ATS-X50310G-C1-R0 [ATS]
High Performance BGA Cooling; 高性能BGA散热型号: | ATS-X50310G-C1-R0 |
厂家: | Advanced Thermal Solutions |
描述: | High Performance BGA Cooling |
文件: | 总1页 (文件大小:654K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Performance BGA Cooling
Solutions w/ superGRIP™ Attachment
ATS PART # ATS-X50310G-C1-R0
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Features & Benefits
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Designed for 31 x 31 mm BGA components
ꢁequires minimal space around the component’s
perimeter; ideal for densely populated PCBs
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Allows the heat sink to be detached and reattached
without damaging the component or the PCB, an important
feature in the event a PCB may need to be reworked
Strong, uniform attachment force helps achieve maximum
performance from phase-changing TIMs
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Eliminates the need to drill mounting holes in the PCB
Assembly comes standard with a high performance
maxiFLOW™ heat sink which maximizes convection (air)
cooling
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Comes standard with clean break, reworkable, Chomerics
T-766 phase change material
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ꢁhermal Performance
*Image above is for illustration purposes only.
AIR VELꢀCITy
THERMAL RESISTANCE
FT/MIN
200
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
3.5
4.3
3.5
3
300
400
500
2.7
2.5
2.3
2.2
600
700
800
Product Details
INTERFACE MATERIAL
LENGTH
WIDTH
HEIGHT
12.5 mm
FIN TIP to FIN TIP
FINISH
31 mm
54.9 mm
CꢀOMEꢁICS T766 BLUE-ANODIZED
31 mm
Nꢀꢁꢂꢃ:
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3)
Length and width dimensions refer to the size of the component. Dimensions of the heat
sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
Thermal performance data are provided for reference only. Actual performance may vary
by application
ATS reserves the right to update or change its products without notice to improve the
design or performance
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Additional tooling fees may be required
Typical lead time is a minimum of 4-6 weeks
Contact ATS to learn about custom options available
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV0_042109
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