AT93C86A-10SQ-2.7 [ATMEL]

Three-wire Automotive Temperature Serial EEPROM 16K (2048 x 8 or 1024 x 16); 三线汽车温度串行EEPROM 16K ( 2048 ×8或1024 ×16 )
AT93C86A-10SQ-2.7
型号: AT93C86A-10SQ-2.7
厂家: ATMEL    ATMEL
描述:

Three-wire Automotive Temperature Serial EEPROM 16K (2048 x 8 or 1024 x 16)
三线汽车温度串行EEPROM 16K ( 2048 ×8或1024 ×16 )

内存集成电路 光电二极管 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟
文件: 总14页 (文件大小:452K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1. Features  
Medium-voltage and Standard-voltage Operation  
– 2.7 (VCC = 2.7V to 5.5V)  
Automotive Temperature Range –40°C to +125°C  
User Selectable Internal Organization  
– 16K: 2048 x 8 or 1024 x 16  
3-wire Serial Interface  
Sequential Read Operation  
Schmitt Trigger, Filtered Inputs for Noise Suppression  
2 MHz Clock Rate (5V) Compatibility  
Self-timed Write Cycle (10 ms max)  
High Reliability  
Three-wire  
Automotive  
Temperature  
Serial  
– Endurance: 1 Million Write Cycles  
– Data Retention: 100 Years  
Lead-Free/Halogen-Free Devices Available  
8-lead JEDEC SOIC and 8-lead TSSOP Packages  
EEPROM  
2. Description  
16K (2048 x 8 or 1024 x 16)  
The AT93C86A provides 16384 bits of serial electrically erasable programmable read  
only memory (EEPROM), organized as 1024 words of 16 bits each when the ORG pin  
is connected to VCC and 2048 words of 8 bits each when it is tied to ground. The  
device is optimized for use in many automotive applications where low-power and  
low-voltage operations are essential. The AT93C86A is available in space saving 8-  
lead JEDEC SOIC and 8-lead TSSOP packages.  
AT93C86A  
Table 2-1.  
Pin Name  
CS  
Pin Configuration  
Function  
8-lead SOIC  
Chip Select  
CS  
SK  
DI  
1
2
3
4
8
7
6
5
VCC  
DC  
SK  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
ORG  
GND  
DI  
DO  
DO  
GND  
VCC  
ORG  
DC  
Power Supply  
Internal Organization  
Don’t Connect  
8-lead TSSOP  
CS  
1
2
3
4
8
7
6
5
VCC  
DC  
SK  
DI  
ORG  
GND  
DO  
The AT93C86A is enabled through the Chip Select pin (CS), and accessed via a  
three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift  
Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the  
data is clocked out serially on the data output pin DO. The write cycle is completely  
self-timed and no separate erase cycle is required before Write. The write cycle is only  
enabled when the part is in the Erase/Write Enable state. When CS is brought “high”  
following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of  
the part. The AT93C86A is available in a 2.7V to 5.5V version.  
Rev. 5096E–SEEPR–1/08  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only, and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability.  
Operating Temperature..................................–55°C to +125°C  
Storage Temperature.....................................–65°C to +150°C  
Voltage on any Pin  
with Respect to Ground....................................1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Figure 2-1. Block Diagram  
Vcc  
GND  
MEMORY ARRAY  
ADDRESS  
DECODER  
2048 x 8  
OR  
ORG  
1024 x 16  
DATA  
REGISTER  
OUTPUT  
BUFFER  
DI  
MODE  
DECODE  
LOGIC  
CS  
CLOCK  
GENERATOR  
DO  
SK  
Note:  
When the ORG pin is connected to Vcc, the x 16 organization is selected. When it is connected to ground, the x 8 organization  
is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the internal 1  
Meg ohm pullup, then the x 16 organization is selected.  
Table 2-2.  
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)  
Pin Capacitance(1)  
Symbol  
COUT  
CIN  
Test Conditions  
Max  
5
Units  
pF  
Conditions  
VOUT = 0V  
VIN = 0V  
Output Capacitance (DO)  
Input Capacitance (CS, SK, DI)  
5
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
2
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
Table 2-3.  
DC Characteristics  
Applicable over recommended operating range from: TA = 40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise  
noted)  
Symbol  
VCC1  
Parameter  
Test Condition  
Min  
2.7  
4.5  
Typ  
Max  
5.5  
Unit  
V
Supply Voltage  
Supply Voltage  
VCC2  
5.5  
V
READ at 1.0 MHz  
WRITE at 1.0 MHz  
CS = 0V  
0.5  
0.5  
2.0  
mA  
mA  
µA  
µA  
µA  
µA  
V
ICC  
Supply Current  
VCC = 5.0V  
2.0  
ISB1  
ISB2  
IIL  
Standby Current  
Standby Current  
Input Leakage  
Output Leakage  
VCC = 2.7V  
6.0  
10.0  
15.0  
3.0  
VCC = 5.0V  
CS = 0V  
10.0  
0.1  
0.1  
VIN = 0V to VCC  
VIN = 0V to VCC  
IOL  
3.0  
(1)  
−−−−0.6  
0.8  
VIL1  
Input Low Voltage  
Input High Voltage  
2.7V VCC 5.5V  
(1)  
VIH1  
2.0  
VCC + 1  
0.4  
V
I
I
OL = 2.1 mA  
V
VOL1  
VOH1  
Output Low Voltage  
Output High Voltage  
2.7V VCC 5.5V  
OH = –0.4 mA  
2.4  
V
Note:  
1. VIL min and VIH max are reference only and are not tested.  
Table 2-4.  
AC Characteristics  
Applicable over recommended operating range from TA = –40°C to +125°C, VCC = As Specified,  
CL = 1 TTL Gate and 100 pF (unless otherwise noted)  
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Units  
SK Clock  
Frequency  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
0
0
2
1
fSK  
MHz  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
tSKH  
tSKL  
tCS  
SK High Time  
SK Low Time  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
ns  
Minimum CS  
Low Time  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
50  
50  
tCSS  
CS Setup Time  
Relative to SK  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
100  
tDIS  
tCSH  
tDIH  
DI Setup Time  
CS Hold Time  
DI Hold Time  
Relative to SK  
Relative to SK  
Relative to SK  
ns  
ns  
ns  
0
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
100  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
500  
tPD1  
Output Delay to ‘1’  
Output Delay to ‘0’  
AC Test  
AC Test  
ns  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
500  
tPD0  
3
5096E–SEEPR–1/08  
Table 2-4.  
AC Characteristics (Continued)  
Applicable over recommended operating range from TA = –40°C to +125°C, VCC = As Specified,  
CL = 1 TTL Gate and 100 pF (unless otherwise noted)  
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Units  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
tSV  
CS to Status Valid  
AC Test  
ns  
CS to DO in High  
Impedance  
AC Test  
CS = VIL  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
150  
tDF  
ns  
tWP  
Write Cycle Time  
5.0V, 25°C  
2.7V VCC 5.5V  
0.1  
1M  
4
10  
ms  
(1)  
Endurance  
Write Cycles  
Note:  
1. This parameter is characterized and is not 100% tested.  
Table 2-5.  
Instruction Set for the AT93C86A  
Address  
Data  
Instruction  
SB  
Op Code  
x 8  
x 16  
x 8  
x 16  
Comments  
READ  
1
10  
A
10 – A0  
A9 – A0  
Reads data stored in memory,  
at specified address.  
EWEN  
1
00  
11XXXXXXXXX  
11XXXXXXXX  
Write enable must precede all  
programming modes.  
ERASE  
WRITE  
ERAL  
1
1
1
11  
01  
00  
A10 – A0  
A10 – A0  
A9 – A0  
A9 – A0  
Erases memory location An – A0.  
D7 – D0  
D7 – D0  
D15 – D0 Writes memory location An – A0.  
10XXXXXXXXX  
10XXXXXXXX  
Erases all memory locations.  
Valid only at VCC = 4.5V to 5.5V.  
WRAL  
EWDS  
1
1
00  
00  
01XXXXXXXXX  
00XXXXXXXXX  
01XXXXXXXX  
00XXXXXXXX  
D15 – D0 Writes all memory locations.  
Valid when VCC = 4.5V to 5.5V and  
Disable Register cleared.  
Disables all programming  
instructions.  
4
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
3. Functional Description  
The AT93C86A is accessed via a simple and versatile 3-wire serial communication interface.  
Device operation is controlled by seven instructions issued by the host processor. A valid  
instruction starts with a rising edge of CS and consists of a Start Bit (logic “1”) followed by the  
appropriate Op Code and the desired memory address location.  
READ (READ): The Read (READ) instruction contains the address code for the memory loca-  
tion to be read. After the instruction and address are decoded, data from the selected memory  
location is available at the serial output pin DO. Output data changes are synchronized with the  
rising edges of serial clock SK. It should be noted that a dummy bit (logic “0”) precedes the 8- or  
16-bit data output string. The AT93C86A supports sequential read operations. The device will  
automatically increment the internal address pointer and clock out the next memory location as  
long as CS is held high. In this case, the dummy bit (logic “0”) will not be clocked out between  
memory locations, thus allowing for a continuous stream of data to be read.  
ERASE/WRITE (EWEN): To assure data integrity, the part automatically goes into the  
Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable (EWEN)  
instruction must be executed first before any programming instructions can be carried out.  
Please note that once in the EWEN state, programming remains enabled until an EWDS instruc-  
tion is executed or VCC power is removed from the part.  
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified memory  
location to the logical “1” state. The self-timed erase cycle starts once the Erase instruction and  
address are decoded. The DO pin outputs the Ready/Busy status of the part if CS is brought  
high after being kept low for a minimum of 250 ns (tCS). A logic “1” at pin DO indicates that the  
selected memory location has been erased, and the part is ready for another instruction.  
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be written  
into the specified memory location. The self-timed programming cycle tWP starts after the last bit  
of data is received at serial data input pin DI. The DO pin outputs the Ready/Busy status of the  
part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A logic “0” at DO  
indicates that programming is still in progress. A logic “1” indicates that the memory location at  
the specified address has been written with the data pattern contained in the instruction and the  
part is ready for further instructions. A Ready/Busy status cannot be obtained if the CS is  
brought high after the end of the self-timed programming cycle tWP  
.
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the memory array  
to the logic “1” state and is primarily used for testing purposes. The DO pin outputs the  
Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250 ns  
(tCS). The Eral instruction is valid only at VCC = 5.0V ± 10%.  
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations with the  
data patterns specified in the instruction. The DO pin outputs the Ready/Busy status of the part if  
CS is brought high after being kept low for a minimum of 250 ns (tCS). The Wral instruction is  
valid only at VCC = 5.0V ± 10%.  
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturbance, the  
Erase/Write Disable (EWDS) instruction disables all programming modes and should be exe-  
cuted after all programming operations. The operation of the Read instruction is independent of  
both the Ewen and Ewds instructions and can be executed at any time.  
5
5096E–SEEPR–1/08  
4. Timing Diagrams  
Figure 4-1. Synchronous Data Timing  
Note:  
1. This is the minimum SK period.  
Table 4-1.  
Organization Key for Timing Diagrams  
AT93C86A (16K)  
I/O  
AN  
DN  
x 8  
A10  
D7  
x 16  
A9  
D15  
Figure 4-2. READ Timing  
6
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
Figure 4-3. EWEN Timing  
tCS  
CS  
SK  
DI  
...  
1
0
0
1
1
Figure 4-4. EWDS Timing  
tCS  
CS  
SK  
...  
0
0
0
DI  
1
0
Figure 4-5. WRITE Timing  
tCS  
CS  
SK  
...  
...  
DI  
AN  
DN  
1
0
1
A0  
D0  
HIGH IMPEDANCE  
BUSY  
READY  
DO  
tWP  
7
5096E–SEEPR–1/08  
Figure 4-6. WRAL Timing(1)  
tCS  
CS  
SK  
DI  
1
0
0
0
1
...  
DN ... D0  
BUSY  
HIGH IMPEDANCE  
DO  
READY  
tWP  
Note:  
1. Valid only at VCC = 4.5V to 5.5V.  
Figure 4-7. ERASE Timing  
tCS  
CS  
STANDBY  
CHECK  
STATUS  
SK  
A0  
DI  
1
1
1
AN  
...  
AN-1 AN-2  
tDF  
tSV  
HIGH IMPEDANCE  
HIGH IMPEDANCE  
BUSY  
DO  
READY  
tWP  
8
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
Figure 4-8. ERAL Timing(1)  
D
Note:  
1. Valid only at VCC = 4.5V to 5.5V.  
9
5096E–SEEPR–1/08  
5. AT93C86A Ordering Information  
Ordering Code  
Package  
Operation Range  
Lead-free/Halogen-free  
Automotive Temperature  
AT93C86A-10SQ-2.7  
AT93C86A-10TQ-2.7  
8S1  
8A2  
(40°C to 125°C)  
Package Type  
8S1  
8A2  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
2.7  
Low Voltage (2.7V to 5.5V)  
10  
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
6. Packaging Information  
6.1  
8S1 – JEDEC SOIC  
C
1
E
E1  
L
N
Ø
TOP VIEW  
END VIEW  
e
b
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.35  
0.10  
MAX  
1.75  
0.25  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
C
D
E1  
E
0.31  
0.17  
4.80  
3.81  
5.79  
0.51  
0.25  
5.05  
3.99  
6.20  
D
SIDE VIEW  
e
1.27 BSC  
L
0.40  
0°  
1.27  
8°  
θ
Note:  
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.  
3/17/05  
TITLE  
DRAWING NO.  
REV.  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
C
Small Outline (JEDEC SOIC)  
R
11  
5096E–SEEPR–1/08  
6.2  
8A2 – TSSOP  
3
2 1  
Pin 1 indicator  
this corner  
E1  
E
L1  
N
L
Top View  
End View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
3.00  
NOTE  
SYMBOL  
D
2.90  
3.10  
2, 5  
A
b
E
6.40 BSC  
4.40  
E1  
A
4.30  
4.50  
1.20  
1.05  
0.30  
3, 5  
4
A2  
b
0.80  
0.19  
1.00  
e
A2  
D
e
0.65 BSC  
0.60  
L
0.45  
0.75  
Side View  
L1  
1.00 REF  
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,  
datums, etc.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm  
(0.010 in) per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the  
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
5/30/02  
DRAWING NO.  
TITLE  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8A2, 8-lead, 4.4 mm Body, Plastic  
Thin Shrink Small Outline Package (TSSOP)  
B
8A2  
R
12  
AT93C86A  
5096E–SEEPR–1/08  
AT93C86A  
7. Revision History  
Doc. Rev.  
Date  
Comments  
Moved to new template  
5096E  
5096D  
5096C  
1/2008  
Replaced Table 5 with correct version  
Removed PDIP package offering  
Removed Pb’d part numbers  
2/2007  
9/2006  
Revision history implemented; Removed ‘Preliminary’ status  
from datasheet.  
13  
5096E–SEEPR–1/08  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
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Hong Kong  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
Atmel Europe  
Le Krebs  
Atmel Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
Tel: (81) 3-3523-3551  
Fax: (81) 3-3523-7581  
8, Rue Jean-Pierre Timbaud  
BP 309  
78054 Saint-Quentin-en-  
Yvelines Cedex  
France  
Tel: (33) 1-30-60-70-00  
Fax: (33) 1-30-60-71-11  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
s_eeprom@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
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5096E–SEEPR–1/08  

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