ATA6624-PGPW [ATMEL]

LIN Bus Transceiver with 3.3V (5V) Regulator and Watchdog; LIN总线收发器,具有3.3V ( 5V )稳压器和看门狗
ATA6624-PGPW
型号: ATA6624-PGPW
厂家: ATMEL    ATMEL
描述:

LIN Bus Transceiver with 3.3V (5V) Regulator and Watchdog
LIN总线收发器,具有3.3V ( 5V )稳压器和看门狗

总线收发器 稳压器 网络接口 电信集成电路 电信电路
文件: 总29页 (文件大小:471K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Master and Slave Operation Possible  
Supply Voltage up to 40V  
Operating voltage VS = 5V to 27V  
Typically 10 µA Supply Current During Sleep Mode  
Typically 57 µA Supply Current in Silent Mode  
Linear Low-drop Voltage Regulator:  
– Normal, Fail-safe, and Silent Mode  
ATA6622 VCC = 3.3V ±2%  
LIN Bus  
ATA6624 VCC = 5.0V ±2%  
ATA6626 VCC = 5.0V ±2%, TXD Time-out Timer Disabled  
– In Sleep Mode VCC is Switched Off  
Transceiver  
with 3.3V (5V)  
Regulator and  
Watchdog  
VCC- Undervoltage Detection (4 ms Reset Time) and Watchdog Reset Logical  
Combined at Open Drain Output NRES  
Negative Trigger Input for Watchdog  
Boosting the Voltage Regulator Possible with an External NPN Transistor  
LIN Physical Layer According to LIN 2.0 Specification and SAEJ2602-2  
Wake-up Capability via LIN-bus, Wake Pin, or Kl_15 Pin  
INH Output to Control an External Voltage Regulator or to Switch off the Master Pull Up  
Resistor  
ATA6622  
ATA6624  
ATA6626  
TXD Time-out Timer; ATA6626 TXD Time-out Timer Is Disabled  
Bus Pin is Overtemperature and Short Circuit Protected versus GND and Battery  
Adjustable Watchdog Time via External Resistor  
Advanced EMC and ESD Performance  
ESD HBM 8 kV at Pins LIN and VS According to STM5.1  
Package: QFN 5 mm × 5 mm with 20 Pins  
1. Description  
The ATA6622 is a fully integrated LIN transceiver, which complies with the LIN 2.0  
and SAEJ2602-2 specifications. It has a low-drop voltage regulator for 3.3V/50 mA  
output and a window watchdog. The ATA6624 has the same functionality as the  
ATA6622; however, it uses a 5V/50 mA regulator. The ATA6626 has the same func-  
tionality as ATA6624 without a TXD time-out timer. The voltage regulator is able to  
source 50 mA up to VS = 18V. The output current of the regulator can be boosted by  
using an external NPN transistor. This chip combination makes it possible to develop  
inexpensive, simple, yet powerful slave and master nodes for LIN-bus systems.  
ATA6622/ATA6624/ATA6626 are designed to handle the low-speed data communica-  
tion in vehicles, e.g., in convenience electronics. Improved slope control at the  
LIN-driver ensures secure data communication up to 20 kBaud. Sleep Mode and  
Silent Mode guarantee very low current consumption. The ATA6626 is able to switch  
the LIN unlimited to dominant level via TXD for low data rates.  
4986F–AUTO–07/08  
Figure 1-1. Block Diagram  
20  
VS  
Normal and  
Fail-safe  
Mode  
10  
9
INH  
Normal and  
Fail-safe  
Mode  
PVCC  
Receiver  
RXD  
7
RF Filter  
LIN  
4
WAKE  
KL_15  
16  
Edge  
Detection  
Wake-up  
Bus Timer  
Short Circuit and  
PVCC  
Overtemperature  
Protection  
Slew Rate Control  
TXD  
Time-out  
Timer  
11  
TXD  
*)  
19  
18  
Control Unit  
Mode Select  
Normal/Silent/  
Fail-safe Mode  
3.3/5V  
VCC  
PVCC  
1
Debounce  
Time  
/50 mA/2%  
EN  
12  
Undervoltage  
Reset  
NRES  
OUT  
Adjustable  
Watchdog  
Oscillator  
13  
Internal Testing  
WD_OSC  
Watchdog  
Unit  
5
GND  
PVCC  
15  
14  
3
MODE TM  
NTRIG  
*) Not in ATA6626  
2
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
2. Pin Configuration  
Figure 2-1. Pinning QFN20  
20 19 18 17 16  
EN  
GND  
1
2
3
4
5
15  
14  
13  
12  
11  
MODE  
TM  
ATA6622/24/26  
QFN 5 mm × 5 mm  
0.65 mm pitch  
20 lead  
NTRIG  
WAKE  
GND  
WD_OSC  
NRES  
TXD  
6
7
8
9
10  
Table 2-1.  
Pin Description  
Pin  
Symbol  
EN  
Function  
1
Enables the device in Normal Mode  
System ground (optional)  
2
GND  
NTRIG  
WAKE  
GND  
GND  
LIN  
3
Low-level watchdog trigger input from microcontroller  
4
High-voltage input for local wake-up request; if not needed, connect to VS  
System ground (mandatory)  
5
6
7
System ground (optional)  
LIN-bus line input/output  
8
GND  
RXD  
System ground (optional)  
9
Receive data output  
10  
INH  
Battery related output for controlling an external voltage regulator  
Transmit data input; active low output (strong pull down) after a local wake-up request  
Output undervoltage and watchdog reset (open drain)  
External resistor for adjustable watchdog timing  
For factory testing only (tie to ground)  
For debug mode: low, watchdog is on; high, watchdog is off  
Ignition detection (edge sensitive)  
11  
TXD  
12  
NRES  
WD_OSC  
TM  
13  
14  
15  
MODE  
KL_15  
GND  
PVCC  
VCC  
16  
17  
System ground (optional)  
18  
3.3V/5V regulator sense input pin  
19  
3.3V/5V regulator output/driver pin  
20  
VS  
Battery supply  
Backside  
Heat slug is connected to all GND pins  
3
4986F–AUTO–07/08  
3. Functional Description  
3.1  
Physical Layer Compatibility  
Since the LIN physical layer is independent from higher LIN layers (e.g., the LIN protocol layer),  
all nodes with a LIN physical layer according to revision 2.0 can be mixed with LIN physical layer  
nodes, which, according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3), are without  
any restrictions.  
3.2  
Supply Pin (VS)  
The LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to dis-  
able data transmission if VS falls below VSth < 4V in order to avoid false bus messages. After  
switching on VS, the IC starts in Fail-safe Mode, and the voltage regulator is switched on (i.e.,  
3.3V/5V/50 mA output capability).  
The supply current is typically 10 µA in Sleep Mode and 57 µA in Silent Mode.  
3.3  
3.4  
Ground Pin (GND)  
The IC is neutral on the LIN pin in the event of GND disconnection. It is able to handle a ground  
shift up to 11.5% of VS. The mandatory system ground is pin 5.  
Voltage Regulator Output Pin (VCC)  
The internal 3.3V/5V voltage regulator is capable of driving loads with up to 50 mA. It is able to  
supply the microcontroller and other ICs on the PCB and is protected against overloads by  
means of current limitation and overtemperature shut-down. Furthermore, the output voltage is  
monitored and will cause a reset signal at the NRES output pin if it drops below a defined thresh-  
old Vthun. To boost up the maximum load current, an external NPN transistor may be used, with  
its base connected to the VCC pin and its emitter connected to PVCC.  
3.5  
3.6  
Voltage Regulator Sense Pin (PVCC)  
The PVCC is the sense input pin of the 3.3V/5V voltage regulator. For normal applications (i.e.,  
when only using the internal output transistor), this pin is connected to the VCC pin. If an exter-  
nal boosting transistor is used, the PVCC pin must be connected to the output of this transistor,  
i.e., its emitter terminal.  
Bus Pin (LIN)  
A low-side driver with internal current limitation and thermal shutdown and an internal pull-up  
resistor compliant with the LIN 2.0 specification are implemented. The allowed voltage range is  
between –27V and +40V. Reverse currents from the LIN bus to VS are suppressed, even in the  
event of GND shifts or battery disconnection. LIN receiver thresholds are compatible with the  
LIN protocol specification. The fall time from recessive to dominant bus state and the rise time  
from dominant to recessive bus state are slope controlled.  
4
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
3.7  
3.8  
Input/Output Pin (TXD)  
In Normal Mode the TXD pin is the microcontroller interface used to control the state of the LIN  
output. TXD must be pulled to ground in order to have a low LIN-bus. If TXD is high or uncon-  
nected (internal pull-up resistor), the LIN output transistor is turned off, and the bus is in  
recessive state. During Fail-safe Mode, this pin is used as output. It is current-limited to < 8 mA.  
and is latched to low if the last wake-up event was from pin WAKE or KL_15.  
TXD Dominant Time-out Function  
The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being  
driven permanently in dominant state. If TXD is forced to low for longer than tDOM > 6 ms, the  
LIN-bus driver is switched to recessive state. Nevertheless, when switching to Sleep Mode, the  
actual level at the TXD pin is relevant.  
To reactivate the LIN bus driver, switch TXD to high (> 10 µs).  
The time-out function is disabled in the ATA6626. Switching to dominant level on the LIN bus  
occurs without any time limitations.  
3.9  
Output Pin (RXD)  
The Output pin reports the state of the LIN-bus to the microcontroller. LIN high (recessive state)  
is reported by a high level at RXD; LIN low (dominant state) is reported by a low level at RXD.  
The output has an internal pull-up structure with typically 5 kΩ to VCC. The AC characteristics  
can be defined with an external load capacitor of 20 pF.  
The output is short-circuit protected. RXD is switched off in Unpowered Mode (i.e., VS = 0V).  
3.10 Enable Input Pin (EN)  
The Enable Input pin controls the operation mode of the interface. If EN is high, the interface is  
in Normal Mode, with transmission paths from TXD to LIN and from LIN to RXD both active. The  
VCC voltage regulator operates with 3.3V/5V/50 mA output capability.  
If EN is switched to low while TXD is still high, the device is forced to Silent Mode. No data trans-  
mission is then possible, and the current consumption is reduced to IVS typ. 57 µA. The VCC  
regulator has its full functionality.  
If EN is switched to low while TXD is low, the device is forced to Sleep Mode. No data transmis-  
sion is possible, and the voltage regulator is switched off.  
3.11 Wake Input Pin (WAKE)  
The Wake Input pin is a high-voltage input used to wake up the device from Sleep Mode or  
Silent Mode. It is usually connected to an external switch in the application to generate a local  
wake-up. A pull-up current source, typically 10 µA, is implemented.  
If a local wake-up is not needed for the application, connect the Wake pin directly to the VS pin.  
3.12 Mode Input Pin (MODE)  
Connect the MODE pin directly or via an external resistor to GND for normal watchdog opera-  
tion. To debug the software of the connected microcontroller, connect MODE pin to 3.3V/5V and  
the watchdog is switched off.  
5
4986F–AUTO–07/08  
3.13 TM Input Pin  
3.14 KL_15 Pin  
The TM pin is used for final production measurements at Atmel®. In normal application, it has to  
be always connected to GND.  
The KL_15 pin is a high-voltage input used to wake up the device from Sleep or Silent Mode. It  
is an edge sensitive pin (low-to-high transition). It is usually connected to ignition to generate a  
local wake-up in the application when the ignition is switched on. Although KL_15 pin is high  
voltage (VBatt), it is possible to switch the IC into Sleep or Silent Mode. Connect the KL_15 pin  
directly to GND if you do not need it. A debounce timer with a typical TdbKl_15 of 160 µs is  
implemented.  
The input voltage threshold can be adjusted by varying the external resistor due to the input cur-  
rent IKL_15. To protect this pin against voltage transients, a serial resistor of 50 kΩ and a ceramic  
capacitor of 100 nF are recommended. With this RC combination you can increase the wake-up  
time TwKL_15 and, therefore, the sensitivity against transients on the ignition Kl.30.  
You can also increase the wake-up time using external capacitors with higher values.  
3.15 INH Output Pin  
The INH Output pin is used to switch an external voltage regulator on during Normal or Fail-safe  
Mode. The INH pin is switched off in Sleep or Silent Mode. It is possible to switch off the external  
1 kΩ master resistor via the INH pin for master node applications. The INH pin is switched off  
during VCC undervoltage reset.  
3.16 Reset Output Pin (NRES)  
The Reset Output pin, an open drain output, switches to low during VCC undervoltage or a  
watchdog failure.  
3.17 WD_OSC Output Pin  
The WD_OSC Output pin provides a typical voltage of 1.2V, which supplies an external resistor  
with values between 34 kΩ and 120 kΩ to adjust the watchdog oscillator time.  
3.18 NTRIG Input Pin  
The NTRIG Input pin is the trigger input for the window watchdog. A pull-up resistor is imple-  
mented. A negative edge triggers the watchdog. The trigger signal (low) must exceed a  
minimum time ttrigmin to generate a watchdog trigger.  
3.19 Wake-up Events from Sleep or Silent Mode  
• LIN-bus  
• WAKE pin  
• EN pin  
• KL_15  
6
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
4. Modes of Operation  
Figure 4-1. Modes of Operation  
a: VS > 5V  
b: VS < 4V  
Unpowered Mode  
VBatt = 0V  
c: Bus wake-up event  
d: Wake up from WAKE or KL_15 pin  
e: NRES switches to low  
b
a
b
Fail-safe Mode  
VCC: 3.3V/5V/50 mA  
with undervoltage monitoring  
Communication: OFF  
Watchdog: ON  
b
b
c + d + e  
e
EN = 1  
EN = 1  
c + d  
Go to silent command  
Local wake-up event  
EN = 0  
Silent Mode  
TXD = 1  
VCC: 3.3V/5V/50 mA  
with undervoltage monitoring  
Communication: OFF  
Watchdog: OFF  
Normal Mode  
EN = 1  
VCC: 3.3V/5V/50 mA  
with undervoltage  
monitoring  
Go to sleep command  
EN = 0  
Sleep Mode  
Communication: ON  
Watchdog: ON  
TXD = 0  
VCC: switched off  
Communication: OFF  
Watchdog: OFF  
4.1  
4.2  
Normal Mode  
Silent Mode  
This is the normal transmitting and receiving mode. The voltage regulator is in Normal Mode and  
can source 50 mA. The undervoltage detection is activated. The watchdog needs a trigger sig-  
nal from NTRIG to avoid resets at NRES. If NRES is switched to low, the IC changes state to  
Fail-safe Mode.  
A falling edge at EN when TXD is high switches the IC into Silent Mode. The TXD Signal has to  
be logic high during the Mode Select window (see Figure 4-2 on page 8). The transmission path  
is disabled in Silent Mode. The overall supply current from VBatt is a combination of the IVSsi  
57 µA plus the VCC regulator output current IVCC  
.
The 3.3V/5V regulator with a 2% tolerance can source up to 50 mA. The internal slave termina-  
tion between the LIN pin and the VS pin is disabled in Silent Mode to minimize the power  
dissipation in the event that the LIN pin is short-circuited to GND. Only a weak pull-up current  
(typically 10 µA) between the LIN pin and the VS pin is present. Silent Mode can be activated  
independently from the actual level on the LIN, WAKE, or KL_15 pins. If an undervoltage condi-  
tion occurs, the NRES is switched to low, and the IC changes its state to Fail-safe Mode.  
7
4986F–AUTO–07/08  
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN  
receiver.  
Figure 4-2. Switch to Silent Mode  
Normal Mode  
Silent Mode  
EN  
Mode select window  
TXD  
td = 3.2 µs  
NRES  
VCC  
Delay time silent mode  
td_sleep = maximum 20 µs  
LIN  
LIN switches directly to recessive mode  
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time  
period (tbus) and the following rising edge at the LIN pin (see Figure 4-3 on page 9) result in a  
remote wake-up request. The device switches from Silent Mode to Fail-safe Mode. The internal  
LIN slave termination resistor is switched on. The remote wake-up request is indicated by a low  
level at the RXD pin to interrupt the microcontroller (see Figure 4-3 on page 9). EN high can be  
used to switch directly to Normal Mode.  
8
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
Figure 4-3. LIN Wake Up from Silent Mode  
Bus wake-up filtering time  
tbus  
Fail-safe mode  
Normal mode  
LIN bus  
RXD  
Node in silent mode  
High  
Low  
High  
TXD  
Watchdog off  
Start watchdog lead time td  
Watchdog  
VCC  
voltage  
regulator  
Silent mode 3.3V/5V/50 mA  
Fail safe mode 3.3V/5V/50 mA  
Normal mode  
EN High  
EN  
Undervoltage detection active  
NRES  
4.3  
Sleep Mode  
A falling edge at EN when TXD is low switches the IC into Sleep Mode. The TXD Signal has to  
be logic low during the Mode Select window (Figure 4-4 on page 10). The transmission path is  
disabled in Sleep Mode. The supply current IVSsleep from VBatt is typically 10 µA.  
The VCC regulator is switched off. NRES and RXD are low. The internal slave termination  
between the LIN pin and VS pin is disabled to minimize the power dissipation in the event that  
the LIN pin is short-circuited to GND. Only a weak pull-up current (typically 10 µA) between the  
LIN pin and the VS pin is present. Sleep Mode can be activated independently from the current  
level on the LIN, WAKE, or KL_15 pin.  
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN  
receiver.  
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time  
period (tbus) and a rising edge at pin LIN respectively result in a remote wake-up request. The  
device switches from Sleep Mode to Fail-safe Mode.  
9
4986F–AUTO–07/08  
The VCC regulator is activated, and the internal LIN slave termination resistor is switched on.  
The remote wake-up request is indicated by a low level at the RXD pin to interrupt the microcon-  
troller (see Figure 4-5 on page 11).  
EN high can be used to switch directly from Sleep/Silent to Fail-safe Mode. If EN is still high after  
VCC ramp up and undervoltage reset time, the IC switches to the Normal Mode.  
Figure 4-4. Switch to Sleep Mode  
Normal Mode  
Sleep Mode  
EN  
Mode select window  
TXD  
td = 3.2 µs  
NRES  
VCC  
Delay time sleep mode  
d_sleep = maximum 20 µs  
t
LIN  
LIN switches directly to recessive mode  
4.4  
Fail-safe Mode  
The device automatically switches to Fail-safe Mode at system power-up. The voltage regulator  
is switched on (VCC = 3.3V/5V/2%/50 mA) (see Figure 5-1 on page 14). The NRES output  
switches to low for tres = 4 ms and gives a reset to the microcontroller. LIN communication is  
switched off. The IC stays in this mode until EN is switched to high. The IC then changes to Nor-  
mal Mode. A power down of VBatt (VS < 4V) during Silent or Sleep Mode switches the IC into  
Fail-safe Mode after power up. A low at NRES switches into Fail-safe Mode directly. During  
Fail-safe Mode the TXD pin is an output and signals the last wake-up source.  
4.5  
Unpowered Mode  
If you connect battery voltage to the application circuit, the voltage at the VS pin increases  
according to the block capacitor (see Figure 5-1 on page 14). After VS is higher than the VS  
undervoltage threshold VSth, the IC mode changes from Unpowered Mode to Fail-safe Mode.  
The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends on the  
VCC capacitor and the load.  
The NRES is low for the reset time delay treset. During this time, treset, no mode change is  
possible.  
10  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
Figure 4-5. LIN Wake Up from Sleep Mode  
Bus wake-up filtering time  
tbus  
Fail-safe Mode  
Normal Mode  
LIN bus  
RXD  
Low or floating  
Low  
TXD  
On state  
VCC  
voltage  
regulator  
Off state  
Regulator wake-up time  
EN High  
EN  
Reset  
time  
NRES  
Floating  
Microcontroller  
start-up time delay  
Watchdog off  
Start watchdog lead time td  
Watchdog  
Table 4-1.  
Mode of  
Table of Modes  
Operation Transceiver  
VCC  
Watchdog  
WD_OSC  
INH  
RXD  
LIN  
Fail-safe  
Off  
3.3V/5V  
On  
1.23V  
On  
High  
Recessive  
TXD  
depending  
Normal  
On  
3.3V/5V  
On  
1.23V  
On  
High  
Silent  
Sleep  
Off  
Off  
3.3V/5V  
0V  
Off  
Off  
0V  
0V  
Off  
Off  
High  
0V  
Recessive  
Recessive  
11  
4986F–AUTO–07/08  
5. Wake-up Scenarios from Silent or Sleep Mode  
5.1  
Remote Wake-up via Dominant Bus State  
A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN  
receiver.  
A falling edge at the LIN pin followed by a dominant bus level VBUSdom maintained for a certain  
time period (tBUS) and a rising edge at pin LIN result in a remote wake-up request. The device  
switches from Silent or Sleep Mode to Fail-safe Mode. The VCC voltage regulator is/remains  
activated, the INH pin is switched to high, and the internal slave termination resistor is switched  
on. The remote wake-up request is indicated by a low level at the RXD pin to generate an inter-  
rupt for the microcontroller. A low level at the LIN pin in the Normal Mode starts the bus wake-up  
filtering time, and if the IC is switched to Silent or Sleep Mode, it will receive a wake-up after a  
positive edge at the LIN pin.  
5.2  
Local Wake-up via Pin WAKE  
A falling edge at the WAKE pin followed by a low level maintained for a certain time period  
(tWAKE) results in a local wake-up request. The device switches to Fail-safe Mode. The internal  
slave termination resistor is switched on. The local wake-up request is indicated by a low level at  
the RXD pin to generate an interrupt in the microcontroller and a strong pull down at TXD. When  
the Wake pin is low, it is possible to switch to Silent or Sleep Mode via pin EN. In this case, the  
wake-up signal has to be switched to high > 10 µs before the negative edge at WAKE starts a  
new local wake-up request.  
5.3  
Local Wake-up via Pin KL_15  
A positive edge at pin KL_15 followed by a high voltage level for a certain time period (> tKL_15  
)
results in a local wake-up request. The device switches into the Fail-safe Mode. The internal  
slave termination resistor is switched on. The extra long wake-up time ensures that no transients  
at KL_15 create a wake up. The local wake-up request is indicated by a low level at the RXD pin  
to generate an interrupt for the microcontroller and a strong pull down at TXD. During high-level  
voltage at pin KL_15, it is possible to switch to Silent or Sleep Mode via pin EN. In this case, the  
wake-up signal has to be switched to low > 250 µs before the positive edge at KL_15 starts a  
new local wake-up request. With external RC combination, the time is even longer.  
5.4  
Wake-up Source Recognition  
The device can distinguish between a local wake-up request (Wake or KL_15 pins) and a  
remote wake-up request (dominant LIN bus state). The wake-up source can be read on the TXD  
pin in Fail-safe Mode. A high level indicates a remote wake-up request (weak pull up at the TXD  
pin); a low level indicates a local wake-up request (strong pull down at the TXD pin). The  
wake-up request flag (signalled on the RXD pin), as well as the wake-up source flag (signalled  
on the TXD pin), is immediately reset if the microcontroller sets the EN pin to high (see Figure  
4-2 on page 8 and Figure 4-3 on page 9) and the IC is in Normal Mode. The last wake-up source  
flag is stored and signalled in Fail-safe Mode at the TXD pin.  
12  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
5.5  
Fail-safe Features  
• During a short-circuit at LIN to VBattery, the output limits the output current to IBUS_LIM. Due to  
the power dissipation, the chip temperature exceeds TLINoff, and the LIN output is switched  
off. The chip cools down and after a hysteresis of Thys, switches the output on again. RXD  
stays on high because LIN is high. During LIN overtemperature switch-off, the VCC regulator  
works independently.  
• During a short-circuit from LIN to GND the IC can be switched into Sleep or Silent Mode. If  
the short-circuit disappears, the IC starts with a remote wake-up.  
• The reverse current is very low < 15 µA at the LIN pin during loss of VBatt or GND. This is  
optimal behavior for bus systems where some slave nodes are supplied from battery or  
ignition.  
• During a short circuit at VCC, the output limits the output current to IVCCn. Because of  
undervoltage, NRES switches to low and sends a reset to the microcontroller. The IC  
switches into Fail-safe Mode. If the chip temperature exceeds the value TVCCoff, the VCC  
output switches off. The chip cools down and after a hysteresis of Thys, switches the output on  
again. Because of the Fail-safe Mode, the VCC voltage will switch on again although EN is  
switched off from the microcontroller. The microcontroller can start with its normal operation.  
• EN pin provides a pull-down resistor to force the transceiver into recessive mode if EN is  
disconnected.  
• RXD pin is set floating if VBatt is disconnected.  
• TXD pin provides a pull-up resistor to force the transceiver into recessive mode if TXD is  
disconnected.  
• If TXD is short-circuited to GND, it is possible to switch to Sleep Mode via ENABLE after  
tdom > 20 ms (only for ATA6622/ATA6624).  
• If the WD_OSC pin has a short-circuit to GND or the resistor is disconnected, the watchdog  
runs with an internal oscillator and guarantees a reset after the second NTRIG signal at the  
latest.  
5.6  
Voltage Regulator  
The voltage regulator needs an external capacitor for compensation and for smoothing the dis-  
turbances from the microcontroller. It is recommended to use an electrolythic capacitor with  
C > 10 µF and a ceramic capacitor with C = 100 nF. The values of these capacitors can be var-  
ied by the customer, depending on the application.  
The main power dissipation of the IC is created from the VCC output current IVCC, which is  
needed for the application. In Figure 5-2 on page 14 the safe operating area of the  
ATA6622/ATA6624/ATA6626 is shown.  
13  
4986F–AUTO–07/08  
Figure 5-1. VCC Voltage Regulator: Ramp-up and Undervoltage Detection  
VS  
12V  
5.5V/3.8V  
t
t
t
5V/3.3V  
Vthun  
Tres_f  
TVCC  
TReset  
NRES  
5V/3.3V  
Figure 5-2. Power Dissipation: Safe Operating Area versus VCC Output Current and Supply  
Voltage VS at Different Ambient Temperatures Due to Rthja = 35 K/W  
60  
T
amb = 105˚C  
50  
40  
30  
20  
10  
0
Tamb = 125˚C  
3
5
7
9
11  
13  
15  
17  
19  
VS/V  
For programming purposes of the microcontroller it is potentially necessary to supply the VCC  
output via an external power supply while the VS Pin of the system basis chip is disconnected.  
This behavior is no problem for the system basis chip.  
14  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
6. Watchdog  
The watchdog anticipates a trigger signal from the microcontroller at the NTRIG (negative edge)  
input within a time window of Twd. The trigger signal must exceed a minimum time  
ttrigmin > 200 ns. If a triggering signal is not received, a reset signal will be generated at output  
NRES. The timing basis of the watchdog is provided by the internal oscillator. Its time period,  
T
osc, is adjustable via the external resistor Rwd_osc (34 kΩ to 120 kΩ).  
During Silent or Sleep Mode the watchdog is switched off to reduce current consumption.  
The minimum time for the first watchdog pulse is required after the undervoltage reset at NRES  
disappears. It is defined as lead time td. After wake up from Sleep or Silent Mode, the lead time  
td starts with the negative edge of the RXD output.  
6.1  
Typical Timing Sequence with RWD_OSC = 51 kΩ  
The trigger signal Twd is adjustable between 20 ms and 64 ms using the external resistor  
RWD_OSC  
.
For example, with an external resistor of RWD_OSC = 51 kΩ ±1%, the typical parameters of the  
watchdog are as follows:  
t
t
osc = 0.405 × RWD_OSC – 0.0004 × (RWD_OSC)2 (RWD_OSC in kΩ; tosc in µs)  
OSC = 19.6 µs due to 51 kΩ  
td = 7895 × 19.6 µs = 155 ms  
t1 = 1053 × 19.6 µs = 20.6 ms  
t2 = 1105 × 19.6 µs = 21.6 ms  
tnres = constant = 4 ms  
After ramping up the battery voltage, the 3.3V/5V regulator is switched on. The reset output  
NRES stays low for the time treset (typically 4 ms), then it switches to high, and the watchdog  
waits for the trigger sequence from the microcontroller. The lead time, td, follows the reset and is  
td = 155 ms. In this time, the first watchdog pulse from the microcontroller is required. If the trig-  
ger pulse NTRIG occurs during this time, the time t1 starts immediately. If no trigger signal  
occurs during the time td, a watchdog reset with tNRES = 4 ms will reset the microcontroller after  
td = 155 ms. The times t1 and t2 have a fixed relationship between each other. A triggering signal  
from the microcontroller is anticipated within the time frame of t2 = 21.6 ms. To avoid false trig-  
gering from glitches, the trigger pulse must be longer than tTRIG,min > 200 ns. This slope serves to  
restart the watchdog sequence. If the triggering signal fails in this open window t2, the NRES  
output will be drawn to ground. A triggering signal during the closed window t1 immediately  
switches NRES to low.  
15  
4986F–AUTO–07/08  
Figure 6-1. Timing Sequence with RWD_OSC = 51 kΩ  
VCC  
3.3V/5V  
Undervoltage Reset  
Watchdog Reset  
tnres = 4 ms  
treset = 4 ms  
NRES  
td = 155 ms  
t1  
t2  
t
1 = 20.6 ms  
t2 = 21 ms  
twd  
NTRIG  
ttrig > 200 ns  
6.2  
Worst Case Calculation with RWD_OSC = 51 kΩ  
The internal oscillator has a tolerance of 20%. This means that t1 and t2 can also vary by 20%.  
The worst case calculation for the watchdog period twd is calculated as follows.  
The ideal watchdog time twd is between the maximum t1 and the minimum t1 plus the minimum  
t2.  
t
t
1,min = 0.8 × t1 = 16.5 ms, t1,max = 1.2 × t1 = 24.8 ms  
2,min = 0.8 × t2 = 17.3 ms, t2,max = 1.2 × t2 = 26 ms  
t
t
wdmax = t1min + t2min = 16.5 ms + 17.3 ms = 33.8 ms  
wdmin = t1max = 24.8 ms  
twd = 29.3 ms ±4.5 ms (±15%)  
A microcontroller with an oscillator tolerance of ±15% is sufficient to supply the trigger inputs  
correctly.  
Table 6-1.  
Typical Watchdog Timings  
Oscillator  
Period  
tosc/µs  
Lead  
Time  
td/ms  
Closed  
Window  
t1/ms  
Trigger Period from  
Microcontroller  
twd/ms  
RWD_OSC  
Open Window  
t2/ms  
Reset Time  
tnres/ms  
kΩ  
34  
51  
13.3  
19.61  
33.54  
42.84  
105  
14.0  
20.64  
35.32  
45.11  
14.7  
21.67  
37.06  
47.34  
19.9  
29.32  
50.14  
64.05  
4
4
4
4
154.8  
264.80  
338.22  
91  
120  
16  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
7. Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Supply voltage VS  
VS  
–0.3  
+40  
V
Pulse time 500 ms  
Ta = 25°C  
Output current IVCC 50 mA  
VS  
VS  
+40  
27  
V
V
Pulse time 2 min  
Ta = 25°C  
Output current IVCC 50 mA  
WAKE (with 33 kΩ serial resistor)  
KL_15 (with 50 kΩ/100 nF)  
DC voltage  
Transient voltage due to ISO7637  
(coupling 1 nF)  
–1  
–150  
+40  
+100  
V
V
INH  
- DC voltage  
–0.3  
–27  
+40  
+40  
V
LIN  
- DC voltage  
V
V
Logic pins (RxD, TxD, EN, NRES, NTRIG,  
WD_OSC, MODE, TM)  
–0.3  
+5.5  
+2  
Output current NRES  
INRES  
mA  
PVCC DC voltage  
VCC DC voltage  
–0.3  
–0.3  
+5.5  
+6.5  
V
V
According to IBEE LIN EMC  
Test Spec. 1.0 following IEC 61000-4-2  
- Pin VS, LIN to GND  
- Pin WAKE (33 kΩ serial resistor) to GND  
±6  
±5  
KV  
KV  
HBM ESD  
ANSI/ESD-STM5.1  
JESD22-A114  
AEC-Q100 (002)  
±3  
KV  
CDM ESD STM 5.3.1  
±750  
±8  
V
ESD HBM following STM5.1 with 1.5 kΩ  
150 pF  
KV  
- Pin VS, LIN, WAKE to GND  
Junction temperature  
Tj  
Ts  
–40  
–55  
+150  
+150  
10  
°C  
°C  
Storage temperature  
Thermal resistance junction to heat slug  
Rthjc  
K/W  
Thermal resistance junction to ambient,  
where heat slug is soldered to PCB  
Rthja  
35  
K/W  
Thermal shutdown of VCC regulator  
Thermal shutdown of LIN output  
Thermal shutdown hysteresis  
150  
150  
165  
165  
10  
170  
170  
°C  
°C  
°C  
17  
4986F–AUTO–07/08  
8. Electrical Characteristics  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
1
VS Pin  
Nominal DC voltage  
range  
1.1  
VS  
VS  
VS  
5
3
27  
14  
V
A
A
Sleep Mode  
VLIN > VS – 0.5V  
IVSsleep  
10  
11  
57  
66  
µA  
VS < 14V (Tj = 25°C)  
Supply current in Sleep  
Mode  
1.2  
1.3  
Sleep Mode  
VLIN > VSt – 0.5V  
VS < 14V (Tj = 125°C)  
IVSsleep  
5
16  
67  
76  
0.8  
53  
µA  
µA  
A
A
A
A
A
A
Bus recessive  
VS < 14V (Tj = 25°C)  
Without load at VCC  
IVSsi  
47  
56  
0.3  
50  
Supply current in Silent  
Mode  
Bus recessive  
VS < 14V (Tj = 125°C)  
Without load at VCC  
IVSsi  
µA  
Bus recessive  
VS < 14V  
Without load at VCC  
Supply current in Normal  
Mode  
1.4  
1.5  
VS  
VS  
VS  
IVSrec  
IVSdom  
IVSfail  
mA  
mA  
mA  
Bus dominant  
VS < 14V  
VCC load current 50 mA  
Supply current in Normal  
Mode  
Bus recessive  
VS < 14V  
Without load at VCC  
Supply current in  
Fail-safe Mode  
1.6  
1.7  
0.35  
4.0  
0.53  
5
VS undervoltage  
threshold  
VS  
VS  
VSth  
4.5  
0.2  
V
V
A
A
VS undervoltage  
threshold hysteresis  
1.8  
VSth_hys  
2
RXD Output Pin  
Normal Mode  
2.1  
Low-level input current  
V
LIN = 0V  
RXD  
IRXD  
1.3  
3
2.5  
5
8
mA  
A
VRXD = 0.4V  
2.2  
2.3  
Low-level output voltage IRXD = 1 mA  
RXD  
RXD  
VRXDL  
RRXD  
0.4  
7
V
A
A
Internal 5 kΩ resistor to  
VCC  
kΩ  
3
TXD Input/Output Pin  
3.1  
Low-level voltage input  
TXD  
TXD  
TXD  
TXD  
VTXDL  
VTXDH  
RTXD  
ITXD  
–0.3  
2
+0.8  
V
V
A
A
A
A
VCC  
+
3.2  
3.3  
3.4  
High-level voltage input  
0.3V  
Pull-up resistor  
VTXD = 0V  
TXD = VCC  
125  
–3  
250  
400  
kΩ  
µA  
High-level leakage  
current  
V
+3  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
18  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
8. Electrical Characteristics (Continued)  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
Fail-safe Mode  
Low-level input current at VLIN = VS  
3.5  
TXD  
ITXDwake  
2
2.5  
8
mA  
A
local wake-up request  
VWAKE = 0V  
VTXD = 0.4V  
4
EN Input Pin  
4.1  
Low-level voltage input  
EN  
EN  
VENL  
VENH  
–0.3  
2
+0.8  
V
V
A
A
VCC  
+
4.2  
High-level voltage input  
0.3V  
4.3  
4.4  
5
Pull-down resistor  
VEN = VCC  
EN  
EN  
REN  
IEN  
50  
–3  
125  
250  
200  
+3  
kΩ  
A
A
Low-level input current VEN = 0V  
NTRIG Watchdog Input Pin  
Low-level voltage input  
µA  
5.1  
VNTRIGL  
VNTRIGH  
RNTRIG  
INTRIG  
–0.3  
2
+0.8  
V
V
A
A
A
A
VCC  
+
5.2  
5.3  
5.4  
High-level voltage input  
0.3V  
Pull-up resistor  
V
NTRIG = 0V  
125  
–3  
400  
kΩ  
µA  
High-level leakage  
current  
VNTRIG = VCC  
+3  
6
Mode Input Pin  
6.1  
Low-level voltage input  
VMODEL  
VMODEH  
–0.3  
2
+0.8  
V
V
A
A
VCC  
+
6.2  
6.3  
High-level voltage input  
0.3V  
High-level leakage  
current  
VMODE = VCC or  
VMODE = 0V  
IMODE  
–3  
+3  
µA  
A
7
INH Output Pin  
7.1  
High-level voltage  
IINH = –15 mA  
VINHH  
RINH  
VS – 0.8  
VS  
50  
V
A
A
Switch-on resistance  
between VS and INH  
7.2  
7.3  
30  
Ω
High-level leakage  
current  
Sleep Mode  
VINH = 27V, VS = 27V  
IINHL  
–3  
+3  
µA  
A
LIN Bus Driver: Bus Load Conditions:  
8
Load 1 (Small): 1 nF, 1 kΩ; Load 2 (Large): 10 nF, 500Ω; Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF  
10.5, 10.6 and 10.7 Specifies the Timing Parameters for Proper Operation at 20 Kbps  
Driver recessive output  
voltage  
8.1  
8.2  
8.3  
8.4  
8.5  
8.6  
Load1/Load2  
LIN  
LIN  
LIN  
LIN  
LIN  
LIN  
VBUSrec  
V_LoSUP  
V_HiSUP  
V_LoSUP_1k  
V_HiSUP_1k  
RLIN  
0.9 × VS  
VS  
1.2  
2
V
V
A
A
A
A
A
A
VVS = 7V  
Rload = 500 Ω  
Driver dominant voltage  
VVS = 18V  
Driver dominant voltage  
Driver dominant voltage  
Driver dominant voltage  
Pull-up resistor to VS  
V
Rload = 500 Ω  
VVS = 7.0V  
0.6  
0.8  
20  
V
Rload = 1000 Ω  
VVS = 18V  
Rload = 1000 Ω  
V
The serial diode is  
mandatory  
30  
60  
kΩ  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
19  
4986F–AUTO–07/08  
8. Electrical Characteristics (Continued)  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
LIN current limitation  
BUS = VBatt_max  
8.7  
8.8  
LIN  
IBUS_LIM  
40  
120  
200  
mA  
A
V
Input leakage current at Input leakage current  
the receiver including  
pull-up resistor as  
specified  
Driver off  
VBUS = 0V  
VBatt = 12V  
LIN IBUS_PAS_dom  
–1  
–0.35  
15  
mA  
µA  
A
A
Driver off  
8V < VBatt < 18V  
8V < VBUS < 18V  
Leakage current LIN  
recessive  
8.9  
LIN  
LIN  
IBUS_PAS_rec  
20  
VBUS VBatt  
Leakage current when  
control unit disconnected  
from ground.  
GNDDevice = VS  
VBatt = 12V  
0V < VBUS < 18V  
8.10 Loss of local ground  
must not affect  
IBUS_NO_gnd  
–10  
+0.5  
+10  
µA  
A
communication in the  
residual network.  
Node has to sustain the  
current that can flow  
VBatt disconnected  
8.11 under this condition. Bus VSUP_Device = GND  
must remain operational 0V < VBUS < 18V  
under this condition.  
LIN  
LIN  
IBUS  
5
15  
µA  
V
A
A
9
LIN Bus Receiver  
Center of receiver  
threshold  
VBUS_CNT  
(Vth_dom + Vth_rec)/2  
=
0.475 ×  
0.5 ×  
VS  
0.525 ×  
9.1  
VBUS_CNT  
VS  
VS  
9.2  
9.3  
Receiver dominant state VEN = 5V  
Receiver recessive state VEN = 5V  
Receiver input  
LIN  
LIN  
VBUSdom  
VBUSrec  
0.4 × VS  
V
V
A
A
0.6 × VS  
0.028 ×  
0.175 ×  
9.4  
9.5  
Vhys = Vth_rec – Vth_dom  
LIN  
LIN  
LIN  
VBUShys  
VLINH  
0.1 × VS  
V
V
V
A
A
A
hysteresis  
VS  
VS  
Pre_Wake detection LIN  
High-level input voltage  
VS +  
0.3V  
VS – 1V  
–27  
Pre_Wake detection LIN  
Low-level input voltage  
VS –  
3.3V  
9.6  
10  
Activates the LIN receiver  
VLINL  
Internal Timers  
Dominant time for  
wake-up via LIN bus  
10.1  
VLIN = 0V  
VEN = 5V  
tbus  
30  
5
90  
15  
150  
20  
µs  
µs  
A
A
Time delay for mode  
change from Fail-safe  
into Normal Mode via  
EN pin  
10.2  
tnorm  
Time delay for mode  
change from Normal  
Mode to Sleep Mode via  
EN pin  
10.3  
10.4  
VEN = 0V  
tsleep  
2
6
7
12  
20  
µs  
A
A
TXD dominant time-out  
timer (ATA6626 disabled)  
VTXD = 0V  
tdom  
13  
ms  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
20  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
8. Electrical Characteristics (Continued)  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Time delay for mode  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
change from Silent  
Mode into Normal Mode  
via EN  
10.5  
VEN = 5V  
ts_n  
5
15  
40  
µs  
A
THRec(max) = 0.744 × VS  
THDom(max) = 0.581 × VS  
VS = 7.0V to 18V  
tBit = 50 µs  
D1 = tbus_rec(min)/(2 × tBit)  
10.6 Duty cycle 1  
10.7 Duty cycle 2  
10.8 Duty cycle 3  
10.9 Duty cycle 4  
D1  
D2  
D3  
D4  
0.396  
A
A
A
THRec(min) = 0.422 × VS  
THDom(min) = 0.284 × VS  
VS = 7.6V to 18V  
tBit = 50 µs  
D2 = tbus_rec(max)/(2 × tBit)  
0.581  
THRec(max) = 0.778 × VS  
THDom(max) = 0.616 × VS  
VS = 7.0V to 18V  
tBit = 96 µs  
D3 = tbus_rec(min)/(2 × tBit)  
0.417  
THRec(min) = 0.389 × VS  
THDom(min) = 0.251 × VS  
VS = 7.6V to 18V  
tBit = 96 µs  
D4 = tbus_rec(max)/(2 × tBit)  
0.590  
22.5  
A
A
VS = 7.0V to 18V Slope  
time dominant and  
recessive edges  
Slope time falling and  
tSLOPE_fall  
tSLOPE_rise  
10.10  
3.5  
µs  
rising edge at LIN  
Receiver Electrical AC Parameters of the LIN Physical Layer  
LIN Receiver, RXD Load Conditions: Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF  
11  
Propagation delay of  
VS = 7.0V to 18V  
11.1 receiver (Figure 8-1 on  
page 24)  
trx_pd  
6
µs  
µs  
A
A
trx_pd = max(trx_pdr, trx_pdf  
)
Symmetry of receiver  
11.2 propagation delay rising  
edge minus falling edge  
VS = 7.0V to 18V  
trx_sym = trx_pdr – trx_pdf  
trx_sym  
–2  
+2  
12  
NRES Open Drain Output Pin  
VS 5.5V  
12.1 Low-level output voltage Inres = 1 mA  
nres = 250 µA  
VNRESL  
0.2  
0.14  
V
V
A
I
10 kΩ to VCC  
VCC = 0V  
12.2 Low-level output low  
VNRESLL  
0.2  
6
V
A
A
A
VVS 5.5V  
CNRES = 20 pF  
12.3 Undervoltage reset time  
T
2
4
ms  
µs  
reset  
Reset debounce time for VVS 5.5V  
falling edge CNRES = 20 pF  
12.4  
T
1.5  
10  
res_f  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
21  
4986F–AUTO–07/08  
8. Electrical Characteristics (Continued)  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
13  
Watchdog Oscillator  
Voltage at WD_OSC in  
Normal Mode  
I
V
WD_OSC = –200 µA  
VS 4V  
13.1  
VWD_OSC  
ROSC  
1.13  
34  
1.23  
1.33  
120  
V
A
A
Positive values of  
resistor  
13.2  
kΩ  
13.3 Oscillator period  
13.4 Oscillator period  
13.5 Oscillator period  
13.6 Oscillator period  
R
OSC = 34 kΩ  
tOSC  
tOSC  
tOSC  
tOSC  
10.65  
15.68  
26.83  
34.2  
13.3  
19.6  
33.5  
42.8  
15.97  
23.52  
40.24  
51.4  
µs  
µs  
µs  
µs  
A
A
A
A
ROSC = 51 kΩ  
ROSC = 91 kΩ  
ROSC = 120 kΩ  
14  
Watchdog Timing Relative to tOSC  
Watchdog lead time after  
Reset  
14.1  
td  
7895  
cycles  
A
Watchdog closed  
window  
14.2  
t1  
t2  
1053  
1105  
4
cycles  
cycles  
ms  
A
A
A
14.3 Watchdog open window  
Watchdog reset time  
NRES  
14.4  
tnres  
3.2  
4.8  
15  
KL_15 Pin  
High-level input voltage Positive edge initializes a  
VS +  
0.3V  
15.1  
VKL_15H  
VKL_15L  
4
V
V
A
A
RV = 50 kΩ  
wake-up  
Low-level input voltage  
RV = 50 kΩ  
15.2  
–1  
+2  
VS < 27V  
VKL_15 = 27V  
15.3 KL_15 pull-down current  
IKL_15  
50  
160  
2
60  
250  
4.5  
µA  
µs  
A
A
C
15.4 Internal debounce time Without external capacitor  
KL_15 wake-up time  
TdbKL_15  
TwKL_15  
80  
15.5  
RV = 50 kΩ, C = 100 nF  
0.4  
ms  
(RV = 50 kΩ, C = 100 nF)  
16  
WAKE Pin  
VS +  
0.3V  
16.1 High-level input voltage  
VWAKEH  
VWAKEL  
IWAKE  
VS – 1V  
–1  
V
V
A
A
A
A
A
VS –  
3.3V  
16.2 Low-level input voltage Initializes a wake-up signal  
VS < 27V  
16.3 WAKE pull-up current  
VWAKE = 0V  
–30  
–5  
–10  
70  
µA  
µA  
µs  
High-level leakage  
current  
VS = 27V  
WAKE = 27V  
16.4  
16.5  
IWAKEL  
IWAKEL  
+5  
V
Time of low pulse for  
wake-up via WAKE pin  
VWAKE = 0V  
30  
150  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
22  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
8. Electrical Characteristics (Continued)  
5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins  
No. Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
17  
VCC Voltage Regulator ATA6622  
4V < VS < 18V  
(0 mA to 50 mA)  
17.1 Output voltage VCC  
VCCnor  
VCClow  
VDrop1  
3.234  
3.366  
3.366  
200  
V
V
A
A
A
A
Output voltage VCC at  
low VS  
VS –  
VDrop  
17.2  
3V < VS < 4V  
VS > 3V  
IVCC = –15 mA  
17.3 Regulator drop voltage  
17.4 Regulator drop voltage  
mV  
mV  
VS > 3V  
IVCC = –50 mA  
VDrop2  
500  
0.5  
700  
17.5 Line regulation  
17.6 Load regulation  
4V < VS < 18V  
VCCline  
VCCload  
1
2
%
%
A
A
5 mA < IVCC < 50 mA  
10 Hz to 100 kHz  
CVCC = 10 µF  
VS = 14V, IVCC = –15 mA  
Power supply ripple  
rejection  
17.7  
50  
dB  
A
17.8 Output current limitation VS > 4V  
IVCCs  
Cload  
–200  
1.8  
–160  
10  
mA  
µF  
A
D
17.9 Load capacity  
1Ω < ESR < 5Ω @ 100 kHz  
VCC undervoltage  
threshold  
Referred to VCC  
VS > 4V  
17.10  
VthunN  
Vhysthun  
TVCC  
2.8  
3.2  
V
A
A
A
Hysteresis of  
17.11  
Referred to VCC  
150  
100  
mV  
µs  
undervoltage threshold VS > 4V  
Ramp-up time VS > 4V to CVCC = 2.2 µF  
VCC = 3.3V  
17.12  
250  
Iload = –5 mA at VCC  
18  
VCC Voltage Regulator ATA6624/ATA6626  
5.5V < VS < 18V  
18.1 Output voltage VCC  
VCCnor  
VCClow  
VD1  
4.9  
5.1  
5.1  
V
A
A
A
A
(0 mA to 50 mA)  
Output voltage VCC at  
low VS  
18.2  
4V < VS < 5.5V  
VS – VD  
V
VS > 4V  
IVCC = –20 mA  
18.3 Regulator drop voltage  
18.4 Regulator drop voltage  
250  
600  
mV  
mV  
VS > 4V  
IVCC = –50 mA  
VD2  
400  
0.5  
VS > 3.3V  
IVCC = –15 mA  
18.5 Regulator drop voltage  
18.6 Line regulation  
VD3  
200  
1
mV  
%
A
A
A
5.5V < VS < 18V  
VCCline  
VCCload  
5 mA < IVCC < 50 mA  
100 kHz  
18.7 Load regulation  
2
%
18.8 Output current limitation VS > 5.5V  
IVCCs  
–200  
1.8  
–130  
10  
mA  
µF  
A
D
18.9 Load capacity  
1Ω < ESR < 5Ω  
VthunN  
VCC undervoltage  
threshold  
Referred to VCC  
VS > 5.5V  
18.10  
VthunN  
Vhysthun  
tVCC  
4.2  
4.8  
V
A
A
A
Hysteresis of  
18.11  
Referred to VCC  
250  
130  
mV  
µs  
undervoltage threshold VS > 5.5V  
Ramp-up time VS > 5.5V CVCC = 2.2 µF  
to VCC = 5V  
18.12  
300  
Iload = –5 mA at VCC  
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
23  
4986F–AUTO–07/08  
Figure 8-1. Definition of Bus Timing Characteristics  
tBit  
tBit  
tBit  
TXD  
(Input to transmitting node)  
tBus_dom(max)  
tBus_rec(min)  
Thresholds of  
THRec(max)  
THDom(max)  
receiving node1  
VS  
(Transceiver supply  
of transmitting node)  
LIN Bus Signal  
Thresholds of  
THRec(min)  
THDom(min)  
receiving node2  
tBus_dom(min)  
tBus_rec(max)  
RXD  
(Output of receiving node1)  
trx_pdf(1)  
trx_pdr(1)  
RXD  
(Output of receiving node2)  
trx_pdr(2)  
trx_pdf(2)  
24  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
Figure 8-2. Application Circuit  
Ignition  
KL15  
VBattery  
KL30  
22 µF  
100 nF  
+
47 kΩ  
Master node  
pull-up  
100 nF  
+
1 kΩ  
10 kΩ  
Debug  
100 nF 10 µF  
20 19 18 17 16  
10 kΩ  
EN  
MODE  
TM  
1
2
3
4
5
15  
14  
13  
12  
11  
VCC  
ATA6622/24/26  
10 kΩ  
WD_OSC  
NTRIG  
WAKE  
GND  
MLP 5 mm × 5 mm  
0.65 mm pitch  
20 lead  
33 kΩ  
51 kΩ  
NRES  
TXD  
Microcontroller  
Wake  
switch  
EN  
6
7
8
9
10  
NTRIG  
RXD  
220 pF  
TXD  
RESET  
INH  
25  
4986F–AUTO–07/08  
Figure 8-3. Application Circuit with External NPN  
Ignition  
KL15  
VBattery  
KL30  
22 µF  
100 nF  
+
MJD31C  
47 kΩ  
+
Master node  
pull-up  
2.2 µF  
100 nF  
3.3Ω  
+
1 kΩ  
10 kΩ  
Debug  
100 nF 10 µF  
20 19 18 17 16  
10 kΩ  
EN  
MODE  
TM  
1
2
3
4
5
15  
14  
13  
12  
11  
VCC  
ATA6622/24/26  
10 kΩ  
WD_OSC  
NTRIG  
WAKE  
GND  
MLP 5 mm × 5 mm  
0.65 mm pitch  
20 lead  
33 kΩ  
51 kΩ  
NRES  
TXD  
Microcontroller  
Wake  
switch  
EN  
6
7
8
9
10  
NTRIG  
RXD  
220 pF  
TXD  
RESET  
INH  
26  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
ATA6622/ATA6624/ATA6626  
9. Ordering Information  
Extended Type Number  
ATA6622-PGPW  
ATA6624-PGPW  
ATA6622-PGQW  
ATA6624-PGQW  
ATA6626-PGQW  
Package  
QFN20  
QFN20  
QFN20  
QFN20  
QFN20  
Remarks  
3.3V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled  
5V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled  
3.3V LIN system-basis-chip, Pb-free, 6k, taped and reeled  
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled  
5V LIN system-basis-chip, Pb-free, 6k, taped and reeled  
10. Package Information  
Package: VQFN_5 x 5_20L  
Exposed pad 3.1 x 3.1  
Dimensions in mm  
Not indicated tolerances ±0.05  
Bottom  
0
3.1±0.15  
0.05-0.05  
Top  
20  
16  
20  
1
15  
1
5
Pin 1 identification  
11  
5
10  
6
0.2  
0.65 nom.  
0.9±0.1  
5
2.6  
Drawing-No.: 6.543-5129.01-4  
Issue: 2; 09.02.07  
technical drawings  
according to DIN  
specifications  
0.28±0.07  
27  
4986F–AUTO–07/08  
11. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Section 3.15 “INH Output Pin” on page 6 changed  
Section 5.5 “Fail-safe Features” on page 13 changed  
Section 6.1 “Typical Timing Sequence with RWD_OSC = 51 kΩ” on page 15  
changed  
4986F-AUTO-05/08  
Section 8 “Electrical Characteristics” numbers 1.6 to 1.8 on page 18  
changed  
Figure 2-1 on page 3 renamed  
Figure 6-1 “Timing Sequence with RWD_OSC = 51 kΩ” on page 16  
changed  
4986E-AUTO-02/08  
4986D-AUTO-10/07  
Figure 8-3 “Application Circuit with External NPN” on page 26 added  
Section 9 “Ordering Information” on page 26 changed  
Features changed  
Sections 4.2, 4.3, 4.4 and 4.5 changed  
4986C-AUTO-09/07  
Figures 4-2, 4-3, 4-4, 5-1, 5-2, 5-3, 5-6, 6-1 and 6-2 changed  
Section 7 “Absolute Maximum Ratings” changed”  
Section 8 “Electrical Characteristics”: numbers 17.9 and 18.9 changed  
Put datasheet into a new template  
Part number ATA6626 added  
Features changed  
Description text changed  
Figure 1-1 “Block Diagram” changed  
Figure 2-1 “Pinning SO8 changed”  
Figure 4-3 “LIN Wake Up from Silent Mode” changed  
Figure 4-5 “LIN Wake Up from Sleep Mode” changed  
Sections 3.2, 3.4, 3.7, 3.8, 3.9, 3.10, 3.11, 3.12, 3.13 and 3.14 changed  
Sections 4.2, 4.3, 4.4, 4.5, 5.1, 5.2, 5.3, 5.5, 5.6, 6.1 and 6.2 changed  
4986B-AUTO-06/07  
Section 8 “Electrical Characteristics”: numbers 1.3, 3.5, 8.4, 12.1, 15.5,  
17.9, 18 and 18.9 changed  
Figure 8-2 “Application Circuit” changed  
Section 9 “Ordering Information” changed  
Section 10 “Package Information” changed  
28  
ATA6622/ATA6624/ATA6626  
4986F–AUTO–07/08  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Atmel Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
Atmel Europe  
Le Krebs  
8, Rue Jean-Pierre Timbaud  
BP 309  
Atmel Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
78054  
Hong Kong  
Saint-Quentin-en-Yvelines Cedex Tel: (81) 3-3523-3551  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
France  
Tel: (33) 1-30-60-70-00  
Fax: (33) 1-30-60-71-11  
Fax: (81) 3-3523-7581  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
auto_control@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any  
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMELS TERMS AND CONDI-  
TIONS OF SALE LOCATED ON ATMELS WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY  
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-  
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF  
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representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided  
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use  
as components in applications intended to support or sustain life.  
© 2008 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of  
Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.  
4986F–AUTO–07/08  

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