AFCT-5715xxZ [AVAGO]
Single-Mode SFP Optical Transceivers;型号: | AFCT-5715xxZ |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | Single-Mode SFP Optical Transceivers |
文件: | 总2页 (文件大小:70K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AFCT-5701xxZ, AFCT-5705xxZ, AFCT-5710xxZ,
AFCT-5715xxZ, AFCT-5765xxZ
Single-Mode SFP Optical Transceivers
with Optional DMI for Gigabit Ethernet and Fibre Channel
Reliability Data Sheet
Introduction
FIT Rate Summary
Avago Technologies Quality System includes an ongoing The mean and standard deviation of the AFCT-5701xxZ,
Reliability Monitoring program to generate a database AFCT-5705xxZ, AFCT-5710xxZ, and AFCT-5715xxZ families
from which this reliability datasheet is published.
of SFP Optical Transceiver steady-state failure rate is calcu-
lated as 118.4 FIT and 66.6 FIT at 40 °C, respectively.
Description
Conclusion
This reliability data sheet addresses reliability parameters
for the single-mode AFCT-5701xxZ, AFCT-5705xxZ, AFCT- Avago Technologies AFCT-5701xxZ, AFCT-5705xxZ, AFCT-
5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of 5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of
SFP optical transceivers.
SFP Optical Transceivers have completed and passed the
reliability qualification criteria defined by Avago Technol-
ogies’Quality & Reliability requirements.
These transceivers are primarily targeted at serving
Gigabit Ethernet or Fibre Channel links interconnecting
optical networking and storage equipment.
Random Failure Rate (FIT) Calculation
Reliability Qualification
Failure in time rate, or FIT, is defined as the number of
failures per billion device hours. In the product useful life
region, the random failure rate is considered as a constant
failure rate. In this region MTTF, Mean Time to Failure, is
defined as MTTF = 1/FIT.
The Optical Transceivers have been qualified in accor-
dance with the requirements of Telcordia Document
GR-468-CORE. Reliability predictions follow the method of
Telcordia SR-332 Issue 3.
FITs Prediction Based on Telcordia SR-332 Parts Count
Procedure
Avago internal test specifications have also been applied.
Testing was carried out under the supervision of Avago
Technologies Quality & Reliability Department.
The Telcordia Parts Count Method assumes that the
module failure rate is equal to the sum of the device
component failure rates. Modifiers are included to take
into consideration variations in module operation envi-
ronments, device quality requirements, temperature, and
stress. Table 1a shows the FITs for the components used in
the module and the total FITs that has been calculated for
a case temperature of 40 °C.
Stress Test Pass Criteria
Product failure has occurred when the units fails to
respond properly to a functional test condition. The func-
tional test condition should not exceed the absolute
maximum data sheet limits for the product.
Table 1a.
Temperature Factor @ 40 °C
Stress Factor at 50%
1
1
Reliability Prediction Based On
Telcordia SR-332 Issue 3 – Parts Count Method
Environmental Factor
1
Component
Component Standard
Failure Rate Deviation Quality Failure Rate Deviation
Total
Total Component
Component Standard
Telcordia
Information
Laser
Telcordia (Photodiode)
Telcordia: (91-170 transistor) 3
Telcordia: (91-170 transistor) 1
Fixed Ceramic
Thick Film
Component
1G FP Laser Diode
Photodiode
IC
Quantity (FITs)
(FITs)
81
5.5
Factor (FITs)
(FITs)
64.8
4.4
1
1
100
7.7
7.7
7.7
0.1
0.18
3.8
0.8
0.8
0.8
0.8
1
80
6.16
18.48
6.16
0.3
5.5
5.5
13.2
4.4
IC
Capacitors
Resistor
3
5
1
0.01
0.13
3.9
0.03
0.65
3.9
1
1
0.9
3.8
IC 8-BIT MCU W/8K FLASH CMOS Technology
256B RAM 36-LFBGA
Connector
PCB, Edge / Multi-Pin
20
0.13
0.088
1
2.6
1.76
118.4
8.45E+06
66.6
Module Failure @ 40 °C (Total FITs)
MTTF @ 40 °C (Hours)
1.50E+07
FITs at other temperatures can be derived following The limitations of the FIT prediction based on the Parts
the procedure of Telcordia SR-332, assuming activation Count Method include the fact that the piece part failure
energy, Ea, of 0.35 eV to determine the component tem- rates are obtained from Telcordia database, which may
perature factor πT. Table 1b shows the FITs at different not be exhaustive for state-of-the-art piece parts, and that
temperatures for the transceiver.
the results are independent of true module environmen-
tal stress tests. Nevertheless, the information obtained
from the Parts Count Method is a useful reference during
design-in and evaluation. Whenever possible, Avago sub-
stitutes internal data for the FIT rates of individual com-
ponents, and predictions will be updated as more current
data becomes available.
FITs between 60% and 90% Upper Confidence Levels
(UCLs) can be derived following the procedure ofTelcordia
SR-332 to determine the shape κ and scale θ of the gamma
distribution. Table 1c shows the FITs at the UCLs.
Table 1b. FIT rates at different operating case temperatures, Table 1c. FIT rates at 40 °C at 60% and 90% Upper Confidence
following the Telcordia Parts Count Method
Level, following the Telcordia Parts Count Method
T
case
(° C)
FITs
UCL
FITs
25
40
50
60
61.6
60%
122.8
118.4
177.6
260.5
90%
207.7
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-3018EN - November 22, 2013
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