ATF16V8CZ-15SL [ATMEL]

Flash PLD, 15ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, MS-013, SOIC-20;
ATF16V8CZ-15SL
型号: ATF16V8CZ-15SL
厂家: ATMEL    ATMEL
描述:

Flash PLD, 15ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, MS-013, SOIC-20

光电二极管
文件: 总26页 (文件大小:585K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Industry-standard Architecture  
– Emulates Many 20-pin PALs  
– Low-cost Easy-to-use Software Tools  
High-speed Electrically-erasable Programmable Logic Devices  
– 12 ns Maximum Pin-to-pin Delay  
Low-power - 5 µA (Typ) Standby Current  
CMOS and TTL Compatible Inputs and Outputs  
– Input and I/O Pin Keeper Circuits  
Advanced Flash Technology  
High-  
– Reprogrammable  
performance  
EE PLD  
– 100% Tested  
High-reliability CMOS Process  
– 20 Year Data Retention  
– 100 Erase/Write Cycles  
– 2,000V ESD Protection  
ATF16V8CZ  
– 200 mA Latchup Immunity  
Commercial and Industrial Temperature Ranges  
Dual-in-line and Surface Mount Packages in Standard Pinouts  
PCI-compliant  
Green (Pb/Halide-free/RoHS Compliant) Package Options Available  
1. Description  
The ATF16V8CZ is a high-performance EECMOS programmable logic device that uti-  
lizes Atmel’s proven electrically-erasable Flash memory technology. Speeds down to  
12 ns and a 5 µA (Typ) edge-sensing power-down mode are offered. All speed ranges  
are specified over the full 5V ±10% range for industrial temperature ranges; 5V ±5%  
for commercial range 5-volt devices.  
The ATF16V8CZ incorporates a superset of the generic architectures, which allows  
direct replacement of the 16R8 family and most 20-pin combinatorial PLDs. Eight out-  
puts are each allocated eight product terms. Three different modes of operation,  
configured automatically with software, allow highly complex logic functions to be  
realized.  
The ATF16V8CZ can significantly reduce total system power, thereby enhancing sys-  
tem reliability and reducing power supply costs. When all the inputs and internal  
nodes are not switching, supply current drops to less than 5 µA typically. This auto-  
matic power-down feature (or sleep mode) allows for power savings in slow clock  
systems and asynchronous applications. Also, the pin-keeper circuits eliminate the  
need for internal pull-up resistors along with their attendant power consumption.  
0453H–PLD–7/05  
Figure 1-1. Block Diagram  
2. Pin Configuration and Pinouts  
Table 2-1.  
Pinouts - All Pinouts Top View  
Pin Name  
Function  
CLK  
I
Clock  
Logic Inputs  
Bi-directional Buffers  
Output Enable  
+5V Supply  
I/O  
OE  
VCC  
Figure 2-1. TSSOP  
I/CLK  
I1  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VCC  
I/O  
I2  
I/O  
I3  
I/O  
I4  
I/O  
I5  
I/O  
I6  
I/O  
I7  
I/O  
I8  
I/O  
GND  
I9/OE  
Figure 2-2. DIP/SOIC  
I/CLK  
1
2
3
4
5
6
7
8
9
20 VCC  
19 I/O  
18 I/O  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
12 I/O  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
GND 10  
11 I9/OE  
2
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
Figure 2-3. PLCC  
I3  
I4  
I5  
I6  
I7  
4
5
6
7
8
18 I/O  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
3. Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Temperature Under Bias.................................. -40°C to +85°C  
Storage Temperature..................................... -65°C to +150°C  
Voltage on Any Pin with  
Respect to Ground .........................................-2.0V to +7.0V(1)  
Voltage on Input Pins  
with Respect to Ground  
During Programming.....................................-2.0V to +14.0V(1)  
Note:  
1. Minimum voltage is -0.6V DC, which may under-  
shoot to -2.0V for pulses of less than 20 ns.  
Maximum output pin voltage is VCC + 0.75V DC,  
which may overshoot to 7.0V for pulses of less  
than 20 ns.  
Programming Voltage with  
Respect to Ground .......................................-2.0V to +14.0V(1)  
4. DC and AC Operating Conditions  
Commercial  
Industrial  
-40°C - 85°C  
5V ±10%  
Operating Temperature (Ambient)  
VCC Power Supply  
0°C - 70°C  
5V ±5%  
4.1  
DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
-10  
10  
Units  
µA  
IIL  
Input or I/O Low Leakage Current  
Input or I/O High Leakage Current  
0 VIN VIL(Max)  
3.5 VIN VCC  
IIH  
µA  
Com  
Ind.  
95  
mA  
mA  
µA  
15 MHz, VCC = Max,  
VIN = 0, VCC, Outputs Open  
ICC1  
Power Supply Current  
105  
Com.  
Ind  
5
5
Power Supply Current,  
Standby Mode  
0 MHz, VCC = Max,  
VIN = 0, VCC, Outputs Open  
(1)  
ICC  
µA  
V
OUT = 0.5V;  
IOS  
Output Short Circuit Current  
-150  
mA  
VCC= 5V; TA = 25°C  
VIL  
VIH  
Input Low Voltage  
Input High Voltage  
Min < VCC < Max  
-0.5  
2.0  
0.8  
V
V
VCC+1  
VCC = Min, All Outputs  
IOL = -16 mA  
VOL  
Output Low Voltage  
Com, Ind.  
0.5  
V
3
0453H–PLD–7/05  
4.1  
DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
VCC = Min  
IOL = -3.2 mA  
VOH  
Output High Voltage  
2.4  
V
Com.  
24  
12  
4
IOL  
Output Low Current  
Output High Current  
VCC = Min  
mA  
mA  
Ind.  
IOH  
VCC = Min  
Com., Ind.  
Note:  
1. All ICC parameters measured with outputs open. Data is based on Atmel test patterns. Reading may vary with pattern.  
4
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
4.2  
AC Waveforms(1)  
Note:  
1. Timing measurement reference is 1.5V. Input AC driving levels are 0.0V and 3.0V, unless otherwise specified.  
4.3  
AC Characteristics  
-12  
-15  
Symbol Parameter  
Min  
Max  
12  
6
Min  
Max  
15  
8
Units  
ns  
tPD  
tCF  
tCO  
tS  
Input or Feedback to Non-registered Output  
Clock to Feedback  
3
3
ns  
Clock to Output  
2
10  
0
8
2
12  
0
10  
ns  
Input or Feedback Setup Time  
Input Hold Time  
ns  
tH  
ns  
tP  
Clock Period  
12  
6
16  
8
ns  
tW  
Clock Width  
ns  
External Feedback 1/(tS + tCO  
)
55  
62  
83  
12  
15  
12  
12  
45  
50  
62  
15  
15  
15  
15  
MHz  
MHz  
MHz  
ns  
fMAX  
Internal Feedback 1/(tS + tCF  
)
No Feedback 1/(tP)  
tEA  
Input to Output Enable – Product Term  
Input to Output Disable – Product Term  
OE pin to Output Enable  
3
2
3
2
tER  
ns  
tPZX  
tPXZ  
2
2
ns  
OE pin to Output Disable  
1.5  
1.5  
ns  
5
0453H–PLD–7/05  
4.4  
Input Test Waveforms  
4.4.1  
Input Test Waveforms and Measurement Levels  
tR, tF < 1.5 ns (10% to 90%)  
4.4.2  
Output Test Loads  
Note:  
Similar devices are tested with slightly different loads. These load differences may affect output  
signals' delay and slew rate. Atmel devices are tested with sufficient margins to meet compatible  
devices.  
4.4.3  
Pin Capacitance  
Table 4-1.  
Pin Capacitance (f = 1 MHz, T = 25°C(1))  
Typ  
5
Max  
8
Units  
pF  
Conditions  
VIN = 0V  
CIN  
COUT  
6
8
pF  
VOUT = 0V  
Note:  
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100%  
tested.  
6
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
4.5  
Power-up Reset  
The ATF16V8CZ’s registers are designed to reset during power-up. At a point delayed slightly  
from VCC crossing VRST, all registers will be reset to the low state. As a result, the registered out-  
put state will always be high on power-up.  
This feature is critical for state machine initialization. However, due to the asynchronous nature  
of reset and the uncertainty of how VCC actually rises in the system, the following conditions are  
required:  
1. The VCC rise must be monotonic, from below 0.7V,  
2. After reset occurs, all input and feedback setup times must be met before driving the  
clock term high, and  
3. The signals from which the clock is derived must remain stable during tPR  
.
Parameter  
tPR  
Description  
Typ  
600  
3.8  
Max  
Units  
ns  
Power-up Reset Time  
Power-up Reset Voltage  
1,000  
4.5  
VRST  
V
4.6  
Preload of Registered Outputs  
The ATF16V8CZ’s registers are provided with circuitry to allow loading of each register with  
either a high or a low. This feature will simplify testing since any state can be forced into the reg-  
isters to control test sequencing. A JEDEC file with preload is generated when a source file with  
vectors is compiled. Once downloaded, the JEDEC file preload sequence will be done automati-  
cally by approved programmers.  
5. Security Fuse Usage  
A single fuse is provided to prevent unauthorized copying of the ATF16V8CZ fuse patterns.  
Once programmed, fuse verify and preload are inhibited. However, the 64-bit User Signature  
remains accessible.  
The security fuse should be programmed last, as its effect is immediate.  
7
0453H–PLD–7/05  
6. Input and I/O Pin-keeper Circuits  
The ATF16V8CZ contains internal input and I/O pin-keeper circuits. These circuits allow each  
ATF16V8CZ pin to hold its previous value even when it is not being driven by an external source  
or by the device’s output buffer. This helps insure that all logic array inputs are at known, valid  
logic levels. This reduces system power by preventing pins from floating to indeterminate levels.  
By using pin-keeper circuits rather than pull-up resistors, there is no DC current required to hold  
the pins in either logic state (high or low).  
These pin-keeper circuits are implemented as weak feedback inverters, as shown in the Input  
Diagram below. These keeper circuits can easily be overdriven by standard TTL- or CMOS-com-  
patible drivers. The typical overdrive current required is 40 µA.  
Figure 6-1. Input Diagram  
Figure 6-2. I/O Diagram  
8
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
7. Functional Logic Diagram Description  
The Logic Option and Functional Diagrams describe the ATF16V8CZ architecture. Eight config-  
urable macrocells can be configured as a registered output, combinatorial I/O, combinatorial  
output, or dedicated input.  
The ATF16V8CZ can be configured in one of three different modes. Each mode makes the  
ATF16V8CZ look like a different device. Most PLD compilers can choose the right mode auto-  
matically. The user can also force the selection by supplying the compiler with a mode selection.  
The determining factors would be the usage of register versus combinatorial outputs and dedi-  
cated outputs versus outputs with output enable control.  
The ATF16V8CZ universal architecture can be programmed to emulate many 20-pin PAL  
devices. These architectural subsets can be found in each of the configuration modes described  
in the following pages. The user can download the listed subset device JEDEC programming file  
to the PLD programmer, and the ATF16V8CZ can be configured to act like the chosen device.  
Check with your programmer manufacturer for this capability.  
Unused product terms are automatically disabled by the compiler to decrease power consump-  
tion. A security fuse, when programmed, protects the content of the ATF16V8CZ. Eight bytes  
(64 fuses) of User Signature are accessible to the user for purposes such as storing project  
name, part number, revision, or date. The User Signature is accessible regardless of the state of  
the security fuse.  
Table 7-1.  
Compiler Mode Selection  
Registered  
P16C8R  
Complex  
P16V8C  
Simple  
P16V8AS  
G16V8AS  
GAL16V8_C8(1)  
“Simple”  
Auto Select  
P16V8  
ABEL, Atmel-ABEL  
CUPL  
G16V8MS  
GAL16V8_R(1)  
“Registered”  
P16V8R  
G16V8MA  
GAL16V8_C7(1)  
“Complex”  
P16V8C  
G16V8A  
GAL16V8  
GAL16V8A  
P16V8A  
LOG/iC  
OrCAD-PLD  
PLDesigner  
Tango-PLD  
P16V8C  
G16V8R  
G16V8C  
G16V8AS  
G16V8  
Notes: 1. Only applicable for version 3.4 or lower.  
9
0453H–PLD–7/05  
8. Macrocell Configuration  
Software compilers support the three different OMC modes as different device types. These  
device types are listed in the table below. Most compilers have the ability to automatically select  
the device type, generally based on the register usage and output enable (OE) usage. Register  
usage on the device forces the software to choose the registered mode. All combinatorial out-  
puts with OE controlled by the product term will force the software to choose the complex mode.  
The software will choose the simple mode only when all outputs are dedicated combinatorial  
without OE control. The different device types listed in the table can be used to override the  
automatic device selection by the software. For further details, refer to the compiler software  
manuals.  
When using compiler software to configure the device, the user must pay special attention to the  
following restrictions in each mode.  
In registered mode pin 1 and pin 11 are permanently configured as clock and output enable,  
respectively. These pins cannot be configured as dedicated inputs in the registered mode.  
In complex mode pin 1 and pin 11 become dedicated inputs and use the feedback paths of pin  
19 and pin 12 respectively. Because of this feedback path usage, pin 19 and pin 12 do not have  
the feedback option in this mode.  
In simple mode all feedback paths of the output pins are routed via the adjacent pins. In doing  
so, the two inner most pins (pins 15 and 16) will not have the feedback option as these pins are  
always configured as dedicated combinatorial output.  
8.1  
ATF16V8CZ Registered Mode  
PAL Device Emulation/PAL Replacement. The registered mode is used if one or more regis-  
ters are required. Each macrocell can be configured as either a registered or combinatorial  
output or I/O, or as an input. For a registered output or I/O, the output is enabled by the OE pin,  
and the register is clocked by the CLK pin. Eight product terms are allocated to the sum term.  
For a combinatorial output or I/O, the output enable is controlled by a product term, and seven  
product terms are allocated to the sum term. When the macrocell is configured as an input, the  
output enable is permanently disabled.  
Any register usage will make the compiler select this mode. The following registered devices can  
be emulated using this mode:  
16R8  
16R6  
16R4  
16RP8  
16RP6  
16RP4  
10  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
Figure 8-1. Registered Configuration for Registered Mode(1)(2)  
Notes: 1. Pin 1 controls common CLK for the registered outputs.  
Pin 11 controls common OE for the registered outputs.  
Pin 1 and Pin 11 are permanently configured as CLK and OE.  
2. The development software configures all the architecture control bits and checks for proper pin  
usage automatically.  
Figure 8-2. Combinatorial Configuration for Registered Mode(1)(2)  
Notes: 1. Pin 1 and Pin 11 are permanently configured as CLK and OE.  
2. The development software configures all the architecture control bits and checks for proper pin  
usage automatically.  
11  
0453H–PLD–7/05  
Figure 8-3. Registered Mode Logic Diagram  
12  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
8.2  
ATF16V8CZ Complex Mode  
PAL Device Emulation/PAL Replacement. In the complex mode, combinatorial output and I/O  
functions are possible. Pins 1 and 11 are regular inputs to the array. Pins 13 through 18 have pin  
feedback paths back to the AND-array, which makes full I/O capability possible. Pins 12 and 19  
(outermost macrocells) are outputs only. They do not have input capability. In this mode, each  
macrocell has seven product terms going to the sum term and one product term enabling the  
output.  
Combinatorial applications with an OE requirement will make the compiler select this mode. The  
following devices can be emulated using this mode:  
16L8  
16H8  
16P8  
Figure 8-4. Complex Mode Option  
9. ATF16V8CZ Simple Mode  
PAL Device Emulation/PAL Replacement. In the Simple Mode, 8 product terms are allocated  
to the sum term. Pins 15 and 16 (center macrocells) are permanently configured as combinato-  
rial outputs. Other macrocells can be either inputs or combinatorial outputs with pin feedback to  
the AND-array. Pins 1 and 11 are regular inputs.  
The compiler selects this mode when all outputs are combinatorial without OE control. The fol-  
lowing simple PALs can be emulated using this mode:  
10L8 10H8 10P8  
12L6 12H6 12P6  
14L4 14H4 14P4  
16L2 16H2 16P2  
13  
0453H–PLD–7/05  
Figure 9-1. Simple Mode Option  
0
1
14  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
Figure 9-2. Complex Mode Logic Diagram  
15  
0453H–PLD–7/05  
Figure 9-3. Simple Mode Logic Diagram  
16  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
9.1  
Test Characterization Data  
17  
0453H–PLD–7/05  
18  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
19  
0453H–PLD–7/05  
10. Ordering Information  
10.1 Standard Package Options  
tPD  
tS  
tCO  
(ns)  
(ns)  
(ns)  
Ordering Code  
Package  
Operation Range  
ATF16V8CZ-12JC  
ATF16V8CZ-12PC  
ATF16V8CZ-12SC  
ATF16V8CZ-12XC  
20J  
20P3  
20S  
Commercial  
12  
15  
10  
12  
12  
8
(0°C to 70°C)  
20X  
ATF16V8CZ-15JC  
ATF16V8CZ-15PC  
20J  
20P3  
20S  
Commercial  
10  
10  
(0°C to 70°C)  
ATF16V8CZ-15SC  
ATF16V8CZ-15XC  
20X  
ATF16V8CZ-15JI  
ATF16V8CZ-15PI  
20J  
20P3  
20S  
Industrial  
(-40°C to 85°C)  
ATF16V8CZ-15SI  
ATF16V8CZ-15XI  
20X  
Note:  
Shaded parts are being obsoleted in Q3-05 and being replaced by Green parts.  
10.2 Using “C” Product for Industrial  
To use commercial product for Industrial temperature ranges, down-grade one speed grade  
from the “I” to the “C” device (7 ns “C” = 10 ns “I”) and de-rate power by 30%.  
10.3 Green Package Options (Pb/Halide-free/RoHS Compliant)  
tPD  
tS  
tCO  
(ns)  
(ns)  
(ns)  
Ordering Code  
Package  
Operation Range  
ATF16V8CZ-15JU  
ATF16V8CZ-15PU  
ATF16V8CZ-15SU  
ATF16V8CZ-15XU  
20J  
20P3  
20S  
Industrial  
15  
12  
10  
(-40°C to 85°C)  
20X  
Package Type  
20J  
20-lead, Plastic J-leaded Chip Carrier (PLCC)  
20P3  
20S  
20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
20-lead, 0.300" Wide, Plastic Gull-wing Small Outline (SOIC)  
20-lead, 4.4 mm Wide, Plastic Thin Shrink Small Outline (TSSOP)  
20X  
20  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
11. Package Information  
11.1 20J – PLCC  
PIN NO. 1  
1.14(0.045) X 45˚  
1.14(0.045) X 45˚  
0.318(0.0125)  
0.191(0.0075)  
IDENTIFIER  
e
E1  
E
D2/E2  
B1  
B
A2  
A1  
D1  
D
A
0.51(0.020)MAX  
45˚ MAX (3X)  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
4.191  
2.286  
0.508  
9.779  
8.890  
9.779  
8.890  
7.366  
0.660  
0.330  
MAX  
4.572  
3.048  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
10.033  
D1  
E
9.042 Note 2  
10.033  
Notes:  
1. This package conforms to JEDEC reference MS-018, Variation AA.  
2. Dimensions D1 and E1 do not include mold protrusion.  
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the upper or lower parting line.  
E1  
D2/E2  
B
9.042 Note 2  
8.382  
0.813  
3. Lead coplanarity is 0.004" (0.102 mm) maximum.  
B1  
e
0.533  
1.270 TYP  
10/04/01  
DRAWING NO. REV.  
20J  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC)  
B
R
21  
0453H–PLD–7/05  
11.2 20P3 – PDIP  
D
PIN  
1
E1  
A
SEATING PLANE  
A1  
L
B
B1  
e
E
COMMON DIMENSIONS  
(Unit of Measure = mm)  
C
MIN  
MAX  
5.334  
NOM  
NOTE  
SYMBOL  
eC  
A
eB  
A1  
D
0.381  
24.892  
7.620  
6.096  
0.356  
1.270  
2.921  
0.203  
26.924 Note 2  
8.255  
E
E1  
B
7.112 Note 2  
0.559  
B1  
L
1.551  
Notes:  
1. This package conforms to JEDEC reference MS-001, Variation AD.  
2. Dimensions D and E1 do not include mold Flash or Protrusion.  
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").  
3.810  
C
0.356  
eB  
eC  
e
10.922  
0.000  
1.524  
2.540 TYP  
1/23/04  
DRAWING NO. REV.  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual  
Inline Package (PDIP)  
20P3  
D
R
22  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
11.3 20S – SOIC  
Dimensions in Millimeters and (Inches).  
Controlling dimension: Inches.  
JEDEC Standard MS-013  
0.51(0.020)  
0.33(0.013)  
10.65 (0.419)  
10.00 (0.394)  
7.60 (0.2992)  
7.40 (0.2914)  
PIN 1 ID  
PIN 1  
1.27 (0.050) BSC  
13.00 (0.5118)  
12.60 (0.4961)  
2.65 (0.1043)  
2.35 (0.0926)  
0.30(0.0118)  
0.10 (0.0040)  
0.32 (0.0125)  
0.23 (0.0091)  
0º ~ 8º  
1.27 (0.050)  
0.40 (0.016)  
10/23/03  
TITLE  
DRAWING NO. REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
20S, 20-lead, 0.300" Body, Plastic Gull Wing Small Outline (SOIC)  
20S  
B
R
23  
0453H–PLD–7/05  
11.4 20X – TSSOP  
Dimensions in Millimeters and (Inches).  
Controlling dimension: Millimeters.  
JEDEC Standard MO-153 AC  
INDEX MARK  
PIN  
1
6.50 (0.256)  
6.25 (0.246)  
4.50 (0.177)  
4.30 (0.169)  
6.60 (.260)  
6.40 (.252)  
1.20 (0.047) MAX  
0.65 (.0256) BSC  
0.15 (0.006)  
0.05 (0.002)  
SEATING  
PLANE  
0.30 (0.012)  
0.19 (0.007)  
0.20 (0.008)  
0.09 (0.004)  
0º ~ 8º  
0.75 (0.030)  
0.45 (0.018)  
10/23/03  
TITLE  
DRAWING NO. REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
20X, (Formerly 20T), 20-lead, 4.4 mm Body Width,  
Plastic Thin Shrink Small Outline Package (TSSOP)  
20X  
C
R
24  
ATF16V8CZ  
0453H–PLD–7/05  
ATF16V8CZ  
12. Revision History  
12.1 0453H  
1. Green Package options added in 2005.  
25  
0453H–PLD–7/05  
Atmel Corporation  
Atmel Operations  
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San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
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Postfach 3535  
74025 Heilbronn, Germany  
Tel: (49) 71-31-67-0  
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2325 Orchard Parkway  
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Tel: 1(408) 441-0311  
Fax: 1(408) 436-4314  
Regional Headquarters  
Microcontrollers  
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San Jose, CA 95131, USA  
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Fax: 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906, USA  
Tel: 1(719) 576-3300  
Europe  
Atmel Sarl  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
Tel: (41) 26-426-5555  
Fax: (41) 26-426-5500  
Fax: 1(719) 540-1759  
Biometrics/Imaging/Hi-Rel MPU/  
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Printed on recycled paper.  
0453H–PLD–7/05  

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