ATA6624C [ATMEL]
Typically 10 μA Supply Current During Sleep Mode; 通常为10 μA电源电流在休眠模式下
| 型号： | ATA6624C |
| 厂家： | 
ATMEL |
| 描述： | Typically 10 μA Supply Current During Sleep Mode |
| 文件： | 总31页 (文件大小：979K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Master and Slave Operation Possible
• Supply Voltage up to 40V
• Operating voltage VS = 5V to 27V
• Typically 10 µA Supply Current During Sleep Mode
• Typically 57 µA Supply Current in Silent Mode
• Linear Low-drop Voltage Regulator:
– Normal, Fail-safe, and Silent Mode
– ATA6622 VCC = 3.3V ±2%
LIN Bus
– ATA6624 VCC = 5.0V ±2%
– ATA6626 VCC = 5.0V ±2%, TXD Time-out Timer Disabled
– In Sleep Mode VCC is Switched Off
Transceiver
with 3.3V (5V)
Regulator and
Watchdog
• VCC- Undervoltage Detection (4 ms Reset Time) and Watchdog Reset Logical
Combined at Open Drain Output NRES
• Negative Trigger Input for Watchdog
• Boosting the Voltage Regulator Possible with an External NPN Transistor
• LIN Physical Layer According to LIN 2.0, 2.1 and SAEJ2602-2
• Wake-up Capability via LIN-bus, Wake Pin, or Kl_15 Pin
• INH Output to Control an External Voltage Regulator or to Switch off the Master Pull Up
Resistor
ATA6622
ATA6624
ATA6626
ATA6622C
ATA6624C
ATA6626C
• TXD Time-out Timer; ATA6626: TXD Time-out Timer Is Disabled
• Bus Pin is Overtemperature and Short Circuit Protected versus GND and Battery
• Adjustable Watchdog Time via External Resistor
• Advanced EMC and ESD Performance
• Fulfills the OEM “Hardware Requirements for LIN in automotive Applications Rev.1.0”
• Interference and Damage Protection According ISO7637
• Package: QFN 5 mm × 5 mm with 20 Pins
1. Description
The ATA6622 is a fully integrated LIN transceiver, which complies with the LIN 2.0,
2.1 and SAEJ2602-2 specifications. It has a low-drop voltage regulator for
3.3V/50 mA output and a window watchdog. The ATA6624 has the same functionality
as the ATA6622; however, it uses a 5V/50 mA regulator. The ATA6626 has the same
functionality as ATA6624 without a TXD time-out timer. The voltage regulator is able
to source 50 mA, but the output current can be boosted by using an external NPN
transistor. This chip combination makes it possible to develop inexpensive, simple, yet
powerful slave and master nodes for LIN-bus systems. ATA6622/ATA6624/ATA6626
are designed to handle the low-speed data communication in vehicles, e.g., in conve-
nience electronics. Improved slope control at the LIN-driver ensures secure data
communication up to 20 kBaud. Sleep Mode and Silent Mode guarantee very low cur-
rent consumption. The ATA6626 is able to switch the LIN unlimited to dominant level
via TXD for low data rates.
4986I–AUTO–07/10
Figure 1-1. Block Diagram
20
VS
Normal and
Fail-safe
Mode
10
INH
PVCC
Normal
Mode
Receiver
-
9
RXD
+
7
RF Filter
LIN
4
WAKE
16
Edge
Wake-up
KL_15
Detection
Bus Timer
Short Circuit and
Overtemperature
PVCC
Protection
Slew Rate Control
TXD
Time-out
Timer
11
TXD
*)
19
Control Unit
Normal/Silent/
Fail-safe Mode
3.3/5V
VCC
18
PVCC
1
Debounce
Time
/50 mA/±2%
EN
Mode Select
12
Undervoltage
Reset
NRES
OUT
Adjustable
Watchdog
Oscillator
13
Internal Testing
WD_OSC
Watchdog
Unit
5
GND
PVCC
15
14
3
MODE TM
NTRIG
*) Not in ATA6626
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ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
2. Pin Configuration
Figure 2-1. Pinning QFN20
20 19 18 17 16
EN
GND
1
2
3
4
5
15
14
13
12
11
MODE
TM
ATA6622/24/26
QFN 5 mm × 5 mm
0.65 mm pitch
20 lead
NTRIG
WAKE
GND
WD_OSC
NRES
TXD
6
7
8
9
10
Table 2-1.
Pin Description
Pin
Symbol
EN
Function
1
Enables the device in Normal Mode
System ground (optional)
2
GND
NTRIG
WAKE
GND
GND
LIN
3
Low-level watchdog trigger input from microcontroller
4
High-voltage input for local wake-up request; if not needed, connect directly to VS
System ground (mandatory)
5
6
7
System ground (optional)
LIN-bus line input/output
8
GND
RXD
System ground (optional)
9
Receive data output
10
INH
Battery related output for controlling an external voltage regulator
Transmit data input; active low output (strong pull down) after a local wake-up request
Output undervoltage and watchdog reset (open drain)
External resistor for adjustable watchdog timing
For factory testing only (tie to ground)
Low, watchdog is on; high, watchdog is off
Ignition detection (edge sensitive)
11
TXD
12
NRES
WD_OSC
TM
13
14
15
MODE
KL_15
GND
PVCC
VCC
16
17
System ground (optional)
18
3.3V/5V regulator sense input pin
19
3.3V/5V regulator output/driver pin
20
VS
Battery supply
Backside
Heat slug is connected to all GND pins
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4986I–AUTO–07/10
3. Functional Description
3.1
Physical Layer Compatibility
Since the LIN physical layer is independent from higher LIN layers (e.g., the LIN protocol layer),
all nodes with a LIN physical layer according to revision 2.x can be mixed with LIN physical layer
nodes, which, according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3), are without
any restrictions.
3.2
Supply Pin (VS)
The LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to
disable data transmission if VS falls below VSth < 4V in order to avoid false bus messages. After
switching on VS, the IC starts in Fail-safe Mode, and the voltage regulator is switched on (i.e.,
3.3V/5V/50 mA output capability).
The supply current is typically 10 µA in Sleep Mode and 57 µA in Silent Mode.
3.3
3.4
Ground Pin (GND)
The IC does not affect the LIN Bus in the event of GND disconnection. It is able to handle a
ground shift up to 11.5% of VS. The mandatory system ground is pin 5.
Voltage Regulator Output Pin (VCC)
The internal 3.3V/5V voltage regulator is capable of driving loads with up to 50 mA. It is able to
supply the microcontroller and other ICs on the PCB and is protected against overloads by
means of current limitation and overtemperature shut-down. Furthermore, the output voltage is
monitored and will cause a reset signal at the NRES output pin if it drops below a defined
threshold Vthun. To boost up the maximum load current, an external NPN transistor may be used,
with its base connected to the VCC pin and its emitter connected to PVCC.
3.5
3.6
Voltage Regulator Sense Pin (PVCC)
The PVCC is the sense input pin of the 3.3V/5V voltage regulator. For normal applications (i.e.,
when only using the internal output transistor), this pin is connected to the VCC pin. If an
external boosting transistor is used, the PVCC pin must be connected to the output of this
transistor, i.e., its emitter terminal.
Bus Pin (LIN)
A low-side driver with internal current limitation and thermal shutdown and an internal pull-up
resistor compliant with the LIN 2.x specification are implemented. The allowed voltage range is
between –27V and +40V. Reverse currents from the LIN bus to VS are suppressed, even in the
event of GND shifts or battery disconnection. LIN receiver thresholds are compatible with the
LIN protocol specification. The fall time from recessive to dominant bus state and the rise time
from dominant to recessive bus state are slope controlled.
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ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
3.7
3.8
Input/Output Pin (TXD)
In Normal Mode the TXD pin is the microcontroller interface used to control the state of the LIN
output. TXD must be pulled to ground in order to have a low LIN-bus. If TXD is high or uncon-
nected (internal pull-up resistor), the LIN output transistor is turned off, and the bus is in
recessive state. During Fail-safe Mode, this pin is used as output. It is current-limited to < 8 mA.
and is latched to low if the last wake-up event was from pin WAKE or KL_15.
TXD Dominant Time-out Function
The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being
driven permanently in dominant state. If TXD is forced to low for longer than tDOM > 6 ms, the
LIN-bus driver is switched to recessive state.
To reactivate the LIN bus driver, switch TXD to high (> 10 µs).
The time-out function is disabled in the ATA6626. Switching to dominant level on the LIN bus
occurs without any time limitations.
3.9
Output Pin (RXD)
This output pin reports the state of the LIN-bus to the microcontroller. LIN high (recessive state)
is reported by a high level at RXD; LIN low (dominant state) is reported by a low level at RXD.
The output has an internal pull-up resistor with typically 5 kΩto VCC. The AC characteristics can
be defined with an external load capacitor of 20 pF.
The output is short-circuit protected. RXD is switched off in Unpowered Mode (i.e., VS = 0V).
3.10 Enable Input Pin (EN)
The Enable Input pin controls the operation mode of the device. If EN is high, the circuit is in
Normal Mode, with transmission paths from TXD to LIN and from LIN to RXD both active. The
VCC voltage regulator operates with 3.3V/5V/50 mA output capability.
If EN is switched to low while TXD is still high, the device is forced to Silent Mode. No data trans-
mission is then possible, and the current consumption is reduced to IVS typ. 57 µA. The VCC
regulator has its full functionality.
If EN is switched to low while TXD is low, the device is forced to Sleep Mode. No data transmis-
sion is possible, and the voltage regulator is switched off.
3.11 Wake Input Pin (WAKE)
The Wake Input pin is a high-voltage input used to wake up the device from Sleep Mode or
Silent Mode. It is usually connected to an external switch in the application to generate a local
wake-up. A pull-up current source, typically 10 µA, is implemented.
If a local wake-up is not needed in the application, connect the Wake pin directly to the VS pin.
3.12 Mode Input Pin (MODE)
Connect the MODE pin directly or via an external resistor to GND for normal watchdog opera-
tion. To debug the software of the connected microcontroller, connect MODE pin to 3.3V/5V and
the watchdog is switched off.
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4986I–AUTO–07/10
3.13 TM Input Pin
3.14 KL_15 Pin
The TM pin is used for final production measurements at Atmel®. In normal application, it has to
be always connected to GND.
The KL_15 pin is a high-voltage input used to wake up the device from Sleep or Silent Mode. It
is an edge sensitive pin (low-to-high transition). It is usually connected to ignition to generate a
local wake-up in the application when the ignition is switched on. Although KL_15 pin is at high
voltage (VBatt), it is possible to switch the IC into Sleep or Silent Mode. Connect the KL_15 pin
directly to GND if you do not need it. A debounce timer with a typical TdbKl_15 of 160 µs is
implemented.
The input voltage threshold can be adjusted by varying the external resistor due to the input
current IKL_15. To protect this pin against voltage transients, a serial resistor of 47 kΩ and a
ceramic capacitor of 100 nF are recommended. With this RC combination you can increase the
wake-up time TwKL_15 and, therefore, the sensitivity against transients on the ignition Kl.15.
You can also increase the wake-up time using external capacitors with higher values.
3.15 INH Output Pin
The INH Output pin is used to switch an external voltage regulator on during Normal or Fail-safe
Mode. The INH pin is switched off in Sleep or Silent Mode. It is possible to switch off the external
1 kΩ master resistor via the INH pin for master node applications. The INH pin is switched off
during VCC undervoltage reset.
3.16 Reset Output Pin (NRES)
The Reset Output pin, an open drain output, switches to low during VCC undervoltage or a
watchdog failure.
3.17 WD_OSC Output Pin
The WD_OSC Output pin provides a typical voltage of 1.2V, which supplies an external resistor
with values between 34 kΩ and 120 kΩ to adjust the watchdog oscillator time.
3.18 NTRIG Input Pin
The NTRIG Input pin is the trigger input for the window watchdog. A pull-up resistor is imple-
mented. A negative edge triggers the watchdog. The trigger signal (low) must exceed a
minimum time ttrigmin to generate a watchdog trigger.
3.19 Wake-up Events from Sleep or Silent Mode
• LIN-bus
• WAKE pin
• EN pin
• KL_15
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ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
4. Modes of Operation
Figure 4-1. Modes of Operation
a: VS > 5V
b: VS < 4V
Unpowered Mode
VBatt = 0V
c: Bus wake-up event
d: Wake up from WAKE or KL_15 pin
e: NRES switches to low
b
a
b
Fail-safe Mode
VCC: 3.3V/5V/50 mA
with undervoltage monitoring
Communication: OFF
Watchdog: ON
b
b
c + d + e
e
EN = 1
EN = 1
c + d
Go to silent command
Local wake-up event
EN = 0
Silent Mode
TXD = 1
VCC: 3.3V/5V/50 mA
with undervoltage monitoring
Communication: OFF
Watchdog: OFF
Normal Mode
EN = 1
VCC: 3.3V/5V/50 mA
with undervoltage
monitoring
Go to sleep command
EN = 0
Sleep Mode
Communication: ON
Watchdog: ON
TXD = 0
VCC: switched off
Communication: OFF
Watchdog: OFF
Table 4-1.
Mode of
Operation Transceiver
Table of Modes
VCC
Watchdog WD_OSC INH
RXD
LIN
High,
except after wake-up
Fail-safe
Normal
Off
On
3.3V/5V
On
On
1.23V
1.23V
On
On
Recessive
TXD
depending
3.3V/5V
LIN depending
Silent
Sleep
Off
Off
3.3V/5V
0V
Off
Off
0V
0V
Off
Off
High
0V
Recessive
Recessive
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4986I–AUTO–07/10
4.1
4.2
Normal Mode
Silent Mode
This is the normal transmitting and receiving mode of the LIN Interface in accordance with the
LIN specification LIN 2.x. The voltage regulator is active and can source up to 50 mA. The
undervoltage detection is activated. The watchdog needs a trigger signal from NTRIG to avoid
resets at NRES. If NRES is switched to low, the IC changes its state to Fail-safe Mode.
A falling edge at EN when TXD is high switches the IC into Silent Mode. The TXD Signal has to
be logic high during the Mode Select window (see Figure 4-2 on page 8). The transmission path
is disabled in Silent Mode. The overall supply current from VBatt is a combination of the
IVSsi = 57 µA plus the VCC regulator output current IVCC.
The 3.3V/5V regulator with 2% tolerance can source up to 50 mA. The internal slave termination
between the LIN pin and the VS pin is disabled in Silent Mode, only a weak pull-up current
(typically 10 µA) between the LIN pin and the VS pin is present. Silent Mode can be activated
independently from the actual level on the LIN, WAKE, or KL_15 pins.
If an undervoltage condition occurs, NRES is switched to low, and the IC changes its state to
Fail-safe Mode.
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN
receiver and switches on the internal slave termination between the LIN pin and the VS pin.
Figure 4-2. Switch to Silent Mode
Normal Mode
EN
Silent Mode
TXD
Mode select window
td = 3.2 µs
NRES
VCC
Delay time silent mode
td_silent = maximum 20 µs
LIN
LIN switches directly to recessive mode
8
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time
period (tbus) and the following rising edge at the LIN pin (see Figure 4-3 on page 9) results in a
remote wake-up request. The device switches from Silent Mode to Fail-safe Mode. The remote
wake-up request is indicated by a low level at the RXD pin to interrupt the microcontroller (see
Figure 4-3 on page 9). EN high can be used to switch directly to Normal Mode.
Figure 4-3. LIN Wake Up from Silent Mode
Bus wake-up filtering time
tbus
Fail-safe mode
Normal mode
LIN bus
Node in silent mode
RXD
High
Low
High
TXD
Watchdog off
Start watchdog lead time td
Watchdog
VCC
voltage
regulator
Silent mode 3.3V/5V/50 mA
Fail safe mode 3.3V/5V/50 mA
Normal mode
EN High
EN
Undervoltage detection active
NRES
4.3
Sleep Mode
A falling edge at EN when TXD is low switches the IC into Sleep Mode. The TXD Signal has to
be logic low during the Mode Select window (Figure 4-4 on page 10). In order to avoid any
influence to the LIN-pin during switching into sleep mode it is possible to switch the EN up to
3.2 µs earlier to LOW than the TXD. Therefore, the best and easiest way are two falling edges at
TXD and EN at the same time.The transmission path is disabled in Sleep Mode. The supply
current IVSsleep from VBatt is typically 10 µA.
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4986I–AUTO–07/10
The VCC regulator is switched off. NRES and RXD are low. The internal slave termination
between the LIN pin and VS pin is disabled, only a weak pull-up current (typically 10 µA)
between the LIN pin and the VS pin is present. Sleep Mode can be activated independently from
the current level on the LIN, WAKE, or KL_15 pin.
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN
receiver and switches on the internal slave termination between the LIN pin and the VS pin.
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time
period (tbus) and a following rising edge at pin LIN results in a remote wake-up request. The
device switches from Sleep Mode to Fail-safe Mode.
The VCC regulator is activated, and the remote wake-up request is indicated by a low level at
the RXD pin to interrupt the microcontroller (see Figure 4-5 on page 11).
EN high can be used to switch directly from Sleep/Silent to Fail-safe Mode. If EN is still high after
VCC ramp up and undervoltage reset time, the IC switches to the Normal Mode.
Figure 4-4. Switch to Sleep Mode
Normal Mode
Sleep Mode
EN
Mode select window
TXD
td = 3.2 µs
NRES
VCC
Delay time sleep mode
t
d_sleep = maximum 20 µs
LIN
LIN switches directly to recessive mode
4.4
Fail-safe Mode
The device automatically switches to Fail-safe Mode at system power-up. The voltage regulator
is switched on (VCC = 3.3V/5V/2%/50 mA) (see Figure 5-1 on page 14). The NRES output
switches to low for tres = 4 ms and gives a reset to the microcontroller. LIN communication is
switched off. The IC stays in this mode until EN is switched to high. The IC then changes to
Normal Mode. A power down of VBatt (VS < 4V) during Silent or Sleep Mode switches the IC into
Fail-safe Mode after power up. A low at NRES switches into Fail-safe Mode directly. During
Fail-safe Mode the TXD pin is an output and signals the last wake-up source.
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ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
4.5
Unpowered Mode
If you connect battery voltage to the application circuit, the voltage at the VS pin increases
according to the block capacitor (see Figure 5-1 on page 14). After VS is higher than the VS
undervoltage threshold VSth, the IC mode changes from Unpowered Mode to Fail-safe Mode.
The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends on the
VCC capacitor and the load.
The NRES is low for the reset time delay treset. During this time, treset, no mode change is
possible.
Figure 4-5. LIN Wake Up from Sleep Mode
Bus wake-up filtering time
tbus
Fail-safe Mode
Normal Mode
LIN bus
RXD
Low or floating
Low
TXD
On state
VCC
voltage
regulator
Off state
Regulator wake-up time
EN High
EN
Reset
time
NRES
Floating
Microcontroller
start-up time delay
Watchdog off
Start watchdog lead time td
Watchdog
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4986I–AUTO–07/10
5. Wake-up Scenarios from Silent or Sleep Mode
5.1
Remote Wake-up via Dominant Bus State
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN
receiver.
A falling edge at the LIN pin followed by a dominant bus level VBUSdom maintained for a certain
time period (tBUS) and a rising edge at pin LIN result in a remote wake-up request. The device
switches from Silent or Sleep Mode to Fail-safe Mode. The VCC voltage regulator is/remains
activated, the INH pin is switched to high, and the remote wake-up request is indicated by a low
level at the RXD pin to generate an interrupt for the microcontroller. A low level at the LIN pin in
the Normal Mode starts the bus wake-up filtering time, and if the IC is switched to Silent or Sleep
Mode, it will receive a wake-up after a positive edge at the LIN pin.
5.2
5.3
Local Wake-up via Pin WAKE
A falling edge at the WAKE pin followed by a low level maintained for a certain time period
(tWAKE) results in a local wake-up request. The device switches to Fail-safe Mode. The local
wake-up request is indicated by a low level at the RXD pin to generate an interrupt in the micro-
controller and a strong pull down at TXD. When the Wake pin is low, it is possible to switch to
Silent or Sleep Mode via pin EN. In this case, the wake-up signal has to be switched to high
> 10 µs before the negative edge at WAKE starts a new local wake-up request.
Local Wake-up via Pin KL_15
A positive edge at pin KL_15 followed by a high voltage level for a certain time period (> tKL_15
)
results in a local wake-up request. The device switches into the Fail-safe Mode. The extra long
wake-up time ensures that no transients at KL_15 create a wake up. The local wake-up request
is indicated by a low level at the RXD pin to generate an interrupt for the microcontroller and a
strong pull down at TXD. During high-level voltage at pin KL_15, it is possible to switch to Silent
or Sleep Mode via pin EN. In this case, the wake-up signal has to be switched to low > 250 µs
before the positive edge at KL_15 starts a new local wake-up request. With external RC combi-
nation, the time is even longer.
5.4
Wake-up Source Recognition
The device can distinguish between a local wake-up request (Wake or KL_15 pins) and a
remote wake-up request (dominant LIN bus state). The wake-up source can be read on the TXD
pin in Fail-safe Mode. A high level indicates a remote wake-up request (weak pull up at the TXD
pin); a low level indicates a local wake-up request (strong pull down at the TXD pin). The
wake-up request flag (signalled on the RXD pin), as well as the wake-up source flag (signalled
on the TXD pin), is immediately reset if the microcontroller sets the EN pin to high (see Figure
4-2 on page 8 and Figure 4-3 on page 9) and the IC is in Normal Mode. The last wake-up source
flag is stored and signalled in Fail-safe Mode at the TXD pin.
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ATA6622/ATA6624/ATA6626
5.5
Fail-safe Features
• During a short-circuit at LIN to VBattery, the output limits the output current to IBUS_lim. Due to
the power dissipation, the chip temperature exceeds TLINoff, and the LIN output is switched
off. The chip cools down and after a hysteresis of Thys, switches the output on again. RXD
stays on high because LIN is high. During LIN overtemperature switch-off, the VCC regulator
works independently.
• During a short-circuit from LIN to GND the IC can be switched into Sleep or Silent Mode. If
the short-circuit disappears, the IC starts with a remote wake-up.
• The reverse current is very low < 2 µA at the LIN pin during loss of VBatt. This is optimal
behavior for bus systems where some slave nodes are supplied from battery or ignition.
• During a short circuit at VCC, the output limits the output current to IVCClim. Because of
undervoltage, NRES switches to low and sends a reset to the microcontroller. The IC
switches into Fail-safe Mode. If the chip temperature exceeds the value TVCCoff, the VCC
output switches off. The chip cools down and after a hysteresis of Thys, switches the output on
again. Because of the Fail-safe Mode, the VCC voltage will switch on again although EN is
switched off from the microcontroller. The microcontroller can start with its normal operation.
• EN pin provides a pull-down resistor to force the transceiver into recessive mode if EN is
disconnected.
• RXD pin is set floating if VBatt is disconnected.
• TXD pin provides a pull-up resistor to force the transceiver into recessive mode if TXD is
disconnected.
• If TXD is short-circuited to GND, it is possible to switch to Sleep Mode via ENABLE after
tdom > 20 ms (only for ATA6622/ATA6624).
• If the WD_OSC pin has a short-circuit to GND and the NTRIG Signal has a period time
> 27 ms, the watchdog runs with an internal oscillator and guarantees a reset after the
second NTRIG signal at the latest.
• If the resistor at WO_OSC pin is disconnected, the watchdog runs with an internal oscillator
and guarantees a reseet after the second NTRIG signal at the latest.
5.6
Voltage Regulator
The voltage regulator needs an external capacitor for compensation and for smoothing the
disturbances from the microcontroller. It is recommended to use an electrolythic capacitor with
C > 1.8 µF and a ceramic capacitor with C = 100 nF. The values of these capacitors can be
varied by the customer, depending on the application.
The main power dissipation of the IC is created from the VCC output current IVCC, which is
needed for the application. In Figure 5-2 on page 14 the safe operating area of the
ATA6622/ATA6624/ATA6626 is shown.
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4986I–AUTO–07/10
Figure 5-1. VCC Voltage Regulator: Ramp-up and Undervoltage Detection
VS
12V
5.5V/3.8V
t
t
t
VCC
5V/3.3V
Vthun
Tres_f
TVCC
TReset
NRES
5V/3.3V
Figure 5-2. Power Dissipation: Safe Operating Area versus VCC Output Current and Supply
Voltage VS at Different Ambient Temperatures Due to Rthja = 35 K/W
60
Tamb = 105°C
50
Tamb = 125°C
40
3 0
20
10
0
3
5
7
9
11
13
15
17
19
VS (V)
For programming purposes of the microcontroller it is potentially necessary to supply the VCC
output via an external power supply while the VS Pin of the system basis chip is disconnected.
This behavior is no problem for the system basis chip.
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ATA6622/ATA6624/ATA6626
6. Watchdog
The watchdog anticipates a trigger signal from the microcontroller at the NTRIG (negative edge)
input within a time window of Twd. The trigger signal must exceed a minimum time
ttrigmin > 200 ns. If a triggering signal is not received, a reset signal will be generated at output
NRES. The timing basis of the watchdog is provided by the internal oscillator. Its time period,
T
osc, is adjustable via the external resistor Rwd_osc (34 kΩ to 120 kΩ).
During Silent or Sleep Mode the watchdog is switched off to reduce current consumption.
The minimum time for the first watchdog pulse is required after the undervoltage reset at NRES
disappears. It is defined as lead time td. After wake up from Sleep or Silent Mode, the lead time
td starts with the negative edge of the RXD output.
6.1
Typical Timing Sequence with RWD_OSC = 51 kΩ
The trigger signal Twd is adjustable between 20 ms and 64 ms using the external resistor
RWD_OSC
.
For example, with an external resistor of RWD_OSC = 51 kΩ ±1%, the typical parameters of the
watchdog are as follows:
t
t
osc = 0.405 × RWD_OSC – 0.0004 × (RWD_OSC)2 (RWD_OSC in kΩ; tosc in µs)
OSC = 19.6 µs due to 51 kΩ
td = 7895 × 19.6 µs = 155 ms
t1 = 1053 × 19.6 µs = 20.6 ms
t2 = 1105 × 19.6 µs = 21.6 ms
tnres = constant = 4 ms
After ramping up the battery voltage, the 3.3V/5V regulator is switched on. The reset output
NRES stays low for the time treset (typically 4 ms), then it switches to high, and the watchdog
waits for the trigger sequence from the microcontroller. The lead time, td, follows the reset and is
td = 155 ms. In this time, the first watchdog pulse from the microcontroller is required. If the trig-
ger pulse NTRIG occurs during this time, the time t1 starts immediately. If no trigger signal
occurs during the time td, a watchdog reset with tNRES = 4 ms will reset the microcontroller after
td = 155 ms. The times t1 and t2 have a fixed relationship between each other. A triggering signal
from the microcontroller is anticipated within the time frame of t2 = 21.6 ms. To avoid false trig-
gering from glitches, the trigger pulse must be longer than tTRIG,min > 200 ns. This slope serves to
restart the watchdog sequence. If the triggering signal fails in this open window t2, the NRES
output will be drawn to ground. A triggering signal during the closed window t1 immediately
switches NRES to low.
15
4986I–AUTO–07/10
Figure 6-1. Timing Sequence with RWD_OSC = 51 kΩ
VCC
3.3V/5V
Undervoltage Reset
Watchdog Reset
nres = 4 ms
t
treset = 4 ms
NRES
td = 155 ms
t1
t2
t1 = 20.6 ms
t2 = 21 ms
twd
NTRIG
t
trig > 200 ns
6.2
Worst Case Calculation with RWD_OSC = 51 kΩ
The internal oscillator has a tolerance of 20%. This means that t1 and t2 can also vary by 20%.
The worst case calculation for the watchdog period twd is calculated as follows.
The ideal watchdog time twd is between the maximum t1 and the minimum t1 plus the minimum
t2.
t
t
1,min = 0.8 × t1 = 16.5 ms, t1,max = 1.2 × t1 = 24.8 ms
2,min = 0.8 × t2 = 17.3 ms, t2,max = 1.2 × t2 = 26 ms
t
t
wdmax = t1min + t2min = 16.5 ms + 17.3 ms = 33.8 ms
wdmin = t1max = 24.8 ms
twd = 29.3 ms ±4.5 ms (±15%)
A microcontroller with an oscillator tolerance of ±15% is sufficient to supply the trigger inputs
correctly.
Table 6-1.
Typical Watchdog Timings
Oscillator
Period
tosc/µs
Lead
Time
td/ms
Closed
Window
t1/ms
Trigger Period from
Microcontroller
twd/ms
RWD_OSC
Open Window
t2/ms
Reset Time
tnres/ms
kΩ
34
51
13.3
19.61
33.54
42.84
105
14.0
20.64
35.32
45.11
14.7
21.67
37.06
47.34
19.9
29.32
50.14
64.05
4
4
4
4
154.8
264.80
338.22
91
120
16
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
7. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Typ.
Max.
Unit
Supply voltage VS
VS
–0.3
+40
V
Pulse time ≤ 500 ms; Ta = 25°C
Output current IVCC ≤ 50 mA
VS
VS
+40
27
V
V
Pulse time ≤ 2 min; Ta = 25°C
Output current IVCC ≤ 50 mA
WAKE (with 33 kΩ serial resistor)
KL_15 (with 50 kΩ/100 nF)
DC voltage
–1
–150
+40
+100
V
V
Transient voltage due to ISO7637 (coupling 1 nF)
INH
- DC voltage
–0.3
–27
VS + 0.3
+40
V
LIN
- DC voltage
V
V
Logic pins (RxD, TxD, EN, NRES, NTRIG,
WD_OSC, MODE, TM)
–0.3
+5.5
+2
Output current NRES
INRES
mA
PVCC DC voltage
VCC DC voltage
–0.3
–0.3
+5.5
+6.5
V
V
ESD according to IBEE LIN EMC
Test Spec. 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
±6
±5
KV
KV
- Pin WAKE (33 kΩ serial resistor) to GND
ESD HBM following STM5.1 with 1.5 kΩ 100 pF
- Pin VS, LIN, WAKE to GND
±6
KV
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
±3
KV
CDM ESD STM 5.3.1
±750
±200
–40
V
V
Machine Model ESD AEC-Q100-RevF(003)
Junction temperature
Tj
+150
+150
°C
°C
Storage temperature
Ts
–55
8. Thermal Characteristics
Parameters
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance junction to heat slug
Rthjc
10
K/W
Thermal resistance junction to ambient, where
heat slug is soldered to PCB
Rthja
35
K/W
Thermal shutdown of VCC regulator
Thermal shutdown of LIN output
Thermal shutdown hysteresis
150
150
165
165
10
170
170
°C
°C
°C
17
4986I–AUTO–07/10
9. Electrical Characteristics
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
1
VS Pin
Nominal DC voltage
range
1.1
VS
VS
VS
5
3
27
14
V
A
A
Sleep Mode
VLIN > VS – 0.5V
IVSsleep
10
11
57
66
µA
VS < 14V (Tj = 25°C)
Supply current in Sleep
Mode
1.2
1.3
Sleep Mode
VLIN > VS – 0.5V
VS < 14V (Tj = 125°C)
VS
VS
VS
VS
VS
VS
IVSsleep
5
16
67
76
0.8
53
µA
µA
µA
mA
mA
µA
A
A
A
A
A
A
Bus recessive
VS < 14V (Tj = 25°C)
Without load at VCC
IVSsi
47
56
0.3
50
Supply current in Silent
Mode
Bus recessive
VS < 14V (Tj = 125°C)
Without load at VCC
IVSsi
Bus recessive
VS < 14V
Without load at VCC
Supply current in Normal
Mode
1.4
1.5
IVSrec
IVSdom
IVSfail
Bus dominant
VS < 14V
VCC load current 50 mA
Supply current in Normal
Mode
Bus recessive
VS < 14V
Without load at VCC
Supply current in
Fail-safe Mode
1.6
1.7
250
4.0
550
5
VS undervoltage
threshold
VS
VS
VSth
4.5
0.2
V
V
A
A
VS undervoltage
threshold hysteresis
1.8
VSth_hys
2
RXD Output Pin
Normal Mode
VLIN = 0V
VRXD = 0.4V
Low-level output sink
current
2.1
RXD
IRXD
1.3
3
2.5
5
8
mA
A
2.2
2.3
3
Low-level output voltage IRXD = 1 mA
Internal resistor to VCC
RXD
RXD
VRXDL
RRXD
0.4
7
V
A
A
kΩ
TXD Input/Output Pin
3.1
Low-level voltage input
TXD
TXD
TXD
TXD
VTXDL
VTXDH
RTXD
ITXD
–0.3
2
+0.8
V
V
A
A
A
A
VCC
+
3.2
3.3
3.4
High-level voltage input
0.3V
Pull-up resistor
V
TXD = 0V
125
–3
250
400
kΩ
µA
High-level leakage
current
VTXD = VCC
+3
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
18
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Fail-safe Mode
VLIN = VS
VWAKE = 0V
VTXD = 0.4V
Low-level output sink
current at local wake-up
request
3.5
TXD
ITXDwake
2
2.5
8
mA
A
4
EN Input Pin
4.1
Low-level voltage input
EN
EN
VENL
VENH
–0.3
2
+0.8
V
V
A
A
VCC
+
4.2
High-level voltage input
0.3V
4.3
4.4
5
Pull-down resistor
VEN = VCC
EN
EN
REN
IEN
50
–3
125
250
200
+3
kΩ
A
A
Low-level input current VEN = 0V
NTRIG Watchdog Input Pin
Low-level voltage input
µA
5.1
NTRIG
NTRIG
NTRIG
NTRIG
VNTRIGL
VNTRIGH
RNTRIG
INTRIG
–0.3
2
+0.8
V
V
A
A
A
A
VCC
+
5.2
5.3
5.4
High-level voltage input
0.3V
Pull-up resistor
V
NTRIG = 0V
125
–3
400
kΩ
µA
High-level leakage
current
VNTRIG = VCC
+3
6
Mode Input Pin
6.1
Low-level voltage input
MODE
MODE
VMODEL
VMODEH
–0.3
2
+0.8
V
V
A
A
VCC
+
6.2
6.3
High-level voltage input
Leakage current
0.3V
VMODE = VCC or
VMODE = 0V
MODE
IMODE
–3
+3
µA
A
7
INH Output Pin
7.1
High-level voltage
IINH = –15 mA
INH
INH
VINHH
RINH
VS – 0.75
VS
50
V
A
A
Switch-on resistance
between VS and INH
7.2
7.3
30
Ω
Sleep Mode
VINH = 0V/27V, VS = 27V
Leakage current
INH
IINHL
–3
+3
µA
A
LIN Bus Driver: Bus Load Conditions:
Load 1 (Small): 1 nF, 1 kΩ; Load 2 (Large): 10 nF, 500Ω; Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF
Load 3 (Medium): 6.8 nF, 660Ω, Characterized on Samples
8
10.6 and 10.7 Specifies the Timing Parameters for Proper Operation at 20 kBit/s and 10.8 and 10.9 at 10.4 kBit/s
Driver recessive output
voltage
8.1
8.2
8.3
8.4
8.5
Load1/Load2
VS = 7V
LIN
LIN
LIN
LIN
LIN
VBUSrec
V_LoSUP
0.9 × VS
VS
1.2
2
V
V
V
V
V
A
A
A
A
A
V
Driver dominant voltage
Rload = 500 Ω
VVS = 18V
Driver dominant voltage
Driver dominant voltage
Driver dominant voltage
V_HiSUP
Rload = 500 Ω
VVS = 7.0V
Rload = 1000 Ω
V_LoSUP_1k
V_HiSUP_1k
0.6
0.8
VVS = 18V
Rload = 1000 Ω
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
19
4986I–AUTO–07/10
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
The serial diode is
mandatory
8.6
8.7
8.8
Pull-up resistor to VS
LIN
RLIN
20
30
60
kΩ
A
Voltage drop at the serial In pull-up path with Rslave
LIN
LIN
VSerDiode
IBUS_LIM
0.4
40
1.0
V
D
A
diodes
ISerDiode = 10 mA
LIN current limitation
VBUS = VBatt_max
120
200
mA
Input leakage current at Input leakage current
the receiver including
pull-up resistor as
specified
Driver off
BUS = 0V
VBatt = 12V
8.9
LIN IBUS_PAS_dom
–1
–0.35
mA
µA
A
A
V
Driver off
8V < VBatt < 18V
8V < VBUS < 18V
Leakage current LIN
recessive
8.10
LIN
LIN
IBUS_PAS_rec
10
20
VBUS ≥ VBatt
Leakage current when
control unit disconnected
from ground.
GNDDevice = VS
VBatt = 12V
0V < VBUS < 18V
8.11 Loss of local ground
must not affect
IBUS_NO_gnd
–10
+0.5
+10
µA
µA
A
A
communication in the
residual network.
Leakage current at a
disconnected battery.
Node has to sustain the VBatt disconnected
8.12 current that can flow
VSUP_Device = GND
under this condition. Bus 0V < VBUS < 18V
must remain operational
LIN
IBUS_NO_bat
0.1
2
under this condition.
Capacitance on pin LIN
to GND
8.13
9
LIN
LIN
CLIN
20
pF
V
D
A
LIN Bus Receiver
Center of receiver
threshold
VBUS_CNT
(Vth_dom + Vth_rec)/2
=
0.475 ×
0.5 ×
VS
0.525 ×
9.1
VBUS_CNT
VS
VS
9.2
9.3
Receiver dominant state VEN = 5V
Receiver recessive state VEN = 5V
Receiver input
LIN
LIN
VBUSdom
VBUSrec
0.4 × VS
V
V
A
A
0.6 × VS
0.028 ×
0.175 ×
9.4
9.5
Vhys = Vth_rec – Vth_dom
LIN
LIN
LIN
VBUShys
VLINH
0.1 × VS
V
V
V
A
A
A
hysteresis
VS
VS
Pre_Wake detection LIN
High-level input voltage
VS +
0.3V
VS – 2V
–27
Pre_Wake detection LIN
Low-level input voltage
VS –
3.3V
9.6
10
Activates the LIN receiver
VLIN = 0V
VLINL
Internal Timers
Dominant time for
wake-up via LIN bus
10.1
LIN
tbus
30
90
150
µs
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
20
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Time delay for mode
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
change from Fail-safe
into Normal Mode via
EN pin
10.2
VEN = 5V
EN
tnorm
5
15
20
µs
A
Time delay for mode
change from Normal
Mode to Sleep Mode via
EN pin
10.3
10.4
10.5
VEN = 0V
VTXD = 0V
VEN = 5V
EN
TXD
EN
tsleep
tdom
ts_n
2
6
5
7
12
20
40
µs
ms
µs
A
A
A
TXD dominant time-out
time (ATA6626 disabled)
13
15
Time delay for mode
change from Silent
Mode into Normal Mode
via EN
THRec(max) = 0.744 × VS
THDom(max) = 0.581 × VS
VS = 7.0V to 18V
tBit = 50 µs
D1 = tbus_rec(min)/(2 × tBit)
10.6 Duty cycle 1
10.7 Duty cycle 2
10.8 Duty cycle 3
10.9 Duty cycle 4
LIN
LIN
LIN
D1
D2
D3
D4
0.396
A
A
A
THRec(min) = 0.422 × VS
THDom(min) = 0.284 × VS
VS = 7.6V to 18V
tBit = 50 µs
D2 = tbus_rec(max)/(2 × tBit)
0.581
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS
VS = 7.0V to 18V
tBit = 96 µs
D3 = tbus_rec(min)/(2 × tBit)
0.417
THRec(min) = 0.389 × VS
THDom(min) = 0.251 × VS
VS = 7.6V to 18V
tBit = 96 µs
D4 = tbus_rec(max)/(2 × tBit)
LIN
LIN
0.590
22.5
A
A
Slope time falling and
tSLOPE_fall
tSLOPE_rise
10.10
VS = 7.0V to 18V
3.5
µs
rising edge at LIN
Receiver Electrical AC Parameters of the LIN Physical Layer
LIN Receiver, RXD Load Conditions: CRXD = 20 pF
11
Propagation delay of
VS = 7.0V to 18V
11.1 receiver (Figure 9-1 on
page 24)
RXD
RXD
trx_pd
6
µs
µs
A
A
t
rx_pd = max(trx_pdr , trx_pdf)
Symmetry of receiver
11.2 propagation delay rising
edge minus falling edge
VS = 7.0V to 18V
trx_sym = trx_pdr – trx_pdf
trx_sym
–2
+2
12
NRES Open Drain Output Pin
VS ≥ 5.5V
INRES = 1 mA
12.1 Low-level output voltage
NRES
VNRESL
A
0.14
V
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
21
4986I–AUTO–07/10
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
10 kΩ to 5V
12.2 Low-level output low
NRES
VNRESLL
0.14
V
A
VCC = 0V
VS ≥ 5.5V
12.3 Undervoltage reset time
NRES
NRES
treset
tres_f
2
4
6
ms
µs
A
A
CNRES = 20 pF
Reset debounce time for VS ≥ 5.5V
12.4
13
1.5
10
falling edge
CNRES = 20 pF
Watchdog Oscillator
Voltage at WD_OSC in
Normal Mode
I
V
WD_OSC = –200 µA
VS ≥ 4V
WD_
OSC
13.1
VWD_OSC
ROSC
1.13
34
1.23
1.33
120
V
A
A
Possible values of
resistor
WD_
OSC
13.2
kΩ
13.3 Oscillator period
13.4 Oscillator period
13.5 Oscillator period
13.6 Oscillator period
R
OSC = 34 kΩ
tOSC
tOSC
tOSC
tOSC
10.65
15.68
26.83
34.2
13.3
19.6
33.5
42.8
15.97
23.52
40.24
51.4
µs
µs
µs
µs
A
A
A
A
ROSC = 51 kΩ
ROSC = 91 kΩ
ROSC = 120 kΩ
14
Watchdog Timing Relative to tOSC
Watchdog lead time after
Reset
14.1
td
7895
cycles
A
Watchdog closed
window
14.2
t1
t2
1053
1105
4
cycles
cycles
ms
A
A
A
14.3 Watchdog open window
Watchdog reset time
NRES
14.4
NRES
tnres
3.2
4.8
15
KL_15 Pin
High-level input voltage Positive edge initializes a
VS +
0.3V
15.1
KL_15
KL_15
KL_15
VKL_15H
VKL_15L
IKL_15
4
V
V
A
A
A
RV = 47 kΩ
wake-up
Low-level input voltage
RV = 47 kΩ
15.2
–1
+2
65
VS < 27V
VKL_15 = 27V
15.3 KL_15 pull-down current
50
µA
15.4 Internal debounce time Without external capacitor KL_15
TdbKL_15
TwKL_15
80
160
2
250
4.5
µs
A
C
15.5 KL_15 wake-up time
16 WAKE Pin
RV = 47 kΩ, C = 100 nF
KL_15
0.4
ms
VS +
0.3V
16.1 High-level input voltage
WAKE
VWAKEH
VWAKEL
IWAKE
VS – 1V
–1
V
V
A
A
A
A
A
VS –
3.3V
16.2 Low-level input voltage Initializes a wake-up signal WAKE
VS < 27V
16.3 WAKE pull-up current
WAKE
WAKE
WAKE
–30
–5
–10
70
µA
µA
µs
VWAKE = 0V
High-level leakage
current
VS = 27V
VWAKE = 27V
16.4
IWAKEL
IWAKEL
+5
Time of low pulse for
16.5
VWAKE = 0V
30
150
wake-up via WAKE pin
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
22
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
17
VCC Voltage Regulator ATA6622, PVCC = VCC
4V < VS < 18V
(0 mA to 50 mA)
17.1 Output voltage VCC
VCC
VCC
VCCnor
VCClow
VD1
3.234
3.366
3.366
200
V
V
A
A
A
A
Output voltage VCC at
low VS
17.2
3V < VS < 4V
VS – VD
VS > 3V
IVCC = –15 mA
VS,
VCC
17.3 Regulator drop voltage
17.4 Regulator drop voltage
mV
mV
VS > 3V
IVCC = –50 mA
VS,
VCC
VD2
500
700
17.5 Line regulation
17.6 Load regulation
4V < VS < 18V
VCC
VCC
VCCline
VCCload
0.1
0.1
0.2
0.5
%
%
A
A
5 mA < IVCC < 50 mA
10 Hz to 100 kHz
CVCC = 10 µF
VS = 14V, IVCC = –15 mA
Power supply ripple
rejection
17.7
VCC
50
dB
D
17.8 Output current limitation VS > 4V
VCC
VCC
IVCClim
Cload
–240
1.8
–160
10
–85
3.2
mA
µF
A
D
0.2Ω < ESR < 5Ω at
100 kHz
17.9 Load capacity
VCC undervoltage
threshold
Referred to VCC
VS > 4V
17.10
VCC
VCC
VCC
VthunN
Vhysthun
TVCC
2.8
V
A
A
A
Hysteresis of
17.11
Referred to VCC
undervoltage threshold VS > 4V
150
100
mV
µs
Ramp-up time VS > 4V to CVCC = 2.2 µF
17.12
250
VCC = 3.3V
Iload = –5 mA at VCC
18
VCC Voltage Regulator ATA6624/ATA6626, PVCC = VCC
5.5V < VS < 18V
(0 mA to 50 mA)
18.1 Output voltage VCC
VCC
VCC
VCCnor
VCClow
VD1
4.9
5.1
5.1
V
A
A
A
A
A
Output voltage VCC at
low VS
18.2
4V < VS < 5.5V
VS – VD
V
VS > 4V
IVCC = –20 mA
VS,
VCC
18.3 Regulator drop voltage
18.4 Regulator drop voltage
18.5 Regulator drop voltage
250
600
200
mV
mV
mV
VS > 4V
IVCC = –50 mA
VS,
VCC
VD2
400
VS > 3.3V
IVCC = –15 mA
VS,
VCC
VD3
18.6 Line regulation
18.7 Load regulation
5.5V < VS < 18V
VCC
VCC
VCCline
VCCload
0.1
0.1
0.2
0.5
%
%
A
A
5 mA < IVCC < 50 mA
10 Hz to 100 kHz
CVCC = 10 µF
VS = 14V, IVCC = –15 mA
Power supply ripple
rejection
18.8
VCC
50
dB
D
18.9 Output current limitation VS > 5.5V
0.2Ω < ESR < 5Ω at
100 kHz
VCC
VCC
IVCClim
VthunN
–240
1.8
–130
10
–85
mA
µF
A
D
18.10 Load capacity
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
23
4986I–AUTO–07/10
9. Electrical Characteristics (Continued)
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
VCC undervoltage
threshold
Referred to VCC
VS > 5.5V
18.11
18.12
18.13
VCC
VthunN
4.2
4.8
V
A
Hysteresis of
undervoltage threshold VS > 5.5V
Referred to VCC
VCC
VCC
Vhysthun
tVCC
250
130
mV
µs
A
A
Ramp-up time VS > 5.5V CVCC = 2.2 µF
to VCC = 5V
300
Iload = –5 mA at VCC
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Figure 9-1. Definition of Bus Timing Characteristics
tBit
tBit
tBit
TXD
(Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
Thresholds of
THRec(max)
receiving node1
VS
THDom(max)
(Transceiver supply
of transmitting node)
LIN Bus Signal
Thresholds of
THRec(min)
THDom(min)
receiving node2
tBus_dom(min)
tBus_rec(max)
RXD
(Output of receiving node1)
trx_pdf(1)
trx_pdr(1)
RXD
(Output of receiving node2)
trx_pdr(2)
trx_pdf(2)
24
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
Figure 9-2. Typical Application Circuit
Ignition
KL15
VBattery
KL30
22 µF
100 nF
+
47 kΩ
Master node
pull-up
100 nF
+
1 kΩ
10 kΩ
Debug
100 nF 10 µF
20 19 18 17 16
10 kΩ
EN
MODE
TM
1
2
3
4
5
15
14
13
12
11
VCC
ATA6622/24/26
10 kΩ
WD_OSC
NTRIG
WAKE
GND
MLP 5 mm 5 mm
0.65 mm pitch
20 lead
33 kΩ
51 kΩ
NRES
Microcontroller
TXD
Wake
switch
EN
6
7
8
9
10
NTRIG
RXD
220 pF
TXD
RESET
GND
INH
25
4986I–AUTO–07/10
Figure 9-3. Application Circuit with External NPN-Transistor
Ignition
KL15
VBattery
KL30
*)
22 µF
100 nF
+
MJD31C
47 kΩ
+
Master node
pull-up
2.2 µF
100 nF
3.3Ω
+
1 kΩ
10 kΩ
Debug
100 nF 10 µF
20 19 18 17 16
10 kΩ
EN
MODE
TM
1
2
3
4
5
15
14
13
12
11
VCC
ATA6622/24/26
10 kΩ
WD_OSC
NTRIG
WAKE
GND
MLP 5 mm 5 mm
0.65 mm pitch
20 lead
33 kΩ
51 kΩ
NRES
Microcontroller
TXD
Wake
switch
EN
6
7
8
9
10
NTRIG
RXD
220 pF
TXD
RESET
GND
INH
*) Note that the output voltage PVCC is no longer short-ciruit protected when boosting the output current by an external NPN-transistor.
26
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
Figure 9-4. LIN Slave Application with Minimum External Devices
VBAT
C2
+
22 µF/50V
VCC
C5
C3
C1
100 nF
+
100 nF
10 µF
20 19 18 17 16
EN
1
MODE
TM
15
14
13
12
11
GND
2
WD_OSC
NTRIG
ATA6622/24/26
VCC
3
4
5
VCC
WAKE
GND
NRES
Microcontroller
TXD
6
7
8
9
10
EN
NTRIG
C4
RXD
TXD
220 pF
R9
10 kΩ
VCC
RESET
GND
Note: No watchdog, INH output not used, no local wake-up
27
4986I–AUTO–07/10
10. Ordering Information
Extended Type Number
Package
QFN20
QFN20
QFN20
QFN20
QFN20
QFN20
QFN20
QFN20
QFN20
QFN20
Remarks
ATA6622-PGPW
3.3V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled
5V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled
3.3V LIN system-basis-chip, Pb-free, 6k, taped and reeled
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled
3.3V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled
5V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled
3.3V LIN system-basis-chip, Pb-free, 6k, taped and reeled
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled
ATA6624-PGPW
ATA6622-PGQW
ATA6624-PGQW
ATA6626-PGQW
ATA6622C-PGPW
ATA6624C-PGPW
ATA6622C-PGQW
ATA6624C-PGQW
ATA6626C-PGQW
11. Package Information
Package: VQFN_5 x 5_20L
Exposed pad 3.1 x 3.1
Dimensions in mm
Not indicated tolerances ±0.05
Bottom
0
3.1±0.15
0.05-0.05
Top
20
16
20
1
15
1
5
Pin 1 identification
11
5
10
6
0.2
0.65 nom.
0.9±0.1
5
2.6
Drawing-No.: 6.543-5129.01-4
Issue: 2; 09.02.07
technical drawings
according to DIN
specifications
0.28±0.07
28
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
ATA6622/ATA6624/ATA6626
12. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
4986I-AUTO-07/10
• Section 6 “Watchdog” on pages 15 to 16 changed
• New Part numbers ATA6622C, ATA6624C and ATA6626C added
• Features on page 1 changed
• Pin Description table: rows Pin 4 and Pin 15 changed
• Text under headings 3.3, 3.9, 3.11, 5.5 and 6 changed
• Figures 4-5, 6-1 and 9-3 changed
• Abs.Max.Rat.Table -> Values in row “ESD HBM following....” changed
4986H-AUTO-05/10
• El.Char.Table -> rows changed:
7.1, 12.1, 12.2, 17.5, 17.6, 17.7, 17.8, 18.6, 18.7, 18.8, 18.9
• El.Char.Table -> row 8.13 added
• Figures 9-2 and 9-3 figure title changed
• Figure 9-4 on page 27 added
• Ord.Info.Table -> new part numbers added
• complete datasheet:
“LIN 2.0 specicfication” changed in “LIN 2.1 specicfication”
• Figures changed: 1-1, 4-2, 4-3, 4-4, 4-5, 5-1, 9-2, 9-3
• Sections changed:
3.1, 3.6, 3.8, 3.9, 3.10, 3.14, 4.1, 4.2, 4,3, 5.1, 5.2, 5.3, 5.5, 5.6
4986G-AUTO-08/09
• Features and Description changed
• Table 4-1 changed
• Abs. Max. Ratings table changed
• Thermal Characteristics table inserted
• El. Characteristics table changed
• Section 3.15 “INH Output Pin” on page 6 changed
• Section 5.5 “Fail-safe Features” on page 13 changed
• Section 6.1 “Typical Timing Sequence with RWD_OSC = 51 kΩ” on page 15
changed
4986F-AUTO-05/08
4986E-AUTO-02/08
• Section 8 “Electrical Characteristics” numbers 1.6 to 1.8 on page 18
changed
• Figure 2-1 on page 3 renamed
• Figure 6-1 “Timing Sequence with RWD_OSC = 51 kΩ” on page 16
changed
• Figure 8-3 “Application Circuit with External NPN” on page 26 added
29
4986I–AUTO–07/10
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
4986D-AUTO-10/07
• Section 9 “Ordering Information” on page 26 changed
• Features changed
• Sections 4.2, 4.3, 4.4 and 4.5 changed
4986C-AUTO-09/07
• Figures 4-2, 4-3, 4-4, 5-1, 5-2, 5-3, 5-6, 6-1 and 6-2 changed
• Section 7 “Absolute Maximum Ratings” changed”
• Section 8 “Electrical Characteristics”: numbers 17.9 and 18.9 changed
• Put datasheet into a new template
• Part number ATA6626 added
• Features changed
• Description text changed
• Figure 1-1 “Block Diagram” changed
• Figure 2-1 “Pinning SO8 changed”
• Figure 4-3 “LIN Wake Up from Silent Mode” changed
• Figure 4-5 “LIN Wake Up from Sleep Mode” changed
• Sections 3.2, 3.4, 3.7, 3.8, 3.9, 3.10, 3.11, 3.12, 3.13 and 3.14 changed
• Sections 4.2, 4.3, 4.4, 4.5, 5.1, 5.2, 5.3, 5.5, 5.6, 6.1 and 6.2 changed
4986B-AUTO-06/07
• Section 8 “Electrical Characteristics”: numbers 1.3, 3.5, 8.4, 12.1, 15.5,
17.9, 18 and 18.9 changed
• Figure 8-2 “Application Circuit” changed
• Section 9 “Ordering Information” changed
• Section 10 “Package Information” changed
30
ATA6622/ATA6624/ATA6626
4986I–AUTO–07/10
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