ACMD-7702-TR1 [AVAGO]
1765 MHz(Tx), 1862.5 MHz(Rx), DUPLEXER, ROHS COMPLIANT, MINIATURE, SMD, 3 PIN;
| 型号： | ACMD-7702-TR1 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 1765 MHz(Tx), 1862.5 MHz(Rx), DUPLEXER, ROHS COMPLIANT, MINIATURE, SMD, 3 PIN |
| 文件： | 总8页 (文件大小：1620K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACMD-7702
Miniature UMTS Band 9 (J-WCDMA) Duplexer
Data Sheet
Description
Features
The Avago Technologies’ ACMD-7702 is a miniature
duplexer designed for use in UMTS Band 9/J-WCDMA
(1750 – 1785 MHz UL, 1845 – 1880 MHz DL) handsets and
mobile data terminals.
• Miniature Size
- 3.8 x 3.8 mm Footprint
- 1.3 mm Maximum Height
• High Power Rating
Bidirectional power handling capability also makes the
ACMD-7702 useful for Femtocell applications.
- 33 dBm Abs Max Tx Power
• Lead-Free Construction
The ACMD-7702 enhances the sensi¬tivity and dynamic
range of handset receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver input
and more than 42 dB rejection of transmit-generated
noise in the receive band.
Specifications
• Rx Band Performance, 1845-1880 MHz, –30 to +85°C
- Insertion Loss: 2.5 dB Max
- Rx Noise Blocking: 42 dB Min
Maximum Insertion Loss in the Tx channel is only 1.8 dB,
which minimizes current drain from the power amplifier.
Insertion Loss in the Rx channel is a maximum of 2.5 dB,
which improves receiver sensitivity.
• Tx Band Performance, 1750-1780 MHz, –30 to +85°C
- Insertion Loss: 1.8 dB Max
- Tx Interferer Blocking: 54 dB Min
The ACMD-7702 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction of
their usual size. The excellent power handling capability
of the FBAR bulk-mode resonators supports the high
output power levels needed in handsets while adding
virtually no distortion.
Applications
• Handsets or data terminals oper¬ating in the UMTS
Band 9 frequency range
• Miniature cellular access point applications such as
Picocells and Femtocells
The ACMD-7702 also utilizes Avago Technologies’innova-
tive Microcap bonded-wafer, chip scale packaging tech-
nology. This process allows the filters to be assembled in
a molded chip-on-board module that is less than 1.3 mm
high with a footprint of only 3.8 mm x 3.8 mm.
Functional Block Diagram
Ant
Port 3
Tx
Rx
Port 1
Port 2
[1]
ACMD-7702 Electrical Specifications, Z0=50 °, TC as indicated
– 30°C
+25°C
+85°C
[3]
[3]
[3]
Symbol Parameter
Units Min Typ
Max Min Typ
Max
Min Typ
Max
Antenna Port to Receive Port
S23
∆S23
S22
S23
S23
S23
S23
Insertion Loss in Receive Band
(1845 – 1880 MHz)
dB
dB
dB
dB
dB
dB
dB
1.7
2.5
1.1
1.7
0.8
12
61
45
38
42
2.5
1.1
1.7
0.7
12
62
45
2.5
1.1
Insertion Loss Ripple (p-p) in
Receive Band (1845 – 1880 MHz)
0.9
12
60
45
Return Loss of Receive Port in
Receive Band
10
54
10
54
35
30
30
10
54
Attenuation in Transmit Band
(1750 – 1785 MHz)
Attenuation in Receive 2nd
Harmonic Band (3690 – 3760 MHz)
Attenuation in UMTS Band 1
Transmit Band (1920 – 1980 MHz)
Attenuation in UMTS Band 1
Receive Band (2110 – 2170 MHz)
Transmit Port to Antenna Port
S31
∆S31
S11
S31
S31
S31
S31
Insertion Loss in Transmit Band
(1750 – 1785 MHz)
dB
dB
dB
dB
dB
dB
dB
1.5
0.4
18
46
10
1.8
1.1
1.5
0.4
18
46
10
38
23
1.8
1.1
1.6
0.5
18
46
10
1.8
1.1
Insertion Loss Ripple (p-p) in
Transmit Band (1750 – 1785 MHz)
Return Loss of Transmit Port in
Transmit Band
10
42
10
42
5
10
42
Attenuation in Receive Band
(1845 – 1880 MHz)
Attenuation in Transmit 2nd
Harmonic Band (3500 – 3570 MHz)
Attenuation in UMTS Band 1
Transmit Band (1920 – 1980 MHz)
30
15
Attenuation in UMTS Band 1
Receive Band (2110 – 2170 MHz)
Antenna Port
S33
Return Loss of Antenna Port in
Transmit and Receive Bands
dB
9
11
9
11
9
11
Isolation Transmit Port to
Receive Port
S21
S21
Tx-Rx Isolation in Transmit Band
(1750 – 1785 MHz)
dB
dB
59
48
59
48
59
48
Tx-Rx Isolation in Receive Band
(1845 – 1880 MHz)
Notes:
1. Specifications are guaranteed over –30 to 85°C temperature range with the input power to the Tx port equal to or less than +29 dBm over all
Tx frequencies, unless otherwise noted.
2. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.
3. Typical data is the average value of the parameter over the indicated frequency range. Refer to “Characterization” section for measurement
details.
2
[1]
Absolute Maximum Ratings
Parameter
Unit
°C
Value
Storage temperature
-65 to +125
+33
Maximum RF Input Power to Tx Port
dBm
[2]
Maximum Recommended Operating Conditions
Parameter
Unit
°C
Value
[3]
Operating temperature, Tc , Tx Power ≤ 29 dBm
-40 to +100
-40 to +85
[3]
Operating temperature, Tc , Tx Power ≤ 30 dBm
°C
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not
guaranteed to meet electrical specifications.
3. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.
ACMD-7702 Typical Performance at Tc = 25°C
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
1830
1840
1850
1860
1870
1880
1740
1750
1760
1770
1780
1790
Frequency (MHz)
Frequency (MHz)
Figure 1. Tx Band Insertion Loss
Figure 2. Rx Band Insertion Loss
0
-10
-20
-30
-40
-50
-60
-70
0
-5
-10
-15
-20
-25
-30
1700
1750
1800
1850
1900
1700
1750
1800
1850
1900
Frequency (MHz)
Frequency (MHz)
Figure 3. Tx Rejection in Rx Band and Rx Rejection in Tx Band
Figure 4. Tx and Rx Port Return Loss
3
-20
-30
-40
-50
-60
-70
0
-5
-10
-15
-20
-25
-30
1700
1750
1800
1850
1900
1700
1750
1800
1850
1900
Frequency (MHz)
Frequency (MHz)
Figure 5. Tx to Rx Isolation
Figure 6. Antenna Port Return Loss
0
0
-10
-20
-30
-40
-50
-60
Tx
-10
-20
-30
-40
-50
-60
Tx
Rx
Rx
0
1
2
3
4
5
6
3.0
3.2
3.4
Frequency (GHz)
Figure 8. Tx and Rx Second Harmonic Rejection
3.6
3.8
4.0
Frequency (GHz)
Figure 7. Tx and Rx Wideband Response
10
20
30
40
50
60
Tx
Rx
1900
1950
2000
2050
2100
2150
2200
Figure 9. Tx and Rx Rejection in the UMTS Band
4
Characterization
A test circuit with the DUT mounted in place is shown in
Figure 11. S-parameters are then measured using a net-
work analyzer and calibrated GSG probe set.
The test circuit shown in Figure 10 was used to measure
typical device performance. This circuit is designed to
interface with coplanar Ground-Signal-Ground (GSG) RF
probes of the type used to test semiconductor wafers. The
test circuit is a 7 x 7 mm PCB with a well-grounded pad for
solder-mounting the device under test (DUT).
Phase data for s-parameters measured with GSG probe
circuits are adjusted to place the reference plane at the
edge of the quadplexer.
Short lengths of 50-ohm microstripline connect the DUT
to GSG probe patterns on the board.
Figure 10. Test Circuit
Figure 11. Test Circuit with Duplexer
PACKAGE
1.6
ORIENTATION
0.8
0.5
SOLDER MASK OVER
INTERNAL VIA
3.8
1.2
0.08
RX
[PRODUCT
MARKING]
RX
TX
TX
ANT
ANT
1.9
Notes:
TOP VIEW
1. Dimensions in millimeters
2. Tolerance is 0.1 mm
3. Contact areas are gold plated
BOTTOM VIEW
4. Solder masks covering internal via is 0.51 mm diam.
Figure 12. Package Outline Drawing.
5
PACKAGE
ORIENTATION
S = ACMD-7702
FB = Avago ID
Y = Year
RX
TX
WW = Work Week
DC = Date Code
NNNN = Lot Number
ANT
Figure 13. Product Marking
1.2
1.2
0.8
0.2
0.4
0.3
1.0
1.8
T
W
1.4
0.3
0.6
Notes:
Dimensions in mm
All vias Ø 0.40
Angles 45°
RF ports are CPW
T and W selected for 50 ohms
Pattern centered on Duplexer
Figure 14. Recommended PCB Land Print.
6
Figure 17. Duplexer Superposed on Solder
Stencil
Figure 15. Duplexer Superposed on PCB Land Print.
300
250
200
150
100
50
Tested profile shown.
0
3.25
0
50
100
150
200
250
300
Time - Seconds
Notes:
Figure 18. Verified SMT Solder Profile
Dimensions in mm
Solder stripes (14 pls) are 0.20 wide, pitch = 0.40
Solder pads for I/O are 0.35 X 0.35
Stencil pattern is centered on duplexer
Figure 16. Recommended Solder Stencil
Package Moisture Sensitivity
Feature
Test Method
Performance
Moisture Sensitivity Level (MSL) at 260°C
J-STD-020C
Level 3
Figure 19. SMD Tape Packing
SPROCKET
HOLES
PACKAGE PIN 1
ORIENTATION
TAPE
WIDTH
POCKET
CAVITY
Figure 20. Unit Orientation In Tape
Ordering Information
Part Number
No. of Devices
Container
ACMD-7702-BLK
ACMD-7702-TR1
25
Anti-static Bag
7-inch Reel
1000
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.
AV02-0840EN - November 13, 2007
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