AFBR-79E4Z-D [AVAGO]

4 Channels Quad Small Form Factor Pluggable Parallel Optics Transceiver; 4四通道小型可插拔平行光学收发器
AFBR-79E4Z-D
型号: AFBR-79E4Z-D
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

4 Channels Quad Small Form Factor Pluggable Parallel Optics Transceiver
4四通道小型可插拔平行光学收发器

光纤 通信
文件: 总2页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AFBR-79E4Z-D  
4 Channels Quad Small Form Factor  
Pluggable Parallel Optics Transceiver  
Reliability Data Sheet  
Description  
FIT Prediction Based on Telcordia SR-332 Parts Count  
Procedure  
The Avago Technologies AFBR-79E4Z-D are 10G, 4 chan-  
nel Quad Small Form Factor, Pluggable Parallel Optics  
Transceiver, utilizing Avago’s 850nm VCSEL.  
The Telcordia parts count method assumes that the mod-  
ule failure rate is equal to the sum of the device compo-  
nent failure rates. Modifiers are included to take into con-  
sideration variations in module operation environments,  
device quality requirements, temperature, and stress. The  
tables that follow show the FIT for the components used  
in the modules and the total FIT which have been calcu-  
lated for an operating ambient temperature of 40oC.  
FIT Rate Summary  
FIT rate for AFBR-79E4Z-D is calculated as 197.42. Compu-  
tation was done at 40°C based on Telcordia SR- 332 (Issue  
2), Part Count Method. The details of the calculation are  
included in this report.  
Random Failure Rate (FIT) Calculation  
Random Failure Rate (FIT) Calculation  
Failure in time rate, or FIT, is defined as the number of  
failures per billion device hours. In the product useful life  
region, the random failure rate is considered as a constant  
failure rate. In this region MTTF, Mean Time to Failure, is  
defined as MTTF = 1/FIT.  
Failure in time rate, or FIT, is defined as the number of  
failures per billion device hours. In the product useful life  
region, the random failure rate is considered as a constant  
failure rate. In this region MTTF, Mean Time to Failure, is  
defined as MTTF = 1/FIT.  
FITs Prediction Based on Telcordia SR-332 Part Count Pro-  
cedure  
The Telcordia parts count method assumes that the mod-  
ule failure rate is equal to the sum of the device compo-  
nent failure rates. Modifiers are included to take into con-  
sideration variations in module operation environments,  
device quality requirements, temperature, and stress. The  
following table shows the FITs for the components used in  
the module and the total FITs which has been calculated  
for a case temperature of 40°C.  
Table 1. FIT Rate Calculations for AFBR-79E4Z-D  
1.0  
1.0  
Reliability Prediction Based on Telcordia SR-332 (Issue 2) Parts Count Method Stress Factor at 50%  
Environmental Factors  
Telcordia Information  
/ Data Source  
Component  
Base Rate (FITs) Factor  
Quality  
Temperature  
Factor @ 40°C  
Total Component Failure  
Rate (FITs) @ 40°C  
19.2  
24.6  
24.6  
9.8  
Component  
VCSEL  
Quantity  
Avago Data  
Photodiode  
Photodiode  
Fixed Ceramic  
Fixed Film  
4
6
0.8  
0.8  
0.8  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
Monitor PIN IC  
PIN  
4
7.7  
7.7  
0.2  
0.5  
2.3  
4
Capacitors  
Resistors  
49  
57  
5
28.5  
11.5  
Ferrite Chip  
(Inductor)  
Power Filter  
MOSFET  
OR Gate  
Nand Gate  
QSFP IC  
Supplier Info  
Supplier Info  
Supplier Info  
Avago Data  
2
1
1
1
1
2
4.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
8.0  
4.3  
4.3  
4.3  
4.3  
11.0  
28.0  
9.3  
11.0  
28.0  
18.6  
MicroController Supplier Info  
Voltage  
Telcordia Information  
Regulator  
/ Data Source  
Connectors  
PCB, Edge (20 pin)  
38  
0.13  
1.0  
1.0  
4.9  
197.4  
Total AFBR-79E4Z-D  
Transceiver Failure at 40°C (FITs)  
5.07E+06  
MTTF @ 40°C (hours)  
FITs at other temperatures can be derived following the  
The limitations of the FIT prediction based on the Parts  
procedure of Telcordia SR-332, assuming activation en- Count method include the fact that the piece part failure  
ergy, Ea, of 0.35eV to determine the component tempera- rates are mostly obtained from Telcordia database, which  
ture factor T. The following table shows FITs at different  
temperature for the transceiver.  
may not be exhaustive for state-of-the-art piece parts,  
and that the results are independent of true module en-  
vironmental stress tests. Nevertheless, the information  
obtained from the Parts Count method is a useful refer-  
ence during design-in and evaluation. Whenever possible,  
Avago substitutes internal data for the FIT rates of individ-  
ual components, and predictions will be updated as more  
current data becomes available.  
Table 2. FIT rates at different operation case temperatures,  
following the Telcordia Parts Count Method  
Tcase (°C)  
AFBR-79E4Z-D  
197.4  
40  
50  
60  
70  
296.1  
434.3  
612.0  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.  
AV02-2738EN - November 18, 2010  

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