ASMT-QYBB-NHJEE [AVAGO]
Single Color LED, Warm White, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4;
| 型号： | ASMT-QYBB-NHJEE |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Single Color LED, Warm White, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4 |
| 文件： | 总10页 (文件大小：616K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMT-QYBB-Nxxxx
Super 0.5W Warm White Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
Features
The Super 0.5W Warm White Power PLCC-4 SMT LED is
Warm white mid-Power PLCC-4 SMT LEDs using InGaN
chip technology. The package can be driven at high
current due to its superior package design. The product
is able to dissipate the heat more efficiently compared to
the Power PLCC-4 SMT LEDs. These LEDs produce higher
light output with better flux performance compared to
the Power PLCC-4 SMT LED.
• Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
• High reliability package with enhanced silicone resin
encapsulation
• High brightness with optimum flux performance
using InGaN chip technologies
• Available in Warm White
• Available in 8mm carrier tape & 7 inch reel
• Low Thermal Resistance 40°C/W
• Wide viewing angle at 120 degree
• JEDEC MSL 2
The Super 0.5W Warm White Power PLCC-4 SMT LEDs are
designed for higher reliability, better performance, and
operate under a wide range of environmental conditions.
The performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh condi-
tions such as in automotive applications, and in electronics
signs and signals.
Applications
1. Interior automotive
a. Instrument panel backlighting
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
b. Central console backlighting
c. Navigation and audio system backlighting
d. Dome/Map lighting
e. Push button backlighting
f. Puddle lamp
g. Glove compartment illumination
2. Exterior automotive
a. Number plate illumination
3. Electronic signs and signals
a. Decorative lighting
4. Office automation, home appliances, industrial equipment
a. Panel/button backlighting
b. Display backl-ighting
CAUTION: ASMT-QYBB-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
ꢁ.8 ꢀ.ꢁ
ꢁ.ꢁ ꢀ.ꢁ
ꢀ.6 ꢀ.3
1.15 ꢀ.ꢁ
1.9 ꢀ.ꢁ
A
A
C
C
ꢀ.7
CATHODE
MARKING
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 12.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Figure 1. Package Drawing
Table 1. Device Selection Guide (T = 25 °C)
J
[1]
Luminous Flux, Φ (lm)
V
Color
Part Number
Min. Flux (lm)
Typ. Flux (lm)
Max. Flux (lm)
Test Current (mA) Dice Technology
Warm White
Notes:
ASMT-QYBB-NFG0E 15.0
22.5
25.5
150
InGaN
1.
Φ is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
V
2. Tolerance = 12ꢀ
Part Numbering System
A S M T - Q X1 B B – N X2 X 3 X 4 X 5
Packaging Option
Colour Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
Y - Warm White
2
Table 2. Absolute Maximum Ratings (T = 25°C)
A
Parameters
ASMT-QYBB-Nxxxx
150 mA
DC Forward Current [1]
Peak Forward Current [2]
Power Dissipation
Reverse Voltage
300 mA
615 mW
Not Recommended
125°C
Junction Temperature
Operating Temperature
Storage Temperature
-40°C to +110°C
-40°C to +110°C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10ꢀ, Frequency = 1kHz
Table 3. Optical Characteristics (T = 25°C)
J
Typical
Chromaticity
Coordinates
Viewing
Angle 2θ
(Degrees)
Luminous
Efficiency
η (lm/W)
e
Total Flux /
[1]
Luminous Intensity
Φ (lm) / I (cd)
½
V
V
Dice
Color
Part Number
Technology
x
y
Typ.
Typ.
Typ.
2.85
Warm White
ASMT-QYBB-Nxxxx
InGaN
0.41
0.39
120
43
Notes:
1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (T = 25°C)
J
Forward Voltage V (Volts) @ I = 150 mA
F
F
Part Number
Typ.
Max.
Thermal Resistance Rθ (°C/W)
J-P
ASMT-QYBB-NxxxE
3.5
4.1
40
3
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
300
250
200
150
100
50
0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
0
1
2
3
4
FORWARD VOLTAGE - V
Figure 2. Relative Intensity Vs. Wavelength
Figure 3. Forward Current Vs. Forward Voltage.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
DC FORWARD CURRENT - mA
T - JUNCTION TEMPERATURE - °C
J
Figure 4. Relative Flux vs. Forward Current
Figure 5. Relative Flux Vs. Temperature
160
140
120
100
80
160
140
Rθ = 90°C/W
JA
Rθ = 110°C/W
JA
RθJP = 40°C/W
120
100
80
60
40
20
0
60
40
20
0
0
20
40
60
TEMPERATURE (°C)
80
100
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W.
Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.
4
0.40
0.30
0.20
0.10
0.00
0.40
0.30
0.20
0.10
0.00
tp
tp
T
D =
IF
D =
0.05
0.10
0.25
0.50
1
T
D =
0.05
0.10
0.25
0.50
1
tp
tp
T
D =
IF
T
0.00001 0.0001 0.001 0.01
0.1
0
10
100
0.00001 0.0001 0.001 0.01
0.1
0
10
100
tp - Time - (s)
tp - Time - (s)
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 25°C, RθJ-A=110°C/W.
Derated Based on TA= 85°C, RθJ-P=110°C/W.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-90
-60
-30
0
30
60
90
-50
-25
0
25
50
75
100
ANGULAR DISPLACEMENT - DEGREES
T - JUNCTION TEMPERATURE - °C
J
Figure 8. Forward Voltage Shift Vs. Temperature.
Figure 9. Radiation Pattern
5
10 to 30 SEC.
255 - 260°C
3°C/SEC. MAX.
217°C
200°C
6°C/SEC.MAX.
D
150°C
3°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
Note: Diameter "D" should be smaller than 2.2
Figure 10. Recommended Pick and Place Nozzle Size
Figure 11. Recommended Pb-free Reflow Soldering Profile
2.4
0.6
0.9 X 6
1.3 x 6
A
C
A
C
0.4
A
C
A
C
1.1
4.6
C
C
0.3
CATHODE
MARKING
SOLDER MASK
ANODE
A
CATHODE
MARKING
MINIMUM 55 mm2 OF CATHODE PAD
CATHODE
C
FOR IMPROVED HEAT DISSIPATION
Figure 12. Recommended Soldering Pad Pattern
6
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Tape Leader and Trailer Dimensions
4
0.1
4
0.1
2 0.05
+0.1
–0
1.75 0.1
2.29 0.1
Ø1.5
C
C
3.5 0.05
3.8 0.1
+0.3
–0.1
8
A
A
+0.1
3.05 0.1
Ø1
–0
0.229 0.01
8°
ALL DIMENSIONS IN mm.
Figure 14. Tape Dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 15. Reeling Orientation
7
Device Color (X )
Handling Precaution
1
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Y
Warm White
Flux Bin Select (X X )
2
3
Individual reel will contain parts from one bin only
X2
X3
Min Flux Bin
Max Flux Bin
Moisture Sensitivity
Flux Bin Limits
This product is qualified as Moisture Sensitive Level 2
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
Bin ID
Min. (lm)
5.50
Max. (lm)
7.00
B
C
D
E
F
G
H
J
7.00
9.00
9.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
73.00
56.00
73.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
43.00
56.00
A. Storage before use
-
Unopen moisture barrier bag (MBB) can be stored
at <40°C/90ꢀRH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
K
L
-
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
J
B. Control after opening the MBB
K
-
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
Tolerance of each bin limit = 12ꢀ
-
The LEDs must be kept at <30°C / 60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 1 year.
Color Bin Select (X )
4
Individual reel will contain parts from one sub bin only.
X
4
C. Control for unfinished reel
0
Full Distribution
H, J and K only
H, J, K, L and M only
L and M only
-
For any unuse LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
A
B
C
D
E
D. Control of assembled boards
-
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5ꢀRH to ensure no LEDs have
exceeded their floor life of 1 year.
L, M, N and P only
N and P only
F
N, P, Q and R only
Q and R only
G
Z
E. Baking is required if:
Special Color Bin
-
-
“60ꢀ”HIC indicator is NOT blue.
The LEDs are exposed to condition of >30°C / 60ꢀ
RH at any time.
-
The LEDs floor life exceeded 1 year.
Recommended baking condition: 60 5°C for 20 hours.
8
Color Bin Limits
Bin ID Sub Bin ID
Limits (Chromaticity Coordinates)
Bin ID Sub Bin ID
Limits (Chromaticity Coordinates)
H
H3
H4
H5
J3
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
0.348
0.332
0.350
0.348
0.352
0.365
0.360
0.341
0.364
0.358
0.367
0.376
0.373
0.350
0.378
0.368
0.383
0.386
0.387
0.358
0.393
0.376
0.399
0.395
0.400
0.366
0.407
0.384
0.414
0.402
0.413
0.372
0.421
0.390
0.429
0.409
0.360
0.341
0.364
0.358
0.367
0.376
0.373
0.350
0.378
0.368
0.383
0.386
0.387
0.358
0.393
0.376
0.399
0.395
0.400
0.366
0.407
0.384
0.414
0.402
0.413
0.372
0.421
0.390
0.429
0.409
0.425
0.378
0.434
0.396
0.443
0.414
0.364
0.358
0.367
0.376
0.371
0.392
0.378
0.368
0.383
0.386
0.388
0.403
0.393
0.376
0.399
0.395
0.405
0.412
0.407
0.384
0.414
0.402
0.421
0.420
0.421
0.390
0.429
0.409
0.436
0.426
0.434
0.396
0.443
0.414
0.451
0.430
0.350
0.348
0.352
0.365
0.354
0.381
0.364
0.358
0.367
0.376
0.371
0.392
0.378
0.368
0.383
0.386
0.388
0.403
0.393
0.376
0.399
0.395
0.405
0.412
0.407
0.384
0.414
0.402
0.421
0.420
0.421
0.390
0.429
0.409
0.436
0.426
P
P3
P4
P5
Q3
Q4
Q5
R3
R4
R5
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
0.425
0.378
0.434
0.396
0.443
0.414
0.438
0.382
0.447
0.400
0.456
0.417
0.450
0.386
0.460
0.403
0.470
0.420
0.438
0.382
0.447
0.400
0.456
0.417
0.450
0.386
0.460
0.403
0.470
0.420
0.462
0.389
0.472
0.405
0.482
0.422
0.447
0.400
0.456
0.417
0.465
0.434
0.460
0.403
0.470
0.420
0.479
0.436
0.472
0.405
0.482
0.422
0.491
0.437
0.434
0.396
0.443
0.414
0.451
0.430
0.447
0.400
0.456
0.417
0.465
0.434
0.460
0.403
0.470
0.420
0.479
0.436
J
Q
J4
J5
K
K3
K4
K5
L3
R
Tolerance of each bin limit = 0.02.
L
L4
L5
M
M3
M4
M5
N3
N4
N5
N
9
0.45
0.43
0.41
0.39
0.37
0.35
0.33
0.31
R5
Q5
P5
N5
M5
Q4
R4
P4
L5
N4
K5
R3
M4
Q3
J5
L4
P3
N3
K4
H5
M3
2800K - 2500K
L3
J4
3150K - 2800K
K3
H4
J3
3650K - 3150K
H3
4800K - 3650K
0.34
0.36
0.38
0.40
0.42
X-COORDINATE
0.44
0.46
0.48
0.50
Packaging Option (X )
5
Option
Test Current
Package Type Reel Size
E
150mA
Top Mount
7 Inch
V Bin Limits
F
Bin ID
S5
Min.
3.20
3.50
3.80
Max.
3.50
3.80
4.10
S6
S7
Tolerance of each bin limit = 0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1323EN - September 28, 2009
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