HEDS-9100OPTIONS [AVAGO]
ROTARY OPTICAL POSITION ENCODER, PLASTIC PACKAGE;型号: | HEDS-9100OPTIONS |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | ROTARY OPTICAL POSITION ENCODER, PLASTIC PACKAGE 光电 编码器 |
文件: | 总4页 (文件大小:113K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
Failure Rate Prediction
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table ꢀ.
TJ (°C) = TA (°C) + θJA PAVG
where
TA = ambient temperature in °C
θ
JA = thermal resistance of
junction-to-ambient in °C/watt
PAVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-2ꢀ7).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Stress Test
Conditions
Total
Device Hrs.
Units
Tested
Total
Failed
Failure Rate
(% /1K Hours)
Test Name
MTBF
High Temperature
Operating Life
VCC = 5.5 V,
VA = VB = 3.5 V
TA = ꢀ00°C
ꢀ,405,000
ꢀ,405
2
702,500
0.ꢀ42
ꢀ000 hours
Temperature
Humidity
Operating Life
VCC = 5.5 V
VA = VB = 3.5 V
ꢀ,000 hours
TA = 85°C
ꢀ,495,000
ꢀ,495
ꢀ0
ꢀ49,500
0.669
RH = 85%
ꢀ
Table 2.
Point Typical Performance [1]
in Time
Performance in Time [2]
(90% Confidence)
Ambient
Temperature (°C)
Junction
Temperature (°C)
Failure Rate
Failure Rate
(%/1K Hours)
MTBF [1]
(%/1K Hours)
0.ꢀ42
0.ꢀ00
0.069
0.047
0.03ꢀ
0.020
0.0ꢀ3
0.008
0.005
MTBF[2]
+ꢀ00
+90
+80
+70
+60
+50
+40
+30
+20
+ꢀꢀ0
+ꢀ00
+90
+80
+70
+60
+50
+40
+30
703,000
264,000
374,000
54ꢀ,000
799,000
ꢀ,206,000
ꢀ,867,000
2,969,000
4,863,000
8,230,000
0.379
0.267
0.ꢀ85
0.ꢀ25
0.083
0.054
0.034
0.02ꢀ
0.0ꢀ2
996,000
ꢀ,440,000
2,ꢀ26,000
3,2ꢀ0,000
4,968,000
7,90ꢀ,000
ꢀ2,942,000
2ꢀ,903,000
Notes:
ꢀ. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero
failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confidence
interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is
commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures
are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or state errors.
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given ꢀ68 hours/week is:
(8 hours/day) x (5 days/week) / (ꢀ68 hours/week) = 0.25
The point failure rate per year (8760 hours) at 50°C ambient temperature is:
(0.020% / ꢀK hours) x 0.25 x (8760 hours/year) = 0.044% per year
Similarly, 90% confidence level failure rate per year at 50°C:
(0.054% / ꢀK hours) x 0.25 x (8760 hours/year) = 0.ꢀꢀ8% per year
2
Table 3. Environmental Tests
MIL-STD-883C
Reference
Units
Tested
Units
Failed
Test Name
Test Conditions
Temperature Cycle
ꢀ0ꢀ0
-40°C to +ꢀ00°C, ꢀ5 minute dwell,
5 minute transfer,
5 cycles
9,5ꢀ2
ꢀ,570
ꢀ,570
0
3
9
200 cycles
500 cycles
Solder Heat Resistance
2003
N/A
Sn/Pb 60/40 Solder; 260°C peak;
ꢀ0 sec., 20 temp cycles @ -40°C to 85°C
38
0
High Temperature
Storage Life
TA = +ꢀ05°C
2,000 hours
77
0
Table 4. Mechanical Tests
MIL-STD-883C
Reference
Units
Tested
Units
Failed
Test Name
Test Conditions
Mechanical Shock
Vibration Variable Frequency
2002
2007
5 blows; X, Y, Z axes, ꢀ500 g, 0.5 msec.
5
0
3 cycles, 4 min. each X, Y, Z axes, 20 g min.
20 to 2000 Hz
5 to ꢀ000 Hz
26
ꢀ0
0
0
Terminal Strength
Lead Fatigue
2004 Condition A ꢀ lb. for 30 seconds
ꢀ5
ꢀ5
0
0
2004, Cond. B
3 bends, ꢀ5° minimum
Table 5. Electrical Tests
MIL-STD-883C
Reference
Units
Tested
Units
Failed
Test Name
Test Conditions
ESD - Human Body Model
30ꢀ5.2
ꢀ.5 KΩ, ꢀ00 pF, 5 positive and 5 negative dis-
charges per pin. VZ = 3.0 KV
35
0
3
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5965-2775E
5965-9642E - December 11, 2006
4
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