AT89C51_00 [ATMEL]

8-bit Microcontroller with 4K Bytes Flash; 8位微控制器与4K字节的Flash
AT89C51_00
型号: AT89C51_00
厂家: ATMEL    ATMEL
描述:

8-bit Microcontroller with 4K Bytes Flash
8位微控制器与4K字节的Flash

微控制器
文件: 总17页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Compatible with MCS-51Products  
4K Bytes of In-System Reprogrammable Flash Memory  
– Endurance: 1,000 Write/Erase Cycles  
Fully Static Operation: 0 Hz to 24 MHz  
Three-level Program Memory Lock  
128 x 8-bit Internal RAM  
32 Programmable I/O Lines  
Two 16-bit Timer/Counters  
Six Interrupt Sources  
Programmable Serial Channel  
Low-power Idle and Power-down Modes  
8-bit  
Microcontroller  
with 4K Bytes  
Flash  
Description  
The AT89C51 is a low-power, high-performance CMOS 8-bit microcomputer with 4K  
bytes of Flash programmable and erasable read only memory (PEROM). The device  
is manufactured using Atmel’s high-density nonvolatile memory technology and is  
compatible with the industry-standard MCS-51 instruction set and pinout. The on-chip  
Flash allows the program memory to be reprogrammed in-system or by a conven-  
tional nonvolatile memory programmer. By combining a versatile 8-bit CPU with Flash  
on a monolithic chip, the Atmel AT89C51 is a powerful microcomputer which provides  
a highly-flexible and cost-effective solution to many embedded control applications.  
AT89C51  
Not Recommended  
for New Designs.  
Use AT89S51.  
PDIP  
Pin Configurations  
P1.0  
P1.1  
P1.2  
P1.3  
P1.4  
P1.5  
P1.6  
P1.7  
RST  
1
2
3
4
5
6
7
8
9
40 VCC  
39 P0.0 (AD0)  
38 P0.1 (AD1)  
37 P0.2 (AD2)  
36 P0.3 (AD3)  
35 P0.4 (AD4)  
34 P0.5 (AD5)  
33 P0.6 (AD6)  
32 P0.7 (AD7)  
31 EA/VPP  
(RXD) P3.0 10  
(TXD) P3.1 11  
(INT0) P3.2 12  
(INT1) P3.3 13  
(T0) P3.4 14  
(T1) P3.5 15  
(WR) P3.6 16  
(RD) P3.7 17  
XTAL2 18  
PQFP/TQFP  
30 ALE/PROG  
29 PSEN  
28 P2.7 (A15)  
27 P2.6 (A14)  
26 P2.5 (A13)  
25 P2.4 (A12)  
24 P2.3 (A11)  
23 P2.2 (A10)  
22 P2.1 (A9)  
21 P2.0 (A8)  
XTAL1 19  
P1.5  
P1.6  
1
2
3
4
5
6
7
8
9
33 PO.4 (AD4)  
32 P0.5 (AD5)  
31 P0.6 (AD6)  
30 P0.7 (AD7)  
29 EA/VPP  
GND 20  
P1.7  
PLCC  
RST  
(RXD) P3.0  
NC  
28 NC  
(TXD) P3.1  
(INT0) P3.2  
(INT1) P3.3  
27 ALE/PROG  
26 PSEN  
25 P2.7 (A15)  
24 P2.6 (A14)  
23 P2.5 (A13)  
(T0) P3.4 10  
(T1) P3.5 11  
P1.5  
P1.6  
P1.7  
7
8
9
39 PO.4 (AD4)  
38 P0.5 (AD5)  
37 P0.6 (AD6)  
36 P0.7 (AD7)  
35 EA/VPP  
RST 10  
(RXD) P3.0 11  
NC 12  
34 NC  
(TXD) P3.1 13  
(INT0) P3.2 14  
(INT1) P3.3 15  
(T0) P3.4 16  
(T1) P3.5 17  
33 ALE/PROG  
32 PSEN  
31 P2.7 (A15)  
30 P2.6 (A14)  
29 P2.5 (A13)  
Rev. 0265G–02/00  
Block Diagram  
P0.0 - P0.7  
P2.0 - P2.7  
VCC  
PORT 0 DRIVERS  
PORT 2 DRIVERS  
GND  
RAM ADDR.  
REGISTER  
PORT 0  
LATCH  
PORT 2  
LATCH  
RAM  
FLASH  
PROGRAM  
ADDRESS  
REGISTER  
STACK  
POINTER  
B
ACC  
REGISTER  
BUFFER  
TMP2  
TMP1  
PC  
INCREMENTER  
ALU  
INTERRUPT, SERIAL PORT,  
AND TIMER BLOCKS  
PROGRAM  
COUNTER  
PSW  
PSEN  
ALE/PROG  
EA / VPP  
RST  
TIMING  
AND  
CONTROL  
INSTRUCTION  
REGISTER  
DPTR  
PORT 1  
LATCH  
PORT 3  
LATCH  
OSC  
PORT 1 DRIVERS  
P1.0 - P1.7  
PORT 3 DRIVERS  
P3.0 - P3.7  
AT89C51  
2
AT89C51  
The AT89C51 provides the following standard features: 4K  
bytes of Flash, 128 bytes of RAM, 32 I/O lines, two 16-bit  
timer/counters, a five vector two-level interrupt architecture,  
a full duplex serial port, on-chip oscillator and clock cir-  
cuitry. In addition, the AT89C51 is designed with static logic  
for operation down to zero frequency and supports two  
software selectable power saving modes. The Idle Mode  
stops the CPU while allowing the RAM, timer/counters,  
serial port and interrupt system to continue functioning. The  
Power-down Mode saves the RAM contents but freezes  
the oscillator disabling all other chip functions until the next  
hardware reset.  
Port 2 pins that are externally being pulled low will source  
current (IIL) because of the internal pullups.  
Port 2 emits the high-order address byte during fetches  
from external program memory and during accesses to  
external data memory that use 16-bit addresses (MOVX @  
DPTR). In this application, it uses strong internal pullups  
when emitting 1s. During accesses to external data mem-  
ory that use 8-bit addresses (MOVX @ RI), Port 2 emits the  
contents of the P2 Special Function Register.  
Port 2 also receives the high-order address bits and some  
control signals during Flash programming and verification.  
Port 3  
Pin Description  
Port 3 is an 8-bit bi-directional I/O port with internal pullups.  
The Port 3 output buffers can sink/source four TTL inputs.  
When 1s are written to Port 3 pins they are pulled high by  
the internal pullups and can be used as inputs. As inputs,  
Port 3 pins that are externally being pulled low will source  
current (IIL) because of the pullups.  
VCC  
Supply voltage.  
GND  
Port 3 also serves the functions of various special features  
of the AT89C51 as listed below:  
Ground.  
Port 0  
Port Pin  
P3.0  
P3.1  
P3.2  
P3.3  
P3.4  
P3.5  
P3.6  
P3.7  
Alternate Functions  
Port 0 is an 8-bit open-drain bi-directional I/O port. As an  
output port, each pin can sink eight TTL inputs. When 1s  
are written to port 0 pins, the pins can be used as high-  
impedance inputs.  
RXD (serial input port)  
TXD (serial output port)  
INT0 (external interrupt 0)  
INT1 (external interrupt 1)  
T0 (timer 0 external input)  
T1 (timer 1 external input)  
WR (external data memory write strobe)  
RD (external data memory read strobe)  
Port 0 may also be configured to be the multiplexed low-  
order address/data bus during accesses to external pro-  
gram and data memory. In this mode P0 has internal  
pullups.  
Port 0 also receives the code bytes during Flash program-  
ming, and outputs the code bytes during program  
verification. External pullups are required during program  
verification.  
Port 3 also receives some control signals for Flash pro-  
gramming and verification.  
Port 1  
Port 1 is an 8-bit bi-directional I/O port with internal pullups.  
The Port 1 output buffers can sink/source four TTL inputs.  
When 1s are written to Port 1 pins they are pulled high by  
the internal pullups and can be used as inputs. As inputs,  
Port 1 pins that are externally being pulled low will source  
current (IIL) because of the internal pullups.  
RST  
Reset input. A high on this pin for two machine cycles while  
the oscillator is running resets the device.  
ALE/PROG  
Port 1 also receives the low-order address bytes during  
Flash programming and verification.  
Address Latch Enable output pulse for latching the low byte  
of the address during accesses to external memory. This  
pin is also the program pulse input (PROG) during Flash  
programming.  
Port 2  
Port 2 is an 8-bit bi-directional I/O port with internal pullups.  
The Port 2 output buffers can sink/source four TTL inputs.  
When 1s are written to Port 2 pins they are pulled high by  
the internal pullups and can be used as inputs. As inputs,  
In normal operation ALE is emitted at a constant rate of 1/6  
the oscillator frequency, and may be used for external tim-  
ing or clocking purposes. Note, however, that one ALE  
3
pulse is skipped during each access to external Data  
Memory.  
unconnected while XTAL1 is driven as shown in Figure 2.  
There are no requirements on the duty cycle of the external  
clock signal, since the input to the internal clocking circuitry  
is through a divide-by-two flip-flop, but minimum and maxi-  
mum voltage high and low time specifications must be  
observed.  
If desired, ALE operation can be disabled by setting bit 0 of  
SFR location 8EH. With the bit set, ALE is active only dur-  
ing a MOVX or MOVC instruction. Otherwise, the pin is  
weakly pulled high. Setting the ALE-disable bit has no  
effect if the microcontroller is in external execution mode.  
Idle Mode  
PSEN  
In idle mode, the CPU puts itself to sleep while all the on-  
chip peripherals remain active. The mode is invoked by  
software. The content of the on-chip RAM and all the spe-  
cial functions registers remain unchanged during this  
mode. The idle mode can be terminated by any enabled  
interrupt or by a hardware reset.  
Program Store Enable is the read strobe to external pro-  
gram memory.  
When the AT89C51 is executing code from external pro-  
gram memory, PSEN is activated twice each machine  
cycle, except that two PSEN activations are skipped during  
each access to external data memory.  
It should be noted that when idle is terminated by a hard  
ware reset, the device normally resumes program execu-  
tion, from where it left off, up to two machine cycles before  
the internal reset algorithm takes control. On-chip hardware  
inhibits access to internal RAM in this event, but access to  
the port pins is not inhibited. To eliminate the possibility of  
an unexpected write to a port pin when Idle is terminated by  
reset, the instruction following the one that invokes Idle  
should not be one that writes to a port pin or to external  
memory.  
EA/VPP  
External Access Enable. EA must be strapped to GND in  
order to enable the device to fetch code from external pro-  
gram memory locations starting at 0000H up to FFFFH.  
Note, however, that if lock bit 1 is programmed, EA will be  
internally latched on reset.  
EA should be strapped to VCC for internal program  
executions.  
This pin also receives the 12-volt programming enable volt-  
age (VPP) during Flash programming, for parts that require  
12-volt VPP.  
Figure 1. Oscillator Connections  
C2  
XTAL2  
XTAL1  
Input to the inverting oscillator amplifier and input to the  
internal clock operating circuit.  
C1  
XTAL1  
XTAL2  
Output from the inverting oscillator amplifier.  
GND  
Oscillator Characteristics  
XTAL1 and XTAL2 are the input and output, respectively,  
of an inverting amplifier which can be configured for use as  
an on-chip oscillator, as shown in Figure 1. Either a quartz  
crystal or ceramic resonator may be used. To drive the  
device from an external clock source, XTAL2 should be left  
Note:  
C1, C2 = 30 pF ±10 pF for Crystals  
= 40 pF ±10 pF for Ceramic Resonators  
Status of External Pins During Idle and Power-down Modes  
Mode  
Program Memory  
ALE  
PSEN  
PORT0  
PORT1  
PORT2  
Data  
PORT3  
Data  
Idle  
Internal  
1
1
0
0
1
1
0
0
Data  
Data  
Idle  
External  
Float  
Data  
Data  
Address  
Data  
Data  
Power-down  
Power-down  
Internal  
Data  
Data  
External  
Float  
Data  
Data  
Data  
AT89C51  
4
AT89C51  
Figure 2. External Clock Drive Configuration  
ters retain their values until the power-down mode is  
terminated. The only exit from power-down is a hardware  
reset. Reset redefines the SFRs but does not change the  
on-chip RAM. The reset should not be activated before VCC  
is restored to its normal operating level and must be held  
active long enough to allow the oscillator to restart and  
stabilize.  
Program Memory Lock Bits  
On the chip are three lock bits which can be left unpro-  
grammed (U) or can be programmed (P) to obtain the  
additional features listed in the table below.  
When lock bit 1 is programmed, the logic level at the EA pin  
is sampled and latched during reset. If the device is pow-  
ered up without a reset, the latch initializes to a random  
value, and holds that value until reset is activated. It is nec-  
essary that the latched value of EA be in agreement with  
the current logic level at that pin in order for the device to  
function properly.  
Power-down Mode  
In the power-down mode, the oscillator is stopped, and the  
instruction that invokes power-down is the last instruction  
executed. The on-chip RAM and Special Function Regis-  
Lock Bit Protection Modes  
Program Lock Bits  
LB1  
U
LB2  
U
LB3  
U
Protection Type  
1
2
No program lock features  
P
U
U
MOVC instructions executed from external program memory are disabled from  
fetching code bytes from internal memory, EA is sampled and latched on reset,  
and further programming of the Flash is disabled  
3
4
P
P
P
P
U
P
Same as mode 2, also verify is disabled  
Same as mode 3, also external execution is disabled  
5
and data for the entire array or until the end of the  
object file is reached.  
Programming the Flash  
The AT89C51 is normally shipped with the on-chip Flash  
memory array in the erased state (that is, contents = FFH)  
and ready to be programmed. The programming interface  
accepts either a high-voltage (12-volt) or a low-voltage  
(VCC) program enable signal. The low-voltage program-  
ming mode provides a convenient way to program the  
AT89C51 inside the user’s system, while the high-voltage  
programming mode is compatible with conventional third-  
party Flash or EPROM programmers.  
Data Polling: The AT89C51 features Data Polling to indi-  
cate the end of a write cycle. During a write cycle, an  
attempted read of the last byte written will result in the com-  
plement of the written datum on PO.7. Once the write cycle  
has been completed, true data are valid on all outputs, and  
the next cycle may begin. Data Polling may begin any time  
after a write cycle has been initiated.  
Ready/Busy: The progress of byte programming can also  
be monitored by the RDY/BSY output signal. P3.4 is pulled  
low after ALE goes high during programming to indicate  
BUSY. P3.4 is pulled high again when programming is  
done to indicate READY.  
The AT89C51 is shipped with either the high-voltage or  
low-voltage programming mode enabled. The respective  
top-side marking and device signature codes are listed in  
the following table.  
Program Verify: If lock bits LB1 and LB2 have not been  
programmed, the programmed code data can be read back  
via the address and data lines for verification. The lock bits  
cannot be verified directly. Verification of the lock bits is  
achieved by observing that their features are enabled.  
VPP = 12V  
VPP = 5V  
Top-side Mark  
Signature  
AT89C51  
xxxx  
AT89C51  
xxxx-5  
yyww  
yyww  
Chip Erase: The entire Flash array is erased electrically  
by using the proper combination of control signals and by  
holding ALE/PROG low for 10 ms. The code array is written  
with all “1”s. The chip erase operation must be executed  
before the code memory can be re-programmed.  
(030H) = 1EH  
(031H) = 51H  
(032H) =F FH  
(030H) = 1EH  
(031H) = 51H  
(032H) = 05H  
The AT89C51 code memory array is programmed byte-by-  
byte in either programming mode. To program any non-  
blank byte in the on-chip Flash Memory, the entire memory  
must be erased using the Chip Erase Mode.  
Reading the Signature Bytes: The signature bytes are  
read by the same procedure as a normal verification of  
locations 030H, 031H, and 032H, except that P3.6 and  
P3.7 must be pulled to a logic low. The values returned are  
as follows.  
Programming Algorithm: Before programming the  
AT89C51, the address, data and control signals should be  
set up according to the Flash programming mode table and  
Figure 3 and Figure 4. To program the AT89C51, take the  
following steps.  
(030H) = 1EH indicates manufactured by Atmel  
(031H) = 51H indicates 89C51  
(032H) = FFH indicates 12V programming  
(032H) = 05H indicates 5V programming  
1. Input the desired memory location on the address  
lines.  
Programming Interface  
2. Input the appropriate data byte on the data lines.  
3. Activate the correct combination of control signals.  
Every code byte in the Flash array can be written and the  
entire array can be erased by using the appropriate combi-  
nation of control signals. The write operation cycle is self-  
timed and once initiated, will automatically time itself to  
completion.  
4. Raise EA/VPP to 12V for the high-voltage program-  
ming mode.  
5. Pulse ALE/PROG once to program a byte in the  
Flash array or the lock bits. The byte-write cycle is  
self-timed and typically takes no more than 1.5 ms.  
Repeat steps 1 through 5, changing the address  
All major programming vendors offer worldwide support for  
the Atmel microcontroller series. Please contact your local  
programming vendor for the appropriate software revision.  
AT89C51  
6
AT89C51  
Flash Programming Modes  
Mode  
RST  
PSEN  
ALE/PROG  
EA/VPP  
P2.6  
P2.7  
P3.6  
P3.7  
Write Code Data  
H
L
H/12V  
L
H
H
H
Read Code Data  
Write Lock  
H
H
L
L
H
H
L
L
H
H
H
H
Bit - 1  
Bit - 2  
Bit - 3  
H/12V  
H
H
H
H
H
H
L
L
L
L
H/12V  
H/12V  
H/12V  
H
H
H
H
L
H
L
L
L
L
H
L
L
L
L
L
Chip Erase  
(1)  
Read Signature Byte  
H
L
Note:  
Figure 3. Programming the Flash  
AT89C51  
1. Chip Erase requires a 10 ms PROG pulse.  
Figure 4. Verifying the Flash  
+5V  
+5V  
AT89C51  
A0 - A7  
OOOOH/OFFFH  
A8 - A11  
A0 - A7  
VCC  
P0  
VCC  
P0  
ADDR.  
P1  
ADDR.  
P1  
PGM DATA  
(USE 10K  
PULLUPS)  
OOOOH/0FFFH  
PGM  
DATA  
P2.0 - P2.3  
P2.6  
P2.0 - P2.3  
P2.6  
A8 - A11  
P2.7  
ALE  
EA  
SEE FLASH  
PROGRAMMING  
MODES TABLE  
SEE FLASH  
PROGRAMMING  
MODES TABLE  
P2.7  
ALE  
EA  
PROG  
P3.6  
P3.6  
VIH  
P3.7  
P3.7  
XTAL2  
VIH/VPP  
XTAL2  
3-24 MHz  
3-24 MHz  
VIH  
XTAL1  
GND  
RST  
VIH  
XTAL1  
GND  
RST  
PSEN  
PSEN  
7
Flash Programming and Verification Waveforms - High-voltage Mode (VPP = 12V)  
PROGRAMMING  
ADDRESS  
VERIFICATION  
ADDRESS  
P1.0 - P1.7  
P2.0 - P2.3  
tAVQV  
PORT 0  
DATA IN  
DATA OUT  
tDVGL tGHDX  
tAVGL  
tGHAX  
ALE/PROG  
tSHGL  
tGHSL  
tGLGH  
VPP  
LOGIC 1  
LOGIC 0  
EA/VPP  
tEHSH  
tEHQZ  
tELQV  
P2.7  
(ENABLE)  
tGHBL  
P3.4  
(RDY/BSY)  
BUSY  
tWC  
READY  
Flash Programming and Verification Waveforms - Low-voltage Mode (VPP = 5V)  
PROGRAMMING  
ADDRESS  
VERIFICATION  
ADDRESS  
P1.0 - P1.7  
P2.0 - P2.3  
tAVQV  
PORT 0  
DATA IN  
DATA OUT  
tDVGL tGHDX  
tAVGL  
tGHAX  
ALE/PROG  
tSHGL  
tGLGH  
LOGIC 1  
LOGIC 0  
EA/VPP  
tEHSH  
tEHQZ  
tELQV  
P2.7  
(ENABLE)  
tGHBL  
P3.4  
(RDY/BSY)  
BUSY  
tWC  
READY  
AT89C51  
8
AT89C51  
Flash Programming and Verification Characteristics  
TA = 0°C to 70°C, VCC = 5.0 ±10%  
Symbol  
Parameter  
Min  
Max  
12.5  
1.0  
Units  
V
(1)  
VPP  
Programming Enable Voltage  
Programming Enable Current  
Oscillator Frequency  
11.5  
(1)  
IPP  
mA  
1/tCLCL  
tAVGL  
3
24  
MHz  
Address Setup to PROG Low  
Address Hold after PROG  
Data Setup to PROG Low  
Data Hold after PROG  
P2.7 (ENABLE) High to VPP  
VPP Setup to PROG Low  
VPP Hold after PROG  
48tCLCL  
48tCLCL  
48tCLCL  
48tCLCL  
48tCLCL  
10  
tGHAX  
tDVGL  
tGHDX  
tEHSH  
tSHGL  
µs  
µs  
µs  
(1)  
tGHSL  
10  
tGLGH  
tAVQV  
tELQV  
tEHQZ  
tGHBL  
tWC  
PROG Width  
1
110  
Address to Data Valid  
ENABLE Low to Data Valid  
Data Float after ENABLE  
PROG High to BUSY Low  
Byte Write Cycle Time  
48tCLCL  
48tCLCL  
48tCLCL  
1.0  
0
µs  
2.0  
ms  
Note: 1. Only used in 12-volt programming mode.  
9
Absolute Maximum Ratings*  
Operating Temperature.................................. -55°C to +125°C  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Storage Temperature..................................... -65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground.....................................-1.0V to +7.0V  
Maximum Operating Voltage ............................................ 6.6V  
DC Output Current...................................................... 15.0 mA  
DC Characteristics  
TA = -40°C to 85°C, VCC = 5.0V ±20% (unless otherwise noted)  
Symbol  
VIL  
Parameter  
Condition  
Min  
-0.5  
Max  
Units  
Input Low-voltage  
(Except EA)  
0.2 VCC - 0.1  
0.2 VCC - 0.3  
VCC + 0.5  
VCC + 0.5  
0.45  
V
V
V
V
V
VIL1  
Input Low-voltage (EA)  
Input High-voltage  
-0.5  
VIH  
(Except XTAL1, RST)  
(XTAL1, RST)  
0.2 VCC + 0.9  
0.7 VCC  
VIH1  
VOL  
Input High-voltage  
Output Low-voltage(1) (Ports 1,2,3)  
IOL = 1.6 mA  
Output Low-voltage(1)  
(Port 0, ALE, PSEN)  
VOL1  
IOL = 3.2 mA  
0.45  
V
I
OH = -60 µA, VCC = 5V ±10%  
IOH = -25 µA  
OH = -10 µA  
2.4  
V
V
Output High-voltage  
(Ports 1,2,3, ALE, PSEN)  
VOH  
0.75 VCC  
0.9 VCC  
2.4  
I
V
IOH = -800 µA, VCC = 5V ±10%  
IOH = -300 µA  
V
Output High-voltage  
(Port 0 in External Bus Mode)  
VOH1  
0.75 VCC  
0.9 VCC  
V
I
OH = -80 µA  
V
IIL  
Logical 0 Input Current (Ports 1,2,3)  
VIN = 0.45V  
-50  
µA  
Logical 1 to 0 Transition Current  
(Ports 1,2,3)  
ITL  
VIN = 2V, VCC = 5V ±10%  
0.45 < VIN < VCC  
-650  
µA  
ILI  
Input Leakage Current (Port 0, EA)  
Reset Pull-down Resistor  
Pin Capacitance  
±10  
300  
10  
µA  
KΩ  
pF  
RRST  
CIO  
50  
Test Freq. = 1 MHz, TA = 25°C  
Active Mode, 12 MHz  
Idle Mode, 12 MHz  
VCC = 6V  
20  
mA  
mA  
µA  
Power Supply Current  
Power-down Mode(2)  
5
ICC  
100  
40  
VCC = 3V  
µA  
Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:  
Maximum IOL per port pin: 10 mA  
Maximum IOL per 8-bit port: Port 0: 26 mA  
Ports 1, 2, 3: 15 mA  
Maximum total IOL for all output pins: 71 mA  
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater  
than the listed test conditions.  
2. Minimum VCC for Power-down is 2V.  
AT89C51  
10  
AT89C51  
AC Characteristics  
Under operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other  
outputs = 80 pF.  
External Program and Data Memory Characteristics  
12 MHz Oscillator  
16 to 24 MHz Oscillator  
Symbol  
1/tCLCL  
tLHLL  
Parameter  
Min  
Max  
Min  
0
Max  
Units  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Oscillator Frequency  
24  
ALE Pulse Width  
127  
43  
2tCLCL-40  
tCLCL-13  
tCLCL-20  
tAVLL  
Address Valid to ALE Low  
Address Hold after ALE Low  
ALE Low to Valid Instruction In  
ALE Low to PSEN Low  
PSEN Pulse Width  
tLLAX  
tLLIV  
48  
233  
4tCLCL-65  
tLLPL  
43  
tCLCL-13  
tPLPH  
tPLIV  
205  
3tCLCL-20  
PSEN Low to Valid Instruction In  
Input Instruction Hold after PSEN  
Input Instruction Float after PSEN  
PSEN to Address Valid  
Address to Valid Instruction In  
PSEN Low to Address Float  
RD Pulse Width  
145  
59  
3tCLCL-45  
tCLCL-10  
tPXIX  
0
0
tPXIZ  
tPXAV  
tAVIV  
75  
tCLCL-8  
312  
10  
5tCLCL-55  
10  
tPLAZ  
tRLRH  
tWLWH  
tRLDV  
tRHDX  
tRHDZ  
tLLDV  
tAVDV  
tLLWL  
tAVWL  
tQVWX  
tQVWH  
tWHQX  
tRLAZ  
tWHLH  
400  
400  
6tCLCL-100  
6tCLCL-100  
WR Pulse Width  
RD Low to Valid Data In  
Data Hold after RD  
252  
5tCLCL-90  
0
0
Data Float after RD  
97  
2tCLCL-28  
8tCLCL-150  
9tCLCL-165  
3tCLCL+50  
ALE Low to Valid Data In  
Address to Valid Data In  
ALE Low to RD or WR Low  
Address to RD or WR Low  
Data Valid to WR Transition  
Data Valid to WR High  
Data Hold after WR  
517  
585  
300  
200  
203  
23  
3tCLCL-50  
4tCLCL-75  
tCLCL-20  
433  
33  
7tCLCL-120  
tCLCL-20  
RD Low to Address Float  
RD or WR High to ALE High  
0
0
43  
123  
tCLCL-20  
tCLCL+25  
11  
External Program Memory Read Cycle  
tLHLL  
ALE  
tPLPH  
tAVLL  
tLLIV  
tPLIV  
tLLPL  
PSEN  
tPXAV  
tPLAZ  
tPXIZ  
tPXIX  
tLLAX  
A0 - A7  
INSTR IN  
A0 - A7  
PORT 0  
PORT 2  
tAVIV  
A8 - A15  
A8 - A15  
External Data Memory Read Cycle  
tLHLL  
ALE  
tWHLH  
PSEN  
tLLDV  
tRLRH  
tLLWL  
RD  
tLLAX  
tRHDZ  
tRHDX  
tRLDV  
tAVLL  
tRLAZ  
A0 - A7 FROM RI OR DPL  
DATA IN  
A0 - A7 FROM PCL  
INSTR IN  
PORT 0  
tAVWL  
tAVDV  
P2.0 - P2.7 OR A8 - A15 FROM DPH  
A8 - A15 FROM PCH  
PORT 2  
AT89C51  
12  
AT89C51  
External Data Memory Write Cycle  
tLHLL  
ALE  
tWHLH  
PSEN  
tLLWL  
tWLWH  
WR  
tLLAX  
tQVWX  
tWHQX  
tAVLL  
tQVWH  
A0 - A7 FROM RI OR DPL  
DATA OUT  
A0 - A7 FROM PCL  
INSTR IN  
PORT 0  
PORT 2  
tAVWL  
P2.0 - P2.7 OR A8 - A15 FROM DPH  
A8 - A15 FROM PCH  
External Clock Drive Waveforms  
tCHCX  
tCHCX  
tCLCH  
tCHCL  
VCC - 0.5V  
0.7 VCC  
0.2 VCC - 0.1V  
0.45V  
tCLCX  
tCLCL  
External Clock Drive  
Symbol  
1/tCLCL  
tCLCL  
Parameter  
Oscillator Frequency  
Clock Period  
High Time  
Min  
0
Max  
Units  
MHz  
ns  
24  
41.6  
15  
tCHCX  
tCLCX  
ns  
Low Time  
15  
ns  
tCLCH  
Rise Time  
20  
20  
ns  
tCHCL  
Fall Time  
ns  
13  
Serial Port Timing: Shift Register Mode Test Conditions  
(VCC = 5.0 V ±20%; Load Capacitance = 80 pF)  
12 MHz Osc  
Variable Oscillator  
Units  
Symbol  
tXLXL  
Parameter  
Min  
1.0  
700  
50  
Max  
Min  
Max  
Serial Port Clock Cycle Time  
12tCLCL  
10tCLCL-133  
2tCLCL-117  
0
µs  
ns  
ns  
ns  
ns  
tQVXH  
tXHQX  
tXHDX  
tXHDV  
Output Data Setup to Clock Rising Edge  
Output Data Hold after Clock Rising Edge  
Input Data Hold after Clock Rising Edge  
Clock Rising Edge to Input Data Valid  
0
700  
10tCLCL-133  
Shift Register Mode Timing Waveforms  
INSTRUCTION  
ALE  
0
1
2
3
4
5
6
7
8
tXLXL  
CLOCK  
tQVXH  
tXHQX  
WRITE TO SBUF  
0
1
2
tXHDX  
3
4
5
6
7
SET TI  
tXHDV  
OUTPUT DATA  
CLEAR RI  
VALID  
VALID  
VALID  
VALID  
VALID  
VALID  
VALID  
VALID  
SET RI  
INPUT DATA  
AC Testing Input/Output Waveforms(1)  
Float Waveforms(1)  
VCC - 0.5V  
+ 0.1V  
- 0.1V  
VOL  
VLOAD  
0.2 VCC + 0.9V  
Timing Reference  
Points  
VLOAD  
TEST POINTS  
- 0.1V  
0.2 VCC - 0.1V  
0.45V  
VLOAD  
+ 0.1V  
VOL  
Note:  
1. AC Inputs during testing are driven at VCC - 0.5V for a  
logic 1 and 0.45V for a logic 0. Timing measurements  
are made at VIH min. for a logic 1 and VIL max. for a  
logic 0.  
Note:  
1. For timing purposes, a port pin is no longer floating  
when a 100 mV change from load voltage occurs. A  
port pin begins to float when 100 mV change from  
the loaded VOH/VOL level occurs.  
AT89C51  
14  
AT89C51  
Ordering Information  
Speed  
(MHz)  
Power  
Supply  
Ordering Code  
AT89C51-12AC  
AT89C51-12JC  
AT89C51-12PC  
AT89C51-12QC  
AT89C51-12AI  
AT89C51-12JI  
AT89C51-12PI  
AT89C51-12QI  
AT89C51-16AC  
AT89C51-16JC  
AT89C51-16PC  
AT89C51-16QC  
AT89C51-16AI  
AT89C51-16JI  
AT89C51-16PI  
AT89C51-16QI  
AT89C51-20AC  
AT89C51-20JC  
AT89C51-20PC  
AT89C51-20QC  
AT89C51-20AI  
AT89C51-20JI  
AT89C51-20PI  
AT89C51-20QI  
AT89C51-24AC  
AT89C51-24JC  
AT89C51-24PC  
AT89C51-24QC  
AT89C51-24AI  
AT89C51-24JI  
AT89C51-24PI  
AT89C51-24QI  
Package  
44A  
Operation Range  
12  
16  
20  
24  
5V ±20%  
5V ±20%  
5V ±20%  
5V ±20%  
Commercial  
44J  
(0°C to 70°C)  
40P6  
44Q  
44A  
Industrial  
44J  
(-40°C to 85°C)  
40P6  
44Q  
44A  
Commercial  
44J  
(0°C to 70°C)  
40P6  
44Q  
44A  
Industrial  
44J  
(-40°C to 85°C)  
40P6  
44Q  
44A  
Commercial  
44J  
(0°C to 70°C)  
40P6  
44Q  
44A  
Industrial  
44J  
(-40°C to 85°C)  
40P6  
44Q  
44A  
Commercial  
44J  
(0°C to 70°C)  
40P6  
44Q  
44A  
Industrial  
44J  
(-40°C to 85°C)  
40P6  
44Q  
Package Type  
44A  
44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP)  
44-lead, Plastic J-leaded Chip Carrier (PLCC)  
44J  
40P6  
44Q  
40-lead, 0.600” Wide, Plastic Dual Inline Package (PDIP)  
44-lead, Plastic Gull Wing Quad Flatpack (PQFP)  
15  
Packaging Information  
44A, 44-lead, Thin (1.0 mm) Plastic Gull Wing Quad  
Flatpack (TQFP)  
Dimensions in Millimeters and (Inches)*  
JEDEC STANDARD MS-026 ACB  
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-018 AC  
.045(1.14) X 30° - 45°  
12.21(0.478)  
11.75(0.458)  
.045(1.14) X 45°  
PIN NO. 1  
IDENTIFY  
.012(.305)  
.008(.203)  
SQ  
PIN 1 ID  
.630(16.0)  
.590(15.0)  
.656(16.7)  
.650(16.5)  
SQ  
0.45(0.018)  
0.30(0.012)  
0.80(0.031) BSC  
.032(.813)  
.026(.660)  
.021(.533)  
.013(.330)  
.695(17.7)  
.685(17.4)  
SQ  
.043(1.09)  
.020(.508)  
.120(3.05)  
.050(1.27) TYP  
.500(12.7) REF SQ  
.090(2.29)  
.180(4.57)  
.165(4.19)  
10.10(0.394)  
9.90(0.386)  
SQ  
1.20(0.047) MAX  
0
7
0.20(.008)  
0.09(.003)  
.022(.559) X 45° MAX (3X)  
0.75(0.030) 0.15(0.006)  
0.45(0.018) 0.05(0.002)  
Controlling dimension: millimeters  
40P6, 40-lead, 0.600" Wide, Plastic Dual Inline  
Package (PDIP)  
Dimensions in Inches and (Millimeters)  
44Q, 44-lead, Plastic Quad Flat Package (PQFP)  
Dimensions in Millimeters and (Inches)*  
JEDEC STANDARD MS-022 AB  
2.07(52.6)  
2.04(51.8)  
13.45 (0.525)  
SQ  
PIN  
1
12.95 (0.506)  
PIN 1 ID  
.566(14.4)  
.530(13.5)  
0.50 (0.020)  
0.80 (0.031) BSC  
0.35 (0.014)  
.090(2.29)  
MAX  
1.900(48.26) REF  
.220(5.59)  
MAX  
.005(.127)  
MIN  
SEATING  
PLANE  
.065(1.65)  
.015(.381)  
.161(4.09)  
.125(3.18)  
10.10 (0.394)  
9.90 (0.386)  
.022(.559)  
.014(.356)  
SQ  
.065(1.65)  
.041(1.04)  
.110(2.79)  
.090(2.29)  
.630(16.0)  
.590(15.0)  
2.45 (0.096) MAX  
0
7
0.17 (0.007)  
0.13 (0.005)  
0
15  
REF  
.012(.305)  
.008(.203)  
.690(17.5)  
.610(15.5)  
1.03 (0.041)  
0.78 (0.030)  
0.25 (0.010) MAX  
Controlling dimension: millimeters  
AT89C51  
16  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL (408) 441-0311  
FAX (408) 487-2600  
Atmel Colorado Springs  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL (719) 576-3300  
FAX (719) 540-1759  
Europe  
Atmel Rousset  
Zone Industrielle  
13106 Rousset Cedex  
France  
Atmel U.K., Ltd.  
Coliseum Business Centre  
Riverside Way  
Camberley, Surrey GU15 3YL  
England  
TEL (33) 4-4253-6000  
FAX (33) 4-4253-6001  
TEL (44) 1276-686-677  
FAX (44) 1276-686-697  
Asia  
Atmel Asia, Ltd.  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimhatsui  
East Kowloon  
Hong Kong  
TEL (852) 2721-9778  
FAX (852) 2722-1369  
Japan  
Atmel Japan K.K.  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Fax-on-Demand  
North America:  
1-(800) 292-8635  
International:  
1-(408) 441-0732  
e-mail  
literature@atmel.com  
Web Site  
http://www.atmel.com  
BBS  
1-(408) 436-4309  
© Atmel Corporation 2000.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war-  
ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for  
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without  
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop-  
erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are  
not authorized for use as critical components in life support devices or systems.  
®
Marks bearing and/or are registered trademarks and trademarks of Atmel Corporation.  
Terms and product names in this document may be trademarks of others.  
Printed on recycled paper.  
0265G–02/00/xM  

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