AT27BV010_07 [ATMEL]

1-Megabit (128K x 8) Unregulated Battery-Voltage OTP EPROM; 1兆位( 128K ×8 )非稳压电池电压OTP EPROM
AT27BV010_07
型号: AT27BV010_07
厂家: ATMEL    ATMEL
描述:

1-Megabit (128K x 8) Unregulated Battery-Voltage OTP EPROM
1兆位( 128K ×8 )非稳压电池电压OTP EPROM

电池 可编程只读存储器 电动程控只读存储器
文件: 总15页 (文件大小:363K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Fast Read Access Time – 90 ns  
Dual Voltage Range Operation  
– Unregulated Battery Power Supply Range, 2.7V to 3.6V  
or Standard 5V 10% Supply Range  
Compatible with JEDEC Standard AT27C010  
Low Power CMOS Operation  
– 20 µA Max (Less than 1 µA Typical) Standby for VCC = 3.6V  
– 29 mW Max Active at 5 MHz for VCC = 3.6V  
JEDEC Standard Packages  
1-Megabit  
(128K x 8)  
– 32-lead PLCC  
– 32-lead TSOP  
– 32-lead VSOP  
Unregulated  
Battery-Voltage  
OTP EPROM  
High Reliability CMOS Technology  
– 2,000V ESD Protection  
– 200 mA Latchup Immunity  
Rapid Programming Algorithm – 100 µs/Byte (Typical)  
CMOS and TTL Compatible Inputs and Outputs  
– JEDEC Standard for LVTTL and LVBO  
Integrated Product Identification Code  
Industrial Temperature Range  
AT27BV010  
Green (Pb/Halide-free) Packaging Option  
1. Description  
The AT27BV010 is a high-performance, low-power, low-voltage 1,048,576-bit one-  
time programmable read-only memory (OTP EPROM) organized as 128K by 8 bits. It  
requires only one supply in the range of 2.7V to 3.6V in normal read mode operation,  
making it ideal for fast, portable systems using either regulated or unregulated battery  
power.  
Atmel’s innovative design techniques provide fast speeds that rival 5V parts while  
keeping the low power consumption of a 3V supply. At VCC = 2.7V, any byte can be  
accessed in less than 90 ns. With a typical power draw of only 18 mW at 5 MHz and  
V
CC = 3V, the AT27BV010 consumes less than one fifth the power of a standard 5V  
EPROM. Standby mode supply current is typically less than 1 µA at 3V. The  
AT27BV010 simplifies system design and stretches battery lifetime even further by  
eliminating the need for power supply regulation.  
The AT27BV010 is available in industry-standard JEDEC-approved one-time  
programmable (OTP) plastic PLCC, TSOP, and VSOP packages. All devices feature  
two-line control (CE, OE) to give designers the flexibility to prevent bus contention.  
The AT27BV010 operating with VCC at 3.0V produces TTL level outputs that are com-  
patible with standard TTL logic devices operating at VCC = 5.0V. At VCC = 2.7V, the  
part is compatible with JEDEC approved low voltage battery operation (LVBO) inter-  
face specifications. The device is also capable of standard 5-volt operation making it  
ideally suited for dual supply range systems or card products that are pluggable in  
both 3-volt and 5-volt hosts.  
0344H–EPROM–12/07  
Atmel’s AT27BV010 has additional features to ensure high quality and efficient production use.  
The Rapid Programming Algorithm reduces the time required to program the part and guaran-  
tees reliable programming. Programming time is typically only 100 µs/byte. The Integrated  
Product Identification Code electronically identifies the device and manufacturer. This feature is  
used by industry-standard programming equipment to select the proper programming algorithms  
and voltages. The AT27BV010 programs exactly the same way as a standard 5V AT27C010  
and uses the same programming equipment.  
2. Pin Configurations  
Pin Name  
Function  
A0 - A16  
O0 - O7  
CE  
Addresses  
Outputs  
Chip Enable  
Output Enable  
Program Strobe  
No Connect  
OE  
PGM  
NC  
2.1  
32-lead TSOP/VSOP (Type 1) Top View  
A11  
A9  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
A10  
CE  
O7  
O6  
O5  
O4  
O3  
GND  
O2  
O1  
O0  
A0  
2
A8  
3
A13  
A14  
NC  
4
5
6
PGM  
VCC  
VPP  
A16  
A15  
A12  
A7  
7
8
9
10  
11  
12  
13  
14  
15  
16  
A6  
A1  
A5  
A2  
A4  
A3  
2.2  
32-lead PLCC Top View  
A7  
A6  
A5  
A4  
A3  
5
6
7
8
9
29 A14  
28 A13  
27 A8  
26 A9  
25 A11  
24 OE  
23 A10  
22 CE  
21 O7  
A2 10  
A1 11  
A0 12  
O0 13  
2
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
3. System Considerations  
Switching between active and standby conditions via the Chip Enable pin may produce transient  
voltage excursions. Unless accommodated by the system design, these transients may exceed  
datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency,  
low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor  
should be connected between the VCC and Ground terminals of the device, as close to the  
device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards  
with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again con-  
nected between the VCC and Ground terminals. This capacitor should be positioned as close as  
possible to the point where the power supply is connected to the array.  
4. Block Diagram  
5. Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability  
Temperature Under Bias.................................. -40°C to +85°C  
Storage Temperature..................................... -65°C to +125°C  
Voltage on Any Pin with  
Respect to Ground .........................................-2.0V to +7.0V(1)  
Voltage on A9 with  
Respect to Ground ......................................-2.0V to +14.0V(1)  
VPP Supply Voltage with  
Respect to Ground .......................................-2.0V to +14.0V(1)  
Note:  
1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is  
VCC + 0.75V DC which may be exceeded if certain precautions are observed (consult application notes) and which may  
overshoot to +7.0V for pulses of less than 20 ns.  
3
0344H–EPROM–12/07  
6. Operating Modes  
Mode/Pin  
CE  
VIL  
X
OE  
VIL  
VIH  
X
PGM  
X(1)  
X
Ai  
VPP  
X
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
Outputs  
DOUT  
Read(2)  
Ai  
Output Disable(2)  
Standby(2)  
X
X
High Z  
High Z  
DIN  
VIH  
VIL  
VIL  
VIH  
X
X
X
Rapid Program(3)  
PGM Verify(3)  
PGM Inhibit(3)  
VIH  
VIL  
X
VIL  
VIH  
X
Ai  
Ai  
VPP  
VPP  
VPP  
DOUT  
X
High Z  
(4)  
A9 = VH  
Identification  
Code  
Product Identification(3)(5)  
VIL  
VIL  
X
A0 = VIH or VIL  
A1 - A16 = VIL  
X
VCC  
Notes: 1. X can be VIL or VIH.  
2. Read, output disable, and standby modes require, 2.7V VCC 3.6V, or 4.5V VCC 5.5V.  
3. Refer to Programming Characteristics. Programming modes require VCC = 6.5V.  
4. VH = 12.0 0.5V.  
5. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled  
low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.  
7. DC and AC Operating Conditions for Read Operation  
AT27BV010-90  
Industrial Operating Temperature (Case)  
CC Power Supply  
-40°C - 85°C  
2.7V to 3.6V  
5V 10%  
V
4
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
8. DC and Operating Characteristics for Read Operation  
Symbol  
Parameter  
Condition  
Min  
Max  
Units  
VCC = 2.7V to 3.6V  
ILI  
Input Load Current  
Output Leakage Current  
VIN = 0V to VCC  
1
5
µA  
µA  
µA  
µA  
µA  
ILO  
VOUT = 0V to VCC  
(2)  
IPP1  
VPP(1) Read/Standby Current VPP = VCC  
10  
20  
100  
I
SB1 (CMOS), CE = VCC 0.3V  
ISB  
ICC  
VIL  
VCC(1) Standby Current  
VCC Active Current  
Input Low Voltage  
ISB2 (TTL), CE = 2.0 to VCC + 0.5V  
f = 5 MHz, IOUT = 0 mA, CE = VIL,  
VCC = 3.6V  
8
mA  
VCC = 3.0 to 3.6V  
-0.6  
-0.6  
0.8  
0.2 x VCC  
VCC + 0.5  
VCC + 0.5  
0.4  
V
V
V
V
V
V
V
V
V
V
VCC = 2.7 to 3.6V  
VCC = 3.0 to 3.6V  
VCC = 2.7 to 3.6V  
IOL = 2.0 mA  
2.0  
VIH  
Input High Voltage  
Output Low Voltage  
0.7 x VCC  
VOL  
I
OL = 100 µA  
0.2  
IOL = 20 µA  
0.1  
IOH = -2.0 mA  
2.4  
VOH  
Output High Voltage  
I
OH = -100 µA  
VCC - 0.2  
VCC - 0.1  
IOH = -20 µA  
VCC = 4.5V to 5.5V  
ILI  
Input Load Current  
VIN = 0V to VCC  
1
µA  
µA  
µA  
µA  
mA  
mA  
V
ILO  
Output Leakage Current  
VOUT = 0V to VCC  
5
10  
(2)  
IPP1  
VPP(1) Read/Standby Current VPP = VCC  
I
SB1 (CMOS), CE = VCC 0.3V  
100  
1
ISB  
VCC(1) Standby Current  
ISB2 (TTL), CE = 2.0 to VCC + 0.5V  
f = 5 MHz, IOUT = 0 mA, CE = VIL  
ICC  
VIL  
VIH  
VOL  
VCC Active Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
25  
-0.6  
2.0  
0.8  
VCC + 0.5  
0.4  
V
IOL = 2.1 mA  
IOH = -400 µA  
V
VOH  
2.4  
V
Notes: 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP  
.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.  
5
0344H–EPROM–12/07  
9. AC Characteristics for Read Operation  
VCC = 2.7V to 3.6V and 4.5V to 5.5V  
-90  
Symbol  
Parameter  
Condition  
CE = OE = VIL  
OE = VIL  
Min  
Max  
90  
Units  
ns  
(3)  
tACC  
Address to Output Delay  
CE to Output Delay  
OE to Output Delay  
(2)  
tCE  
90  
ns  
(2)(3)  
tOE  
CE = VIL  
50  
ns  
OE or CE High to Output Float, Whichever  
Occurred First  
(4)(5)  
tDF  
40  
ns  
ns  
Output Hold from Address, CE or OE,  
Whichever Occurred First  
tOH  
0
10. AC Waveforms for Read Operation(1)  
Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.  
2. OE may be delayed up to tCE-tOE after the falling edge of CE without impact on tCE  
3. OE may be delayed up to tACC-tOE after the address is valid without impact on tACC  
.
.
4. This parameter is only sampled and is not 100% tested.  
5. Output float is defined as the point when data is no longer driven.  
6
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
11. Input Test Waveform and Measurement Level  
tR, tF < 20 ns (10% to 90%)  
12. Output Test Load  
Note: CL = 100 pF  
including jig capacitance.  
13. Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
4
Max  
8
Units  
pF  
Conditions  
VIN = 0V  
COUT  
8
12  
pF  
VOUT = 0V  
Note:  
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.  
7
0344H–EPROM–12/07  
14. Programming Waveforms(1)  
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.  
2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.  
3. When programming the AT27BV010, a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage  
transients.  
8
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
15. DC Programming Characteristics  
TA = 25 5°C, VCC = 6.5 0.25V, VPP = 13.0 0.25V  
Limits  
Symbol  
ILI  
Parameter  
Test Conditions  
Min  
Max  
10  
Units  
µA  
V
Input Load Current  
VIN = VIL, VIH  
VIL  
Input Low Level  
-0.6  
2.0  
0.8  
VIH  
Input High Level  
VCC + 1  
0.4  
V
VOL  
VOH  
ICC2  
IPP2  
VID  
Output Low Voltage  
IOL = 2.1 mA  
IOH = -400 µA  
V
Output High Voltage  
VCC Supply Current (Program and Verify)  
VPP Supply Current  
2.4  
V
40  
20  
mA  
mA  
V
CE = PGM = VIL  
A9 Product Identification Voltage  
11.5  
12.5  
16. AC Programming Characteristics  
TA = 25 5°C, VCC = 6.5 0.25V, VPP = 13.0 0.2V  
Limits  
Symbol  
tAS  
Parameter  
Test Conditions(1)  
Min  
2
Max  
Units  
µs  
Address Setup Time  
CE Setup Time  
tCES  
tOES  
tDS  
2
µs  
Input Rise and Fall Times:  
OE Setup Time  
2
µs  
(10% to 90%) 20 ns  
Data Setup Time  
2
µs  
Input Pulse Levels:  
tAH  
Address Hold Time  
0
µs  
0.45V to 2.4V  
tDH  
Data Hold Time  
2
µs  
Input Timing Reference Level:  
0.8V to 2.0V  
tDFP  
tVPS  
tVCS  
tPW  
OE High to Output Float Delay(2)  
VPP Setup Time  
0
130  
ns  
2
µs  
VCC Setup Time  
2
µs  
Output Timing Reference Level:  
0.8V to 2.0V  
PGM Program Pulse Width(3)  
Data Valid from OE  
VPP Pulse Rise Time During Programming  
95  
105  
150  
µs  
tOE  
ns  
tPRT  
50  
ns  
Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.  
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer  
driven – see timing diagram.  
3. Program Pulse width tolerance is 100 µsec 5%.  
17. Atmel’s AT27BV010 Integrated Product Identification Code(1)  
Pins  
Hex  
Codes  
A0  
0
O7  
0
O6  
0
O5  
0
O4  
1
O3  
1
O2  
1
O1  
1
O0  
0
Data  
Manufacturer  
Device Type  
1E  
1
0
0
0
0
0
1
0
1
05  
Note:  
1. The AT27BV010 has the same Product Identification Code as the AT27C010. Both are programming compatible.  
9
0344H–EPROM–12/07  
18. Rapid Programming Algorithm  
A 100 µs PGM pulse width is used to program. The address is set to the first location. VCC is  
raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs  
PGM pulse without verification. Then a verification/reprogramming loop is executed for each  
address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are  
applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been  
applied, the part is considered failed. After the byte verifies properly, the next address is  
selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes are  
read again and compared with the original data to determine if the device passes or fails.  
10  
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
19. Ordering Information  
19.1 Standard Package  
ICC (mA)  
V
CC = 3.6V  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
AT27BV010-90JI  
AT27BV010-90TI  
AT27BV010-90VI  
32J  
Industrial  
90  
8
0.02  
32T  
32V(1)  
(-40°C to 85°C)  
Note:  
Not recommended for new designs. Use Green package option.  
19.2 Green Package (Pb/Halide-free)  
I
CC (mA)  
VCC = 3.6V  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
AT27BV010-90JU  
AT27BV010-90TU  
32J  
32T  
Industrial  
90  
8
0.02  
(-40°C to 85°C)  
Note:  
1. The 32-lead VSOP package is not recommended for new designs.  
Package Type  
32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32J  
32T  
32V  
32-lead, Plastic Thin Small Outline Package (TSOP)  
33-lead, Plastic Thin Small Outline Package (VSOP)  
11  
0344H–EPROM–12/07  
20. Packaging Information  
20.1 32J – PLCC  
1.14(0.045) X 45˚  
PIN NO. 1  
IDENTIFIER  
1.14(0.045) X 45˚  
0.318(0.0125)  
0.191(0.0075)  
E2  
E1  
E
B1  
B
e
A2  
A1  
D1  
D
A
0.51(0.020)MAX  
45˚ MAX (3X)  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
3.175  
1.524  
0.381  
12.319  
11.354  
9.906  
14.859  
13.894  
12.471  
0.660  
0.330  
MAX  
3.556  
2.413  
NOM  
NOTE  
SYMBOL  
A
D2  
A1  
A2  
D
12.573  
D1  
D2  
E
11.506 Note 2  
10.922  
Notes:  
1. This package conforms to JEDEC reference MS-016, Variation AE.  
2. Dimensions D1 and E1 do not include mold protrusion.  
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the upper or lower parting line.  
15.113  
E1  
E2  
B
14.046 Note 2  
13.487  
0.813  
3. Lead coplanarity is 0.004" (0.102 mm) maximum.  
B1  
e
0.533  
1.270 TYP  
10/04/01  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32J  
B
R
12  
AT27BV010  
0344H–EPROM–12/07  
AT27BV010  
20.2 32T – TSOP  
PIN 1  
0º ~ 8º  
c
Pin 1 Identifier  
D1  
D
L
b
L1  
e
A2  
E
GAGE PLANE  
A
SEATING PLANE  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A1  
MIN  
MAX  
1.20  
0.15  
1.05  
20.20  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.05  
0.95  
19.80  
18.30  
7.90  
0.50  
1.00  
Notes:  
1. This package conforms to JEDEC reference MO-142, Variation BD.  
2. Dimensions D1 and E do not include mold protrusion. Allowable  
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.  
3. Lead coplanarity is 0.10 mm maximum.  
20.00  
18.40  
8.00  
D1  
E
18.50 Note 2  
8.10  
0.70  
Note 2  
L
0.60  
L1  
b
0.25 BASIC  
0.22  
0.17  
0.10  
0.27  
0.21  
c
e
0.50 BASIC  
10/18/01  
DRAWING NO. REV.  
32T  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline  
Package, Type I (TSOP)  
B
R
13  
0344H–EPROM–12/07  
20.3 32V – VSOP  
PIN 1  
0º ~ 8º  
c
Pin 1 Identifier  
D1  
D
L
b
L1  
e
A2  
E
GAGE PLANE  
A
SEATING PLANE  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A1  
MIN  
MAX  
1.20  
0.15  
1.05  
14.20  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.05  
0.95  
13.80  
12.30  
7.90  
0.50  
1.00  
Notes:  
1. This package conforms to JEDEC reference MO-142, Variation BA.  
2. Dimensions D1 and E do not include mold protrusion. Allowable  
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.  
3. Lead coplanarity is 0.10 mm maximum.  
14.00  
12.40  
8.00  
D1  
E
12.50 Note 2  
8.10  
0.70  
Note 2  
L
0.60  
L1  
b
0.25 BASIC  
0.22  
0.17  
0.10  
0.27  
0.21  
c
e
0.50 BASIC  
10/18/01  
DRAWING NO. REV.  
32V  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
32V, 32-lead (8 x 14 mm Package) Plastic Thin Small Outline  
Package, Type I (VSOP)  
B
R
14  
AT27BV010  
0344H–EPROM–12/07  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Atmel Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
Hong Kong  
Tel: (852) 2721-9778  
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0344H–EPROM–12/07  

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