AFBR-79E4Z-D [AVAGO]
4 Channels Quad Small Form Factor Pluggable Parallel Optics Transceiver; 4四通道小型可插拔平行光学收发器型号: | AFBR-79E4Z-D |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | 4 Channels Quad Small Form Factor Pluggable Parallel Optics Transceiver |
文件: | 总2页 (文件大小:160K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AFBR-79E4Z-D
4 Channels Quad Small Form Factor
Pluggable Parallel Optics Transceiver
Reliability Data Sheet
Description
FIT Prediction Based on Telcordia SR-332 Parts Count
Procedure
The Avago Technologies AFBR-79E4Z-D are 10G, 4 chan-
nel Quad Small Form Factor, Pluggable Parallel Optics
Transceiver, utilizing Avago’s 850nm VCSEL.
The Telcordia parts count method assumes that the mod-
ule failure rate is equal to the sum of the device compo-
nent failure rates. Modifiers are included to take into con-
sideration variations in module operation environments,
device quality requirements, temperature, and stress. The
tables that follow show the FIT for the components used
in the modules and the total FIT which have been calcu-
lated for an operating ambient temperature of 40oC.
FIT Rate Summary
FIT rate for AFBR-79E4Z-D is calculated as 197.42. Compu-
tation was done at 40°C based on Telcordia SR- 332 (Issue
2), Part Count Method. The details of the calculation are
included in this report.
Random Failure Rate (FIT) Calculation
Random Failure Rate (FIT) Calculation
Failure in time rate, or FIT, is defined as the number of
failures per billion device hours. In the product useful life
region, the random failure rate is considered as a constant
failure rate. In this region MTTF, Mean Time to Failure, is
defined as MTTF = 1/FIT.
Failure in time rate, or FIT, is defined as the number of
failures per billion device hours. In the product useful life
region, the random failure rate is considered as a constant
failure rate. In this region MTTF, Mean Time to Failure, is
defined as MTTF = 1/FIT.
FITs Prediction Based on Telcordia SR-332 Part Count Pro-
cedure
The Telcordia parts count method assumes that the mod-
ule failure rate is equal to the sum of the device compo-
nent failure rates. Modifiers are included to take into con-
sideration variations in module operation environments,
device quality requirements, temperature, and stress. The
following table shows the FITs for the components used in
the module and the total FITs which has been calculated
for a case temperature of 40°C.
Table 1. FIT Rate Calculations for AFBR-79E4Z-D
1.0
1.0
Reliability Prediction Based on Telcordia SR-332 (Issue 2) Parts Count Method Stress Factor at 50%
Environmental Factors
Telcordia Information
/ Data Source
Component
Base Rate (FITs) Factor
Quality
Temperature
Factor @ 40°C
Total Component Failure
Rate (FITs) @ 40°C
19.2
24.6
24.6
9.8
Component
VCSEL
Quantity
Avago Data
Photodiode
Photodiode
Fixed Ceramic
Fixed Film
4
6
0.8
0.8
0.8
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Monitor PIN IC
PIN
4
7.7
7.7
0.2
0.5
2.3
4
Capacitors
Resistors
49
57
5
28.5
11.5
Ferrite Chip
(Inductor)
Power Filter
MOSFET
OR Gate
Nand Gate
QSFP IC
Supplier Info
Supplier Info
Supplier Info
Avago Data
2
1
1
1
1
2
4.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
8.0
4.3
4.3
4.3
4.3
11.0
28.0
9.3
11.0
28.0
18.6
MicroController Supplier Info
Voltage
Telcordia Information
Regulator
/ Data Source
Connectors
PCB, Edge (20 pin)
38
0.13
1.0
1.0
4.9
197.4
Total AFBR-79E4Z-D
Transceiver Failure at 40°C (FITs)
5.07E+06
MTTF @ 40°C (hours)
FITs at other temperatures can be derived following the
The limitations of the FIT prediction based on the Parts
procedure of Telcordia SR-332, assuming activation en- Count method include the fact that the piece part failure
ergy, Ea, of 0.35eV to determine the component tempera- rates are mostly obtained from Telcordia database, which
ture factor T. The following table shows FITs at different
temperature for the transceiver.
may not be exhaustive for state-of-the-art piece parts,
and that the results are independent of true module en-
vironmental stress tests. Nevertheless, the information
obtained from the Parts Count method is a useful refer-
ence during design-in and evaluation. Whenever possible,
Avago substitutes internal data for the FIT rates of individ-
ual components, and predictions will be updated as more
current data becomes available.
Table 2. FIT rates at different operation case temperatures,
following the Telcordia Parts Count Method
Tcase (°C)
AFBR-79E4Z-D
197.4
40
50
60
70
296.1
434.3
612.0
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2738EN - November 18, 2010
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