AT97SC3204-X1A90-1 [ATMEL]

Micro Peripheral IC,;
AT97SC3204-X1A90-1
型号: AT97SC3204-X1A90-1
厂家: ATMEL    ATMEL
描述:

Micro Peripheral IC,

文件: 总10页 (文件大小:702K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
28-pin Thin TSSOP  
4.4 mm x 9.7 mm Body  
0.65 mm Pitch  
40-pin QFN  
6.0 mm x 6.0 mm Body  
0.50 mm Pitch  
28-pin TSSOP  
6.1 mm x 9.7 mm Body  
0.65 mm Pitch  
ATest  
GND  
SB3V  
GPIO6  
NC  
1
2
3
4
5
6
7
8
9
30 LAD0  
29 GND  
28 VCC  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
LPCPD#  
SERIRQ  
LAD0  
ATest  
ATest  
ATest  
GND  
SB3V  
GPIO6  
NC  
2
3
27 LAD1  
26 LFRAME#  
25 LCLK  
24 LAD2  
23 VCC  
4
GND  
5
VCC  
TestI  
TestBI  
VCC  
6
LAD1  
7
LFRAME#  
LCLK  
8
TestI  
TestBI  
VCC  
GND  
22 GND  
21 LAD3  
9
LAD2  
NBO 10  
10  
11  
12  
13  
14  
VCC  
GND  
GND  
NBO  
NBO  
NBO  
LAD3  
LRESET#  
CLKRUN#  
b
L
L1  
E
E1  
e
D
A
A2  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
9.70  
NOTE  
SYMBOL  
D
9.60  
9.80  
1,4  
1. Dimension "D" does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusions and gate burrs shall not exceed  
.15mm (.006 in) per side.  
2. Dimension "E1" does not include inter-lead flash or protrusions.  
Inter-lead flash and protrusions shall not exceed .25mm (.010 in)  
per side.  
3. Dimension 'b' does not include Dambar protrusion. Allowable  
Dambar protrusion shall be 0.08 mm total in excess of the 'b'  
dimension at maximum material condition. Dambar cannot be  
located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
E
6.40 BSC  
4.40  
E1  
A
4.30  
4.50  
1.20  
1.05  
0.30  
2,4  
3
A2  
b
0.80  
0.19  
1.00  
e
0.65 BSC  
0.60  
L
0.45  
0.75  
L1  
1.00 REF  
4. Dimension 'D' and 'E1' to be determined at Datum Plane H.  
This drawing is for general information only. Please refer to  
JEDEC Drawing MO-153, Variation AE for additional information.  
6/17/08  
GPC  
TFL  
DRAWING NO.  
TITLE  
REV.  
Package Drawing Contact:  
packagedrawings@atmel.com  
28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch,  
Thin Shrink Small Outline Package (TSSOP)  
28A2  
B
b
L
L1  
E1  
E
e
End View  
Top View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
9.70  
NOTE  
SYMBOL  
D
9.60  
9.80  
2, 5  
D
E
8.10 BSC  
6.10  
A2  
A
E1  
A
6.00  
6.20  
1.20  
1.05  
0.30  
3, 5  
A2  
b
0.80  
0.19  
1.00  
Side View  
4
e
0.65 BSC  
0.60  
L
0.45  
0.75  
L1  
1.00 REF  
Note:  
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional  
information.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall  
not exceed 0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed  
0.25 mm (0.010 in) per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of  
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum  
space between protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
1/8/02  
TITLE  
DRAWING NO.  
28A3  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,  
Thin Shrink Small Outline Package (TSSOP)  
R
A
A
D
A1  
A3  
N
A2  
1
2
3
Pin 1 Indicator  
E
Top View  
L
0
Side View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
D2  
MIN  
MAX  
NOM  
6.00 BSC  
6.00 BSC  
4.10  
NOTE  
SYMBOL  
D
E2  
E
D2  
E2  
A
3.95  
3.95  
-
4.25  
4.25  
0.90  
0.05  
0.70  
3
2
1
4.10  
0.85  
b
A1  
A2  
A3  
L
0.0  
-
0.01  
0.65  
N
0.20 REF  
0.40  
e
0.30  
0.18  
0.50  
0.30  
e
0.50 BSC  
0.23  
PIN1 ID  
b
2
Bottom View  
Note:  
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper  
dimensions, tolerances, datums, etc.  
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal  
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be  
measured in that radius area.  
9/27/07  
DRAWING NO. REV.  
40ML1  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded  
Quad Flat No Lead Package (QFN) Punched  
R
C

相关型号:

AT97SC3204-X2A10-ZB

RISC Microprocessor, 8-Bit, CMOS, PDSO28
MICROCHIP

AT97SC3204-X2A16-00

IC CRYPTO TPM LPC 28TSSOP
MICROCHIP

AT97SC3204-X2A16-10

IC CRYPTO TPM LPC 28TSSOP
MICROCHIP

AT97SC3204-X2A1610B

RISC Microprocessor, 8-Bit, CMOS, PDSO28
MICROCHIP

AT97SC3204-X2A1A-10

RISC Microcontroller, 8-Bit, EEPROM, CMOS, PDSO28, 4.40 X 9.70 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-153AE, TSSOP-28
ATMEL

AT97SC3204-X2A1A-10

IC CRYPTO TPM LPC 28TSSOP
MICROCHIP

AT97SC3204-X2A1A-20

IC CRYPTO TPM LPC 28TSSOP
MICROCHIP

AT97SC3204-X2A1A-20

RISC Microcontroller, 8-Bit, EEPROM, CMOS, PDSO28, 4.40 X 9.70 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-153AE, TSSOP-28
ATMEL

AT97SC3204-X2A1A10B

RISC Microprocessor, 8-Bit, CMOS, PDSO28
MICROCHIP

AT97SC3204-X2A1A20B

RISC Microprocessor, 8-Bit, CMOS, PDSO28
MICROCHIP

AT97SC3204-X2M6-00

IC CRYPTO TPM LPC 40QFN
MICROCHIP

AT97SC3204-X2M600B

RISC Microprocessor, 8-Bit, CMOS
MICROCHIP