AT27C400-12JI [ATMEL]
OTP ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44;
| 型号： | AT27C400-12JI |
| 厂家： | 
ATMEL |
| 描述： | OTP ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 OTP只读存储器 PC 内存集成电路 |
| 文件： | 总12页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Fast Read Access Time – 90 ns
• Word-wide or Byte-wide Configurable
• 4-megabit Flash and Mask ROM Compatible
• Low-power CMOS Operation
– 100 µA Maximum Standby
– 50 mA Maximum Active at 5 MHz
• Wide Selection of JEDEC Standard Packages
– 40-lead 600 mil PDIP
– 44-lead SOIC (SOP)
4-megabit
– 48-lead TSOP (12 mm x 20 mm)
• 5V 10% Power Supply
(256K x 16 or
512K x 8) OTP
EPROM
• High-reliability CMOS Technology
– 2,000V ESD Protection
– 200 mA Latch-up Immunity
• Rapid™ Programming Algorithm – 50 µs/Word (Typical)
• CMOS- and TTL-compatible Inputs and Outputs
• Integrated Product Identification Code
• Commercial and Industrial Temperature Ranges
AT27C400
Description
The AT27C400 is a low-power, high-performance, 4,194,304-bit, one-time program-
mable read-only memory (OTP EPROM) organized as either 256K by 16 or 512K by 8
bits. It requires a single 5V power supply in normal read mode operation. Any word
can be accessed in less than 90 ns, eliminating the need for speed-reducing WAIT
states. The by-16 organization makes this part ideal for high-performance 16- and 32-
Not Recommended for
New Designs
(continued)
bit microprocessor systems.
PLCC
Pin Configurations
Pin Name
A0 - A17
O0 - O15
O15/A-1
Function
A4
A3
A2
7
8
9
39 A12
38 A13
37 A14
Addresses
Outputs
A1 10
A0 11
CE 12
GND 13
OE 14
O0 15
O8 16
O1 17
36 A15
35 A16
34 BYTE/VPP
33 GND
32 O15/A-1
31 O7
Output/Address
30 O14
29 O6
Byte Mode/
Program Supply
BYTE/VPP
CE
OE
NC
Chip Enable
Output Enable
No Connect
TSOP
Type 1
Note: Both GND pins must be connected.
PDIP Top View SOIC (SOP)
A15
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE/VPP
GND
O15/A-1
I/O7
O14
O6
A14
A13
A12
A11
A10
A9
2
3
4
5
A17
A7
A6
A5
A4
A3
A2
A1
A0
1
2
3
4
5
6
7
8
9
40 A8
NC
NC
A17
A7
1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
6
39 A9
2
NC
7
38 A10
37 A11
36 A12
35 A13
34 A14
33 A15
32 A16
31 BYTE/VPP
30 GND
29 O15/A-1
28 O7
3
A8
A8
8
O13
O5
4
A9
NC
NC
NC
NC
NC
NC
NC
NC
A17
A7
9
A6
5
A10
A11
A12
A13
A14
A15
A16
BYTE/VPP
GND
O15/A-1
O7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
O12
O4
A5
6
A4
7
VCC
O11
O3
A3
8
A2
9
CE 10
GND 11
OE 12
O0 13
O8 14
O1 15
O9 16
O2 17
O10 18
O3 19
O11 20
A1
10
11
12
13
14
15
16
17
18
19
20
21
22
O10
O2
A0
CE
GND
OE
O0
O8
O1
O9
O2
O10
O3
O11
O9
O1
27 O14
26 O6
A6
O8
A5
O0
25 O13
24 O5
O14
O6
A4
OE
A3
GND
CE
23 O12
22 O4
O13
O5
Rev. 0844C–05/00
A2
A1
A0
21 VCC
O12
O4
VCC
The AT27C400 can be organized as either word-wide or
byte-wide. The organization is selected via the BYTE/VPP
pin. When BYTE/VPP is asserted high (VIH), the word-wide
organization is selected and the O15/A-1 pin is used for
O15 data output. When BYTE/VPP is asserted low (VIL), the
byte-wide organization is selected and the O15/A-1 pin is
used for the address pin A-1. When the AT27C400 is logi-
cally regarded as x16 (word-wide), but read in the byte-
wide mode, then with A-1 = VIL, the lower eight bits of the
16-bit word are selected and with A-1 = VIH, the upper eight
bits of the 16-bit word are selected.
Programming Algorithm reduces the time required to pro-
gram the part and guarantees reliable programming. Pro-
gramming time is typically only 50 µs/word. The Integrated
Product Identification Code electronically identifies the
device and manufacturer. This feature is used by industry-
standard programming equipment to select the proper pro-
gramming algorithms and voltages.
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions.
Unless accommodated by the system design, these tran-
sients may exceed datasheet limits, resulting in device
non-conformance. At a minimum, a 0.1 µF high-frequency,
low inherent inductance, ceramic capacitor should be uti-
lized for each device. This capacitor should be connected
between the VCC and Ground terminals of the device, as
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7 µF bulk electrolytic capacitor should
be utilized, again connected between the VCC and Ground
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.
In read mode, the AT27C400 typically consumes 15 mA.
Standby mode supply current is typically less than 10 µA.
The AT27C400 is available in industry-standard, JEDEC-
approved, one-time programmable (OTP) PDIP, SOIC
(SOP) and TSOP packages. The device features two-line
control (CE, OE) to eliminate bus contention in high-speed
systems.
With high-density 256K word or 512K byte storage capabil-
ity, the AT27C400 allows firmware to be stored reliably and
to be accessed by the system without the delays of mass
storage media.
Atmel’s AT27C400 has additional features that ensure
high quality and efficient production use. The Rapid™
Block Diagram
AT27C400
2
AT27C400
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other condi-
tions beyond those indicated in the operational sec-
tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.
Temperature under Bias ................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
Voltage on Any Pin with
Respect to Ground ........................................-2.0V to +7.0V (1)
Voltage on A9 with
Respect to Ground .....................................-2.0V to +14.0V (1)
VPP Supply Voltage with
Respect to Ground ......................................-2.0V to +14.0V (1)
Integrated UV Erase Dose........................... .7258 W •sec/cm2
Note:
1. Minimum voltage is -0.6V DC, which undershoots to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC
+ 0.75V DC, which may overshoot to +7.0V for pulses of less than 20 ns.
Operating Modes
Outputs
O8 - O14
DOUT
Mode/Pin
CE
VIL
VIL
VIL
X(1)
VIH
VIL
X
OE
VIL
VIL
VIL
VIH
X(1)
VIH
VIL
VIH
Ai
X(1)
BYTE/VPP
VIH
O0 - O7
DOUT
O15/A-1
DOUT
VIH
Read Word-wide
Read Byte-wide Upper
Read Byte-wide Lower
Output Disable
Standby
X(1)
VIL
DOUT
High-Z
High-Z
High-Z
High-Z
DIN
X(1)
VIL
DOUT
VIL
X(1)
X
X(1)
X(5)
Rapid Program(2)
Ai
VPP
VPP
VPP
PGM Verify
Ai
DOUT
PGM Inhibit
VIH
X(1)
High-Z
(3)
A9 = VH
Identification
Code
Product Identification(4)
VIL
VIL
VIH
A0 = VIH or VIL
A1 - A17 = VIL
Notes: 1. X can be VIL or VIH.
2. Refer to the programming characteristics tables in this datasheet.
3. VH = 12.0 0.5V.
4. Two identifier words may be selected. All inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled
low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word.
5. Standby VCC current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB.
3
DC and AC Operating Conditions for Read Operation
AT27C400
-12
-90
-15
Com.
Ind.
0°C - 70°C
-40°C - 85°C
5V =10%
0°C - 70°C
-40°C - 85°C
5V =10%
0°C - 70°C
-40°C - 85°C
5V =10%
Operating Temperature (Case)
CC Power Supply
V
DC and Operating Characteristics for Read Operation
Symbol Parameter
Condition
Min
Max
Units
ILI
Input Load Current
VIN = 0V to VCC
VOUT = 0V to VCC
VPP = VCC
1
µA
µA
µA
µA
mA
mA
V
ILO
Output Leakage Current
5
10
(2)
IPP1
VPP(1) Read/Standby Current
ISB1 (CMOS), CE = VCC 0.3V
ISB2 (TTL), CE = 2.0 to VCC + 0.5V
f = 5 MHz, IOUT = 0 mA, CE = VIL
100
1
VCC(1) Standby Current
ISB
VCC Active Current
40
VIL
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
-0.6
2.0
0.8
VIH
VOL
VCC + 0.5
0.4
V
IOL = 2.1 mA
IOH = -400 µA
V
VOH
2.4
V
Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP
.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP
.
AC Characteristics for Read Operation
AT27C400
-90
-12
-15
Symbol Parameter
Condition
Min
Max
Min
Max
Min
Max
Units
CE = OE
= VIL
(2)
tACC
Address to Output Delay
90
120
150
ns
(2)
tCE
tOE
tDF
CE to Output Delay
OE to Output Delay
OE = VIL
CE = VIL
90
35
20
120
40
150
50
ns
ns
ns
(2)(3)
(4)(5)
OE or CE High to Output Float,
whichever occurred first
30
35
(4)
tOH
tST
Output Hold from Address,
CE or OE, whichever occurred first
5
5
5
ns
BYTE High to Output Valid
90
40
120
50
150
60
ns
ns
tSTD
BYTE Low to Output Transition
Note:
2, 3, 4, 5. See the AC Waveforms for Read Operation diagram.
AT27C400
4
AT27C400
Byte-wide Read Mode AC Waveforms
Note:
BYTE/VPP = VIL
Word-wide Read Mode AC Waveforms
Note:
BYTE/VPP = VIH
BYTE Transition AC Waveforms
Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.
2. OE maybe delayed up to tCE - tOE after the falling edge of CE without impact on tCE
3. OE maybe delayed up to tACC - tOE after the address is valid without impact on tACC
.
.
4. This parameter is only sampled and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
5
Input Test Waveforms and
Measurement Levels
Output Test Load
1.3V
(1N914)
3.3K
OUTPUT
PIN
CL
tR, tF < 20 ns (10% to 90%)
Note:
CL = 100 pF including jig capacitance.
Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
CIN
Typ
4
Max
10
Units
pF
Conditions
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
AT27C400
6
AT27C400
Programming Waveforms(1)
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device but mist be accommodated by the programmer.
3. When programming the AT27C400, a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage
transients.
DC Programming Characteristics
TA = 25= 5°C, VCC = 6.5= 0.25V, VPP = 13.0= 0.25V
Limits
Symbol
ILI
Parameter
Test Conditions
Min
Max
10
Units
µA
V
Input Load Current
VIN = VIL, VIH
VIL
Input Low Level
-0.6
2.0
0.8
VIH
Input High Level
VCC + 0.5
0.4
V
VOL
VOH
ICC2
IPP2
VID
Output Low Voltage
Output High Voltage
VCC Supply Current (Program and Verify)
VPP Supply Current
IOL = 2.1 mA
IOH = -400 µA
V
2.4
V
50
30
mA
mA
V
CE = VIL
A9 Product Identification Voltage
11.5
12.5
7
AC Programming Characteristics
TA = 25= 5°C, VCC = 6.5= 0.25V, VPP = 13.0= 0.25V
Limits
Symbol
tAS
Parameter
Test Conditions(1)
Min
Max
Units
µs
Address Setup Time
OE Setup Time
2
2
tOES
tDS
µs
Input Rise and Fall Times:
Data Setup Time
2
µs
(10% to 90%) 20 ns
tAH
Address Hold Time
0
µs
Input Pulse Levels:
tDH
Data Hold Time
2
µs
0.45V to 2.4V
tDFP
tVPS
tVCS
tPW
OE High to Output Float Delay(2)
VPP Setup Time
0
130
ns
2
µs
Input Timing Reference Level:
0.8V to 2.0V
VCC Setup Time
2
µs
CE Program Pulse Width(3)
47.5
52.5
150
µs
Output Timing Reference Level:
0.8V to 2.0V
tOE
Data Valid from OE
ns
BYTE/VPP Pulse Rise Time
During Programming
tPRT
50
ns
Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven
— see timing diagram.
3. Program Pulse width tolerance is 50 µsec 5%.
Atmel’s 27C400 Integrated Product Identification Code
Pins
A0
O15
O7
0
O14
O6
0
O13
O5
0
O12
O4
1
O11
O3
1
O10
O2
1
O9
O1
1
O8
O0
0
Hex
Data
Codes
Manufacturer
Device Type
0
1
1E1E
F4F4
1
1
1
1
0
1
0
0
AT27C400
8
AT27C400
Rapid Programming Algorithm
A 50 µs CE pulse width is used to program. The address is
set to the first location. VCC is raised to 6.5V and BYTE/VPP
is raised to 13.0V. Each address is first programmed with
one 50 µs CE pulse without verification. Then a verifica-
tion/reprogramming loop is executed for each address. In
the event a word fails to pass verification, up to 10 succes-
sive 50 µs pulses are applied with a verification after each
pulse. If the word fails to verify after 10 pulses have been
applied, the part is considered failed. After the word verifies
properly, the next address is selected until all have been
checked. VPP is then lowered to 5.0V and VCC to 5.0V. All
words are read again and compared with the original data
to determine if the device passes or fails.
9
Ordering Information
I
Active
40
CC (mA)
tACC
(ns)
Standby
Ordering Code
Package
Operation Range
90
0.1
0.1
0.1
0.1
0.1
0.1
AT27C400-90PC
AT27C400-90RC
AT27C400-90TC
AT27C400-90JC
40P6
44R
48T
44J
Commercial
(0°C to 70°C)
40
40
40
40
40
AT27C400-90PI
AT27C400-90RI
AT27C400-90TI
AT27C400-90JI
40P6
44R
48T
44J
Industrial
(-40°C to 85°C)
120
AT27C400-12PC
AT27C400-12RC
AT27C400-12TC
AT27C400-12JC
40P6
44R
48T
44J
Commercial
(0°C to 70°C)
AT27C400-12PI
AT27C400-12RI
AT27C400-12TI
AT27C400-12JI
40P6
44R
48T
44J
Industrial
(-40°C to 85°C)
150
AT27C400-15PC
AT27C400-15RC
AT27C400-15TC
AT27C400-15JC
40P6
44R
48T
44J
Commercial
(0°C to 70°C)
AT27C400-15PI
AT27C400-15RI
AT27C400-15TI
AT27C400-15JI
40P6
44R
48T
44J
Industrial
(-40°C to 85°C)
Package Type
40-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
40P6
44R
48T
44J
44-lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP)
48-lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm
44-lead, Plastic J-leaded Chip Carrier (PLCC)
AT27C400
10
AT27C400
Packaging Information
40P6, 40-lead, 0.600" Wide, Plastic Dual Inline
Package (PDIP)
44R, 44-lead, 0.525" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-011 AC
Dimensions in Inches and (Millimeters)
2.07(52.6)
2.04(51.8)
PIN
1
.566(14.4)
.530(13.5)
.090(2.29)
MAX
1.900(48.26) REF
.220(5.59)
MAX
.005(.127)
MIN
SEATING
PLANE
.065(1.65)
.015(.381)
.161(4.09)
.125(3.18)
.022(.559)
.014(.356)
.065(1.65)
.041(1.04)
.110(2.79)
.090(2.29)
.630(16.0)
.590(15.0)
0
15
REF
.012(.305)
.008(.203)
.690(17.5)
.610(15.5)
48T, 48-lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*
JEDEC OUTLINE MO-142 DD
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-018 AC
.045(1.14) X 30° - 45°
.045(1.14) X 45°
PIN NO. 1
IDENTIFY
.012(.305)
.008(.203)
.630(16.0)
.590(15.0)
.656(16.7)
SQ
.650(16.5)
.032(.813)
.026(.660)
.021(.533)
.013(.330)
.695(17.7)
.685(17.4)
SQ
.043(1.09)
.020(.508)
.120(3.05)
.050(1.27) TYP
.500(12.7) REF SQ
.090(2.29)
.180(4.57)
.165(4.19)
.022(.559) X 45° MAX (3X)
*Controlling dimension: millimeters
11
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0844C–05/00/xM
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