AT25080AN-10SJ-1.8 [ATMEL]

EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8;
AT25080AN-10SJ-1.8
型号: AT25080AN-10SJ-1.8
厂家: ATMEL    ATMEL
描述:

EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 ATM 异步传输模式 光电二极管 内存集成电路
文件: 总23页 (文件大小:193K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Serial Peripheral Interface (SPI) Compatible  
Supports SPI Modes 0 (0,0) and 3 (1,1)  
Low-voltage and Standard-voltage Operation  
– 2.7 (VCC = 2.7V to 5.5V)  
– 1.8 (VCC = 1.8V to 5.5V)  
20 MHz Clock Rate (5V)  
32-byte Page Mode  
Block Write Protection  
– Protect 1/4, 1/2, or Entire Array  
Write Protect (WP) Pin and Write Disable Instructions for  
both Hardware and Software Data Protection  
Self-timed Write Cycle (5 ms Max)  
High-reliability  
SPI Serial  
EEPROMs  
– Endurance: One Million Write Cycles  
8K (1024 x 8)  
16K (2048 x 8)  
32K (4096 x 8)  
64K (8192 x 8)  
– Data Retention: 100 Years  
Automotive Grade, Extended Temperature and Lead-Free Devices Available  
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP and 8-lead TSSOP Packages  
Description  
The AT25080A/160A/320A/640A provides 8192/16384/32768/65536 bits of serial  
electrically-erasable programmable read only memory (EEPROM) organized as  
1024/2048/4096/8192 words of 8 bits each. The device is optimized for use in many  
industrial and commercial applications where low-power and low-voltage operation  
are essential. The AT25080A/160A/320A/640A is available in space saving 8-lead  
PDIP, 8-lead JEDEC SOIC, 8-lead MAP and 8-lead TSSOP packages.  
AT25080A  
AT25160A  
AT25320A  
AT25640A  
The AT25080A/160A/320A/640A is enabled through the Chip Select pin (CS) and  
accessed via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output  
(SO), and Serial Clock (SCK). All programming cycles are completely self-timed, and  
no separate ERASE cycle is required before WRITE.  
Preliminary  
Pin Configuration  
8-lead PDIP  
8-lead SOIC  
Pin Name  
Function  
CS  
SO  
1
2
3
4
8
7
6
5
VCC  
HOLD  
SCK  
SI  
CS  
SO  
1
2
3
4
8
7
6
5
VCC  
HOLD  
SCK  
SI  
CS  
Chip Select  
SCK  
SI  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
WP  
WP  
GND  
GND  
SO  
8-lead TSSOP  
8-lead MAP  
1 CS  
GND  
VCC  
WP  
CS  
SO  
1
2
3
4
8
7
6
5
VCC  
HOLD  
SCK  
SI  
VCC 8  
HOLD 7  
SCK 6  
SI 5  
Power Supply  
Write Protect  
Suspends Serial Input  
No Connect  
2 SO  
WP  
3 WP  
4 GND  
GND  
HOLD  
NC  
Bottom View  
DC  
Don’t Connect  
3347E–SEEPR–9/03  
BLOCK WRITE protection is enabled by programming the status register with one of four blocks of write protection. Sepa-  
rate program enable and program disable instructions are provided for additional data protection. Hardware data protection  
is provided via the WP pin to protect against inadvertent write attempts to the status register. The HOLD pin may be used to  
suspend any serial communication without resetting the serial sequence.  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Operating Temperature.................................. -55°C to +125°C  
Storage Temperature..................................... -65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground .....................................-1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Block Diagram  
2
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
Pin Capacitance(1)  
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).  
Symbol  
COUT  
CIN  
Test Conditions  
Max  
8
Units  
pF  
Conditions  
VOUT = 0V  
VIN = 0V  
Output Capacitance (SO)  
Input Capacitance(CS, SCK, SI, WP, HOLD)  
6
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
DC Characteristics(1): TAI = -40°C to +85°C  
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V (unless otherwise noted).  
Symbol  
VCC1  
Parameter  
Test Condition  
Min  
1.8  
2.7  
4.5  
5.0  
Typ  
Max  
5.5  
5.5  
5.5  
10  
Units  
V
Supply Voltage  
Supply Voltage  
Supply Voltage  
Supply Current  
VCC2  
V
VCC3  
V
ICC1  
VCC = 5.0V at 20 MHz, SO = Open, Read  
7.5  
4.0  
mA  
VCC = 5.0V at 10 MHz, SO = Open,  
Read, Write  
ICC2  
Supply Current  
3.0  
5.0  
mA  
ISB1  
ISB2  
ISB3  
IIL  
Standby Current  
Standby Current  
Standby Current  
Input Leakage  
VCC = 1.8V, CS = VCC  
VCC = 2.7V, CS = VCC  
VCC = 5.0V, CS = VCC  
VIN = 0V to VCC  
< 0.1  
0.3  
1.5  
2.0  
5.0  
µA  
µA  
µA  
µA  
µA  
V
2.0  
-3.0  
-3.0  
IOL  
Output Leakage  
VIN = 0V to VCC, TAC = 0°C to 70°C  
3.0  
(1)  
VIL  
Input Low-voltage  
Input High-voltage  
Output Low-voltage  
Output High-voltage  
Output Low-voltage  
Output High-voltage  
-0.6  
VCC x 0.3  
VCC + 0.5  
0.4  
(1)  
VIH  
VCC x 0.7  
V
VOL1  
VOH1  
VOL2  
VOH2  
I
OL = 3.0 mA  
V
4.5V VCC 5.5V  
1.8V VCC 3.6V  
IOH = -1.6 mA  
IOL = 0.15 mA  
IOH = -100 µA  
VCC - 0.8  
VCC - 0.2  
V
0.2  
V
V
Note:  
1. VIL min and VIH max are reference only and are not tested.  
3
3347E–SEEPR–9/03  
DC Characteristics(1): TAE = -40°C to +125°C  
Applicable over recommended operating range from: TAE = -40°C to +125°C, VCC = +1.8V to +5.5V (unless otherwise  
noted).  
Symbol  
VCC1  
Parameter  
Test Condition  
Min  
1.8  
2.7  
4.5  
5.0  
Typ  
Max  
5.5  
5.5  
5.5  
10  
Units  
V
Supply Voltage  
Supply Voltage  
Supply Voltage  
Supply Current  
VCC2  
V
VCC3  
V
ICC1  
VCC = 5.0V at 20 MHz, SO = Open, Read  
7.5  
4.0  
mA  
VCC = 5.0V at 10 MHz, SO = Open,  
Read, Write  
ICC2  
Supply Current  
3.0  
5.0  
mA  
ISB1  
ISB2  
ISB3  
IIL  
Standby Current  
Standby Current  
Standby Current  
Input Leakage  
VCC = 1.8V, CS = VCC  
VCC = 2.7V, CS = VCC  
VCC = 5.0V, CS = VCC  
VIN = 0V to VCC  
< 0.1  
0.3  
6
7
µA  
µA  
µA  
µA  
µA  
V
2.0  
10  
-3.0  
-3.0  
3.0  
IOL  
Output Leakage  
VIN = 0V to VCC, TAC = 0°C to 70°C  
3.0  
(1)  
VIL  
Input Low-voltage  
Input High-voltage  
Output Low-voltage  
Output High-voltage  
Output Low-voltage  
Output High-voltage  
-0.6  
VCC x 0.3  
VCC + 0.5  
0.4  
(1)  
VIH  
VCC x 0.7  
V
VOL1  
VOH1  
VOL2  
VOH2  
IOL = 3.0 mA  
4.5V VCC 5.5V  
V
IOH = -1.6 mA  
VCC - 0.8  
VCC - 0.2  
V
IOL = 0.15 mA  
0.2  
V
1.8V VCC 3.6V  
IOH = -100 µA  
V
Note:  
1. VIL min and VIH max are reference only and are not tested.  
4
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
AC Characteristics  
Applicable over recommended operating range from TAI = -40°C to +85°C, TAE = -40°C to +125°C, VCC = As Specified,  
CL = 1 TTL Gate and 30 pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
0
0
0
20  
10  
5
fSCK  
SCK Clock Frequency  
MHz  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
2
2
2
tRI  
Input Rise Time  
Input Fall Time  
SCK High Time  
µs  
µs  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
2
2
2
tFI  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
20  
40  
tWH  
80  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
20  
40  
tWL  
tCS  
tCSS  
tCSH  
tSU  
tH  
SCK Low Time  
CS High Time  
ns  
ns  
ns  
ns  
ns  
ns  
80  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
CS Setup Time  
CS Hold Time  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
Data In Setup Time  
Data In Hold Time  
Hold Setup Time  
Hold Hold Time  
Output Valid  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
tHD  
tCD  
tV  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
ns  
ns  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
0
0
0
20  
40  
80  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
0
0
0
tHO  
Output Hold Time  
5
3347E–SEEPR–9/03  
AC Characteristics (Continued)  
Applicable over recommended operating range from TAI = -40°C to +85°C, TAE = -40°C to +125°C, VCC = As Specified,  
CL = 1 TTL Gate and 30 pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
0
0
0
25  
50  
100  
tLZ  
Hold to Output Low Z  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
tHZ  
Hold to Output High Z  
Output Disable Time  
ns  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
25  
50  
100  
tDIS  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 5.5  
5
5
5
tWC  
Write Cycle Time  
ms  
Endurance(1)  
5.0V, 25°C, Page Mode  
1M  
Write Cycles  
Note:  
1. This parameter is characterized and is not 100% tested.  
6
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
Serial Interface  
Description  
MASTER: The device that generates the serial clock.  
SLAVE: Because the Serial Clock pin (SCK) is always an input, the  
AT25080A/160A/320A/640A always operates as a slave.  
TRANSMITTER/RECEIVER: The AT25080A/160A/320A/640A has separate pins designated  
for data transmission (SO) and reception (SI).  
MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.  
SERIAL OP-CODE: After the device is selected with CS going low, the first byte will be  
received. This byte contains the op-code that defines the operations to be performed.  
INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the  
AT25080A/160A/320A/640A, and the serial output pin (SO) will remain in a high impedance  
state until the falling edge of CS is detected again. This will reinitialize the serial  
communication.  
CHIP SELECT: The AT25080A/160A/320A/640A is selected when the CS pin is low. When  
the device is not selected, data will not be accepted via the SI pin, and the serial output pin  
(SO) will remain in a high impedance state.  
HOLD: The HOLD pin is used in conjunction with the CS pin to select the  
AT25080A/160A/320A/640A. When the device is selected and a serial sequence is underway,  
HOLD can be used to pause the serial communication with the master device without resetting  
the serial sequence. To pause, the HOLD pin must be brought low while the SCK pin is low.  
To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK  
may still toggle during HOLD). Inputs to the SI pin will be ignored while the SO pin is in the  
high impedance state.  
WRITE PROTECT: The write protect pin (WP) will allow normal read/write operations when  
held high. When the WP pin is brought low and WPEN bit is “1”, all write operations to the sta-  
tus register are inhibited. WP going low while CS is still low will interrupt a write to the status  
register. If the internal write cycle has already been initiated, WP going low will have no effect  
on any write operation to the status register. The WP pin function is blocked when the WPEN  
bit in the status register is “0”. This will allow the user to install the  
AT25080A/160A/320A/640A in a system with the WP pin tied to ground and still be able to  
write to the status register. All WP pin functions are enabled when the WPEN bit is set to “1”.  
7
3347E–SEEPR–9/03  
SPI Serial Interface  
AT25080A/160A/320A/640A  
8
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
Functional  
Description  
The AT25080A/160A/320A/640A is designed to interface directly with the synchronous serial  
peripheral interface (SPI) of the 6805 and 68HC11 series of microcontrollers.  
The AT25080A/160A/320A/640A utilizes an 8-bit instruction register. The list of instructions  
and their operation codes are contained in Table 1. All instructions, addresses, and data are  
transferred with the MSB first and start with a high-to-low CS transition.  
Table 1. Instruction Set for the AT25080A/160A/320A/640A  
Instruction Name  
WREN  
Instruction Format  
0000 X110  
Operation  
Set Write Enable Latch  
Reset Write Enable Latch  
Read Status Register  
Write Status Register  
Read Data from Memory Array  
Write Data to Memory Array  
WRDI  
0000 X100  
RDSR  
0000 X101  
WRSR  
0000 X001  
READ  
0000 X011  
WRITE  
0000 X010  
WRITE ENABLE (WREN): The device will power-up in the write disable state when VCC is  
applied. All programming instructions must therefore be preceded by a Write Enable  
instruction.  
WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the Write Disable  
instruction disables all programming modes. The WRDI instruction is independent of the sta-  
tus of the WP pin.  
READ STATUS REGISTER (RDSR): The Read Status Register instruction provides access to  
the status register. The READY/BUSY and Write Enable status of the device can be deter-  
mined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of  
protection employed. These bits are set by using the WRSR instruction.  
Table 2. Status Register Format  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
WPEN  
X
X
X
BP1  
BP0  
WEN  
RDY  
Table 3. Read Status Register Bit Definition  
Bit  
Definition  
Bit 0 (RDY)  
Bit 0 = 0 (RDY) indicates the device is READY. Bit 0 = 1 indicates the write cycle is  
in progress.  
Bit 1 (WEN)  
Bit 1= 0 indicates the device is not WRITE ENABLED. Bit 1 = 1 indicates the  
device is WRITE ENABLED.  
Bit 2 (BP0)  
Bit 3 (BP1)  
See Table 4 on page 10.  
See Table 4 on page 10.  
Bits 4 - 6 are 0s when device is not in an internal write cycle.  
Bit 7 (WPEN) See Table 5 on page 10.  
Bits 0 - 7 are 1s during an internal write cycle.  
9
3347E–SEEPR–9/03  
WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select one of  
four levels of protection. The AT25080A/160A/320A/640A is divided into four array segments.  
One quarter (1/4), one half (1/2), or all of the memory segments can be protected. Any of the  
data within any selected segment will therefore be READ only. The block write protection lev-  
els and corresponding status register control bits are shown in Table 4.  
The three bits, BP0, BP1, and WPEN are nonvolatile cells that have the same properties and  
functions as the regular memory cells (e.g. WREN, tWC, RDSR).  
Table 4. Block Write Protect Bits  
Status  
Register Bits  
Array Addresses Protected  
Level  
BP1  
BP0  
AT25080A  
AT25160A  
AT25320A  
AT25640A  
0
0
0
None  
None  
None  
None  
0300  
-03FF  
0600  
-07FF  
0C00  
-0FFF  
1800  
-1FFF  
1(1/4)  
0
1
1
1
0
1
0200  
-03FF  
0400  
-07FF  
0800  
-0FFF  
1000  
-1FFF  
2(1/2)  
3(All)  
0000  
-03FF  
0000  
-07FF  
0000  
-0FFF  
0000  
-1FFF  
The WRSR instruction also allows the user to enable or disable the write protect (WP) pin  
through the use of the Write Protect Enable (WPEN) bit. Hardware write protection is enabled  
when the WP pin is low and the WPEN bit is “1”. Hardware write protection is disabled when  
either the WP pin is high or the WPEN bit is “0”. When the device is hardware write protected,  
writes to the Status Register, including the Block Protect bits and the WPEN bit, and the block-  
protected sections in the memory array are disabled. Writes are only allowed to sections of the  
memory which are not block-protected.  
NOTE: When the WPEN bit is hardware write protected, it cannot be changed back to “0”, as  
long as the WP pin is held low.  
Table 5. WPEN Operation  
Protected  
Blocks  
Unprotected  
Blocks  
Status  
Register  
WPEN  
WP  
X
WEN  
0
0
1
1
X
X
0
1
0
1
0
1
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
X
Low  
Low  
High  
High  
Protected  
Protected  
Protected  
Writable  
10  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
READ SEQUENCE (READ): Reading the AT25080A/160A/320A/640A via the SO (Serial Out-  
put) pin requires the following sequence. After the CS line is pulled low to select a device, the  
READ op-code is transmitted via the SI line followed by the byte address to be read (A15 - A0,  
Refer to Table 6). Upon completion, any data on the SI line will be ignored. The data (D7 - D0)  
at the specified address is then shifted out onto the SO line. If only one byte is to be read, the  
CS line should be driven high after the data comes out. The READ sequence can be contin-  
ued since the byte address is automatically incremented and data will continue to be shifted  
out. When the highest address is reached, the address counter will roll over to the lowest  
address allowing the entire memory to be read in one continuous READ cycle.  
WRITE SEQUENCE (WRITE): In order to program the AT25080A/160A/320A/640A, two sep-  
arate instructions must be executed. First, the device must be write enabled via the Write  
Enable (WREN) Instruction. Then a Write (WRITE) Instruction may be executed. Also, the  
address of the memory location(s) to be programmed must be outside the protected address  
field location selected by the Block Write Protection Level. During an internal write cycle, all  
commands will be ignored except the RDSR instruction.  
A Write Instruction requires the following sequence. After the CS line is pulled low to select the  
device, the WRITE op-code is transmitted via the SI line followed by the byte address  
(A15 - A0) and the data (D7 - D0) to be programmed (Refer to Table 6). Programming will start  
after the CS pin is brought high. (The LOW-to-High transition of the CS pin must occur during  
the SCK low-time immediately after clocking in the D0 (LSB) data bit.  
The READY/BUSY status of the device can be determined by initiating a READ STATUS  
REGISTER (RDSR) Instruction. If Bit 0 = 1, the WRITE cycle is still in progress. If Bit 0 = 0, the  
WRITE cycle has ended. Only the READ STATUS REGISTER instruction is enabled during  
the WRITE programming cycle.  
The AT25080A/160A/320A/640A is capable of a 32-byte PAGE WRITE operation. After each  
byte of data is received, the five low order address bits are internally incremented by one; the  
high order bits of the address will remain constant. If more than 32 bytes of data are transmit-  
ted, the address counter will roll over and the previously written data will be overwritten. The  
AT25080A/160A/320A/640A is automatically returned to the write disable state at the comple-  
tion of a WRITE cycle.  
NOTE: If the device is not Write enabled (WREN), the device will ignore the Write instruction  
and will return to the standby state, when CS is brought high. A new CS falling edge is  
required to re-initiate the serial communication.  
Table 6. Address Key  
Address  
AN  
AT25080A  
A9 - A0  
AT25160A  
A10 - A0  
AT25320A  
A11 - A0  
AT25640A  
A12 - A0  
Don't Care Bits  
A15 - A10  
A15 - A11  
A15 - A12  
A15 - A13  
11  
3347E–SEEPR–9/03  
Timing Diagrams  
Synchronous Data Timing (for Mode 0)  
tCS  
VIH  
CS  
VIL  
tCSH  
tCSS  
VIH  
tWH  
tWL  
SCK  
VIL  
tSU  
VIH  
tH  
SI  
VALID IN  
VIL  
tHO  
tDIS  
tV  
VOH  
HI-Z  
HI-Z  
SO  
VOL  
WREN Timing  
WRDI Timing  
12  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
RDSR Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15  
SCK  
INSTRUCTION  
SI  
DATA OUT  
HIGH IMPEDANCE  
7
6
5
4
3
2
1
0
SO  
MSB  
WRSR Timing  
CS  
0
1
2
3
4
5
6
7
8
7
9
6
10 11 12 13 14 15  
SCK  
DATA IN  
INSTRUCTION  
SI  
5
4
3
2
1
0
HIGH IMPEDANCE  
SO  
READ Timing  
CS  
0
1
2
3
4
5
6
7
8
9 10 11 20 21 22 23 24 25 26 27 28 29 30 31  
SCK  
BYTE ADDRESS  
...  
3 2 1 0  
SI  
INSTRUCTION  
15 14 13  
DATA OUT  
HIGH IMPEDANCE  
SO  
7 6 5 4 3 2 1 0  
MSB  
13  
3347E–SEEPR–9/03  
WRITE Timing  
CS  
0 1 2 3 4 5 6 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31  
SCK  
BYTE ADDRESS  
...  
DATA IN  
INSTRUCTION  
SI  
15 14 13  
3 2 1 0  
7 6 5 4 3 2 1 0  
HIGH IMPEDANCE  
SO  
HOLD Timing  
CS  
tCD  
tCD  
SCK  
tHD  
tHD  
HOLD  
SO  
tHZ  
tLZ  
14  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
AT25080A Ordering Information  
Ordering Code  
Package  
Operation Range  
AT25080A-10PI-2.7  
8P3  
Industrial  
AT25080AN-10SI-2.7  
AT25080A-10TI-2.7  
8S1  
8A2  
8Y1  
(-40 to 85°C)  
AT25080AY1-10YI-2.7  
AT25080A-10PI-1.8  
8P3  
8S1  
Industrial  
AT25080AN-10SI-1.8  
AT25080A-10TI-1.8  
(-40 to 85°C)  
8A2  
8Y1  
AT25080AY1-10YI-1.8  
AT25080AN-10SJ-2.7  
AT25080AN-10SJ-1.8  
8S1  
8S1  
Lead-Free/Industrial Temperature  
(-40 to 85°C)  
High Grade/Extended Temperature  
AT25080AN-10SE-2.7  
8S1  
(-40 to 125°C)  
Note:  
For 2.7V devices used in the 4.5 to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)  
Options  
8P3  
8S1  
8A2  
8Y1  
-2.7  
-1.8  
Low Voltage (2.7 to 5.5V)  
Low Voltage (1.8 to 5.5V)  
15  
3347E–SEEPR–9/03  
AT25160A Ordering Information  
Ordering Code  
Package  
Operation Range  
AT25160A-10PI-2.7  
AT25160AN-10SI-2.7  
AT25160A-10TI-2.7  
AT25160AY1-10YI-2.7  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
AT25160A-10PI-1.8  
AT25160AN-10SI-1.8  
AT25160A-10TI-1.8  
AT25160AY1-10YI-1.8  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
AT25160AN-10SJ-2.7  
AT25160AN-10SJ-1.8  
8S1  
8S1  
Lead-Free/Industrial Temperature  
(-40 to 85°C)  
High Grade/Extended Temperature  
AT25160AN-10SE-2.7  
8S1  
(-40 to 125°C)  
Note:  
For 2.7V devices used in the 4.5 to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
8P3  
8S1  
8A2  
8Y1  
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)  
Options  
Low Voltage (2.7 to 5.5V)  
-2.7  
-1.8  
Low Voltage (1.8 to 5.5V)  
16  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
AT25320A Ordering Information  
Ordering Code  
Package  
Operation Range  
AT25320A-10PI-2.7  
AT25320AN-10SI-2.7  
AT25320A-10TI-2.7  
AT25320AY1-10YI-2.7  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
AT25320A-10PI-1.8  
AT25320AN-10SI-1.8  
AT25320A-10TI-1.8  
AT25320AY1-10YI-1.8  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
Lead-Free/Industrial Temperature  
AT25320AN-10SJ-2.7  
AT25320AN-10SJ-1.8  
8S1  
8S1  
(-40 to 85°C)  
High Grade/Extended Temperature  
AT25320AN-10SE-2.7  
8S1  
(-40 to 125°C)  
Note:  
For 2.7V devices used in the 4.5 to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)  
Options  
8P3  
8S1  
8A2  
8Y1  
-2.7  
-1.8  
Low Voltage (2.7 to 5.5V)  
Low Voltage (1.8 to 5.5V)  
17  
3347E–SEEPR–9/03  
AT25640A Ordering Information  
Ordering Code  
Package  
Operation Range  
AT25640A-10PI-2.7  
AT25640AN-10SI-2.7  
AT25640A-10TI-2.7  
AT25640AY1-10YI-2.7  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
AT25640A-10PI-1.8  
AT25640AN-10SI-1.8  
AT25640A-10TI-1.8  
AT25640AY1-10YI-1.8  
8P3  
8S1  
8A2  
8Y1  
Industrial  
(-40 to 85°C)  
AT25640AN-10SJ-2.7  
AT25640AN-10SJ-1.8  
8S1  
8S1  
Lead-Free/Industrial Temperature  
(-40 to 85°C)  
High Grade/Extended Temperature  
AT25640AN-10SE-2.7  
8S1  
(-40 to 125°C)  
Note:  
For 2.7V devices used in the 4.5 to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
8P3  
8S1  
8A2  
8Y1  
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)  
Options  
Low Voltage (2.7 to 5.5V)  
-2.7  
-1.8  
Low Voltage (1.8 to 5.5V)  
18  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
Packaging Information  
8P3 – PDIP  
E
1
E1  
N
Top View  
c
eA  
End View  
COMMON DIMENSIONS  
(Unit of Measure = inches)  
D
e
MIN  
MAX  
NOM  
NOTE  
SYMBOL  
D1  
A2 A  
A
0.210  
0.195  
0.022  
0.070  
0.045  
0.014  
0.400  
2
A2  
b
0.115  
0.014  
0.045  
0.030  
0.008  
0.355  
0.005  
0.300  
0.240  
0.130  
0.018  
0.060  
0.039  
0.010  
0.365  
5
6
6
b2  
b3  
c
D
3
3
4
3
b2  
L
D1  
E
b3  
4 PLCS  
0.310  
0.250  
0.325  
0.280  
b
E1  
e
0.100 BSC  
0.300 BSC  
0.130  
Side View  
eA  
L
4
2
0.115  
0.150  
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.  
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.  
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.  
4. E and eA measured with the leads constrained to be perpendicular to datum.  
5. Pointed or rounded lead tips are preferred to ease insertion.  
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).  
01/09/02  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8P3, 8-lead, 0.300" Wide Body, Plastic Dual  
In-line Package (PDIP)  
8P3  
B
R
19  
3347E–SEEPR–9/03  
8S1 – JEDEC SOIC  
1
3
2
H
N
Top View  
e
B
A
D
COMMON DIMENSIONS  
(Unit of Measure = mm)  
Side View  
MIN  
MAX  
1.75  
0.51  
0.25  
5.00  
4.00  
NOM  
NOTE  
SYMBOL  
A
B
C
D
E
e
A2  
L
1.27 BSC  
E
H
L
6.20  
1.27  
End View  
Note:  
This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.  
10/10/01  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
A
R
Small Outline (JEDEC SOIC)  
20  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
AT25080A/160A/320A/640A  
8A2 – TSSOP  
3
2 1  
Pin 1 indicator  
this corner  
E1  
E
L1  
N
L
Top View  
End View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
3.00  
NOTE  
SYMBOL  
D
2.90  
3.10  
2, 5  
A
b
E
6.40 BSC  
4.40  
E1  
A
4.30  
4.50  
1.20  
1.05  
0.30  
3, 5  
4
A2  
b
0.80  
0.19  
1.00  
e
A2  
D
e
0.65 BSC  
0.60  
L
0.45  
0.75  
Side View  
L1  
1.00 REF  
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,  
datums, etc.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm  
(0.010 in) per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the  
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
5/30/02  
DRAWING NO.  
TITLE  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8A2, 8-lead, 4.4 mm Body, Plastic  
Thin Shrink Small Outline Package (TSSOP)  
B
8A2  
R
21  
3347E–SEEPR–9/03  
8Y1 – MAP  
PIN 1 INDEX AREA  
A
1
3
4
2
PIN 1 INDEX AREA  
E1  
D1  
D
L
8
6
5
7
b
e
A1  
E
Bottom View  
End View  
Top View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
SYMBOL  
MIN  
MAX  
0.90  
0.05  
5.10  
3.20  
1.15  
1.15  
0.35  
NOM  
NOTE  
A
A1  
D
0.00  
4.70  
2.80  
0.85  
0.85  
0.25  
4.90  
3.00  
1.00  
1.00  
0.30  
0.65 TYP  
0.60  
Side View  
E
D1  
E1  
b
e
L
0.50  
0.70  
2/28/03  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package  
(MAP) Y1  
8Y1  
C
R
22  
AT25080A/160A/320A/640A  
3347E–SEEPR–9/03  
Atmel Corporation  
Atmel Operations  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Memory  
RF/Automotive  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 436-4314  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
Tel: (49) 71-31-67-0  
Fax: (49) 71-31-67-2340  
Regional Headquarters  
Microcontrollers  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906, USA  
Tel: 1(719) 576-3300  
Europe  
Atmel Sarl  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
Tel: (41) 26-426-5555  
Fax: (41) 26-426-5500  
Fax: 1(719) 540-1759  
Biometrics/Imaging/Hi-Rel MPU/  
High Speed Converters/RF Datacom  
Avenue de Rochepleine  
La Chantrerie  
BP 70602  
44306 Nantes Cedex 3, France  
Tel: (33) 2-40-18-18-18  
Fax: (33) 2-40-18-19-60  
BP 123  
38521 Saint-Egreve Cedex, France  
Tel: (33) 4-76-58-30-00  
Fax: (33) 4-76-58-34-80  
Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
Hong Kong  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
ASIC/ASSP/Smart Cards  
Zone Industrielle  
13106 Rousset Cedex, France  
Tel: (33) 4-42-53-60-00  
Fax: (33) 4-42-53-60-01  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906, USA  
Tel: 1(719) 576-3300  
Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
Tel: (81) 3-3523-3551  
Fax: (81) 3-3523-7581  
Fax: 1(719) 540-1759  
Scottish Enterprise Technology Park  
Maxwell Building  
East Kilbride G75 0QR, Scotland  
Tel: (44) 1355-803-000  
Fax: (44) 1355-242-743  
Literature Requests  
www.atmel.com/literature  
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard  
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any  
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and  
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are  
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use  
as critical components in life support devices or systems.  
© Atmel Corporation 2003. All rights reserved. Atmel® and combinations thereof, are the registered trademarks of Atmel Corporation or its  
subsidiaries. Other terms and product names may be the trademarks of others.  
Printed on recycled paper.  
3347E–SEEPR–9/03  
xM  

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