ALN2331 [ASB]
Internally Matched LNA Module; 内部匹配LNA模块
| 型号： | ALN2331 |
| 厂家： | 
ADVANCED SEMICONDUCTOR BUSINESS INC. |
| 描述： | Internally Matched LNA Module |
| 文件： | 总3页 (文件大小：382K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
plerowALN2331
Internally Matched LNA Module
Features
· S21 = 24.7 dB @ 2300 MHz
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
= 25.3 dB @ 2360 MHz
· NF of 0.88 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 2330 MHz, Zo.sys = 50 ohm
2-stage Single Type
Specifications
Parameter
Unit
Min
2300
24
Typ
Max
2360
Frequency Range
Gain
MHz
dB
25
± 0.3
0.88
36
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Gain Flatness
dB
± 0.5
Noise Figure
dB
0.93
Output IP3 (1)
dBm
dB
35
19
S11 / S22 (2)
-15 / -12
185
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Output P1dB
dBm
µsec
mA
V
20
-
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Switching Time (3)
Supply Current
Supply Voltage
Impedance
165
5
50
Ω
Max. RF Input Power
Package Type & Size
Operating temperature is -40°C to +85°C.
dBm
mm
C.W 29 ~ 31 (before fail)
Surface Mount Type, 13Wx13Lx3.8H
1) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
plerow
ALN2331
3
8
RF Out
Vs
ASB Inc.
10
Others
Ground
(Top View)
(Bottom View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
Solder Stencil Area
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
March 2009
plerowALN2331
Internally Matched LNA Module
S-parameters
0
-5
26.0
25.5
Typical Performance
(Measured)
S21
-10
-15
-20
-25
-30
-35
-40
25.0
24.5
S22
24.0
S11
23.5
23.0
2300~2360
+5 V
22.5
S12
22.0
2300
2310
2320
2330
2340
2350
2360
Frequency [MHz]
S-parameters & K Factor
Noise Figure
30
20
10
9
8
7
6
5
4
3
2
1
0
S21
S22
10
0
-10
-20
-30
-40
-50
-60
-70
S11
S12
0
500
1000
1500
2000
2500
3000
3500
Frequency [MHz]
OIP3
P1dB
2/3
www.asb.co.kr
March 2009
plerowALN2331
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
IN
OUT
ALN
C3 = 0.5pF
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca-
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are in-
cluded inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added
just in case that the customer wants. The value of C1 & C2 is determined by considering the application
frequency. C3 shall be used for matching.
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
20~40 sec
260°C
Ramp-up
(3˚C/sec)
OUT
IN
Ramp-down
(6°C/sec)
200°C
150°C
60~180 sec
Size 25x25mm
(for ALN Series – 13x13mm)
3/3
www.asb.co.kr
March 2009
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