ꢀ.ꢀꢀ78
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
1.05 (ꢀ.ꢀ738
MAX.
31.6ꢀ
(1.ꢁ448
MIN.
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
1.5ꢀ ꢀ.15
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68
31.6ꢀ
MIN.
(1.ꢁ448
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
CATHODE
LEAD
CATHODE
LEAD
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
SQ. TYP.
1.ꢀꢀ
MIN.
1.ꢀꢀ
MIN.
(ꢀ.ꢀ398
(ꢀ.ꢀ398
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
CATHODE
FLAT
CATHODE
FLAT
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
Notes:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 0.5 mm (0.020 in.) down the leads.
HLMP-Cx15 and HLMP-Cx23
HLMP-Cx17
Absolute Maximum Ratings at T = 25°C
A
High
High
DH AS
AlGaAs
Red
Efficiency
Red and
Orange
Performance
Green and
Emerald Green
Parameter
DC Forward Current1
Yellow
20
Units
mA
30
30
30
Transient Forward Current2
500
500
500
500
mA
(10 sec Pulse)
Reverse Voltage (Ir = 100 A)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Notes:
5
5
5
5
V
110
110
110
110
°C
°C
°C
–20 to +100
–40 to +100
–40 to +100
–40 to +100
–40 to +100
–40 to +100
–20 to +100
–40 to +100
1. See Figure 5 for maximum current derating vs. ambient temperature.
2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.
4
Electrical Characteristics at T = 25°C
A
Forward
Voltage
Vf (Volts)
@ If = 20 mA
Typ.
Reverse
Capacitance
C (pF)
Vf = 0
f = 1 MHz
Typ.
Speed of Response
Breakdown
Vr (Volts)
@ Ir = 100 A
Min.
Thermal
Resistance
(ns)
s
Time Constant
-t/s
R
e
J-PIN
(°C/W)
Part Number
Max.
Typ.
HLMP-C115
HLMP-C117
HLMP-C123
1.8
2.2
5
30
210
30
HLMP-C215
HLMP-C223
1.9
2.1
1.9
2.2
2.2
2.6
2.6
2.6
3.0
3.0
5
5
5
5
5
11
15
4
210
210
210
210
210
90
HLMP-C315
HLMP-C323
90
HLMP-C415
HLMP-C423
280
260
260
HLMP-C515
HLMP-C523
18
18
HLMP-C615
HLMP-C623
Optical Characteristics at T = 25°C
A
Luminous
Intensity
Iv (mcd)
@ 20 mA
Min.
Color,
Dominant
Viewing
Angle
Peak
Wavelength
Luminous
Efficacy
Wavelength
2
½
[1]
[2]
[3]
(nm)
(nm)
(Degrees)
Typ.
v
peak
Typ.
d
Part Number
Typ.
Typ.
(lm/w)
HLMP-C115
HLMP-C117
290
600
645
637
11
80
HLMP-C123
HLMP-C215
90
200
300
170
300
170
300
170
300
170
45
26
17
23
17
25
17
23
20
28
20
28
138
90
635
583
600
568
558
626
585
602
570
560
145
500
380
595
656
HLMP-C315
HLMP-C415
HLMP-C515
HLMP-C615
Notes:
146
96
138
90
170
69
17
6
27
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. The dominant wavelength, , is derived from the CIE Chromaticity Diagram and represents the color of the device.
d
3. 2 is the off-axis angle where the luminous intensity is ½ the on-axis intensity.
½
5
1.0
TS AlGaAs RED
DH As AlGaAs RED
ORANGE
EMERALD GREEN
HIGH
TA = 25° C
PERFORMANCE
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
WAVELENGTH – nm
700
750
Figure 1. Relative intensity vs. wavelength.
300.0
HIGH EFFICIENCY RED, ORANGE, YELLOW,
AND HIGH PERFORMANCE GREEN, EMERALD GREEN
200.0
DH As AlGaAs RED
100.0
100
80
60
40
20
0
TS AlGaAs RED
50.0
HIGH PERFORMANCE GREEN,
EMERALD GREEN
20.0
10.0
5.0
HIGH EFFICIENCY
RED/ORANGE
YELLOW
2.0
1.0
0.5
0.2
0.1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
1.0
2.0
3.0
4.0
5.0
VF – FORWARD VOLTAGE – V
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage (non-resistor lamp).
5.0
2.0
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
DH As AlGaAs RED
1.0
0.5
TS AlGaAs RED
0.2
0.1
0.05
0.02
0.01
0
5
10
15
20
25
30
0.1 0.2
0.5
1
2
5
10 20 30 50
IDC – DC CURRENT PER LED – mA
IF – DC FORWARD CURRENT – mA
Figure 3. Relative luminous intensity vs. forward current.
6
DH As AlGaAs RED
HER, ORANGE, YELLOW, HIGH
PERFORMANCE GREEN, EMERALD GREEN
1.2
1.0
0.8
0.6
1.3
1.2
1.1
1.0
EMERALD GREEN
YELLOW
HIGH EFFICIENCY
RED/ORANGE
0.9
0.8
0.7
0.6
0.5
0.4
HIGH PERFORMANCE GREEN
0.4
0.2
0
0
10
20
50
100
200 300
0
10 20 30 40 50 60 70 80 90
I
PEAK – PEAK FORWARD CURRENT – mA
IPEAK – PEAK FORWARD CURRENT – mA
Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current.
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
DH As AlGaAs RED
40
40
35
30
25
20
15
10
5
35
30
25
HER, ORANGE, GREEN, EMERALD GREEN
RJA = 470°C/W
RJA = 300°C/W
RJA = 559°C/W
20
RJA = 689°C/W
YELLOW
15
10
5
RJA = 705°C/W
0
0
0
20
40
60
80
100
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
TA – AMBIENT TEMPERATURE – °C
Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TjMAX = 110°C.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
45
35
25
15
5
-5 -15 -25 -35 -45
45
35
25
15
5
-5 -15 -25 -35 -45
ANGULAR DISPLACEMENT – DEGREES
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Relative luminous intensity vs. angular displacement.
15 degree family.
Figure 7. Relative luminous intensity vs. angular displacement.
25 degree family.
7
Intensity Bin Limits
Color
Color Categories
Color
Intensity Range (mcd)
Lambda (nm)
Category# Min.
Bin
L
Min.
Max.
Max.
101.5
162.4
6
5
4
3
2
1
3
2
4
5
1
2
3
4
5
6
7
8
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
597.0
599.5
602.0
604.5
607.5
610.5
613.5
616.5
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
599.5
602.0
604.5
607.5
610.5
613.5
616.5
619.5
M
N
O
P
162.4
234.6
234.6
340.0
Green
340.0
540.0
540.0
850.0
Q
R
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
250.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
173.2
Red/Orange
S
Yellow
T
U
V
W
X
Y
Z
Orange
L
M
N
O
P
250.0
360.0
360.0
510.0
510.0
800.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
12.0
Yellow
Q
R
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
7.6
Tolerance for each bin limit is 0.5 nm.
S
T
U
V
W
E
Mechanical Option Matrix
Mechanical
Option Code
Definition
F
12.0
19.1
G
H
I
19.1
30.7
00
Bulk Packaging,
minimum increment 500 pcs/bag
30.7
49.1
49.1
78.5
01
Tape & Reel, crimped leads,
minimum increment 1300 pcs/bag
J
78.5
125.7
02
Tape & Reel, straight leads,
minimum increment 1300 pcs/bag
K
125.7
201.1
L
201.1
289.0
B2
Right Angle Housing, even leads,
minimum increment 500 pcs/bag
Green/
Emerald Green
M
N
O
P
289.0
417.0
417.0
680.0
UQ
Note:
Ammo Pack, horizontal leads,
in 1K minimum increment
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
Q
R
All categories are established for classification of products. Products
may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
S
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
8
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Plated Through
Hole Diameter
Diagonal
Recommended soldering condition:
0.45 x 0.45 mm
(0.018 x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020 x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Wave
Soldering
Manual Solder
Dipping
[1],[2]
Pre-heat Temperature 105°C Max.
–
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Pre-heat Time
60 sec Max.
250°C Max.
3 sec Max.
–
Peak Temperature
260°C Max.
5 sec Max.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
Dwell Time
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
9
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢀ temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peaꢀ temperature = 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
10
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4251EN
AV02-1561EN - July 23, 2012
相关型号:
HLMP-C415-M0D001
Single Color LED, Orange, Microtinted Nondiffused, T-1 3/4, 5mm, PLASTIC PACKAGE-2
AVAGO
HLMP-C415-M0D002
Single Color LED, Orange, Microtinted Nondiffused, T-1 3/4, 5mm, PLASTIC PACKAGE-2
AVAGO
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